TW202240196A - Packaging structure and packaging method of distance sensor - Google Patents

Abstract

The invention relates to the technical field of distance sensor packaging, and provides a packaging structure and packaging method of a distance sensor. The packaging structure comprises a substrate, a light-emitting chip, a sensing chip, an insulating support and a light blocking glue wall assembly; the light blocking glue wall assembly comprises at least one of a surrounding glue wall and a separating glue wall, and the surrounding glue wall surrounds the side face of the substrate and the side face of the insulating support; and the separation glue wall is connected to the sensing chip, is located between a receiving end photosensitive area and a transmitting end photosensitive area, and is connected with the insulating support. According to the packaging structure and packaging method of the distance sensor, the light blocking glue wall assembly is adopted to prevent light leakage, the technical problem that an existing distance sensor is low in detection accuracy is solved, and therefore the detection accuracy of the distance sensor is improved.

Description

Encapsulation structure and encapsulation method of distance sensor

The invention relates to the technical field of sensor packaging, in particular to a packaging structure of a distance sensor and a packaging method thereof.

Proximity sensors are sensors that detect the proximity or distance of objects in a non-contact manner. Because it can be detected in a non-contact manner, it will not wear and damage the detection object, so the distance sensor is widely used in various industries. For example, an automatic teller machine uses a distance sensor to detect whether a cashier is approaching, a production line uses a distance sensor to realize product counting, and so on.

According to the working principle of the distance sensor, the distance sensor can be divided into inductive type, capacitive type, Hall type, photoelectric type and pyroelectric type. Among them, due to the advantages of convenient design, high sensitivity, and strong anti-interference, the photoelectric distance sensor is widely used in products such as smart phones, smart homes, smart cars, and wearable devices.

According to the related technologies learned by the inventor, please refer to FIGS. 1 to 3 , the package structure of the distance sensor includes a substrate 11 , a light emitting chip 12 , a sensing chip 13 and an insulating support 14 . The light-emitting chip 12 and the sensing chip 13 are separately arranged on the substrate 11, the insulating support 14 is connected on the substrate 11, and covers the light-emitting chip 12 and the sensing chip 13, the insulating support 14 and the substrate 11 form a relatively airtight casing .

However, the distance sensor manufactured in the related art has the technical problems of light leakage and low detection accuracy.

The object of the present invention is to provide a packaging structure of a distance sensor and a packaging method thereof, aiming to solve the conventional technical problem of low detection accuracy of the distance sensor.

In order to achieve the above object, the technical solution adopted by the present invention is to provide a package structure of a distance sensor, including a substrate, a light-emitting chip, a sensing chip, an insulating support and a light-shielding plastic wall element. The light-emitting chip and the sensing chip are mounted on the first surface of the substrate at intervals. The sensing wafer includes a receiving end photosensitive area and an emitting end photosensitive area. The insulating bracket is installed on the first surface of the substrate to cover the light emitting chip and the sensing chip. The insulating support has a first light hole and a second light hole, the position of the first light hole corresponds to the position of the photosensitive area of the receiving end, and the position of the second light hole corresponds to the position of the light-emitting chip Corresponding. The light blocking glue wall element includes at least one of a surrounding glue wall and a partition glue wall, the surrounding glue wall surrounds the side of the base plate and the side of the insulating bracket, and the partition glue wall is connected to the The sensing chip is located between the photosensitive area of the receiving end and the photosensitive area of the emitting end, and is connected with the insulating support.

In one of the embodiments, the insulating support has partition walls. The partition wall joins the partition glue wall to separate the inner chamber of the insulating support into a first chamber and a second chamber, and the light-emitting chip and the photosensitive region of the emitting end are located in the first chamber chamber, the photosensitive area of the receiving end is located in the second chamber.

