CN1925176A - Integrated light emitting device and method for making same - Google Patents
Integrated light emitting device and method for making same Download PDFInfo
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- CN1925176A CN1925176A CNA2005100958420A CN200510095842A CN1925176A CN 1925176 A CN1925176 A CN 1925176A CN A2005100958420 A CNA2005100958420 A CN A2005100958420A CN 200510095842 A CN200510095842 A CN 200510095842A CN 1925176 A CN1925176 A CN 1925176A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
This invention discloses one integral eradiation device, which comprises the following steps: one baseboard; one light part fixed on baseboard; one reflection layer with one mode round light part; one sealing layer round light pat to process mode with reflection surface; one prism lens covering one the sealing layer and fixing on the reflection layer and to change generation lines.
Description
Technical field
The present invention relates to a kind of light emitting devices and manufacture method thereof, particularly relate to a kind of integrated light emitting device and manufacture method thereof.
Background technology
(Light emitting diodes LED) has advantages such as tool low driving voltage and high-luminous-efficiency, makes LED extensively be applied to fields such as display and light-emitting device owing to light-emitting diode.
As shown in Figure 1, general with the encapsulating structure of LED12 as the light emitting devices of light source, be to drill through required cup-shaped groove 110 with drilling technique at a printed circuit board (PCB) 11 end faces earlier mostly, make this cup-shaped groove 110 have a cup-shaped cell wall, and plate metallic reflection material in order to reflection ray (figure does not show), but and form the reflecting surface 10 of a reflection ray in this cell wall.And then a LED12 is fixed in assembling in this cup-shaped groove 110, and is electrically connected this ED12 and printed circuit board (PCB) 11 with lead 13.By the design of this reflecting surface 10, can make most of light of LED12 directive reflecting surface 10 can be, and penetrate, and then reach light and concentrate and the effect that increases brightness by cup-shaped groove 110 openings via the reflection of reflecting surface 10.Some design also can be in this cup-shaped groove 110 filling moulding one coat the transparent encapsulated layer 14 of this LED12; can protect LED12 on the one hand; on the other hand also can be by the exterior design of this encapsulated layer 14, make this transparent encapsulated layer 14 can be used as lens in order to refracted ray.
But the above-mentioned method that drills through cup-shaped groove 110 on printed circuit board (PCB) 11 has many shortcomings: (1) cup-shaped groove processing procedure is complicated.Except holing, still needing to cooperate makes Precision Machining steps such as the smooth precise finiss of these cup-shaped groove 110 cell walls, polishing, easily because of a step mistake wherein, and has a strong impact on the light reflection efficiency of cup-shaped groove 110, and grinding, polishing process are quite consuming time.(2) grind, polishing weares and teares easily with drill bit, and causes the cell wall out-of-flatness, and then influence the light reflection efficiency of reflecting surface 10, so must be often bit change more, cause processing cost higher.(3) be subject to boring and polishing grinding equipment, the external form of cup-shaped groove 110 can only be designed to round aecidioid mostly, makes that the reflection angle of reflecting surface 10 is limited.(4) adsorption strength of the coat of metal of formation reflecting surface 10 and cup-shaped groove 110 cell walls is not enough, in the temperature changing process that the each work done of light-emitting device produces, reflecting surface 10 coating may peel off, and make transparent encapsulated layer 14 and 11 of printed circuit board (PCB)s produce boundary, and then can cause the decay of the light that reflects, and reduce the reliability of product.
Therefore, the reflection performance of the cup-shaped reflecting surface of making in this way 10 is not good, for remedying this shortcoming, normally utilize extra complicated processing procedure on cup-shaped groove 110, to form this boss sphere shape encapsulated layer 14, so that utilize the lens effect of the sphere profile of this encapsulated layer 14 to increase brightness.
