CN108511566A - A kind of LED production method - Google Patents
A kind of LED production method Download PDFInfo
- Publication number
- CN108511566A CN108511566A CN201810206524.4A CN201810206524A CN108511566A CN 108511566 A CN108511566 A CN 108511566A CN 201810206524 A CN201810206524 A CN 201810206524A CN 108511566 A CN108511566 A CN 108511566A
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- Prior art keywords
- groove
- emitting diode
- production method
- light
- identification point
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
Abstract
The embodiment of the present invention proposes a kind of LED production method, is related to technical field of semiconductors.Pass through the base board of Light-Emitting Diode of the making with polarity identification point, then luminescence chip corresponding with polarity identification point position in the groove of each pedestal is installed and carry out die bond, then by die bond, the technique drying and cut, make formed include polarity identification point light emitting diode.LED production method provided by the invention has the light emitting diode made more beautiful, the advantages of being less prone to electrode reversed situation.
Description
Technical field
The present invention relates to technical field of semiconductors, in particular to a kind of LED production method.
Background technology
With the continuous development of LED industry, requirement of the upper, middle and lower reaches the LED industry to product is also increasingly harsher.Continuous
While pursuing high brightness, lean on reliability, it is desirable that the volume that shines is as small as possible, to downstream industry structure, heat dissipation and optical design
With some superiority.CSP (Chip Scale Package, chip size packages) this encapsulating structure is extensively sent out in the industry by LED
Concern, domestic and international major producer are directed to CSP and release corresponding product, are applied to mobile phone flashlight, car light, TV backlights and intelligence and shine
Bright equal fields.
But at present when carrying out CSP, the appearance of molding LED is bad, and during patch, it is susceptible to electrode
Reversed problem.
It is the emphasis of those skilled in the art's concern in view of this, how to solve the above problems.
Invention content
In view of this, the purpose of the present invention is to provide a kind of LED production method, to solve in the prior art
The appearance of diode after being encapsulated by CSP is bad, and electrode reversed problem is susceptible to during patch.
To achieve the goals above, technical solution used in the embodiment of the present invention is as follows：
An embodiment of the present invention provides a kind of LED production method, the LED production method includes：
Make the base board of the Light-Emitting Diode with polarity identification point；Wherein, the base board includes multiple band grooves
Pedestal；
Luminescence chip corresponding with the polarity identification point position is installed in the groove of each pedestal and is consolidated
It is brilliant；
Dispensing is carried out to the groove after die bond；
Base board after dispensing is dried, to form light emitting diode semi-finished product；
The light emitting diode semi-finished product are cut, to form more light emitting diodes, wherein every described luminous
Diode includes at least one polarity identification point.
Further, the step of base board for making the Light-Emitting Diode with polarity identification point includes：
White wall glue is injected into the mold pre-seted；
Baking molding is carried out to the white wall glue；To form the light-emitting base plate.
Further, described that the light emitting diode semi-finished product are cut, to form the step of more light emitting diodes
Suddenly include：
The light emitting diode semi-finished product are cut along the presetting position of the mold；
More Light-Emitting Diodes after cutting are taken out from the mold.
Further, before described the step of injecting white wall glue into the mold pre-seted, the making band polarized
The step of base board of the Light-Emitting Diode of identification point further includes：
In the surface adhesion adhesive film of the mold pre-seted, so that the white wall glue of injection is contacted with the adhesive film.
Further, the adhesive film includes release film, high temperature membrane or antiultraviolet film.
Further, baking molding is carried out to the white wall glue described；With the step of forming the light-emitting base plate it
Before, it is described make with polarity identification point Light-Emitting Diode base board the step of further include：
It is fitted closely using a pressing plate and the mold after the white wall glue of injection, and the white wall glue is contacted with the pressing plate.
Further, the groove to after die bond carries out the step of dispensing and includes：
Dispensing is carried out to the groove after die bond, so that the glue surface formed after dispensing is in the bottom notch to the groove
Arc.