In one of the embodiments, the insulating bracket has a glue filling groove. The opening of the glue filling groove is arranged on the top surface of the insulating support, the height of the glue filling groove is less than the distance from the sensing chip to the top surface of the insulating support, and the glue filling groove covers the insulation The inner chamber of the bracket is divided into a first chamber and a second chamber, the light-emitting chip and the photosensitive area of the emitting end are located in the first chamber, and the photosensitive area of the receiving end is located in the second chamber , the top of the partition glue wall extends into the glue filling groove.

In one of the embodiments, the package structure of the distance sensor further includes a lens and a first filter. The first optical hole is a stepped hole, and the stepped hole is divided into a large-diameter section and a small-diameter section from top to bottom, the lens is installed on the small-diameter section, and the first optical filter is installed on the Describe the large diameter section.

In one of the embodiments, the lens is a glass lens.

In one of the embodiments, the package structure of the distance sensor further includes a lens. The lens is facing the first optical hole, and the lens is integrally injection molded with the insulating bracket.

The present invention also provides a method for packaging a distance sensor, comprising the following steps: providing a substrate, and installing a light-emitting chip and a sensing chip on the first surface of the substrate at intervals; providing an insulating support having a first light hole and a second light hole; Install the insulating support on the first surface of the substrate, and make the insulating support cover the light-emitting chip and the sensing chip, and the position of the first light hole is related to the receiving position of the sensing chip. The position of the end photosensitive area corresponds to the position of the second light hole corresponds to the position of the light-emitting chip; and A surrounding glue wall surrounding the sides of the base plate and the insulating support is formed by a molding process.

In one of the embodiments, forming the surrounding glue wall around the sides of the base plate and the sides of the insulating bracket through a molding process includes the following steps: arranging a plurality of the substrates installed with the insulating brackets, and there is a gap between adjacent substrates; Molding the arranged plurality of substrates, injecting light-blocking glue into the gaps; and Cuts are made along the gap to form the surrounding glue walls around the sides of the base plate and the sides of the insulating support.

In one of the embodiments, the providing the substrate, and installing the light-emitting chip and the sensing chip on the first surface of the substrate at intervals includes the following steps: arranging a plurality of said substrates at intervals on the first whole board; arranging a plurality of the first full boards on the first jig board; and One light-emitting chip and one sensing chip are pasted on each of the substrates.

In one of the embodiments, the providing the insulating support having the first light hole and the second light hole includes the following steps: Injection molding a second full board comprising a plurality of insulating supports, wherein the order of arrangement of the plurality of insulating supports on the second full board is the same as that of the plurality of substrates on the first full board The sorting order is the same.

In one of the embodiments, the installation of the insulating support on the first surface of the substrate, and making the insulating support cover the light emitting chip and the sensing chip includes the following steps: bonding the plurality of second full plates to the plurality of first full plates on the first jig plate in one-to-one correspondence; Covering the second jig plate on the first jig plate, wherein a plurality of the first full plates and a plurality of the second full plates are located between the first jig plate and the second jig plate between the boards; baking the combined body formed by the first jig plate and the second jig plate; and cutting along the interval between adjacent substrates to form a package structure of a single distance sensor.

The beneficial effect of the packaging structure of the distance sensor and the packaging method thereof provided by the present invention is that the surrounding glue wall is used to surround the sides of the substrate and the side of the insulating support, even if the insulating support and the substrate are connected when there is an offset or even The gap and the surrounding glue wall can prevent light leakage and protect the sensing chip from the interference of external light, or use a partition glue wall to prevent light leakage and prevent the light emitted by the light-emitting chip from directly reaching the photosensitive area of the receiving end through the second light hole. That is, at least one of the surrounding glue wall and the partition glue wall can block the interference of the sensing chip with irrelevant light, which solves the known technical problem of low detection accuracy of the distance sensor, thereby improving the detection of the distance sensor Accuracy.

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", " The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating Or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those with ordinary knowledge in the technical field can understand the specific meanings of the above terms in the present invention according to specific situations.