No. 5043716 patent case of United States Patent (USP) just provides a kind of similar method, this patent case is earlier to have most one to be array distribution and to add encapsulating material in the mould of down protruding rounded channels respectively, and then down insert a reflecting plate that has been pre-formed the cup-shaped hole of most corresponding above-mentioned rounded channels in the mould, encapsulating material is squeezed into is filled in the cup-shaped hole, at last, a circuit substrate that has been fixed with the light-emitting diode of most corresponding above-mentioned cup-shaped holes arrangement modes is down attached be fixed in the reflecting plate end face again.But, to be that processing procedure is too complicated wait a moment the shortcoming of this mode, and this kind is not good with the winding intensity that independent molded and shaped reflecting plate splices on circuit substrate yet, except whole step is complicated, does not have special optical performance yet and need have certain thickness and hardness though make for transparent acrylic the following protuberance position of formation rounded channels.Generally speaking also be not suitable for being used for the flexible circuit board of moulding thin type for these No. 5043716.
Summary of the invention
The object of the present invention is to provide a kind of optical performance good and make comparatively simple and rapid integrate shaped type light emitting devices.
A further object of the present invention is to provide a kind of thickness can be thin and in conjunction with the innovative approach of stable integrate shaped type light emitting devices.
Integrated light emitting device of the present invention comprises a substrate, and at least one luminous element that is fixed on this substrate, it is characterized in that: also comprise one around this integrally moulded moulding in luminous element ground on this substrate and have one and seal this integrally moulded moulding in luminous element ground on this substrate and the encapsulated layer affixed with the reflecting surface in this reflector around the reflector, of the reflecting surface of this luminous element, and one covers the water chestnut mirror film that this encapsulated layer ground pastes the ejaculation angle that is fixed in the light that also can change this luminous element generation on this reflector and encapsulated layer.
The manufacture method of integrated light emitting device of the present invention is characterized in that: this manufacture method comprises:
Prepare a substrate;
Borrow the mode of metaideophone moulding, put substrate in a molding cave and in die cavity in the one-body molded reflector of substrate top surface, and match with this substrate define an opening cup-shaped groove up when moulding in this reflector;
The zone that is arranged in this cup-shaped groove in this substrate is electrically connected at least one luminous element;
Borrow the mode of metaideophone moulding, put substrate after abovementioned steps is finished and in a molding cave and in die cavity, in this cup-shaped groove, one-body molded one coat this luminous element and be fixed in encapsulated layer on this substrate and the reflector; And
One water chestnut mirror film pasted be fixed in this encapsulated layer surface.
Description of drawings
Below in conjunction with drawings and Examples integrated light emitting device of the present invention and manufacture method thereof are elaborated, in the accompanying drawing:
Fig. 1 is the side-looking generalized section of general light emitting devices;
Fig. 2 is the side-looking generalized section of an embodiment of integrated light emitting device of the present invention;
Fig. 3 is the schematic diagram of this embodiment with a metaideophone shaping mechanism moulding one reflector;
Fig. 4 is the schematic diagram of this embodiment with metaideophone shaping mechanism moulding one encapsulated layer;
Fig. 5 is the step of manufacturing flow chart of this embodiment;
Fig. 6 is the side-looking generalized section of this embodiment flow process in moulding one reflector on a substrate;
Fig. 7 is in order to the side cutaway view at the mold in this this reflector of substrate top surface moulding;
Fig. 8 is the top plan view of Fig. 7 A-A along the line;
Fig. 9 is in order to the side cutaway view at the mold in this this reflector of substrate top surface moulding;
Figure 10 is the top plan view of Fig. 9 B-B along the line;
Figure 11 is in order to the side cutaway view at the mold in this this reflector of substrate top surface moulding;
Figure 12 is the top plan view of Figure 11 C-C along the line;
Figure 13 be this embodiment with a luminous element and a lead fixed side-looking generalized section on this substrate;
Figure 14 is this embodiment moulding one encapsulated layer in a cup-shaped groove, and pastes the side-looking generalized section of the flow process of a water chestnut mirror film on this encapsulated layer;
Figure 15 is that the water chestnut mirror film of this embodiment pastes the local enlarged diagram of the side-looking section that is fixed in this encapsulated layer and reflector end face;
Figure 16 is the most reflection grooves of this embodiment moulding on a substrate, and the side-looking generalized section of a luminous element is set in each reflection groove.
