CN101876407A - LED light source module - Google Patents
LED light source module Download PDFInfo
- Publication number
- CN101876407A CN101876407A CN 201010174061 CN201010174061A CN101876407A CN 101876407 A CN101876407 A CN 101876407A CN 201010174061 CN201010174061 CN 201010174061 CN 201010174061 A CN201010174061 A CN 201010174061A CN 101876407 A CN101876407 A CN 101876407A
- Authority
- CN
- China
- Prior art keywords
- led light
- light source
- substrate
- source module
- lens module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses an LED light source module which comprises a substrate, a fluorescent powder layer, a lens module and an LED light emitting chip arranged on the substrate. The lens module comprises a main body, a frame and a lens unit, wherein, the edge of the main body stretches towards one side to form the frame, and the main body partially protrudes to form the lens unit; the substrate is covered at the outer side of the frame to form an enclosed box body with the lens module; the LED light emitting chip is arranged in the box body; and the fluorescent powder layer is arranged on the inner surface of the main body. By adopting the LED light source module of the technical scheme of the invention, the substrate and the lens module form the enclosed box body and the fluorescent powder layer is coated on the inner surface of the lens module so that the fluorescent powder layer is far away from the LED light emitting chip, thus being beneficial to lowering the temperature of the fluorescent powder layer, improving the excitation efficiency and the service life of fluorescent powder in the fluorescent powder layer, and increasing the light extraction ratio; and meanwhile by adopting an inwards concave hollow structure of the lens module, the fluorescent powder can be directly dripped on the inner surface of the lens module to form the fluorescent powder layer, so a complicated powder dispersing process is not required, thus achieving simple operation.
Description
Technical field
The present invention relates to the LED lighting technical field, be specifically related to a kind of led light source module.
Background technology
Along with the appearance of blue-ray LED, LED can mix out white light, thereby can be used as lighting source.In the last few years, the development of LED lighting engineering was very fast, and various led light source modules also continue to bring out, and in the up-to-date technology, all generally adopt phosphor powder layer to inspire gold-tinted.But the structure of existing led light source module is generally comparatively complicated, and the generally all naked leakage of its phosphor powder layer is in air, so the decay of fluorescent material is very fast, and the life-span of LED illuminating module is short, light extraction efficiency is lower; Though the fluorescent material of existing minority led light source module does not expose in air, usually very close to the LED luminescence chip, causes the fluorescent material temperature too high, thereby influences the launching efficiency and the life-span of fluorescent material.Therefore, existing led light source module needs to improve.
Summary of the invention
Technical problem to be solved by this invention provides a kind of simple in structure, light extraction efficiency is higher, the life-span is longer led light source module.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of led light source module, comprise substrate, phosphor powder layer, lens module, and being arranged on LED luminescence chip on the described substrate, described lens module comprises main body, the body rim lens unit that local crowning forms on frame that a side extends to form, main body; Described substrate is covered in the frame outside, forms enclosed box body with lens module; Described LED luminescence chip is positioned at described box body; Described phosphor powder layer is arranged at the inner surface of main body.
In the optimized technical scheme, described LED luminescence chip has a plurality of, and the lens unit on the described lens unit main body also has a plurality of.
In the optimized technical scheme, described substrate and/or frame inner surface adhere to the reflecting layer arranged
Described reflecting layer is specular layer or diffuse reflector.
Further, described reflecting layer is the highly reflective coatint of coating.
Further, described specular layer is a high reflectance coating; Described high reflectance coating is high reflectance silverskin or the aluminium film that vacuum evaporation or vacuum sputtering form.
In the optimized technical scheme, described substrate adopts joinery and its construction to be connected with lens module; Described joinery and its construction comprises tenon and mortise, and the shape of described tenon and mortise is corresponding with the position, and is separately positioned on described frame and the substrate; Between assembling described mortise in back and the tenon is interference fit.
Further, described frame is a rectangle, respectively is provided with plural tenon on two long limits of frame, respectively is provided with more than one tenon on two minor faces; Described substrate also is a rectangle, and it is provided with the mortise more than six; Described tenon is a cylindrical shape, and described mortise is a manhole.
In the optimized technical scheme, described led light source module also comprises obturator, and described obturator is filled between substrate and the lens module.