Further, the groove to after die bond carries out the step of dispensing and includes：
A fluorescent glue is carried out to the groove after die bond.
Further, the groove to after die bond carries out the step of dispensing and includes：
It dusts to the groove after die bond；
A transparent adhesive tape is carried out to the groove after dusting.
Further, the polarity identification point includes convex block or recess.
Compared with the prior art, the invention has the advantages that：
The present invention provides a kind of LED production methods, pass through Light-Emitting Diode of the making with polarity identification point
Base board, then corresponding with polarity identification point position luminescence chip in the groove of each pedestal is installed and consolidated
Crystalline substance, then by die bond, the technique drying and cut, make formed include polarity identification point light emitting diode.On the one hand,
Since base board provided by the invention includes multiple identical pedestals, cutting is easy in cutting, and make the appearance after cutting
It is more beautiful.On the other hand, and due to being provided with polarity identification point, thus during later stage shoe plate making more easy to identify hair
The polarity of optical diode is less prone to the reversed situation of electrode.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment cited below particularly, and coordinate
Appended attached drawing, is described in detail below.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 shows the flow chart for the LED production method that the embodiment of the present invention provides.
Fig. 2 shows the schematic cross-sections that the embodiment of the present invention provides light emitting diode.
Fig. 3 shows the sub-step schematic diagram of the step S101 for Fig. 1 that the embodiment of the present invention provides.
Fig. 4 shows the sub-step schematic diagram of the step S103 for Fig. 1 that the embodiment of the present invention provides.
Icon：100- light emitting diodes；110- pedestals；120- luminescence chips；130- point glue-lines；140- polarity identification points.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Usually exist
The component of the embodiment of the present invention described and illustrated in attached drawing can be arranged and be designed with a variety of different configurations herein.Cause
This, the detailed description of the embodiment of the present invention to providing in the accompanying drawings is not intended to limit claimed invention below
Range, but it is merely representative of the selected embodiment of the present invention.Based on the embodiment of the present invention, those skilled in the art are not doing
The every other embodiment obtained under the premise of going out creative work, shall fall within the protection scope of the present invention.
It should be noted that：Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent attached drawing in a attached drawing.Meanwhile the present invention's
In description, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " connected ", " connection " shall be understood in a broad sense,
It for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be mechanical connection, can also be electricity
Connection；It can be directly connected, can also can be indirectly connected through an intermediary the connection inside two elements.For
For those skilled in the art, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.It ties below
Attached drawing is closed, is elaborated to some embodiments of the present invention.In the absence of conflict, following embodiment and embodiment
In feature can be combined with each other.
Fig. 1 is please referred to, an embodiment of the present invention provides a kind of 100 production method of light emitting diode, the light emitting diodes 100
Production method includes：
Step S101 makes 110 plate of pedestal of the Light-Emitting Diode with polarity identification point 140.
In the present embodiment, more rapid in order to process, include multiple pedestals 110 with groove on 110 plate of pedestal so that
All pedestals 110 can be processed simultaneously, multiple light emitting diodes 100 be formed, then again to multiple light emitting diodes
100 are cut, you can form single light emitting diode 100.Of course, in some other embodiments, 110 plate of pedestal
Also can only include a pedestal 110, i.e., the later stage, the present embodiment did not do this any restriction without the step of being cut.
Also, there is the reversed situation of motor during carrying out the patch of light emitting diode 100 in the later stage in order to prevent
Appearance, in the present embodiment, 110 strip polarized identification point 140 of pedestal.Wherein, each pedestal 110 of 110 plate of pedestal is equal
It is provided at least one memory identification point.
Wherein, step S101 includes：
Sub-step S1011, in the surface adhesion adhesive film of the mold pre-seted.