Embodiment
As shown in Figure 2, the embodiment of integrated light emitting device of the present invention comprises a horizontal base plate 3, be shaped in these substrate 3 end faces and luminous element 5, that the reflector 4, that constitutes an opening cup-shaped groove 40 up of matching with this substrate 3 is fixed in these substrate 3 end faces and is arranged in this cup-shaped groove 40 be electrically connected this substrate 3 and 5 of this luminous elements lead 6, be shaped in this cup-shaped groove 40 and coat an encapsulated layer 7 of this luminous element 5 and lead 6, and one covers the smooth water chestnut mirror film 8 that is fixed in this reflector 4 and encapsulated layer 7 end faces that pastes in these encapsulated layer 7 ground.And this reflector 4 has an annular reflex face 41 that defines these cup-shaped groove 40 groove edge.
Cooperate shown in Fig. 3,4, relevant integrated mode, embodiments of the invention are the moulds that substrate 3 placed ejection formation, utilize the mode of ejection formation to be shaped in reflector 4 and encapsulated layer 7 on the substrate 3 respectively step by step, wherein the mode of ejection formation is to use metaideophone formula molding mode (transfer molding), so that moulding is thin, flat and during the thermoplasticity primary structural component of many grooves shape, have preferable moulding quality and homogeneity, particularly when the present invention be when being used in the plane light-emitting device of matrix form or informal style plurality of LEDs Boulez.Present embodiment is to adopt metaideophone formula molding mode to come moulding to have the lamellar reflector 4 and this encapsulated layer 7 of most cup-shaped grooves 40, because metaideophone formula moulding (transfer molding) technology be frequent adopted technology in the one ejection formation field, below be summarized as follows with regard to the mode of metaideophone forming technique in moulding reflector 4 of the present invention.
Mainly be by pedestal 211 end faces that this substrate 3 placed a metaideophone shaping mechanism 21, metaideophone shaping mechanism 21 comprises that one comprises the mould of mold 213 and bed die 212, this pedestal 211 is placed on the bed die 212, cup-shaped groove 40 profiles that cooperate the moulding of wanting then, pairing mold 213 is assembled in bed die 212 tops, and the cup-shaped portion of protruding downwards with one 214 abuts against in substrate 3 end faces, put substrate 3 whereby in a molding cave 210, to insert one in order to the moulding material 20 that constitutes reflector 4 then squeezes in the heated chamber 220 of groove 22, and by heater 23 with moulding material 20 heating, simultaneously with in the moulding material 20 extruding injection moulding mechanisms 21 of a pressure ram 24 with the melting state, and fill up the die cavity 210 of 213 of whole base plate 3 and molds, material 20 hardenings by cooling to be formed and with mould 212, after 213 dismountings, just can obtain having the reflector 4 of required cup-shaped groove 40.As a same reason, the method for making of this encapsulated layer 7 is roughly the same, and just mold 213 profile differences as shown in Figure 4, therefore no longer describe in detail.Metaideophone formula moulding (transfer molding) can be filled part and melting equably with moulding material before injection die cavity 210, and inject die cavity 210 apace, the flowability of raising in die cavity 210, therefore in thin die cavity 210, still can evenly flow, make the uniform in shaping in reflector 4, can obtain smooth and uniform optimal light reflection performance at cup-shaped reflecting surface 41, again can moulding thin reflector 4, when particularly containing the light reflective particle in the moulding material, the light reflective particle can be evenly distributed in reflecting surface 41 zones, and effect is taken advantage of in water chestnut mirror film 8 own the highest the adding of optical performance that give above it, is detailed later about this point.In addition, this case utilizes the cup-shaped portion 214 that mold 213 protrudes to abut against in substrate 3 end faces downwards, the required cup-shaped groove 40 that can be shaped according to this, very convenient, and can be by changing the shape that difform cup-shaped portion 214 change cup-shaped groove 40 as long as change different molds.
Shown in Fig. 2,5,6, just below describe at each step of the manufacture method of this integrated light emitting device.
That at first, carries out step 201 prepares substrate 3.This substrate 3 is to be made by the material of high temperature resistant, resist chemical and tool conductive characteristic.In the present embodiment, this substrate 3 is that (printed circuit board, PCB), and this printed circuit board (PCB) can be sheet type or the flexible printed circuit board (PCB) of tool to printed circuit board (PCB).During enforcement, this substrate 3 also can be ceramic wafer or the lead frame (lead frame) that is laid with lead, does not exceed with above-mentioned kenel when still implementing.