Please refer to FIG. 1 and FIG. 2 , in the distance sensor of the related art, the light emitting chip 12 and the sensing chip 13 are separately installed on the substrate 11 . The insulating support 14 is mounted on the substrate 11 and covers the light emitting chip 12 and the sensing chip 13 . The installation and alignment requirements of the insulating support 14 and the substrate 11 are very high, otherwise a gap as shown in FIG. 2 may easily appear between the two, resulting in a decrease in the airtightness of the distance sensor. External light can enter the distance sensor through the gap, and there is light leakage, which affects the detection of the distance sensor, which is one of the reasons for the low detection accuracy.

Another reason for the low detection accuracy of the distance sensor is that the light-emitting chip and the photosensitive area of the receiving end are not isolated, and there is light leakage. The light emitted by the light-emitting chip is not reflected by the detected object but directly reaches from the inside of the distance sensor Sensing the photosensitive area of the receiving end of the chip, resulting in low detection accuracy.

Please refer to FIG. 3 , the packaging method of the distance sensor in the related art is to install the lens 15 on one side of the insulating support 14 , and then install the optical filter on the other side of the insulating support 14 after the insulating support 14 is turned 180 degrees. Then, the whole insulating bracket 14 is installed on the substrate 11 on which the light emitting chip 12 and the sensing chip 13 have been installed, which causes the problem that the manufacturing process is complicated and the lens 15 is easy to fall off.

Embodiment one

Please refer to FIG. 4 , a package structure of a distance sensor, including a substrate 100 , a light-emitting chip 200 , a sensing chip 300 , an insulating support 400 and light-shielding adhesive wall components. The light emitting chip 200 and the sensing chip 300 are mounted on the first surface 101 of the substrate 100 at intervals, and the insulating bracket 400 is mounted on the first surface 101 of the substrate 100 to cover the light emitting chip 200 and the sensing chip 300 . The insulating support 400 has a first light hole 410 and a second light hole 420, the position of the first light hole 410 corresponds to the position of the receiving end photosensitive area 310 of the sensing chip 300, and the position of the second light hole 420 corresponds to the position of the light emitting chip 200 corresponding to the position.

Please refer to FIG. 5 , the sensing chip 300 is used for sensing the light source emitted by the light emitting chip 200 . The insulating support 400 has two mutually independent chambers, the light-emitting chip 200 and the photosensitive area 320 of the emitting end are located in one of the chambers, and the chamber communicates with the second optical hole 420, and the photosensitive area 310 of the receiving end is located in the other chamber. Another chamber communicates with the first optical hole 410 . Part of the light emitted by the light-emitting chip 200 reaches the photosensitive area 320 of the transmitting end, and the other part passes through the second optical hole 420, the detection object 1, and the first optical hole 410 in sequence and then reaches the photosensitive area 310 of the receiving end. The time difference between the photosensitive area 320 receiving the light can measure the distance of the detection object 1 .

In one embodiment, please refer to FIG. 4 , the light-shielding glue wall component includes a surrounding glue wall 500 , and the surrounding glue wall 500 surrounds the sides of the substrate 100 and the side of the insulating bracket 400 . In this way, even if there is an offset or even a gap between the insulating bracket 400 and the substrate 100 during connection, the surrounding adhesive wall 500 can protect the sensing chip 300 from interference of external light, thereby improving the detection accuracy of the distance sensor.

In another embodiment, please refer to FIG. 4 , the light-blocking adhesive wall element includes a partition adhesive wall 600, the partition adhesive wall 600 is connected to the sensing chip 300, and is located between the photosensitive area 310 of the receiving end and the photosensitive area 320 of the emitting end, And it is connected with the insulating support 400 . In this way, the separating glue wall 600 isolates the light-emitting chip 200 from the receiving-end photosensitive area 310 inside the distance sensor, preventing light leakage, preventing the light emitted by the light-emitting chip 200 from directly reaching and interfering with the receiving-end photosensitive area 310, and improving the sense of distance. The detection accuracy of the detector.

In yet another embodiment, the light-blocking glue wall element includes the surrounding glue wall 500 and the partition glue wall 600 at the same time.