In the present embodiment, by the pedestal 110 of the Mold Making light emitting diode 100 pre-seted, in the production process,
It needs to inject white wall glue into mold, if due to directly injecting white wall glue on the surface of mold, due between packet wall glue and mold
It is easily adhered, so when taking out in the later stage, it is possible that the situation that pedestal 110 is impaired, to influence light emitting diode 100
Qualification rate.In view of this, in the present embodiment, one layer of adhesive film of surface adhesion first in the mold pre-seted is needed, thus
It is easier to take out when taking light emitting diode 100 up from 110 plate of pedestal.
It should be noted that in the present embodiment, adhesive film includes release film, high temperature membrane or antiultraviolet film etc. with double
The film of engineering is pasted in face, when needing to take out light emitting diode 100, due to the film with double faced adhesive engineering, so more
It is easy to take out and is hardly damaged light emitting diode 100.
Sub-step S1012 injects white wall glue into the mold pre-seted.
It after adhering to adhesive film, needs as injecting white wall glue in the mold, since the molding consistency of white wall glue is good, repeats
Property is good, so photochromic consistency is preferable in later stage dispensing operation.Of course, in some other embodiments, pedestal 110
Other materials can be used to be made, the present embodiment does not do this any restrictions.
In the present embodiment, multiple protrusions are provided on mold so that each pedestal 110 being made includes recessed
Slot, the groove is for placing luminescence chip 120.In the present embodiment, the slot bottom for the plane and groove that the notch of groove is formed
Plane is parallel and at default certainty ratio, and the area of the plane of the notch of groove is more than the area of the plane of the notch of groove,
To make 100 light-emitting zone of light emitting diode that a cup type structure be presented.
As a kind of realization method of the present embodiment, the section of the cell wall of groove is straight line, for example, the notch of groove is square
The slot bottom of shape, groove is also rectangle, and the cross section of groove tapers into from top to bottom.Since the pedestal 110 of the present embodiment makes
With white wall glue, thus it is reproducible, and white wall glue one-pass molding is utilized, slope is consistent, and chamfer length is also consistent, so to photoelectricity
Parameter influences smaller, concentration degree higher.
And it is further desired that explanation, the inclined-planes Bai Qiang of pedestal 110 contribute to light to extract so that provided in this embodiment
The brightness higher of the more common single side light emitting diode 100 made of SCP techniques of light emitting diode 100.Simultaneously as recessed
The area of the plane of the notch of slot is more than the area of the plane of the notch of groove, thus the light that sends out of luminescence chip 120 along to
The direction of external diffusion is propagated, and is conducive to illuminate.
As another realization method of the present embodiment, the section of the cell wall of groove is curve, for example, the notch of groove is
Rectangle, the slot bottom of groove are also rectangle, and the cross section of groove first becomes larger become smaller afterwards from top to bottom, so as to use meeting
When different demands.
Also, in the present embodiment, the groove of the pedestal 110 of light emitting diode 100 may be alternatively provided as other shapes, i.e., recessed
The notch of slot and the slot bottom of groove are set as his shape, such as triangle or circle, and the present embodiment does not do this any
It limits, staff need to only make different molds, then inject white wall glue in mold, you can white wall glue pedestal is made in drying
110.Meanwhile the angle of inclination of the cell wall of groove can be also arranged according to actual demand, staff can be by making no mould
Then tool injects white wall glue in mold, you can white wall pedestal 110 is made in drying.So in the present embodiment, to luminous two
The shape of the groove of pole pipe 100 and the gradient of cell wall do not do any restriction.
Step S1013 is fitted closely using a pressing plate and the mold after the white wall glue of injection, and the white wall glue and the pressure
Plate contacts.
In the present embodiment, it in order to keep the pedestal produced 110 more beautiful and prevent white wall glue body from flowing out, needs
It is fitted closely using a pressing plate and the mold after the white wall glue of injection, so that white wall glue is contacted with the pressing plate.
Sub-step S1014 carries out baking molding to the white wall glue；To form 110 plate of the pedestal.