Further, described obturator is transparent resin material; Offer the steam vent that is used to pour into the glue feeding opening of described resin material and is used for discharged air on the described lens module or on the substrate.
Further, described obturator is transparent resin material; Offer the steam vent that is used to pour into the glue feeding opening of described resin material and is used for discharged air on described lens module and the substrate respectively.
The invention has the beneficial effects as follows:
Adopted the led light source module of technical solution of the present invention, constitute an enclosed box body by substrate and lens module, and the inner surface at lens module is coated with phosphor powder layer, this kind structure makes phosphor powder layer away from the LED luminescence chip, help reducing the temperature of phosphor powder layer, thereby also help improving the launching efficiency and the life-span of fluorescent material in the phosphor powder layer.
The frame of integrated molding on the lens module, the hollow structure of the indent of formation can directly drop in phosphor gel on the inner surface of lens module by the form of dripping glue, thereby form the uniform phosphor powder layer of thickness, does not need complicated some powder craft, and is simple to operate.
On the lens module upper surface with the bulge-structure of a plurality of periodic arrangement of lens module integrated molding as lens unit, the corresponding LEDs luminescence chip of each lens unit, the blue light that the LED luminescence chip can be sent at utmost extracts; Simultaneously, the surface that the bulge-structure of fluctuating is formed, the gold-tinted that inspires for phosphor powder layer can play good light extraction effect equally.
Also by obturator is set, adopt lensless hot insulation package compared to existing technology, or directly with the exposed aerial encapsulating structure of phosphor powder layer, the decay of phosphor powder layer is slower, effect is more lasting, the life-span is longer, and such led light source module has higher light extraction efficiency.
The lens module of integrated molding and substrate use the mode of interference fit to form box body structure, make the structural member of whole LED illuminating module have only lens module and two parts of substrate, thereby simple in structure, and assembly technology is also quite simple.
Description of drawings
Fig. 1 is the structural representation that dissects of specific embodiment of the invention led light source module.
Fig. 2 is the decomposing schematic representation of specific embodiment of the invention led light source module.
The invention will be further described below in conjunction with accompanying drawing.
The specific embodiment
By Fig. 1 and Fig. 2 as seen, a kind of led light source module that this specific embodiment provides comprises: substrate 1, LED luminescence chip 2, lens module 3, phosphor powder layer 4, obturator 5.In the present embodiment, described substrate 1 is a rectangular thin plate.Described LED luminescence chip 2 has many, and array is at a side surface (upper surface) of described substrate 1.Described lens module 3 comprises main body 30, frame 31, some lens units 32.Described main body 30 is rectangular, and its edge extends to form the described frame 31 of rectangle to a side (downside).Described substrate 1 is covered in the outside (open side) of described frame 31, forms a rectangular box that seals with described lens module 3; Described LED luminescence chip 2 promptly is positioned at the box body of described rectangle.The one side (upper surface) of lens module 3 main bodys has a plurality of projectioies, and in fact each projection is a described lens unit 32, and the position of lens unit 32, corresponding with the position of LED luminescence chip 2.The whole transparent materials that adopt of lens module 3 are made, and perhaps lens unit 32 adopts transparent materials to make at least, so the light that sent of LED luminescence chip 2, can transmit lens module 3 after converging through lens unit 32.
Can adopt modes such as screw, rivet to connect between the frame 31 of lens module 3 and the substrate 1, also can bonding or ultrasonic bonding, in this specific embodiment, adopt joinery and its construction to connect between lens module 3 and the substrate 1; Particularly set in advance several tenons 33 on four limits of lens module 3 frames 31, and correspondence is provided with several mortises 11 on substrate 1, only mortise 11 corresponding on 33 align substrates 1 of the tenon on the lens module 3 need be pushed into during assembling and get final product, thereby assembling is very much to make things convenient for.In the present embodiment, more specifically, on two long limits of lens module 3 frames 31, respectively be provided with two cylinders, and on two minor faces of frame 31, respectively be provided with a cylinder as tenon 33 as tenon 33; Corresponding, on substrate 1, be provided with six manholes as mortise 11, the size and the position of the size of described manhole mortise 11 and position and described cylinder tenon 33 are suitable, particularly adopt interference fit between tenon 33 and the mortise 11, be the diameter that the diameter of tenon 33 is a bit larger tham mortise 11, so that all tenons 33 can inject mortise 11 under certain external force.