To sum up, the light-blocking plastic wall element only needs to include any one of the surrounding plastic wall 500 and the partitioning plastic wall 600, or includes the surrounding plastic wall 500 and the partitioning plastic wall 600 at the same time, which can prevent light leakage and improve the performance of the distance sensor. Detection accuracy.

In addition, the surrounding glue wall 500 can also protect the light-emitting chip 200 and the sensing chip 300 inside the insulating support 400 from being corroded by water vapor in the external environment, reducing the requirements for alignment accuracy between the insulating support 400 and the substrate 100, thereby reducing the The manufacturing difficulty and cost are reduced, and the airtight performance of the distance sensor is guaranteed.

Preferably, the substrate 100 includes but not limited to one of printed circuit board, bismaleimide triazine substrate, glass fiber substrate or direct copper clad substrate.

Preferably, the light emitting chip 200 is electrically connected to the substrate 100 through a wire bonding process. The light emitting chip 200 may be, for example, a laser chip.

Preferably, the sensing chip 300 is electrically connected to the substrate 100 through a wire bonding process. The sensing chip 300 may be, for example, an IC chip (Integrated Circuit Chip).

Preferably, the insulating bracket 400 can be mounted on the first surface 101 of the substrate 100 by bonding, snap-fitting connection or connecting elements (such as bolts or screws).

Wherein, the insulating bracket 400 can be formed first and then fixed on the substrate 100 . For example, the insulating bracket 400 may be a plastic bracket, for example. At this time, the partition wall 600 also acts as a buffer to prevent the sensing chip 300 from being crushed when the insulating support 400 is installed on the substrate 100 .

Preferably, the material of the light-shielding adhesive wall element includes but is not limited to opaque epoxy resin, acrylic resin, or polyurethane. For example, the surrounding glue wall 500 is a black glue wall, and the partition glue wall 600 is a black glue wall.

In some embodiments, please refer to FIG. 6( b ) and FIG. 6( d ), the insulating bracket 400 has partition walls 440 . The partition wall 440 joins the partition glue wall 600 to separate the inner chamber of the insulating support 400 into a first chamber and a second chamber. The light-emitting chip 200 and the photosensitive area 320 of the emitting end are located in the first chamber, and the photosensitive area of the receiving end is located in the first chamber. 310 is located in the second chamber. Wherein, the partition wall 440 and the partition glue wall 600 together form a light-blocking wall that isolates the first chamber and the second chamber to prevent light leakage between the first chamber and the second chamber, and the partition glue wall 600 also functions The cushioning function can prevent the partition wall 440 from crushing the sensing chip 300 when the insulating support 400 is installed on the substrate 100 .

Please refer to FIG. 10 , in some embodiments, the insulating bracket 400 has a glue filling groove 430 . The upper opening of the glue filling groove 430 is set on the top surface of the insulating support 400, the lower opening of the glue filling groove 430 is set on the bottom surface of the glue filling groove 430, and the height of the glue filling groove 430 is less than the top surface of the sensing chip 300 to the insulating support 400. The distance between them can prevent the sensing chip 300 from being crushed by the adhesive groove 430 when the insulating bracket 400 is installed on the substrate 100 . The glue filling groove 430 divides the internal chamber of the insulating support 400 into a first chamber and a second chamber, the light-emitting chip 200 and the photosensitive area 320 of the emitting end are located in the first chamber, and the photosensitive area 310 of the receiving end is located in the second chamber Among them, the partition glue wall 600 extends to the glue filling groove 430, filling the gap between the glue filling groove 430 and the sensing chip 300, preventing light leakage in the gap, so that the light in the first chamber and the second chamber does not interfere with each other, and the distance The sensor is more accurate.

In some embodiments, please refer to FIG. 4 , FIG. 7 and FIG. 10 , the package structure of the distance sensor further includes a lens 710 . The lens 710 is mounted on the first light hole 410 . The lens 710 can gather the incident light and project it to the photosensitive region 310 of the receiving end of the sensing chip 300 to improve the sensing capability of the sensing chip 300 . The package structure of the distance sensor further includes a first filter 720 . The first filter 720 is mounted on the first aperture 410 . The first filter 720 is used to filter stray light.