In the present embodiment, since white wall glue has thermoplasticity, so needing white wall carrying out baking molding.Due to mold
It need to be put into togerther oven for baking, so mold provided in this embodiment is high-temperature resistance die.
It should be noted that due to being provided with polarity identification point 140 on mold, by the way that white wall glue is injected mold
Afterwards, it is corresponded at the polarity identification point 140 that the pedestal 110 that white wall glue is formed can be also arranged on mold and generates polarity identification point 140.
For example, when the polarity identification point 140 on mold is a convex block, then the polarity identification point 140 on the pedestal 110 is one recessed
It falls into；And when the polarity identification point 140 on mold is a recess, then the polarity identification point 140 on the pedestal 110 is one convex
Block.Also, in the present embodiment, polarity identification point 140 is set as convex block or recess, but in others so that in embodiment, pole
Property identification point 140 may be alternatively provided as other shapes, and the present embodiment does not do this any restriction.
Also, a kind of realization method realized as the present embodiment, polarity identification point 140 are set to the separate of pedestal 110
The end of groove, as another realization method that the present embodiment is realized, polarity identification point 140 is set to the groove of pedestal 110
Cell wall, the present embodiment do not do this any restriction.
Step S102 installs hair corresponding with 140 position of polarity identification point in the groove of each pedestal 110
Optical chip 120 simultaneously carries out die bond.
Behind pedestal 110 for producing light emitting diode 100, need to be respectively mounted hair in the groove of each pedestal 110
Optical chip 120 simultaneously carries out die bond operation.It should be noted that in the present embodiment, in order to keep the light of light emitting diode 100 equal
Even, luminescence chip 120 is installed on the center of the bottom of groove.Since luminescence chip 120 can regard a point light source as, so
In practical application, when luminescence chip 120 is placed in the centre position of bottom, the light that luminescence chip 120 is sent out can be along groove
Direction propagates out, and light is more uniform after the reflection of white wall.
Also, the luminescence chip 120 provided in the present embodiment uses LED chip, of course, in some other embodiments
In, LED chip can also use other chips, the present embodiment not to do any restriction to this.
Step S103 carries out dispensing to the groove after die bond.
After mounting after luminescence chip 120, in order to make luminescence chip 120 fix, after the present embodiment also needs to die bond
Groove carries out operation for dispensing glue, to form a glue-line 130.
Sub-step S1031 carries out a fluorescent glue to the groove after die bond.
As a kind of dispensing mode of the present embodiment, a fluorescent glue can be carried out to the groove after die bond, luminescence chip 120 is sent out
The light gone out is launched after fluorescent adhesive layer, on the one hand, by the way that fluorescent adhesive layer is arranged, can play protection luminescence chip 120
Effect；Since after fluorescent adhesive layer is arranged, luminescence chip 120 is not contacted with external environment, so will not touch
Dust impurity to extend the service life of luminescence chip 120120, and then also increases the use of entire light emitting diode 100
Service life.Also, by the way that fluorescent adhesive layer is arranged, it can also play the role of certain blocking external force, for example, working as light emitting diode 100
When by external force, external force will not directly act on the luminescence chip 120 of light emitting diode 100, but act on pedestal 110 with it is glimmering
Optical cement layer so that luminescence chip 120 is not damaged, and further extends the service life of light emitting diode 100.
Sub-step S1032 dusts to the groove after die bond.
As another dispensing mode of the present embodiment, can directly dust to the groove after die bond.
Sub-step S1033 carries out a transparent adhesive tape to the groove after dusting.
By way of dusting and adding some points transparent adhesive tape, effect identical with point fluorescent glue is used can be played.
Furthermore, it is desirable to explanation, in order to make in subpackage operation dispensing be to be not easy to adhere to suction nozzle, reduce board report an error and
Machine probability is manually adjusted, working hour and cost are saved, application end patch is that reduction board reports an error and manually rate is opened in adjustment, promotes production and imitates
Rate and yield save working hour and cost, and in the present embodiment, the glue surface after dispensing is in the arc to the bottom notch of groove.
