CN201549506U - Cutting channel structure of surface-mount LED packaging substrate - Google Patents
Cutting channel structure of surface-mount LED packaging substrate Download PDFInfo
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- CN201549506U CN201549506U CN2009201712703U CN200920171270U CN201549506U CN 201549506 U CN201549506 U CN 201549506U CN 2009201712703 U CN2009201712703 U CN 2009201712703U CN 200920171270 U CN200920171270 U CN 200920171270U CN 201549506 U CN201549506 U CN 201549506U
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- led
- cutting road
- base plate
- mount device
- adhesive layer
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Abstract
The utility model relates to a cutting channel structure of a surface-mount LED packaging substrate, comprising a substrate, a plurality of LED crystal grains and a sealing glue layer, wherein the plurality of LED crystal grains are arranged on the substrate by a surface-mount technology; the sealing glue layer is arranged above the substrate and covers the LED crystal grains; the sealing glue layer is provided with a plurality of cutting channels which are sunk in an arranging shape according to the distribution of the LED crystal grains; and the thickness of a sealing glue body of the cutting channel needs to be equal to or less than 0.1mm. The cutting channel structure has the advantages of leading the cutting process to be convenient and fast, being incapable of damaging the sealing glue body, ensuring the completeness of the LED packaging body and having the effects of improving the throughput yield and reliability.
Description
Technical field
The utility model relates to a kind of Cutting Road structure of SMD LED surface-mount device LED LED base plate for packaging.
Background technology
Light-emitting diode (Light Emitting Diode, electronic component that can be luminous when LED) being a kind of the energising, principle of luminosity is to convert electrical energy into luminous energy, that is compound semiconductor applied electric current, by combining of electronics and electric hole, superfluous energy can discharge with the form of light, reaches luminous effect.
Inferior pressing, because the LED technology is constantly progressive, impel the brightness of LED product to continue to raise, by early stage indicator light function, advance to have power saving, environmental protection, the life-span is long, volume is little illumination and light source product, range of application contains general lighting, automobile-used illumination, street lighting and backlight etc., and also scale and growth power are considerable, the industry that the whole world of can saying so will be actively promoted future.
Press again because the demand day Yin Dynasty of LED also makes rapid progress on its processing procedure, a kind of SMD LED surface-mount device LED (surface Mount Device, SMD) light-emitting diode also in response to and give birth to.SMD LED surface-mount device LED shown in Figure 1 (SMD) LED encapsulating structure, be on a substrate 10, be connected with several LED crystal grain 20, and then bestow an adhesive layer 30 in substrate 10 with surface mount technology (SMT), after waiting it to solidify, this encapsulating structure is cut into the LED of predetermined form with cutting tool 40.
But, the thickness of present existing SMT adhesive body 30 (T) is more than 0.3mm, and adhesive body 30 materials own have the characteristic that is difficult for cutting, so cutting tool 40 is when cutting, easily cause its cut surface as shown in Figure 2, produce irregular defective face 35; Thus, easily produce higher fraction defective, and this adhesive body 30 so can influence the light that LED crystal grain 20 is cast out, causes reliability thereby reduction because of imperfect.
The utility model content
Technical problem underlying to be solved in the utility model is, overcome the above-mentioned defective that prior art exists, and provide a kind of Cutting Road of SMD LED surface-mount device LED LED base plate for packaging to construct, it has makes the cutting processing procedure convenient, and can not make the adhesive body damage, guarantee the integrality of LED packaging body, have the effect that promotes production capacity yield and reliability and promote.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of Cutting Road structure of SMD LED surface-mount device LED LED base plate for packaging comprises: a substrate; Several LED crystal grain are to be located on this substrate with surface mount technology (SMT); One adhesive layer is provided in a side of this substrate top, and this LED crystal grain is covered; It is characterized in that: this adhesive layer be provided with several and be the Cutting Road of arranging the shape depression, and the thickness of the adhesive body of this Cutting Road (T1) must be equal to or less than 0.1 millimeter (millimeter according to the distribution of this LED crystal grain; Mm).
The Cutting Road structure of aforesaid SMD LED surface-mount device LED LED base plate for packaging, wherein the width of Cutting Road (w) is included as 0.3mm ± 0.2mm.
The Cutting Road structure of aforesaid SMD LED surface-mount device LED LED base plate for packaging, wherein the thickness of adhesive layer (T2) is included as 0.3mm.
The Cutting Road structure of aforesaid SMD LED surface-mount device LED LED base plate for packaging, wherein the material of adhesive layer is an insulation light transmissive material.