Since the lens 710 is small in size and the edge thickness is only 0.1mm, if it is necessary to open a positioning hole for installing the lens 710 on the insulating support 400, the production is very difficult, and the defective rate of the product is high. In addition, the lens 710 is fixed on the positioning hole with glue, and the glue is easy to liquefy or even lose its viscosity when passing through an SMT (Surface Mounted Technology, Surface Mount Technology) high-temperature furnace, causing the lens 710 to fall off.

To solve the above problem, in an embodiment, please refer to FIG. 7 and FIG. 8 , the first light hole 410 is a stepped hole. The stepped hole is sequentially divided into a large-diameter section 411 and a small-diameter section 412 from top to bottom. The lens 710 is installed on the small-diameter section 412 , and the first optical filter 720 is installed on the large-diameter section 411 . In this way, the lens 710 and the first filter 720 are sequentially installed in the stepped hole from top to bottom in the same direction, without turning over the insulating bracket 400 by 180 degrees, which simplifies the manufacturing process, reduces manufacturing difficulty, and saves manufacturing cost. Moreover, the lens 710 is placed in the stepped hole, so that it will not be degummed or dropped even in a high-temperature environment or during transportation and vibration.

Specifically, please refer to FIG. 8 , a support arm for placing the lens 710 is extended from the wall of the bottom hole of the stepped hole. The central wall of the stepped hole forms a shoulder for placing the first filter 720 .

Preferably, please refer to FIG. 7 and FIG. 8 , the lens 710 is a glass lens, and the lens 710 made of glass can avoid aging and yellowing, and avoid affecting the light transmittance, so as to ensure the long-term stability of the performance of the distance sensor.

In another embodiment, please refer to FIG. 9( a ), the lens 710 and the insulating bracket 400 are integrally injection-molded, and there is no need to set a special installation structure for installing the lens 710 on the insulating bracket 400, and it is not necessary to use glue to glue the lens 710 Bonding on the insulating support 400 simplifies the manufacturing process, reduces the investment in automation equipment, improves the production efficiency, and reduces the production cost.

In some embodiments, please refer to FIG. 4 , FIG. 7 and FIG. 10 , the package structure of the distance sensor further includes a second filter 730 mounted on the second aperture 420 .

Embodiment two

The invention provides a method for packaging a distance sensor, comprising the following steps:

In step S100 , please refer to FIG. 6( a ), providing the substrate 100 , and mounting the light emitting chip 200 and the sensing chip 300 on the first surface 101 of the substrate 100 at intervals. Preferably, the light emitting chip 200 is electrically connected to the substrate 100 through a wire bonding process. The sensing chip 300 is electrically connected to the substrate 100 through a wire bonding process. In particular, the sensing chip 300 is electrically connected to the substrate 100 through gold bonding wires.

Step S200, please refer to FIG. 6(b) and FIG. 6(c), provide an insulating bracket 400 having a first aperture 410 and a second aperture 420, and install the lens 710 and the first filter 720 on the first At the bottom and top of the light hole 410 , the second filter 730 is installed on the top of the second light hole 420 .

Step S300, please refer to FIG. 6(d) and FIG. 6(e), install the insulating support 400 on the first surface 101 of the substrate 100, and make the insulating support 400 cover the light emitting chip 200 and the sensing chip 300, and the first light The position of the hole 410 corresponds to the position of the receiving end photosensitive area 310 of the sensing chip 300 , and the position of the second light hole 420 corresponds to the position of the light emitting chip 200 .

In step S400 , please refer to FIG. 6( g ) and FIG. 6( h ), forming a surrounding glue wall 500 around the side of the substrate 100 and the side of the insulating bracket 400 through a molding process. In this way, the surrounding glue wall 500 is wrapped around the side of the substrate 100 and the side of the insulating support 400 , and the thickness can be made to be only micron level, occupying a small space, which is beneficial to the miniaturization of the distance sensor.