Then, carry out the cup-shaped groove 40 of moulding of step 202.This substrate 3 is arranged in the metaideophone shaping mechanism, and cup-shaped groove 40 profiles of moulding that foundation is desired, one cup-shaped portion 214 of being scheduled to the mold 213 of profile is abutted against in substrate 3 end faces, shown in Fig. 6 first half, again around cup-shaped portion 214 with metaideophone formula molding mode, moulding should with the reflector 4 of matching and defining cup-shaped groove 40 with this substrate 3, treat that mold 213 removes after, just can obtain the cup-shaped groove 40 of required profile, shown in Fig. 6 Lower Half.
In the present embodiment, the cup-shaped portion 214 of this mold 213 broadens from lower to upper gradually for external diameter and cross section is circle, and the frusto-conical thing of smooth outer surface, therefore, this cup-shaped groove 40 is that correspondence is opening frusto-conical up, during enforcement, these mold 213 cross sections also can be oval or tetragonal, but when implementing, the cup-shaped portion 214 of this mold 213 is exceeded with above-mentioned kenel with cup-shaped groove 40 profiles of institute's moulding are neither, can according to desire reflecting surface 41 structures of moulding and select required external form.And this reflector 4 is to be made by epoxy resin (epoxy resin), high molecular polymer, silica gel (silicone), plastics, metal or above blend compositions.During enforcement, be embedded into metallics, pigment, nanoparticle or the above light reflecting materials such as mixed component that can make these reflecting surface 41 reflection rays but can in above-mentioned material, mix.
Shown in Fig. 5,13, behind the required cup-shaped groove 40 of moulding, just the fixing electrical connecting wire 6 of luminous element 5 and step 204 of the assembling that can carry out step 203.This luminous element 5 is to paste to be fixed in this substrate 3 and to be arranged in 40 area surrounded of cup-shaped groove, and with this lead 6 electrical connections this luminous element 5 and substrate 3, the driving voltage that this luminous element 5 can be exported by substrate 3 drives and luminous, and make the light of directive reflecting surface 41, can reflect opening, and light is concentrated to this cup-shaped groove 40.In the present embodiment, this luminous element 5 is the light-emitting diode of GaN, InGaN, AlInGaP or GaP kenel, and the wave-length coverage of the light that produces is to be situated between at ultraviolet light (ultraviolet, UV) district and infrared light (infrared, IR) interval, but when implementing, this luminous element 5 also can be anyly to be subjected to driven and luminous electronic component, and can be arranged in 40 area surrounded of this cup-shaped groove in these substrate 3 end faces more than one luminous element 5 is set, but when implementing, the kenel of this luminous element and quantity are neither as limit.
Shown in Fig. 5,14, and then, carry out the moulding encapsulated layer 7 of step 205.The substrate 3 of fixing luminous element 5 and lead 6 is placed metaideophone formula shaping mechanism again, and the encapsulating material metaideophone formula that will constitute encapsulated layer 7 takes shape in the whole cup-shaped groove 40, and in this cup-shaped groove 40 an one-body molded embedding luminous element 5 and lead 6, and the encapsulated layer 7 affixed with this reflecting surface 41, and this encapsulated layer 7 is contour with this reflector 4.In the present embodiment, this encapsulated layer 7 is to be made by the transparent epoxy resin of tool high light line penetrance, and except can protecting luminous element 5, the light that luminous element 5 is produced can intactly penetrate.During enforcement, this encapsulated layer 7 also can be made by encapsulating materials such as transparent polymer polymer, silica gel or plastics, and can state in last encapsulation and add light-converting material (light converting material) in the material, this light-converting material comprises light diffusate (diffusing bodies), coloured dye (color dyes), pigment (pigments), ultraviolet light material (UV inhibitor) or above mixed component, the ejaculation that can help light whereby with excite (emission and excitation), but when implementing not as limit.
That then, carries out step 206 pastes water chestnut mirror film (prism film) 8.To cover the mode of this encapsulated layer 7, smooth pasting is fixed in this encapsulated layer 7 and reflector 4 end faces, at this moment, just finishes integrated light emitting device of the present invention with water chestnut mirror film 8.
