JP2000114583A - Light emitting and receiving device for infrared communication and manufacture thereof - Google Patents
Light emitting and receiving device for infrared communication and manufacture thereofInfo
- Publication number
- JP2000114583A JP2000114583A JP28766298A JP28766298A JP2000114583A JP 2000114583 A JP2000114583 A JP 2000114583A JP 28766298 A JP28766298 A JP 28766298A JP 28766298 A JP28766298 A JP 28766298A JP 2000114583 A JP2000114583 A JP 2000114583A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- forming section
- emitting element
- element forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、赤外線通信用発光
受光デバイス及びその製造方法に関し、特に、携帯用機
器のような電子機器の間のデータ伝送に用いるために発
光素子と受光素子が一体化された赤外線通信用発光受光
デバイス及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting and receiving device for infrared communication and a method for manufacturing the same, and more particularly, to a light emitting device and a light receiving device integrated for use in data transmission between electronic devices such as portable devices. And a method of manufacturing the same.
【０００２】[0002]
【従来の技術】ノートパソコン、ＰＤＡ、デジタルスチ
ルカメラのような携帯情報機器が急速に普及している。
このような情報機器の間で、データ伝送が行われる。情
報機器間をケーブルにより接続して電気的にデータのや
りとりを行うことに代わり、変調赤外線を用いて空間的
にデータ通信を行うことが、最近の一般的な傾向であ
る。このような赤外線通信は、双方向であることが好ま
しい。そのような双方通信のために、発光素子と受光素
子とが用いられる。赤外線信号を電気信号に変換する受
光素子として、光電変換効率が高く安価であるシリコン
受光素子が使用される。シリコン受光素子は、赤外線だ
けでなく太陽光、蛍光灯の光のような可視光に対しても
感度を持つ。2. Description of the Related Art Portable information devices such as notebook personal computers, PDAs, and digital still cameras are rapidly spreading.
Data transmission is performed between such information devices. It is a recent general tendency to perform spatial data communication using modulated infrared rays instead of electrically exchanging data by connecting information devices with a cable. Such infrared communication is preferably bidirectional. A light emitting element and a light receiving element are used for such two-way communication. As a light receiving element that converts an infrared signal into an electric signal, a silicon light receiving element that has high photoelectric conversion efficiency and is inexpensive is used. The silicon light receiving element is sensitive not only to infrared light but also to visible light such as sunlight and fluorescent light.
【０００３】１対として用いられる発光・受光素子は、
一体化されていることが好ましい。一体化された発光受
光素子は、特開平８−２０４６５３号で知られている。
この公知技術は、共通のプリント基板に発光素子と受光
素子をとりつけてそれらを一体化した技術を開示してい
る。The light-emitting / light-receiving elements used as a pair are:
Preferably they are integrated. An integrated light-emitting and light-receiving element is known from JP-A-8-204653.
This known technique discloses a technique in which a light emitting element and a light receiving element are mounted on a common printed circuit board and integrated with each other.
【０００４】極端に高い生産効率が求められる発光受光
素子の量産性が考慮される必要がある。受光素子に関し
てその受光性能と量産性が考慮された技術は、実開昭６
１−１５６２５０号で知られている。この技術は、蛍光
灯が発する可視光を遮断して赤外線を通す樹脂により受
光部品を被覆する２層構造を開示している。[0004] It is necessary to consider the mass productivity of light emitting and receiving elements that require extremely high production efficiency. The technology that takes into account the light receiving performance and mass productivity of the photo detector is
No. 1-156250. This technology discloses a two-layer structure in which a light receiving component is covered with a resin that blocks visible light emitted from a fluorescent lamp and transmits infrared light.
【０００５】発光素子、受光素子のような光デバイス部
品は、半導体回路などの周辺回路により駆動される。こ
のような周辺回路は光を嫌う性質がある。そのような周
辺回路を光遮断物質で被覆し、且つ、その光デバイス部
品とその光遮断物質を一体化するために透明樹脂でモー
ルドする技術が、特開平１−２１６５６２号で知られて
いる。[0005] Optical device components such as light emitting elements and light receiving elements are driven by peripheral circuits such as semiconductor circuits. Such a peripheral circuit has a property of dislike light. Japanese Patent Application Laid-Open No. 1-216562 discloses a technique in which such a peripheral circuit is covered with a light-blocking material and molded with a transparent resin in order to integrate the optical device component with the light-blocking material.