Step S104 dries 110 plate of pedestal after dispensing, to form 100 semi-finished product of light emitting diode.
By being dried to 110 plate of pedestal after dispensing, you can obtain multiple light emitting diodes 100, at this time multiple hairs
Optical diode 100 keeps the state of adhesion, i.e., forms the semi-finished product of light emitting diode 100 at this time.
Step S105 cuts 100 semi-finished product of the light emitting diode, to form more light emitting diodes 100,
In, every light emitting diode 100 includes at least one polarity identification point 140.
After obtaining light emitting diode 100, light emitting diode 100 need to be cut, to form single light-emitting diodes
Pipe 100.
Wherein, step S105 includes：
Sub-step S1051 cuts 100 semi-finished product of the light emitting diode along the presetting position of the mold.
In the present embodiment, due to the pedestal 110 using Mold Making light emitting diode 100, so can be directly in mold
On cut, and on mold preset be equipped with cutting position.It on the one hand, can by the preset cutting position along mold
It is that cutting is more convenient, to promote service speed.On the other hand, due in mold preset cutting position will can each send out
Optical diode 100 is uniformly arranged, so operation is more beautiful in cutting, and be not in it is uneven and the case where.
Sub-step S1052 takes out more Light-Emitting Diodes after cutting from the mold.
After being cut light emitting diode 100, multiple light emitting diodes 100 can be formed, then will be shone
Diode 100 is removed from the molds.
In conclusion the present invention provides a kind of LED production method, by making with polarity identification point
Then the base board of Light-Emitting Diode installs luminous core corresponding with polarity identification point position in the groove of each pedestal
Piece simultaneously carries out die bond, then by die bond, the technique drying and cut, make formed include polarity identification point light-emitting diodes
Pipe.On the one hand, since base board provided by the invention includes multiple identical pedestals, it is easy cutting in cutting, and to cut
Appearance after cutting is more beautiful.On the other hand, and due to being provided with polarity identification point, so being more easy to know during later stage shoe plate
The polarity for the light emitting diode not made is less prone to the reversed situation of electrode.
It should be noted that herein, the relational terms of such as " first " and " second " or the like are used merely to one
A entity or operation with another entity or operate distinguish, without necessarily requiring or implying these entities or operation it
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant are intended to
Cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those
Element, but also include other elements that are not explicitly listed, or further include for this process, method, article or setting
Standby intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.It should be noted that：Similar label and letter exist
Similar terms are indicated in following attached drawing, therefore, once being defined in a certain Xiang Yi attached drawing, are then not required in subsequent attached drawing
It is further defined and is explained.
Claims (10)
1. a kind of LED production method, which is characterized in that the LED production method includes：
Make the base board of the Light-Emitting Diode with polarity identification point；Wherein, the base board includes multiple bottoms with groove
Seat；
Luminescence chip corresponding with the polarity identification point position is installed in the groove of each pedestal and carries out die bond；
Dispensing is carried out to the groove after die bond；
Base board after dispensing is dried, to form light emitting diode semi-finished product；
The light emitting diode semi-finished product are cut, to form more light emitting diodes, wherein every light-emitting diodes
Guan Jun includes at least one polarity identification point.
2. LED production method as described in claim 1, which is characterized in that described to make with polarity identification point
The step of base board of Light-Emitting Diode includes：
White wall glue is injected into the mold pre-seted；
Baking molding is carried out to the white wall glue；To form the light-emitting base plate.
3. LED production method as claimed in claim 2, which is characterized in that it is described to the light emitting diode half at
Product are cut, and include the step of more light emitting diodes to be formed：
The light emitting diode semi-finished product are cut along the presetting position of the mold；
More Light-Emitting Diodes after cutting are taken out from the mold.