Shown in the partial enlarged drawing of cooperation Figure 15, this water chestnut mirror film 8 is the blooming piece of a kind of tool trickle rill 80 surfaces and tool light-guiding function, in the present embodiment, the product that this water chestnut mirror film 8 is produced for 3M company, product type is VikuitiTM Brightness Enhancement Film (BEF)-III10T, it is a kind of semi-transparent film with most trickle rill 80 body structure surfaces, above-mentioned trickle rill 80 cross sections are water chestnut mirror structure, can will penetrate in the cup-shaped groove 40 of light reflected back of cup-shaped groove 40 via the angular regions beyond the general angular field of view, and via the reflection again of reflecting surface 41, and penetrate by preferable angular field of view, and then make the light that penetrates cup-shaped groove 40 to concentrate, reach the effect that highlights.In the present embodiment, be to carry out pasting of water chestnut mirror film 8 with transparent adhesive agent or optical cement, but when implementing not as limit.
Behind the completing steps 206, if the light emitting devices that manufacturing is finished is the structure with most cup-shaped grooves 40 and luminous element 5, as shown in figure 16, just can optionally and in regular turn carry out the cutting of step 207, the functional test of step 208, and the winding of step 209 assembling (tapping).This light emitting devices is cut into most the little luminescence units that only have single cup-shaped groove 40 and luminous element 5 respectively, and carry out functional test and winding assembling at luminescence unit.Because being all with the winding assembling, cutting, functional test have the knack of the technology that this operator institute often adopts, and non-improvement emphasis of the present invention, so detailed description no longer.
In addition, more than one luminous element 5 and lead 6 can be set in each cup-shaped groove 40 also during enforcement, thereby can improve the light luminance that penetrates each cup-shaped groove 40, but when implementing not as limit.
Take a broad view of above-mentioned, the design of one-body molded reflector 4 and encapsulated layer 7 by metaideophone formula molding mode in these substrate 3 end faces, can make the reflector 4, encapsulated layer 7 and 3 of the substrates that mutually combine have preferable bond strength, and the thin and reflector 4 uniformly of moulding when needing helping; Moreover, 3 preferable bond strength structures of reflector 4 that the metaideophone moulding is constituted and encapsulated layer 7 and substrate, in flexual structure, can relatedly improve water chestnut mirror film 8 and paste fastness, and this cup-shaped groove 40 has the preferable exterior design degree of freedom, as long as utilize the profile of the cup-shaped portion 214 of this mold 213 to change, just can be according to the needs in the design, the cup-shaped groove 40 of the required profile of moulding.And by the uniform and smooth cup-shaped reflecting surface of metaideophone method of forming institute moulding, the brightness that the light of cup-shaped groove 40 openings of raising directive can produce, make the optical characteristics of this water chestnut mirror film 8 on the LED product, perform to best efficiency, and then the optical performance of light-emitting device integral body is promoted again, do not need extra moulding domed lens structure.Add the ultra-thin characteristic of this water chestnut mirror film 8, can improve the thinning degree of black box.
In addition, reflector 4 is many with the selectivity of encapsulated layer 7 moulding materials, and reflector 4 is easy to control with encapsulated layer 7 thickness, and can be in a large amount of simultaneously required cup-shaped groove 40 and the encapsulated layers 7 made of substrate 3 end faces, therefore, except being applicable to the large-scale light emitting devices of development slimming array, also be applicable to and cooperate flexible electric circuit board to make flexible light emitting devices, and whole manufacturing cost is far below the cost of Precision Machining programs such as boring on printed circuit board (PCB) 11, grinding, polishing, and the quality bills of materials of light emitting devices also is easy to control.
Comprehensive above-mentioned each advantage makes integrated light emitting device of the present invention have goodish application development potentiality.Therefore, very practical really and progressive.
Claims (28)
1. integrated light emitting device, comprise a substrate, and at least one luminous element that is fixed on this substrate, it is characterized in that: this integrated light emitting device also comprises one around the reflector of integrally moulded moulding on this substrate, this luminous element ground, one seals the encapsulated layer of the integrally moulded moulding in this luminous element ground on this substrate, reach one and paste the water chestnut mirror film that is fixed on this encapsulated layer and can concentrates the light of this luminous element generation with covering this encapsulated layer, this water chestnut mirror film surface has most microgroove rills, above-mentioned trickle rill cross section is water chestnut mirror structure, match with substrate and define a cup-shaped groove with external opening in this reflector, and this cup-shaped groove has one around this luminous element and the reflecting surface affixed with encapsulated layer.