【０００６】図２に示される案が考えられる。この案
は、受光素子１０１と発光素子１０２を可視光カットモ
ールド樹脂１０３で被覆して、両素子をリードフレーム
１０４と駆動用ＩＣチップ１０５とをボンディング線１
０６を含めて一体化しようとするものである。発光素子
１０２から発光される赤外線を散乱させる可視光カット
モールド樹脂１０３は、その発光量の利用効率を低下さ
せることが知られている。[0006] The plan shown in FIG. 2 is conceivable. In this case, a light receiving element 101 and a light emitting element 102 are covered with a visible light cut mold resin 103, and both elements are connected to a lead frame 104 and a driving IC chip 105 by a bonding wire 1.
06 is to be integrated. It is known that the visible light cut mold resin 103 that scatters infrared light emitted from the light emitting element 102 reduces the use efficiency of the amount of emitted light.
【０００７】このような問題点を解消する技術が、特開
平１０−７０３０４号で知られている。図３は、この公
知の技術の要点を整理して図解している。受光素子１０
７は可視光遮断モールド樹脂１０８で被覆され、発光素
子１０９は透明モールド樹脂１１０で被覆されている。
この技術は、受光側パッケージと発光側パッケージが個
別化されているため、両パッケージの一体化のために更
に他の樹脂で両側パッケージを被覆するステップが必要
であり、極端なコストの低減化のためには好ましくな
い。A technique for solving such a problem is known from Japanese Patent Application Laid-Open No. H10-70304. FIG. 3 illustrates the main points of this known technique. Light receiving element 10
7 is covered with a visible light blocking mold resin 108, and the light emitting element 109 is covered with a transparent mold resin 110.
In this technology, since the light-receiving side package and the light-emitting side package are separated, a step of coating both sides of the package with another resin is required for integration of the two packages, which leads to an extreme cost reduction. Is not preferred.
【０００８】双方向通信機器に用いられる光デバイス
は、発光素子と受光素子を独立に有し、受光素子は可視
光を透過させる材料を嫌い、発光素子はその波長の光を
吸収する材料を嫌う。このようにクロスした物性を持つ
材料を選択し、且つ、発光・受光素子の一体化が行わ
れ、既述の先行技術を参照しつつ、一体的にプリント基
板に実装されて極端な低コスト化が実現され得る双方向
通信用光デバイスの提供が望まれる。An optical device used in a two-way communication device has a light emitting element and a light receiving element independently. The light receiving element dislikes a material that transmits visible light, and the light emitting element dislikes a material that absorbs light of the wavelength. . The materials having crossed physical properties are selected as described above, and the light-emitting and light-receiving elements are integrated. By referring to the above-described prior art, they are integrally mounted on a printed circuit board to reduce the cost extremely. It is desired to provide an optical device for two-way communication that can realize the above.
【発明が解決しようとする課題】本発明の課題は、発光
素子を被覆する材料は赤外線透過性にすぐれ、受光素子
を被覆する材料は赤外線透過性・可視光遮断性にすぐ
れ、このような発光素子と受光素子を一体化することに
より低コスト化を実現することができる赤外線通信用発
光受光デバイス及びその製造方法を提供することにあ
る。SUMMARY OF THE INVENTION It is an object of the present invention to provide a light-emitting element having a material which is excellent in infrared transmission and a light-receiving element which is excellent in infrared transmission and visible light shielding. An object of the present invention is to provide a light emitting and receiving device for infrared communication which can realize a low cost by integrating an element and a light receiving element, and a method for manufacturing the same.
【０００９】[0009]
【課題を解決するための手段】その課題を解決するため
の手段が請求項に対応して表現される次の記載中に現れ
る（）つきの数字は、請求項の記載事項が詳しく後述さ
れる実施の複数の形態のうちの少なくとも１つの形態の
部材、工程、動作に対応することを示すが、本発明の解
決手段がそれらの数字が示す実施の形態の部材、工程、
動作に限定して解釈されるためのものではなく、その対
応関係を明白にするためのものである。Means for solving the problem are indicated in the following description in which the means for solving the problem are expressed according to the claims. It shows that it corresponds to the member, the process, and the operation of at least one of a plurality of forms of the present invention.
It is not intended to be interpreted as being limited to operations, but to clarify their correspondence.
【００１０】本発明による赤外線通信用発光受光デバイ
スは、発光素子（５）を備える発光素子形成部（１）
と、受光素子（７）と受光素子（５）を被覆し可視光を
遮断するための可視光遮断用樹脂被覆（８）とを備える
受光素子形成部（２）と、起動用ＩＣを備える起動用Ｉ
Ｃ形成部（３）と、発光素子形成部（１）と受光素子形
成部（２）と起動用ＩＣ形成部（３）とを被覆するため
の単一の被覆（１４）とからなり、単一の被覆（１４）
は赤外線に対しても可視光に対しても実質的に透明であ
る。A light emitting and receiving device for infrared communication according to the present invention comprises a light emitting element forming section (1) having a light emitting element (5).