Further, being provided with the reflecting layer at the upper surface (being used to be provided with a side surface of LED luminescence chip 2) of substrate 1, particularly is to be coated with one deck highly reflective coatint is arranged, thereby improves the utilization rate of the light that LED luminescence chip 2 sent.Further, the inner surface at frame 31 also is coated with highly reflective coatint.Described reflecting layer both can be a specular layer, also can be diffuse reflector.Described specular layer both can be the highly reflective coatint that adopts in this specific embodiment, also can be the coating of high reflectance.High reflectance coating specifically can adopt the technology of vacuum evaporation or vacuum sputtering, plates the silverskin of one deck high reflectance or aluminium film etc. at the inner surface of the upper surface of substrate 1 and/or frame 31.
As shown in Figure 1, present embodiment is also at the inner surface (lower surface of lens module 3 main bodys 30, promptly, with the relative another side of one side that a plurality of projectioies are arranged on lens module 3 main bodys 30) scribble layer of fluorescent powder layer 4, more specifically be the layer of fluorescent powder glue-line, so that the fluorescent material of the blue light that LED luminescence chip 2 emits in can fluorescence excitation bisque 4 sends gold-tinted, the mixing light that finally transmits lens module 3 more approaches white light, and become comparatively soft, and can be not dazzling.Further, also in the rectangular box of led light source module, promptly fill described obturator 5 in the space between lens module 3 and the substrate 1.Obturator 5 particularly is transparent resin material, for example transparent silica gel.
In order to fill described obturator 5 smoothly, on substrate 1, set in advance two through holes, one of them is a glue feeding opening 12, another is a steam vent 13.When by glue feeding opening 12 injecting glues the time, air is discharged from described steam vent 13, thereby makes as the gluey transparent resin of obturator 5, can fill the whole space between full substrate 1 and the lens module 3 smoothly.Certainly, glue feeding opening 12 and steam vent 13 also can be arranged on the suitable position of lens module 3, such as the side of frame 31; Glue feeding opening 12 and steam vent 13 can also be separately positioned on substrate 1 and the lens module 3, also can reach identical technique effect.
During making, make lens module 3 and substrate 1 earlier, described frame 31, lens unit 32 and tenon 33 are one-body molded with lens module 3, and described mortise 11, glue feeding opening 12 and steam vent 13 are also one-body molded with substrate 1; Then at the upper surface of substrate 1 and the inner surface coating highly reflective coatint of lens module 3 frames 31; Upper surface at substrate 1 mounts LED luminescence chip 2 again, is coated with the fluorescent material glue-line at the inner surface of lens module 3; After at last substrate 1 and lens module 3 being assembled from glue feeding opening 12 injecting glues, the led light source module of present embodiment.
Led light source module provided by the invention, constitute an enclosed box body by substrate 1 and lens module 3, and the inner surface at lens module 3 is coated with phosphor powder layer 4, obturator 5 also is set in box body, adopt lensless hot insulation package compared to existing technology, or directly with phosphor powder layer 4 exposed aerial encapsulating structures, the decay of phosphor powder layer 4 is slower, effect is more lasting, the life-span is longer, and such led light source module has higher light extraction efficiency.And this kind structure makes phosphor powder layer 4 away from LED luminescence chip 2, helps reducing the temperature of phosphor powder layer 4, thereby also helps improving the launching efficiency and the life-span of fluorescent material in the phosphor powder layer 4.On lens module 3 upper surfaces with the bulge-structure of a plurality of periodic arrangement of lens module 3 integrated moldings as lens unit 32, each lens unit 32 corresponding LEDs luminescence chip 2 can at utmost extract the blue light that LED luminescence chip 2 sends; Simultaneously, the surface that the bulge-structure of fluctuating is formed, the gold-tinted that inspires for phosphor powder layer 4 can play good light extraction effect equally.And the frame 31 of integrated molding on the lens module 3, the hollow structure of the indent that forms can directly drop in phosphor gel on the inner surface of lens module 3 by the form of dripping glue, thereby forms the uniform phosphor powder layer 4 of thickness, do not need complicated some powder craft, simple to operate.The lens module 3 of integrated molding and substrate 1 use the mode of interference fit to form box body structure, make the structural member of whole LED illuminating module have only lens module 3 and 1 two parts of substrate, thereby simple in structure, and assembly technology is also quite simple.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. a led light source module comprises substrate, phosphor powder layer, and is arranged on the LED luminescence chip on the described substrate, it is characterized in that, described led light source module also comprises lens module; Described lens module comprises main body, the body rim lens unit that local crowning forms on frame that a side extends to form, main body; Described substrate is covered in the frame outside, forms enclosed box body with lens module; Described LED luminescence chip is positioned at described box body; Described phosphor powder layer is arranged at the inner surface of main body.