In the packaging method of the distance sensor provided by the present invention, even if there is an offset or even a gap between the insulating support 400 and the substrate 100, the surrounding glue wall 500 is wrapped on the outside of the substrate 100 and the insulating support 400 through the molding process to prevent Light leakage can improve the detection accuracy of the distance sensor.

In addition, the surrounding adhesive wall 500 can also protect the light-emitting chip 200 and the sensing chip 300 inside the insulating support 400 from being corroded by moisture in the external environment, which reduces the alignment accuracy between the insulating support 400 and the substrate 100, and reduces the manufacturing process. difficulty and cost.

Wherein, the order of step S100 and step S200 is adjustable, that is, the encapsulation method may first perform step S100 and then step S200, or first perform step S200 and then perform step S100.

Specifically, step S100 includes:

In step S110 , referring to FIG. 9( b ), a plurality of substrates 100 are arranged at intervals on the first full board 810 .

In step S120 , please refer to FIG. 9( c ) and FIG. 9( d ), arranging a plurality of first full boards 810 on the first jig board 830 . Wherein, each first full board 810 has a plurality of substrates 100 on it.

In step S130 , please refer to FIG. 9( e ), an automatic equipment may be used to stick a light emitting chip 200 and a sensing chip 300 on each substrate 100 .

In this way, multiple first full boards 810 are placed on one first jig board 830, and the light emitting chip 200 and the sensing chip 300 are mounted on the substrate 100 in batches, which can improve work efficiency and reduce manufacturing cost.

Specifically, step S200 includes: please refer to FIG. 9( a ), injection molding a second whole board 820 including a plurality of insulating brackets 400 . Wherein, the arrangement order of the plurality of insulating supports 400 on the second full board 820 is the same as the arrangement order of the plurality of substrates 100 on the first full board 810 .

It should be noted that, for ease of viewing, the arrangement density of the insulating supports 400 in Fig. 9(a) is relatively loose. In actual production, the arrangement of the insulating supports 400 on the second whole board 820 in Fig. In (b), the substrates 100 are arranged in the same manner on the first full board 810 .

In this way, the above packaging method utilizes the injection molding process to mass-produce a plurality of insulating brackets 400 , greatly improving work efficiency and reducing manufacturing costs.

Further, in FIG. 9( a ), a lens 710 is integrally formed on each insulating bracket 400 .

Specifically, step S300 includes:

In step S310 , please refer to FIG. 9( f ), attaching the multiple second full boards 820 to the multiple first full boards 810 on the first fixture board 830 in one-to-one correspondence. That is, a second whole board 820 is attached to a first whole board 810 . Since the arrangement sequence of the plurality of insulating supports 400 on the second full board 820 is the same as that of the plurality of substrates 100 on the first full plate 810 , the insulating supports 400 and the substrates 100 are attached in one-to-one correspondence.

Step S320, please refer to FIG. 9(g), cover the second jig plate 840 on the first jig plate 830, wherein a plurality of first entire plates 810 and a plurality of second entire plates 820 are located on the first jig between the plate 830 and the second jig plate 840.

Step S330 , please refer to FIG. 9( h ), bake the combined body formed by the first jig plate 830 and the second jig plate 840 .

Step S340 , cutting along the interval between adjacent substrates 100 to form a package structure of a single distance sensor (as shown in FIG. 6( f )).

In this way, the above-mentioned packaging method can produce a single package in batches. In each package, the light-emitting chip 200 and the sensing chip 300 are installed on the substrate 100 at intervals, and the insulating bracket 400 is fixed on the substrate 100 and covers the light-emitting chip 200 and the sensor chip 300. The sensing chip 300 greatly improves work efficiency and reduces manufacturing cost.

Preferably, before the step S310 , it further includes: applying glue on the edge of the first surface 101 of the substrate 100 , so that in the subsequent baking process, the insulating bracket 400 is fixed on the substrate 100 by glue.