A light-receiving element forming section (2) including a light-receiving element (7), a visible light blocking resin coating (8) for covering the light-receiving element (5) and blocking visible light; For I
A single covering (14) for covering the C forming part (3), the light emitting element forming part (1), the light receiving element forming part (2), and the starting IC forming part (3); One coating (14)
Is substantially transparent to both infrared and visible light.
【００１１】入射赤外線は、有効に被覆（１４）を透過
し、かなり有効に可視光遮断用樹脂被覆（８）を透過し
て受光素子（７）に到達する。可視光は、有効に可視光
遮断用樹脂被覆（８）で遮断される。発光素子（５）か
ら出る赤外線は有効に被覆（１４）を透過する。発光素
子形成部（１）と、受光素子形成部（２）と、起動用Ｉ
Ｃ形成部（３）とは、被覆（１４）により一体化され、
当該赤外線通信用発光受光デバイスは１物体として回路
基板に実装されうる。The incident infrared rays effectively pass through the coating (14) and pass through the visible light blocking resin coating (8) quite effectively to reach the light receiving element (7). Visible light is effectively blocked by the visible light blocking resin coating (8). Infrared light emitted from the light emitting element (5) effectively passes through the coating (14). A light emitting element forming section (1), a light receiving element forming section (2),
The C forming part (3) is integrated with the coating (14),
The light emitting and receiving device for infrared communication can be mounted on a circuit board as one object.
【００１２】単一の被覆（１４）は、発光素子形成部
（１）、受光素子形成部（２）、起動用ＩＣ形成部
（３）のそれぞれの裏面側及び表面側を被覆しているこ
とが好ましい。発光素子形成部（１）、受光素子形成部
（２）、起動用ＩＣ形成部（３）とが、より確実に一体
化される。単一の被覆（１４）は、発光素子形成部
（１）、受光素子形成部（２）、起動用ＩＣ形成部
（３）にそれぞれに接合していることが好ましい。その
接合によりその一体化が一層に確実になる。その接合
は、成形時の熱で接着されることが好ましい。The single coating (14) covers the back surface and the front surface of the light emitting element forming section (1), the light receiving element forming section (2), and the starting IC forming section (3), respectively. Is preferred. The light emitting element forming section (1), the light receiving element forming section (2), and the starting IC forming section (3) are more reliably integrated. The single coating (14) is preferably bonded to the light emitting element forming section (1), the light receiving element forming section (2), and the starting IC forming section (3). The joining further ensures its integration. It is preferable that the bonding is performed by heat at the time of molding.
【００１３】発光素子形成部（１）は第１リードフレー
ム（４）を備え、受光素子形成部（２）は第２リードフ
レーム（６）を備え、起動用ＩＣ形成部（３）は第３リ
ードフレーム（９）を備え、これらリードフレームを含
めてその一体化がなされることが好ましい。発光素子形
成部（１）と起動用ＩＣ形成部（３）とを電気的に接続
する第１接続線（１２）と、受光素子形成部（２）と起
動用ＩＣ形成部（３）とを電気的に接続する第２接続線
（１３）を含めて一体化することが、更に好ましい。単
一の被覆（１４）は、第１接続線（１２）と第２接続線
（１３）を被覆していることがより好ましい。The light emitting element forming section (1) has a first lead frame (4), the light receiving element forming section (2) has a second lead frame (6), and the starting IC forming section (3) has a third lead frame. It is preferable that a lead frame (9) is provided, and that the lead frame and the lead frame are integrated. A first connection line (12) for electrically connecting the light emitting element forming section (1) and the starting IC forming section (3), and a light receiving element forming section (2) and a starting IC forming section (3); It is more preferable to integrate the second connection line (13) including the electrical connection. More preferably, the single covering (14) covers the first connecting line (12) and the second connecting line (13).
【００１４】単一の被覆（１４）は、基体部分（１５）
と、発光素子形成部（１）に位置対応している発光側レ
ンズ部分（１６）と、受光素子形成部（２）に位置対応
している受光側レンズ部分（１７）とを備え、発光素子
形成部（１）は発光側レンズ部分（１６）により被覆さ
れ、受光素子形成部（２）は受光側レンズ部分（１７）
により被覆されていることは、更に、製造のためのステ
ップ数を削減する。A single coating (14) is provided on the substrate portion (15).