2. a kind of led light source module as claimed in claim 1 is characterized in that described LED luminescence chip has a plurality of, and the lens unit on the described lens unit main body also has a plurality of.
3. a kind of led light source module as claimed in claim 1 is characterized in that, described substrate and/or frame inner surface adhere to the reflecting layer arranged
Described reflecting layer is specular layer or diffuse reflector.
4. a kind of led light source module as claimed in claim 3 is characterized in that, described reflecting layer is the highly reflective coatint of coating.
5. a kind of led light source module as claimed in claim 3 is characterized in that described specular layer is a high reflectance coating; Described high reflectance coating is high reflectance silverskin or the aluminium film that vacuum evaporation or vacuum sputtering form.
6. a kind of led light source module as claimed in claim 1 is characterized in that, described substrate adopts joinery and its construction to be connected with lens module; Described joinery and its construction comprises tenon and mortise, and the shape of described tenon and mortise is corresponding with the position, and is separately positioned on described frame and the substrate; Between assembling described mortise in back and the tenon is interference fit.
7. a kind of led light source module as claimed in claim 6 is characterized in that described frame is a rectangle, respectively is provided with plural tenon on two long limits of frame, respectively is provided with more than one tenon on two minor faces; Described substrate also is a rectangle, and it is provided with the mortise more than six; Described tenon is a cylindrical shape, and described mortise is a manhole.
8. as any described a kind of led light source module in the claim 1 to 7, it is characterized in that described led light source module also comprises obturator, described obturator is filled between substrate and the lens module.
9. a kind of led light source module as claimed in claim 8 is characterized in that described obturator is transparent resin material; Offer the steam vent that is used to pour into the glue feeding opening of described resin material and is used for discharged air on the described lens module or on the substrate.
10. a kind of led light source module as claimed in claim 8 is characterized in that described obturator is transparent resin material; Offer the steam vent that is used to pour into the glue feeding opening of described resin material and is used for discharged air on described lens module and the substrate respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010174061 CN101876407A (en) | 2010-05-17 | 2010-05-17 | LED light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010174061 CN101876407A (en) | 2010-05-17 | 2010-05-17 | LED light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101876407A true CN101876407A (en) | 2010-11-03 |
Family
ID=43019030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010174061 Pending CN101876407A (en) | 2010-05-17 | 2010-05-17 | LED light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101876407A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709454A (en) * | 2012-05-30 | 2012-10-03 | 上舜照明（中国）有限公司 | Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof |
| WO2013020415A1 (en) * | 2011-08-08 | 2013-02-14 | 浙江生辉照明有限公司 | Lens applied to led lamp |
| CN103090319A (en) * | 2012-12-20 | 2013-05-08 | 康佳集团股份有限公司 | Lamp bar of liquid crystal display (LCD) television and directly-down type backlight module |
| CN103292174A (en) * | 2013-04-28 | 2013-09-11 | 杭州杭科光电股份有限公司 | 2 pi luminous LED (Light Emitting Diode) light source module |
| CN104141889A (en) * | 2013-05-08 | 2014-11-12 | 欧普照明电器（中山）有限公司 | An illumination lamp |
