CN103413884A - LED encapsulation structure and encapsulation method - Google Patents
LED encapsulation structure and encapsulation method Download PDFInfo
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- CN103413884A CN103413884A CN2013103290923A CN201310329092A CN103413884A CN 103413884 A CN103413884 A CN 103413884A CN 2013103290923 A CN2013103290923 A CN 2013103290923A CN 201310329092 A CN201310329092 A CN 201310329092A CN 103413884 A CN103413884 A CN 103413884A
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Abstract
An embodiment of the invention relates to an LED encapsulation structure and an encapsulation method. The LED encapsulation structure comprises a substrate, an LED chip fixed to the substrate, a fluorescent glue layer formed on the outside of the LED chip and an optical structure layer formed on the outer side of the fluorescent glue layer in a pressing injection mode, wherein the surface of the optical structure layer undergoes atomization processing. The surface of the optical structure layer undergoing the atomizing processing by means of an atomization film is uneven, so that diffuse reflection of an LED light source is generated. Therefore, light colors are uniform, light spots caused by uneven light colors are avoided, and luminous efficacy and reliability are high.
Description
Technical field
The present invention relates to the LED encapsulation technology, relate in particular to a kind of LED encapsulating structure and method for packing.
Background technology
Light-emitting diode (Light Emitting Diode, LED) be a kind of can by electric energy conversion, be the solid-state semiconductor device of light, it is widely used in the fields such as display screen, traffic signal, display light source, lamps for vehicle, LED-backlit source and lighting source.
The most of mode of some glue or pressure injection that adopts of existing LED encapsulation forms lens, and the light source encapsulated out like this is photochromic inhomogeneous, easily forms hot spot.
Summary of the invention
Embodiment of the present invention technical problem to be solved is, a kind of LED encapsulating structure and method for packing are provided, and to realize the photochromic uniformity of light source, produces without hot spot, and light efficiency and reliability are higher.
For solving the problems of the technologies described above, the embodiment of the present invention adopts following technical scheme:
A kind of LED encapsulating structure, comprising: substrate; Be fixed on the LED chip of described substrate one side; Be formed at the fluorescent adhesive layer in the described LED chip outside; Form and the optical structure layers that process through atomization on surface in described fluorescent adhesive layer outside pressure injection.Particularly, the optical structure layers surface of adopting the sprayed film atomization to process presents uneven, makes LED light source produce diffuse reflection, thereby makes photochromic uniformity, has avoided the hot spot due to photochromic inhomogeneous generation.
Further, described optical structure layers is shaped as hemisphere, square, oval, Fresnel shape, taper shape or regular hexagon.
Further, described substrate is the high heat-conducting ceramic substrate.By described high heat-conducting ceramic substrate, make LED encapsulating structure thermal diffusivity good, stay in grade is reliable.
Further, LED chip is a plurality of.Thereby the integrated level of LED light source is higher, brightness is larger.
Further, the spread geometry of LED chip be square, polygon or circle.
A kind of LED method for packing, described method comprises: the die bond step: LED chip is fixed on substrate; Coating step: the fluorescent glue that will configure is coated on above LED chip to form fluorescent adhesive layer; And forming step: pressure injection forms the optical structure layers that process through atomization on surface in the described fluorescent adhesive layer outside.Thereby, by the optical structure layers of processing through the sprayed film atomization, reached the photochromic uniformity of light source, without hot spot, produce the technique effect that light efficiency and reliability are higher.
Further, described forming step also comprises:
Lay sub-step: separable sprayed film is layed in the groove of mould and to pressure injection transparent colloid in groove; And pressure injection sub-step: by described transparent colloid pressure injection on the LED chip that is coated with fluorescent glue, the then demoulding baking molding.During concrete operations, by liquid-transparent silica gel pressure injection in being equipped with the dies cavity of sprayed film, then by the transparent silica gel pressure injection on the LED chip that is coated with fluorescent glue, then baking forms optical structure layers after sprayed film is removed in the demoulding.
Further, described substrate is the high heat-conducting ceramic substrate.
Further, LED chip is a plurality of.
Further, the spread geometry of LED chip be square, polygon or circle.
The beneficial effect of the embodiment of the present invention is: in the encapsulating structure of the embodiment of the present invention, optical structure layers is processed through surface atomizing, and luminous flux promotes greatly, and photochromic uniformity produces without hot spot, and light efficiency and reliability are higher.