The Cutting Road structure of aforesaid SMD LED surface-mount device LED LED base plate for packaging, the light transmissive material that wherein insulate is a silica gel material.
The Cutting Road structure of aforesaid SMD LED surface-mount device LED LED base plate for packaging, the light transmissive material that wherein insulate is an epoxy resin.
The Cutting Road of aforesaid SMD LED surface-mount device LED LED base plate for packaging structure, wherein the surface of adhesive layer comprises and is plane.
The Cutting Road of aforesaid SMD LED surface-mount device LED LED base plate for packaging structure, wherein the surface of adhesive layer comprises and is circular arc type.
The Cutting Road of aforesaid SMD LED surface-mount device LED LED base plate for packaging structure, wherein adhesive layer comprises and is provided with a fluorescent material.
The Cutting Road structure of aforesaid SMD LED surface-mount device LED LED base plate for packaging, wherein adhesive layer comprises with mould notes (Molding), penetrates (Injection), spraying (spray) and the moulding of coating (coating) wherein arbitrary mode institute.
The Cutting Road of aforesaid SMD LED surface-mount device LED LED base plate for packaging structure, wherein the material of substrate comprises by pottery, epoxy resin and oxide is wherein arbitrary or its composite type is constituted.
The beneficial effects of the utility model are that it has makes the cutting processing procedure convenient, and can not make the adhesive body damage, guarantees the integrality of LED packaging body, has the effect that promotes production capacity yield and reliability and promotes.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is existing LED adhesive body schematic diagram.
Fig. 2 is the schematic diagram after the existing LED adhesive body cutting.
Fig. 3 is the utility model preferred embodiment vertical view.
Fig. 4 is the utility model preferred embodiment end view.
Fig. 5 is a part-structure amplification view shown in Figure 4.
Fig. 6 is the cutaway view after the utility model cutting.
Fig. 7 is another possible embodiments schematic diagram of the utility model.
Fig. 8 is the another possible embodiments schematic diagram of the utility model.
The number in the figure explanation:
10 substrates
20 LED crystal grain
30 adhesive bodies
31 Cutting Roads
32 planes
33 circular arc types
34 fluorescent material
40 cutting tools
Embodiment
At first, see also Fig. 3～shown in Figure 6, the utility model preferred embodiment includes:
One substrate 10, be can by pottery, epoxy resin or oxide wherein arbitrary material constituted.
Several LED crystal grain 20 are to be located on this substrate 10 with surface mount technology (SMT), because the SMT processing method, non-patent target of the present utility model is held and do not given unnecessary details.
One adhesive layer 30 is constituted by an insulation light transmissive material, and its material comprises silica gel or epoxy resin etc., but is not limited to this, and equivalent material also can be implemented; This adhesive layer 30 is provided in a side of this substrate 10 tops, and LED crystal grain 20 is covered.But more than be that mounting structure is prior art (PriorArt), hold and do not give unnecessary details.
Principal character of the present utility model is: this adhesive layer 30 is provided with majority and is the Cutting Road 31 of arranging the shape depression according to the distribution of this LED crystal grain 20, and it comprises being laterally or vertically arranges, and in the present embodiment, this Cutting Road 31 is to be criss-cross arrangement, just as the chessboard shape, but is not limited to this.
The utility model is through many times research and development and improvement, when the thickness (T1) of the adhesive body 30 of this Cutting Road 31 when being equal to or less than 0.1mm, when cutting tool 40 cuts processing procedure, can not damage adhesive layer 30.
The width w of aforementioned Cutting Road is included as 0.3mm ± 0.2mm.And the thickness T 2 of adhesive body 30 comprises 0.3mm, more than is preferred values, and the utility model is when being not limited to this.
Again, the processing procedure of this adhesive layer 30 comprise with: mould annotate (Molding), penetrate (Injection), spraying (spray) and the moulding of coating (coating) wherein arbitrary mode institute.And the thickness of controlling this Cutting Road 31 is 0.1mm to the maximum.
In addition, in the present embodiment, the surface of this adhesive layer 30 is to be plane 32, but is not limited to this.
Please consult shown in Figure 7ly again, adhesive layer 30 of the present utility model is except that aforesaid plane 32, and another possible embodiments, is to can be made into circular arc type 33, and the feature of its Cutting Road 31 is same as last embodiment, repeats no more.
Hold, this enforcement is a possible embodiments again, is that this adhesive layer 30 comprises and is provided with fluorescent material 34, and thus, this LED crystal grain 20 can be blue-ray LED, and then present embodiment promptly can be a white light LEDs packaging body.Moreover in the present embodiment, this fluorescent material 34 is a mouthful word and removes following one horizontal shape coating LED crystal grain 20, but is not limited to this.