A light emitting side lens portion (16) corresponding to the light emitting element forming portion (1) and a light receiving side lens portion (17) corresponding to the light receiving element forming portion (2); The forming part (1) is covered with a light emitting side lens part (16), and the light receiving element forming part (2) is coated with a light receiving side lens part (17).
Is further reduced the number of steps for manufacturing.
【００１５】本発明による赤外線通信用発光受光デバイ
スの製造方法は、発光素子（５）を備える発光素子形成
部（１）を形成するためのステップと、受光素子（７）
に可視光を遮断する可視光遮断用樹脂被覆（８）を被覆
して受光素子形成部（２）を形成するためのステップ
と、起動用ＩＣを備える起動用ＩＣ形成部（３）を形成
するためのステップと、発光素子形成部（１）と受光素
子形成部（２）と起動用ＩＣ形成部（３）とを単一の被
覆（１４）により同時に被覆するためのステップとから
なり、単一の被覆（１４）は赤外線に対しても可視光に
対しても実質的に透明である材料が用いられている。A method for manufacturing a light-emitting and light-receiving device for infrared communication according to the present invention comprises the steps of forming a light-emitting element forming section (1) having a light-emitting element (5);
For forming a light receiving element forming portion (2) by coating a visible light blocking resin coating (8) for blocking visible light, and forming a starting IC forming portion (3) including a starting IC. And a step of simultaneously covering the light emitting element forming section (1), the light receiving element forming section (2), and the starting IC forming section (3) with a single coating (14). One coating (14) is made of a material that is substantially transparent to both infrared and visible light.
【００１６】発光素子形成部（１）と、受光素子形成部
（２）と、起動用ＩＣ形成部（３）とからなるものを被
覆して一体化するステップは単一であり、ステップ数を
有効に削減することができる。発光素子形成部（１）を
形成するためのステップが発光素子を第１リードフレー
ムに形成するためのステップを備え、受光素子形成部
（２）を形成するためのステップが受光素子を第２リー
ドフレームに形成するためのステップを備え、起動用Ｉ
Ｃ形成部（３）を形成するためのステップが起動用ＩＣ
を第３リードフレームに形成するためのステップを備え
ることは、全体の製造のための一連のステップを系統立
てその製造を円滑にすることができる。The step of covering and integrating the light emitting element forming section (1), the light receiving element forming section (2), and the starting IC forming section (3) is a single step. It can be reduced effectively. The step of forming the light emitting element forming part (1) includes the step of forming the light emitting element on the first lead frame, and the step of forming the light receiving element forming part (2) connects the light receiving element to the second lead. A step for forming into a frame,
The step for forming the C forming part (3) is an activation IC.
To form the third lead frame, a series of steps for the whole manufacturing can be organized and the manufacturing can be facilitated.
【００１７】[0017]
【発明の実施の形態】図１に一致対応して、本発明によ
る赤外線通信用発光受光デバイスは、発光素子形成部１
と受光素子形成部２と起動用ＩＣ形成部３とを備えてい
る。発光素子形成部１は、第１リードフレーム４と発光
素子チップ５とから形成されている。第１リードフレー
ム４と発光素子チップ５との一体化形成は、慣用技術に
より行われる。発光素子チップ５は、第１リードフレー
ム４の上面側に一体に形成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In correspondence with FIG. 1, a light emitting and receiving device for infrared communication according to the present invention comprises a light emitting element forming section 1.
And a light receiving element forming section 2 and a starting IC forming section 3. The light emitting element forming section 1 is formed from a first lead frame 4 and a light emitting element chip 5. The integrated formation of the first lead frame 4 and the light emitting element chip 5 is performed by a conventional technique. The light emitting element chip 5 is formed integrally on the upper surface side of the first lead frame 4.
【００１８】受光素子形成部２は、第２リードフレーム
６と受光素子チップ７と可視光遮断用樹脂被覆８とから
形成されている。受光素子チップ７は、第２リードフレ
ーム６の上面側に一体に形成されている。第２リードフ
レーム６と受光素子チップ７の一体化形成は、慣用の技
術により行われる。可視光遮断用樹脂被覆８は、第２リ
ードフレーム６の上面側及び受光素子チップ７の上面側
に形成されている。その被覆は、慣用の技術により行わ
れる。そのような慣用技術としては、ポッティング、イ
ンサート射出成形が知られている。The light receiving element forming section 2 is formed of a second lead frame 6, a light receiving element chip 7, and a visible light shielding resin coating 8. The light receiving element chip 7 is formed integrally on the upper surface side of the second lead frame 6. The integrated formation of the second lead frame 6 and the light receiving element chip 7 is performed by a conventional technique. The visible light shielding resin coating 8 is formed on the upper surface of the second lead frame 6 and the upper surface of the light receiving element chip 7. The coating is performed by conventional techniques. Potting and insert injection molding are known as such conventional techniques.