4. LED production method as claimed in claim 2, which is characterized in that noted into the mold pre-seted described
Before the step of entering white wall glue, it is described make with polarity identification point Light-Emitting Diode base board the step of further include：
In the surface adhesion adhesive film of the mold pre-seted, so that the white wall glue of injection is contacted with the adhesive film.
5. LED production method as claimed in claim 4, which is characterized in that the adhesive film includes release film, height
Warm film or antiultraviolet film.
6. LED production method as claimed in claim 2, which is characterized in that dried to the white wall glue described
It is roasted into type；Before the step of forming the light-emitting base plate, the bottom for making the Light-Emitting Diode with polarity identification point
The step of seat board further includes：
It is fitted closely using a pressing plate and the mold after the white wall glue of injection, and the white wall glue is contacted with the pressing plate.
7. LED production method as described in claim 1, which is characterized in that the groove to after die bond into
The step of row dispensing includes：
Dispensing is carried out to the groove after die bond, so that the glue surface formed after dispensing is in the arc to the bottom notch of the groove
Shape.
8. LED production method as described in claim 1, which is characterized in that the groove to after die bond into
The step of row dispensing includes：
A fluorescent glue is carried out to the groove after die bond.
9. LED production method as described in claim 1, which is characterized in that the groove to after die bond into
The step of row dispensing includes：
It dusts to the groove after die bond；
A transparent adhesive tape is carried out to the groove after dusting.
10. LED production method as described in claim 1, which is characterized in that the polarity identification point includes convex block
Or recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810206524.4A CN108511566A (en) | 2018-03-13 | 2018-03-13 | A kind of LED production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810206524.4A CN108511566A (en) | 2018-03-13 | 2018-03-13 | A kind of LED production method |
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| Publication Number | Publication Date |
|---|---|
| CN108511566A true CN108511566A (en) | 2018-09-07 |
Family
ID=63375989
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810206524.4A Pending CN108511566A (en) | 2018-03-13 | 2018-03-13 | A kind of LED production method |
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| CN1925176A (en) * | 2005-09-02 | 2007-03-07 | 杨丕福 | Integrated light emitting device and method for making same |
| CN200962430Y (en) * | 2006-09-22 | 2007-10-17 | 深圳市瑞丰光电子有限公司 | Led |
| CN103219447A (en) * | 2013-03-20 | 2013-07-24 | 深圳雷曼光电科技股份有限公司 | TOP-LED packaging device and preparation method thereof |
| CN103258948A (en) * | 2012-02-21 | 2013-08-21 | Lg伊诺特有限公司 | Light emitting device |
| CN105655469A (en) * | 2008-11-13 | 2016-06-08 | 行家光电有限公司 | System and method for forming thin-film phosphor layer for phosphor-converted light emitting devices |
| CN106531857A (en) * | 2016-12-28 | 2017-03-22 | 芜湖聚飞光电科技有限公司 | Chip scale LED packaging structure and packaging technology |
-
2018
- 2018-03-13 CN CN201810206524.4A patent/CN108511566A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1925176A (en) * | 2005-09-02 | 2007-03-07 | 杨丕福 | Integrated light emitting device and method for making same |
| CN200962430Y (en) * | 2006-09-22 | 2007-10-17 | 深圳市瑞丰光电子有限公司 | Led |
| CN105655469A (en) * | 2008-11-13 | 2016-06-08 | 行家光电有限公司 | System and method for forming thin-film phosphor layer for phosphor-converted light emitting devices |
| CN103258948A (en) * | 2012-02-21 | 2013-08-21 | Lg伊诺特有限公司 | Light emitting device |
| CN103219447A (en) * | 2013-03-20 | 2013-07-24 | 深圳雷曼光电科技股份有限公司 | TOP-LED packaging device and preparation method thereof |
| CN106531857A (en) * | 2016-12-28 | 2017-03-22 | 芜湖聚飞光电科技有限公司 | Chip scale LED packaging structure and packaging technology |
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Application publication date: 20180907 |