The accompanying drawing explanation
Fig. 1 is the generalized section of LED encapsulating structure specific embodiment of the present invention.
Fig. 2 is the stereogram of LED encapsulating structure shown in Figure 1.
Fig. 3 is LED method for packing flow chart of the present invention.
Embodiment
It should be noted that, in the situation that do not conflict, embodiment and the feature in embodiment in the application can mutually combine, and below in conjunction with the drawings and specific embodiments, the present invention are described in further detail.
Please refer to Fig. 1, be the generalized section of LED encapsulating structure specific embodiment of the present invention.The LED encapsulating structure that the present embodiment provides comprises: substrate 10, LED chip 20, fluorescent adhesive layer 30 and optical structure layers 40.
Described substrate 10 can be metallic support, pottery or metal substrate.Described substrate 10 is preferably high heat-conducting ceramic substrate 10.By described high heat-conducting ceramic substrate, make the thermal diffusivity of LED encapsulating structure good, stay in grade is reliable.
Described LED chip 20 is fixed on the upper of substrate 10.As a kind of execution mode, LED chip 20 is a plurality of, and the spread geometry of LED chip 20 is square, polygon or circle.
One deck colloid of described fluorescent adhesive layer 30 for forming in its outside pressure injection centered by LED chip 20.
Described optical structure layers 40 is layer of silica gel, and pressure injection is formed at described fluorescent adhesive layer 30 outsides.Described optical structure layers 40 be shaped as hemisphere, square, oval, Fresnel shape, taper shape or regular hexagon.
Wherein, the colloid layer of described optical structure layers 40 for processing through surface atomizing, by the demoulding remove the sprayed film baking molding and form in inner chamber is equipped with the mould of sprayed film of colloid pressure injection.
Please refer to Fig. 2, is the stereogram of LED encapsulating structure shown in Figure 1.Described optical structure layers 40 non-smooth surface, but atomization surface, the luminous flux of described LED encapsulating structure promotes greatly, and the photochromic uniformity of this LED light source produces without hot spot, and light efficiency and reliability are higher.
Please refer to Fig. 3, the method for packing flow chart of LED encapsulating structure of the present invention.The concrete technology flow process is as follows:
301, die bond step: LED chip 20 is fixed on substrate 10.As a kind of execution mode, LED chip 20 is a plurality of, and the spread geometry of LED chip 20 is square, polygon or circle.
302, coating step: the fluorescent glue that will configure is coated on LED chip 20 surfaces to form fluorescent adhesive layer 30.
303, forming step: form the optical structure layers 40 that process through atomization on surface in described fluorescent adhesive layer 30 outside pressure injections.
Particularly, described forming step also comprises:
Lay sub-step: separable sprayed film is layed in the groove of mould and to pressure injection transparent colloid in groove; And the pressure injection sub-step: by described transparent colloid pressure injection on the LED chip 20 that is coated with fluorescent glue, the then baking molding demoulding.During concrete operations, by liquid-transparent silica gel pressure injection in being equipped with the dies cavity of sprayed film, then by the transparent silica gel pressure injection on the LED chip 20 that is coated with fluorescent glue, then baking forms optical structure layers 40 after sprayed film is removed in the demoulding.The refractive index of described optical structure layers 40 is less than or equal to the refractive index of described fluorescent adhesive layer 30, and light transmittance is greater than 90%.
The optical structure layers 40 of the LED encapsulating structure of the embodiment of the present invention is by specific mould injection-compression molding, and its even thickness, process through surface atomizing, and luminous flux promotes greatly, and the photochromic uniformity of light source produces without hot spot, and light efficiency and reliability are higher.
The above is the specific embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Claims (10)
1. a LED encapsulating structure, is characterized in that, comprising:
Substrate;
Be fixed on the LED chip of described substrate one side;
Be formed at the fluorescent adhesive layer in the described LED chip outside;
Form and the optical structure layers that process through atomization on surface in described fluorescent adhesive layer outside pressure injection.
2. LED encapsulating structure as claimed in claim 1, is characterized in that, described optical structure layers be shaped as hemisphere, square, oval, Fresnel shape, taper shape or regular hexagon.
3. LED encapsulating structure as claimed in claim 1, is characterized in that, described substrate is the high heat-conducting ceramic substrate.
4. LED encapsulating structure as claimed in claim 1, is characterized in that, LED chip is a plurality of.
5. LED encapsulating structure as claimed in claim 4, is characterized in that, the spread geometry of LED chip is square, polygon or circle.