| CN104613373A (en) * | 2013-11-05 | 2015-05-13 | 岭南大学校产学协力团 | Light emitting diode light box |
| CN105180092A (en) * | 2015-10-23 | 2015-12-23 | 欧普照明股份有限公司 | Lens and light source module |
| CN105508906A (en) * | 2014-09-22 | 2016-04-20 | 欧普照明电器（中山）有限公司 | LED lamp and LED light source module |
| WO2017148075A1 (en) * | 2016-03-03 | 2017-09-08 | 深圳欧菲光科技股份有限公司 | Imaging module and electronic device |
| CN109256051A (en) * | 2018-09-20 | 2019-01-22 | 深圳市海讯高科技术有限公司 | A kind of COB display screen and its packaging method |
| CN111357123A (en) * | 2017-11-14 | 2020-06-30 | Lg伊诺特有限公司 | Lighting module and lighting device comprising same |
| WO2020197172A1 (en) * | 2019-03-22 | 2020-10-01 | 엘지이노텍 주식회사 | Lighting module and lighting apparatus having same |
| WO2020197171A1 (en) * | 2019-03-22 | 2020-10-01 | 엘지이노텍 주식회사 | Lighting module and lighting device comprising same |
| WO2020197174A1 (en) * | 2019-03-22 | 2020-10-01 | 엘지이노텍 주식회사 | Lighting module and lighting device comprising same |
| WO2020197173A1 (en) * | 2019-03-22 | 2020-10-01 | 엘지이노텍 주식회사 | Lighting module and lighting apparatus comprising same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5959316A (en) * | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
| CN1836339A (en) * | 2002-08-30 | 2006-09-20 | 吉尔科有限公司 | Light emitting diode with improved effience |
| CN1960016A (en) * | 2005-11-02 | 2007-05-09 | 西铁城电子股份有限公司 | Light emitting diode |
| CN101163916A (en) * | 2005-04-26 | 2008-04-16 | 日本精机株式会社 | Lighting device and liquid crystal display device provided with such lighting device |
| CN201349021Y (en) * | 2008-12-25 | 2009-11-18 | 厦门华联电子有限公司 | Rectangular light distribution LED |
-
2010
- 2010-05-17 CN CN 201010174061 patent/CN101876407A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5959316A (en) * | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
| CN1836339A (en) * | 2002-08-30 | 2006-09-20 | 吉尔科有限公司 | Light emitting diode with improved effience |
| CN101163916A (en) * | 2005-04-26 | 2008-04-16 | 日本精机株式会社 | Lighting device and liquid crystal display device provided with such lighting device |
| CN1960016A (en) * | 2005-11-02 | 2007-05-09 | 西铁城电子股份有限公司 | Light emitting diode |
| CN201349021Y (en) * | 2008-12-25 | 2009-11-18 | 厦门华联电子有限公司 | Rectangular light distribution LED |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013020415A1 (en) * | 2011-08-08 | 2013-02-14 | 浙江生辉照明有限公司 | Lens applied to led lamp |
| CN102709454A (en) * | 2012-05-30 | 2012-10-03 | 上舜照明（中国）有限公司 | Surface-roughened double-layer adhesive structure LED light source and manufacturing method thereof |
| CN103090319A (en) * | 2012-12-20 | 2013-05-08 | 康佳集团股份有限公司 | Lamp bar of liquid crystal display (LCD) television and directly-down type backlight module |
| CN103292174A (en) * | 2013-04-28 | 2013-09-11 | 杭州杭科光电股份有限公司 | 2 pi luminous LED (Light Emitting Diode) light source module |
| CN104141889A (en) * | 2013-05-08 | 2014-11-12 | 欧普照明电器（中山）有限公司 | An illumination lamp |
| CN104613373A (en) * | 2013-11-05 | 2015-05-13 | 岭南大学校产学协力团 | Light emitting diode light box |
| CN106931320A (en) * | 2014-09-22 | 2017-07-07 | 欧普照明电器（中山）有限公司 | A kind of LED lamp and its LED light source module |
| CN105508906A (en) * | 2014-09-22 | 2016-04-20 | 欧普照明电器（中山）有限公司 | LED lamp and LED light source module |
| CN105180092A (en) * | 2015-10-23 | 2015-12-23 | 欧普照明股份有限公司 | Lens and light source module |
| WO2017148075A1 (en) * | 2016-03-03 | 2017-09-08 | 深圳欧菲光科技股份有限公司 | Imaging module and electronic device |
| CN111357123A (en) * | 2017-11-14 | 2020-06-30 | Lg伊诺特有限公司 | Lighting module and lighting device comprising same |
| US11658266B2 (en) | 2017-11-14 | 2023-05-23 | Lg Innotek Co., Ltd. | Lighting module and lighting apparatus having same |
| US11949042B2 (en) | 2017-11-14 | 2024-04-02 | Lg Innotek Co., Ltd. | Lighting module and lighting apparatus having same |