【００１９】起動用ＩＣ形成部３は、第３リードフレー
ム９と駆動用ＩＣチップ１１とから形成されている。第
３リードフレーム９と駆動用ＩＣチップ１１との一体化
形成は、慣用技術により行われる。第１リードフレーム
４、第２リードフレーム６、第３リードフレーム９と
は、一体に接続された共通フレームとして形成されてい
ることが好ましい。The starting IC forming section 3 is formed by a third lead frame 9 and a driving IC chip 11. The integrated formation of the third lead frame 9 and the driving IC chip 11 is performed by a conventional technique. It is preferable that the first lead frame 4, the second lead frame 6, and the third lead frame 9 are formed as a common frame integrally connected.
【００２０】発光素子チップ５と駆動用ＩＣチップ１１
とは、第１ボンディング線１２により電気的に接続され
ている。受光素子チップ７と駆動用ＩＣチップ１１と
は、第２ボンディング線１３により電気的に接続されて
いる。発光素子形成部１、受光素子形成部２、起動用Ｉ
Ｃ形成部３、第１ボンディング線１２、第２ボンディン
グ線１３は、第１リードフレーム４と第２リードフレー
ム６と第３リードフレーム９が共有する共有フレーム
（図示せず）を介して互いに固着されあう関係にあり、
言い換えれば、一体化されている。Light emitting element chip 5 and driving IC chip 11
Are electrically connected by the first bonding line 12. The light receiving element chip 7 and the driving IC chip 11 are electrically connected by a second bonding line 13. Light emitting element forming section 1, light receiving element forming section 2, starting I
The C forming portion 3, the first bonding line 12, and the second bonding line 13 are fixed to each other via a shared frame (not shown) shared by the first lead frame 4, the second lead frame 6, and the third lead frame 9. In a relationship
In other words, they are integrated.
【００２１】このように一体化されたもの（発光素子形
成部１，受光素子形成部２，駆動用ＩＣ形成部３，第１
ボンディング線１２，第２ボンディング線１３）は、透
明被覆１４により概ね完全に被覆されている。このよう
な被覆は、慣用技術により行われる。そのような慣用技
術としては、トランスファー・モールド法が知られてい
る。透明被覆１４の透明性は、赤外線に関する透明性と
可視光線に関する透明性を含む。透明被覆１４は、基体
部分１５と発光側レンズ部分１６と受光側レンズ部分１
７とから形成されている。発光側レンズ部分１６、受光
側レンズ部分１７とは、それぞれに、発光素子形成部
１、受光素子形成部２とに対応する位置関係を有してい
る。The components integrated in this manner (the light emitting element forming section 1, the light receiving element forming section 2, the driving IC forming section 3, the first
The bonding wire 12 and the second bonding wire 13) are almost completely covered by the transparent coating 14. Such coatings are made by conventional techniques. As such a conventional technique, a transfer molding method is known. The transparency of the transparent coating 14 includes transparency for infrared rays and transparency for visible rays. The transparent coating 14 includes a base portion 15, a light-emitting side lens portion 16, and a light-receiving side lens portion 1.
7 are formed. The light emitting side lens portion 16 and the light receiving side lens portion 17 have a positional relationship corresponding to the light emitting element forming portion 1 and the light receiving element forming portion 2, respectively.
【００２２】基体部分１５と発光側レンズ部分１６と受
光側レンズ部分１７とは、既述のトランスファー・モー
ルド法により成形される場合に、一体樹脂物として成形
される。発光側レンズ部分１６と受光側レンズ部分１７
のレンズとして持つ表面の曲率は、発光素子チップ５、
受光素子チップ７がその焦点位置になるように設計され
る必要はなく、それらのレンズ作用は、ある程度の集光
性とある程度の拡散性を有していることが好ましい。The base portion 15, the light-emitting side lens portion 16, and the light-receiving side lens portion 17 are molded as an integral resin when molded by the transfer molding method described above. Light emitting side lens portion 16 and light receiving side lens portion 17
The curvature of the surface of the light-emitting element chip 5,
It is not necessary that the light receiving element chip 7 be designed to be at the focal position, and it is preferable that the lens function has a certain light collecting property and a certain diffusing property.