2. a kind of integrated light emitting device as claimed in claim 1 is characterized in that: this substrate is a printed circuit board (PCB).
3. a kind of integrated light emitting device as claimed in claim 2 is characterized in that: this substrate is the flexible printed circuit board (PCB) of tool.
4. a kind of integrated light emitting device as claimed in claim 1 is characterized in that: this substrate is a ceramic wafer.
5. a kind of integrated light emitting device as claimed in claim 1 is characterized in that: this substrate is a lead frame.
6. a kind of integrated light emitting device as claimed in claim 1 is characterized in that: this luminous element is a light-emitting diode.
7. a kind of integrated light emitting device as claimed in claim 1 is characterized in that: this reflector and encapsulated layer are molded and shaped by epoxide resin material.
8. a kind of integrated light emitting device as claimed in claim 1 is characterized in that: this reflector and encapsulated layer are by the silica gel material mold casting forming.
9. a kind of integrated light emitting device as claimed in claim 1 is characterized in that: the reflecting surface in this reflector is mixed with the material that can reflect the light that this luminous element produces.
10. a kind of integrated light emitting device as claimed in claim 9 is characterized in that: this reflector is to be made by the epoxy resin that is embedded with metallics and/or nanoparticle.
11. a kind of integrated light emitting device as claimed in claim 9 is characterized in that: this reflector is to be made by the silica gel that is embedded with metallics and/or nanoparticle.
12. a kind of integrated light emitting device as claimed in claim 1 is characterized in that: the cup-shaped groove in this reflector has multiple different profile.
13. a kind of integrated light emitting device as claimed in claim 1 is characterized in that: this reflector is to be tabular and/or lamellar structure.
14. a kind of integrated light emitting device as claimed in claim 1 is characterized in that: this encapsulated layer is molded and shaped by transparent epoxy resin.
15. a kind of integrated light emitting device as claimed in claim 1 is characterized in that: this encapsulated layer is to be made by the epoxy resin with light-converting material.
16. a kind of integrated light emitting device as claimed in claim 15 is characterized in that: the light-converting material of the epoxy resin of this encapsulated layer of moulding is the colony that is formed of mixing that is selected from light diffusate, coloured dye, uvioresistant material and light diffusate, coloured dye and uvioresistant material.
17. the method in order to the manufacturing integrated light emitting device, it is characterized in that: this manufacture method comprises:
Prepare a substrate;
Borrow the mode of metaideophone moulding, put substrate in the die cavity of a molding tool and in die cavity in the one-body molded reflector of substrate top surface, and match with this substrate define an opening cup-shaped groove up when moulding in this reflector;
The zone that is arranged in this cup-shaped groove in this substrate is electrically connected at least one luminous element;
Borrow the mode of metaideophone moulding, the substrate after abovementioned steps is finished places the die cavity of a molding tool and coats this luminous element and be fixed in encapsulated layer on this substrate and the reflector in this cup-shaped groove one-body molded at die cavity; And
One water chestnut mirror film pasted be fixed in this encapsulated layer surface.
18. it is as claimed in claim 17 a kind of in order to make the method for integrated light emitting device, it is characterized in that: the manufacture method in this metaideophone moulding reflector, be by mould with a cup-shaped portion identical with the cup-shaped groove profile of desire moulding, cup-shaped portion is supported behind substrate top surface, around this cup-shaped portion, use with matching to define the reflector of this cup-shaped groove with this substrate with the moulding of metaideophone formula.
19. as claimed in claim 18 a kind of in order to make the method for integrated light emitting device, it is characterized in that: the replaceable difformity of cup-shaped portion.
20. as claimed in claim 18 a kind of in order to make the method for integrated light emitting device, it is characterized in that: this cup-shaped portion has the smooth exterior surface face.
21. as claimed in claim 18 a kind of in order to make the method for integrated light emitting device, it is characterized in that: the external diameter of this cup-shaped portion is to broaden gradually from lower to upper and the cross section ovalize.