| CN111357123B (en) * | 2017-11-14 | 2024-01-16 | Lg伊诺特有限公司 | Lighting module and lighting device comprising the same |
| CN109256051A (en) * | 2018-09-20 | 2019-01-22 | 深圳市海讯高科技术有限公司 | A kind of COB display screen and its packaging method |
| WO2020197172A1 (en) * | 2019-03-22 | 2020-10-01 | 엘지이노텍 주식회사 | Lighting module and lighting apparatus having same |
| US11428372B2 (en) | 2019-03-22 | 2022-08-30 | Lg Innotek Co., Ltd. | Lighting module and lighting device comprising same |
| US11531153B2 (en) | 2019-03-22 | 2022-12-20 | Lg Innotek Co., Ltd. | Lighting module and lighting device comprising same |
| US11543579B2 (en) | 2019-03-22 | 2023-01-03 | Lg Innotek Co., Ltd. | Lighting module and lighting device comprising same |
| US11614208B2 (en) | 2019-03-22 | 2023-03-28 | Lg Innotek Co., Ltd. | Lighting module and lighting device comprising same |
| WO2020197173A1 (en) * | 2019-03-22 | 2020-10-01 | 엘지이노텍 주식회사 | Lighting module and lighting apparatus comprising same |
| US11828969B2 (en) | 2019-03-22 | 2023-11-28 | Lg Innotek Co., Ltd. | Lighting module and lighting device comprising same |
| US11841525B2 (en) | 2019-03-22 | 2023-12-12 | Lg Innotek Co., Ltd. | Lighting module and lighting device comprising same |
| WO2020197174A1 (en) * | 2019-03-22 | 2020-10-01 | 엘지이노텍 주식회사 | Lighting module and lighting device comprising same |
| US11946607B2 (en) | 2019-03-22 | 2024-04-02 | Lg Innotek Co., Ltd. | Lighting module and lighting device comprising same |
| WO2020197171A1 (en) * | 2019-03-22 | 2020-10-01 | 엘지이노텍 주식회사 | Lighting module and lighting device comprising same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101876407A (en) | LED light source module | |
| TWI447450B (en) | Light guide panel, backlight module, and manufacturing method thereof | |
| CN105319773A (en) | Backlight module and liquid crystal display device | |
| US8870431B2 (en) | Light mixing module | |
| JP5511524B2 (en) | Sealing sheet for optical semiconductor | |
| CN101639181A (en) | Direct type backlighting system | |
| CN104006334A (en) | Backlight module and display device | |
| CN201526868U (en) | Direct type backlight system | |
| US9960323B2 (en) | LED module and its manufacturing process | |
| CN101865378A (en) | LED surface light-emitting lamp | |
| CN103791455A (en) | Side edge type backlight module and manufacturing method thereof and display device | |
| CN101859759A (en) | White LED light source package | |
| CN201293226Y (en) | LED bar light source | |
| CN101867004A (en) | Light source module based on remote fluorescent powder | |
| CN106601897A (en) | Method for manufacturing chip on board (COB) light source with white adhesive surface package | |
| CN1925176A (en) | Integrated light emitting device and method for making same | |
| CN207097818U (en) | A kind of high colour gamut led lamp beads and its backlight of bluish-green dual chip collocation red fluorescence powder | |
| CN206754927U (en) | One kind is added lustre to type LED backlight light-emitting device | |
| CN202012778U (en) | Light mixing LED (light-emitting diode) white lamp with high color rendering index | |
| CN101980385A (en) | Method for encapsulating light-emitting diode (LED), LED and LED illumination device | |
| CN201628173U (en) | LED lamp | |
| CN102214770B (en) | Light-emitting diode (LED) planar light source support and light-emitting diode (LED) planar light source with same | |
| CN102095092A (en) | Wafer level packaging structure and method for LED (light emitting diode | |
| CN101520570A (en) | Light emitting device, backlight module and a flat panel display | |
| CN204178089U (en) | A kind of LED backlight and LED backlight module of exempting from secondary lens |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20101103 |