【００２３】受光素子チップ７は、入力赤外線信号を電
気信号に出力変換する光電素子である。発光素子チップ
５は、入力電気信号を赤外線に出力変換する光電素子で
ある。駆動用ＩＣチップ１１は、当該赤外線通信用発光
受光デバイスの外側から第３リードフレーム９を介して
入力される電気的送信データ信号を増幅し変調して、第
１ボンディング線１２を介して発光素子チップ５に印加
するためのドライバ部（図示せず）と、受光素子チップ
７が受光赤外線を電気信号に変換した電気的受信データ
信号を増幅して当該赤外線通信用発光受光デバイスの外
部に出力するための受信部（図示せず）とを備えてい
る。The light receiving element chip 7 is a photoelectric element for converting an input infrared signal into an electric signal. The light emitting element chip 5 is a photoelectric element that converts an input electric signal into infrared light. The driving IC chip 11 amplifies and modulates an electric transmission data signal input from the outside of the light emitting and receiving device for infrared communication via the third lead frame 9, and the light emitting element via the first bonding wire 12. A driver unit (not shown) for applying the signal to the chip 5 and the light receiving element chip 7 amplify the electrical reception data signal obtained by converting the received infrared ray into an electric signal and output the amplified signal to the outside of the light emitting and receiving device for infrared communication. And a receiving unit (not shown).
【００２４】当該赤外線通信用発光受光デバイスに外部
から向かう赤外線と可視光は、透明被覆１４の受光側レ
ンズ部分１７を良好に透過し、その可視光は可視光遮断
用樹脂被覆８により良好に遮断され、その赤外線は可視
光遮断用樹脂被覆８を相当に良好に透過して、受光素子
形成部２に入射する。その入射赤外線に対応する信号は
既述の通り増幅されて当該赤外線通信用発光受光デバイ
スの外側である携帯用電子機器のような機器のコンピュ
ータの受信部に第３リードフレーム９を介して送信され
る。太陽光、蛍光灯の光のようなノイズ光は、可視光遮
断用樹脂被覆８により有効に除去されている。発光素子
チップ５から出力される赤外線は、透明被覆１４の基体
部分１５、発光側レンズ部分１６を良好に透過して通信
相手の電子機器に送信される。Infrared light and visible light which travel from the outside to the light emitting and receiving device for infrared communication are transmitted through the light receiving side lens portion 17 of the transparent coating 14, and the visible light is well blocked by the visible light blocking resin coating 8. The infrared rays pass through the visible light-blocking resin coating 8 very well, and enter the light receiving element forming section 2. The signal corresponding to the incident infrared light is amplified as described above and transmitted via the third lead frame 9 to the receiving unit of the computer of a device such as a portable electronic device outside the light emitting and receiving device for infrared communication. You. Noise light such as sunlight and fluorescent light is effectively removed by the visible light shielding resin coating 8. Infrared light output from the light emitting element chip 5 is transmitted through the base portion 15 and the light emitting side lens portion 16 of the transparent coating 14 to the communication partner electronic device.
【００２５】発光素子形成部１と受光素子形成部２と起
動用ＩＣ形成部３とを含む形成物を透明樹脂で被覆する
ステップは、発光素子チップ５に対する十分な透明性を
保証し、且つ、受光素子チップ７に対する透明性を選択
的に十分に保証して、発光素子形成部１と受光素子形成
部２と起動用ＩＣ形成部３とを一体化するための単一の
ステップである。半球状の発光側レンズ部分１６の直径
が４ｍｍのものについて試作した試作品については、発
光素子チップ５の出力効率は、３０％ほど向上する。The step of covering the structure including the light emitting element forming section 1, the light receiving element forming section 2, and the starting IC forming section 3 with a transparent resin ensures sufficient transparency to the light emitting element chip 5, and This is a single step for integrating the light emitting element forming section 1, the light receiving element forming section 2, and the start-up IC forming section 3 while ensuring the transparency of the light receiving element chip 7 sufficiently and selectively. With respect to the prototype of the hemispherical light emitting side lens portion 16 having a diameter of 4 mm, the output efficiency of the light emitting element chip 5 is improved by about 30%.
【００２６】[0026]
【発明の効果】本発明による赤外線通信用発光受光デバ
イス及びその製造方法は、受光素子、発光素子、駆動回
路を含む一体物が受光素子、発光素子に対して最良の透
明性を持ち、且つ、製造コストを低減することができ
る。According to the present invention, the light emitting and receiving device for infrared communication and the method for manufacturing the same can be obtained by integrating the light receiving device, the light emitting device, and the driving circuit with the light receiving device and the light emitting device. Manufacturing costs can be reduced.