22. as claimed in claim 18 a kind of in order to make the method for integrated light emitting device, it is characterized in that: the external diameter of this cup-shaped portion be broaden gradually from lower to upper and cross section rounded.
23. as claimed in claim 18 a kind of in order to make the method for integrated light emitting device, it is characterized in that: the external diameter of this cup-shaped portion be broaden gradually from lower to upper and cross section rectangular.
24. as claimed in claim 17 a kind of in order to make the method for integrated light emitting device, it is characterized in that: be epoxy resin this reflector of moulding on this substrate to contain light reflecting material.
25. as claimed in claim 24 a kind of in order to make the method for integrated light emitting device, it is characterized in that: but be embedded with the metallics and/or the nanoparticle that can make this reflector reflection ray in this epoxy resin.
26. as claimed in claim 17 a kind of in order to make the method for integrated light emitting device, it is characterized in that: be with this encapsulated layer of transparent epoxy resin moulding.
27. as claimed in claim 17 a kind of in order to make the method for integrated light emitting device, it is characterized in that: encapsulated layer comprises light-converting material.
28. as claimed in claim 27 a kind of in order to make the method for integrated light emitting device, it is characterized in that: this light-converting material is the colony that is formed of mixing that is selected from light diffusion body, coloured dye, uvioresistant material and light diffusate, coloured dye and uvioresistant material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100958420A CN1925176A (en) | 2005-09-02 | 2005-09-02 | Integrated light emitting device and method for making same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100958420A CN1925176A (en) | 2005-09-02 | 2005-09-02 | Integrated light emitting device and method for making same |
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| CN1925176A true CN1925176A (en) | 2007-03-07 |
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| CNA2005100958420A Pending CN1925176A (en) | 2005-09-02 | 2005-09-02 | Integrated light emitting device and method for making same |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102779919A (en) * | 2011-05-12 | 2012-11-14 | 展晶科技(深圳)有限公司 | Semiconductor encapsulation structure |
| CN103000785A (en) * | 2012-11-05 | 2013-03-27 | 何忠亮 | LED luminous structure and method for manufacturing same |
| CN106601898A (en) * | 2015-10-19 | 2017-04-26 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure |
| CN108008570A (en) * | 2016-10-27 | 2018-05-08 | 船井电机株式会社 | Display device |
| CN108511566A (en) * | 2018-03-13 | 2018-09-07 | 广东省半导体产业技术研究院 | A kind of LED production method |
| CN109373278A (en) * | 2018-10-11 | 2019-02-22 | 孟秋维 | A kind of electronic intelligence joint trimming agent |
| CN114361319A (en) * | 2021-07-28 | 2022-04-15 | 友达光电股份有限公司 | Display panel and method for manufacturing the same |
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- 2005-09-02 CN CNA2005100958420A patent/CN1925176A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102779919A (en) * | 2011-05-12 | 2012-11-14 | 展晶科技(深圳)有限公司 | Semiconductor encapsulation structure |
| CN102779919B (en) * | 2011-05-12 | 2015-07-08 | 展晶科技(深圳)有限公司 | Semiconductor encapsulation structure |
| CN103000785A (en) * | 2012-11-05 | 2013-03-27 | 何忠亮 | LED luminous structure and method for manufacturing same |
| CN106601898A (en) * | 2015-10-19 | 2017-04-26 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure |
| CN108008570A (en) * | 2016-10-27 | 2018-05-08 | 船井电机株式会社 | Display device |
| CN108008570B (en) * | 2016-10-27 | 2021-01-29 | 船井电机株式会社 | Display device |
| CN108511566A (en) * | 2018-03-13 | 2018-09-07 | 广东省半导体产业技术研究院 | A kind of LED production method |
| CN109373278A (en) * | 2018-10-11 | 2019-02-22 | 孟秋维 | A kind of electronic intelligence joint trimming agent |
| CN114361319A (en) * | 2021-07-28 | 2022-04-15 | 友达光电股份有限公司 | Display panel and method for manufacturing the same |
| CN114361319B (en) * | 2021-07-28 | 2023-06-27 | 友达光电股份有限公司 | Display panel and manufacturing method thereof |
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