6. a LED method for packing, is characterized in that, described method comprises:
Die bond step: LED chip is fixed to substrate one side;
Coating step: the fluorescent glue that will configure is coated on the LED chip surface to form fluorescent adhesive layer; And
Forming step: pressure injection forms the optical structure layers that process through atomization on surface in the described fluorescent adhesive layer outside.
7. LED method for packing as claimed in claim 6, is characterized in that, described forming step also comprises:
Lay sub-step: separable sprayed film is layed in the groove of mould and to pressure injection transparent colloid in groove; And
The pressure injection sub-step: by described transparent colloid pressure injection on the LED chip that is coated with fluorescent glue, the then demoulding baking molding.
8. LED method for packing as claimed in claim 6, is characterized in that, described substrate is the high heat-conducting ceramic substrate.
9. LED method for packing as claimed in claim 6, is characterized in that, LED chip is a plurality of.
10. LED method for packing as claimed in claim 9, is characterized in that, the spread geometry of LED chip is square, polygon or circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310329092.3A CN103413884B (en) | 2013-07-31 | 2013-07-31 | LED encapsulation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310329092.3A CN103413884B (en) | 2013-07-31 | 2013-07-31 | LED encapsulation method |
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| CN103413884A true CN103413884A (en) | 2013-11-27 |
| CN103413884B CN103413884B (en) | 2015-10-21 |
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| CN201310329092.3A Active CN103413884B (en) | 2013-07-31 | 2013-07-31 | LED encapsulation method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789412A (en) * | 2016-03-11 | 2016-07-20 | 厦门理工学院 | Wafer LED with remote fluorescent powder layer and preparation method thereof |
| CN110034225A (en) * | 2019-04-24 | 2019-07-19 | 江西联创南分科技有限公司 | A kind of preparation method of novel WiFi intelligent control type curved surface LED display device |
| CN110085727A (en) * | 2019-06-04 | 2019-08-02 | 永林电子有限公司 | A kind of side tilts upward scattering and shines RGB Multifunctional LED device |
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| US20070212802A1 (en) * | 2006-02-21 | 2007-09-13 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing light emitting diode package |
| CN201594553U (en) * | 2010-01-28 | 2010-09-29 | 诠兴开发科技股份有限公司 | LED illumination structure with good uniform light |
| CN102257643A (en) * | 2009-05-11 | 2011-11-23 | 旭明光电股份有限公司 | Led device with light extracting rough structure and manufacturing methods thereof |
| KR20130043685A (en) * | 2010-09-06 | 2013-04-30 | 헤레우스 노블라이트 게엠베하 | Coating method for an optoelectronic chip-on-board module |
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2013
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070212802A1 (en) * | 2006-02-21 | 2007-09-13 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing light emitting diode package |
| CN102257643A (en) * | 2009-05-11 | 2011-11-23 | 旭明光电股份有限公司 | Led device with light extracting rough structure and manufacturing methods thereof |
| CN201594553U (en) * | 2010-01-28 | 2010-09-29 | 诠兴开发科技股份有限公司 | LED illumination structure with good uniform light |
| KR20130043685A (en) * | 2010-09-06 | 2013-04-30 | 헤레우스 노블라이트 게엠베하 | Coating method for an optoelectronic chip-on-board module |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789412A (en) * | 2016-03-11 | 2016-07-20 | 厦门理工学院 | Wafer LED with remote fluorescent powder layer and preparation method thereof |
| CN105789412B (en) * | 2016-03-11 | 2023-08-04 | 厦门理工学院 | Wafer-level LED with remote fluorescent powder layer and preparation method thereof |
| CN110034225A (en) * | 2019-04-24 | 2019-07-19 | 江西联创南分科技有限公司 | A kind of preparation method of novel WiFi intelligent control type curved surface LED display device |
| CN110085727A (en) * | 2019-06-04 | 2019-08-02 | 永林电子有限公司 | A kind of side tilts upward scattering and shines RGB Multifunctional LED device |
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| Publication number | Publication date |
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| CN103413884B (en) | 2015-10-21 |
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Effective date of registration: 20160125 Address after: The Town Lake Anxi County of Quanzhou City, Fujian Province Industrial Park Patentee after: FUJIAN LIGHTNING OPTOELECTRONIC CO., LTD. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518000 South Road community should be one stone Wentao Science Park building B Patentee before: Lighting Optoectronic(SZ) Co., Ltd. |