【図面の簡単な説明】[Brief description of the drawings]
【図１】図１は、本発明による赤外線通信用発光受光デ
バイスの実施の形態を示す断面図である。FIG. 1 is a sectional view showing an embodiment of a light emitting and receiving device for infrared communication according to the present invention.
【図２】図２は、想定される改良案を示す断面図であ
る。FIG. 2 is a sectional view showing a possible improvement.
【図３】図３は、公知の光デバイスを示す断面図であ
る。FIG. 3 is a cross-sectional view showing a known optical device.
１…発光素子形成部 ２…受光素子形成部 ３…起動用ＩＣ形成部 ４…第１リードフレーム ５…発光素子チップ ６…第２リードフレーム ７…受光素子チップップ ８…可視光遮断用樹脂被覆 ９…第３リードフレーム １１…駆動用ＩＣチップ １２…第１ボンディング線 １３…第２ボンディング線 １４…透明被覆 １５…基体部分 １６…発光側レンズ部分 １７…受光側レンズ部分 DESCRIPTION OF SYMBOLS 1 ... Light emitting element formation part 2 ... Light receiving element formation part 3 ... Starting IC formation part 4 ... 1st lead frame 5 ... Light emitting element chip 6 ... Second lead frame 7 ... Light receiving element chip top 8 ... Visible light shielding resin coating 9 ... third lead frame 11 ... drive IC chip 12 ... first bonding wire 13 ... second bonding wire 14 ... transparent coating 15 ... substrate portion 16 ... light emitting side lens portion 17 ... light receiving side lens portion
Claims (10)
の可視光遮断用樹脂被覆とを備える受光素子形成部と、 起動用ＩＣを備える起動用ＩＣ形成部と、 前記発光素子形成部と前記受光素子形成部と前記起動用
ＩＣ形成部とを被覆するための単一の被覆とからなり、 前記単一の被覆は赤外線に対しても可視光に対しても実
質的に透明である赤外線通信用発光受光デバイス。A light-emitting element forming part including a light-emitting element; a light-receiving element forming part including a light-receiving element and a visible light blocking resin coating for covering the light-receiving element and blocking visible light; A starting IC forming section, comprising a single coating for covering the light emitting element forming section, the light receiving element forming section, and the starting IC forming section; A light emitting and receiving device for infrared communication that is substantially transparent to light and visible light.
形成部、前記起動用ＩＣ形成部のそれぞれの裏面側及び
表面側を被覆していることを特徴とする赤外線通信用発
光受光デバイス。2. The method according to claim 1, wherein the single coating covers the back surface and the front surface of each of the light emitting element forming section, the light receiving element forming section, and the starting IC forming section. Characteristic light emitting and receiving device for infrared communication.
形成部、前記起動用ＩＣ形成部にそれぞれに接合してい
ることを特徴とする赤外線通信用発光受光デバイス。3. The infrared communication system according to claim 1, wherein the single coating is bonded to the light emitting element forming section, the light receiving element forming section, and the starting IC forming section, respectively. Light emitting and receiving device.
形成部、前記起動用ＩＣ形成部とを一体化していること
を特徴とする赤外線通信用発光受光デバイス。4. The infrared communication light-emitting device according to claim 3, wherein the single coating is formed by integrating the light emitting element forming section, the light receiving element forming section, and the starting IC forming section. Light receiving device.
ることを特徴とする赤外線通信用発光受光デバイス。5. The light emitting element forming section according to claim 1, wherein the light emitting element forming section includes a first lead frame, the light receiving element forming section includes a second lead frame, and the starting IC forming section includes a third lead frame. A light emitting and receiving device for infrared communication, comprising:
電気的に接続する第１接続線と、 前記受光素子形成部と前記起動用ＩＣ形成部とを電気的
に接続する第２接続線とからなり、 前記単一の被覆は、前記第１接続線と前記第２接続線を
被覆していることを特徴とする赤外線通信用発光受光デ
バイス。6. The device according to claim 1, further comprising: a first connection line for electrically connecting the light emitting element forming section and the starting IC forming section; and a light receiving element forming section and the starting IC forming section. And a second connection line that electrically connects the first and second connection lines, wherein the single covering covers the first and second connection lines.
分と、 前記受光素子形成部に位置対応している受光側レンズ部
分とを備えていることを特徴とする赤外線通信用発光受
光デバイス。7. The light-receiving element according to claim 1, wherein the single coating comprises a base portion, a light-emitting side lens portion corresponding to the light-emitting element forming portion, and a light-receiving portion corresponding to the light receiving element forming portion. A light emitting and receiving device for infrared communication, comprising: a side lens portion.