Be with, the utility model is able to when carrying out cutting processing with the Cutting Road manufacture procedure of adhesive of a predetermined thickness, guarantees the integrality of adhesive layer cut surface and can not be damaged, convenience with procedure for processing, and can promote the production capacity yield of LED encapsulation and the reliability of product.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any simple modification, equivalent variations and modification that above embodiment did.
In sum, the utility model is on structural design, use practicality and cost benefit, it is required to meet industry development fully, and the structure that is disclosed also is to have unprecedented innovation structure, have novelty, creativeness, practicality, the regulation that meets relevant novel patent requirement is so mention application in accordance with the law.
Claims (9)
1. the Cutting Road of a SMD LED surface-mount device LED LED base plate for packaging is constructed, and comprising:
One substrate;
Several LED crystal grain are to be located on this substrate with surface mount technology;
One adhesive layer is provided in a side of this substrate top, and this LED crystal grain is covered; It is characterized in that:
This adhesive layer be provided with several and be the Cutting Road of arranging the shape depression, and the thickness of the adhesive body of this Cutting Road must be equal to or less than 0.1 millimeter according to the distribution of this LED crystal grain.
2. the Cutting Road structure of SMD LED surface-mount device LED LED base plate for packaging according to claim 1, it is characterized in that: the width of described Cutting Road is included as 0.3mm ± 0.2mm.
3. the Cutting Road structure of SMD LED surface-mount device LED LED base plate for packaging according to claim 1, it is characterized in that: the thickness of described adhesive layer is included as 0.3mm.
4. the Cutting Road structure of SMD LED surface-mount device LED LED base plate for packaging according to claim 1 is characterized in that: the material of described adhesive layer is an insulation light transmissive material.
5. the Cutting Road structure of SMD LED surface-mount device LED LED base plate for packaging according to claim 4, it is characterized in that: described insulation light transmissive material is a silica gel material.
6. the Cutting Road structure of SMD LED surface-mount device LED LED base plate for packaging according to claim 4, it is characterized in that: described insulation light transmissive material is an epoxy resin.
7. the Cutting Road of SMD LED surface-mount device LED LED base plate for packaging according to claim 1 structure is characterized in that: the surface of described adhesive layer comprises and is plane.
8. the Cutting Road of SMD LED surface-mount device LED LED base plate for packaging according to claim 1 structure is characterized in that: the surface of described adhesive layer comprises and is circular arc type.
9. the Cutting Road of SMD LED surface-mount device LED LED base plate for packaging according to claim 8 structure is characterized in that: described adhesive layer comprises and is provided with a fluorescent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201712703U CN201549506U (en) | 2009-08-14 | 2009-08-14 | Cutting channel structure of surface-mount LED packaging substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201712703U CN201549506U (en) | 2009-08-14 | 2009-08-14 | Cutting channel structure of surface-mount LED packaging substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201549506U true CN201549506U (en) | 2010-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201712703U Expired - Fee Related CN201549506U (en) | 2009-08-14 | 2009-08-14 | Cutting channel structure of surface-mount LED packaging substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201549506U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311380A (en) * | 2012-03-08 | 2013-09-18 | 展晶科技(深圳)有限公司 | Semiconductor packaging process and packaging structures thereof |
| CN103390700A (en) * | 2012-05-10 | 2013-11-13 | 展晶科技(深圳)有限公司 | Light-emitting diode encapsulation manufacturing procedure and encapsulation structure thereof |
| CN108311434A (en) * | 2018-01-31 | 2018-07-24 | 京东方科技集团股份有限公司 | The method that glue material is removed for the system of stripping glue material from substrate and from substrate |
-
2009
- 2009-08-14 CN CN2009201712703U patent/CN201549506U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311380A (en) * | 2012-03-08 | 2013-09-18 | 展晶科技(深圳)有限公司 | Semiconductor packaging process and packaging structures thereof |
| CN103390700A (en) * | 2012-05-10 | 2013-11-13 | 展晶科技(深圳)有限公司 | Light-emitting diode encapsulation manufacturing procedure and encapsulation structure thereof |
| CN108311434A (en) * | 2018-01-31 | 2018-07-24 | 京东方科技集团股份有限公司 | The method that glue material is removed for the system of stripping glue material from substrate and from substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100811 Termination date: 20150814 |
|
| EXPY | Termination of patent right or utility model |