され、 前記受光素子形成部は前記受光側レンズ部分により被覆
されていることを特徴とする赤外線通信用発光受光デバ
イス。8. The infrared communication light emission according to claim 7, wherein the light emitting element forming portion is covered by the light emitting side lens portion, and the light receiving element forming portion is covered by the light receiving side lens portion. Light receiving device.
るためのステップと、 受光素子に可視光を遮断する可視光遮断用樹脂被覆を被
覆して受光素子形成部を形成するためのステップと、 起動用ＩＣを備える起動用ＩＣ形成部を形成するための
ステップと、 前記発光素子形成部と前記受光素子形成部と前記起動用
ＩＣ形成部とを単一の被覆により同時に被覆するための
ステップとからなり、 前記単一の被覆は赤外線に対しても可視光に対しても実
質的に透明である材料が用いられている赤外線通信用発
光受光デバイスの製造方法。9. A step for forming a light emitting element forming section having a light emitting element, and a step for forming a light receiving element forming section by covering a light receiving element with a visible light blocking resin coating for blocking visible light. Forming a starting IC forming unit including a starting IC; and simultaneously covering the light emitting element forming unit, the light receiving element forming unit, and the starting IC forming unit with a single coating. A method for manufacturing a light-emitting and light-receiving device for infrared communication, wherein the single coating is made of a material that is substantially transparent to both infrared light and visible light.
前記発光素子を第１リードフレームに形成するためのス
テップを備え、 前記受光素子形成部を形成するためのステップは、前記
受光素子を第２リードフレームに形成するためのステッ
プを備え、 前記起動用ＩＣ形成部を形成するためのステップは、前
記起動用ＩＣを第３リードフレームに形成するためのス
テップを備えることを特徴とする赤外線通信用発光受光
デバイスの製造方法。10. The method according to claim 9, wherein the step of forming the light emitting element forming portion comprises:
Forming the light emitting element on a first lead frame; forming the light receiving element forming portion includes forming the light receiving element on a second lead frame; The method for manufacturing a light emitting and receiving device for infrared communication, wherein the step of forming an IC forming part includes the step of forming the starting IC on a third lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28766298A JP3144634B2 (en) | 1998-10-09 | 1998-10-09 | Light emitting and receiving device for infrared communication and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28766298A JP3144634B2 (en) | 1998-10-09 | 1998-10-09 | Light emitting and receiving device for infrared communication and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000114583A true JP2000114583A (en) | 2000-04-21 |
| JP3144634B2 JP3144634B2 (en) | 2001-03-12 |
Family
ID=17720114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28766298A Expired - Fee Related JP3144634B2 (en) | 1998-10-09 | 1998-10-09 | Light emitting and receiving device for infrared communication and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3144634B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002176184A (en) * | 2000-12-11 | 2002-06-21 | Rohm Co Ltd | Infrared data communication module and its manufacturing method |
| JP2005353928A (en) * | 2004-06-14 | 2005-12-22 | Rohm Co Ltd | Light receiving module and electric equipment equipped therewith |
| US7291867B2 (en) * | 2005-03-09 | 2007-11-06 | Sharp Kabushiki Kaisha | Optical semiconductor device, electronic device, and method for producing optical semiconductor device |
| CN106129051A (en) * | 2015-05-07 | 2016-11-16 | 亿光电子工业股份有限公司 | Optical sensor and method for manufacturing optical device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7557129B2 (en) | 2003-02-28 | 2009-07-07 | Bayer Healthcare Llc | Cyanopyridine derivatives useful in the treatment of cancer and other disorders |
-
1998
- 1998-10-09 JP JP28766298A patent/JP3144634B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002176184A (en) * | 2000-12-11 | 2002-06-21 | Rohm Co Ltd | Infrared data communication module and its manufacturing method |
| JP2005353928A (en) * | 2004-06-14 | 2005-12-22 | Rohm Co Ltd | Light receiving module and electric equipment equipped therewith |
| US7291867B2 (en) * | 2005-03-09 | 2007-11-06 | Sharp Kabushiki Kaisha | Optical semiconductor device, electronic device, and method for producing optical semiconductor device |
| CN100463171C (en) * | 2005-03-09 | 2009-02-18 | 夏普株式会社 | Optical semiconductor device and method for manufacturing the same, electronic device, |
| CN106129051A (en) * | 2015-05-07 | 2016-11-16 | 亿光电子工业股份有限公司 | Optical sensor and method for manufacturing optical device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3144634B2 (en) | 2001-03-12 |
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