Preferably, please refer to Fig. 9(a) ~ Fig. 9(c), the first jig plate 830 has a first positioning post 831, the first whole board 810 and the second whole board 820 both have the first positioning post 831 Matching first positioning holes 801, so that when the first fixture plate 830, the first full plate 810 and the second full plate 820 are combined, the first positioning column 831 of the first fixture plate 830 is passed through the first The first positioning hole 801 of the whole board 810 and the first positioning hole 801 of the second whole board 820 . In this way, the first whole board 810 and the second whole board 820 can be conveniently positioned and stacked on the first jig board 830, which greatly improves the installation accuracy and reduces the defect rate.

Preferably, please refer to FIG. 9( g ), the first jig plate 830 further has a second positioning post 832 , and the second jig plate 840 has a second positioning hole 841 matched with the second positioning post 832 .

In some embodiments, step S400 includes:

In step S410 , please refer to FIG. 6( f ), arranging a plurality of substrates 100 bonded with insulating brackets 400 , with gaps between adjacent substrates 100 .

In step S420 , please refer to FIG. 6( g ), molding the arranged substrates 100 , and injecting light blocking glue into the gaps.

In step S430 , please refer to FIG. 6( h ), cutting along the gap to form a surrounding glue wall 500 around the side of the substrate 100 and the side of the insulating bracket 400 . At this time, after cutting, a thin layer of surrounding adhesive wall 500 is formed around the substrate 100 and the insulating support 400 .

In this way, in the above packaging method, the packaging structure of a single distance sensor is obtained after cutting. In each package, even if there is a gap between the substrate 100 and the insulating support 400 , the surrounding glue wall 500 can seal the gap. At the same time, multiple substrates 100 are directly molded to realize mass production, which greatly reduces production costs and improves production efficiency.

Embodiment three

Please refer to FIG. 10. Embodiment 3 provides a packaging structure of a distance sensor. Specifically, the insulating bracket 400 has a glue filling groove 430, and the glue filling groove 430 divides the inner chamber of the insulating bracket 400 into a first chamber and a first chamber. In the second chamber, the separating glue wall 600 extends into the glue filling groove 430, and the separating glue wall 600 fills the gap between the glue filling groove 430 and the sensing wafer 300 to prevent light leakage from the gap, and the separating glue wall 600 makes the first chamber and the second chamber The light in the second chamber does not interfere with each other, and the recognition accuracy of the distance sensor is higher.

Specifically, the top of the separating glue wall 600 is flush with the top of the insulating support 400, and the height of the glue filling groove 430 is smaller than the distance from the sensing chip 300 to the top surface of the insulating support 400, so as to prevent the insulating support 400 from being installed on the substrate 100. The glue tank 430 crushes the sensing chip 300 .

Embodiment 3 also provides a packaging method for a distance sensor, including:

Step 1, please refer to FIG. 11( a ), providing a substrate 100 , and mounting a light emitting chip 200 and a sensing chip 300 on the substrate 100 at intervals.

Step 2, please refer to FIG. 11( b ), providing an insulating bracket 400 having a first light hole 410 , a second light hole 420 and a glue filling groove 430 .

Step 3, please refer to FIG. 11(c), FIG. 11(d) and FIG. 11(e), install the lens 710 on the bottom of the first aperture 410, place the first filter 720 and the second filter 730 installed above the first light hole 410 and the second light hole 420 respectively.

Step 4, please refer to FIG. 11( f ), install the insulating bracket 400 on the substrate 100 .

Step 5, please refer to FIG. 11( g ), use the glue dispensing head 850 to inject light blocking glue into the glue filling tank 430 to form the partition glue wall 600 .

In this way, please refer to FIG. 11( h ), the above packaging method completes the manufacture of the distance sensor.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. within range.

1: Detect objects 11: Substrate 12: Light-emitting chip 13: Sensing chip 14: Insulation bracket 15: lens 100: Substrate 101: First Surface 200: light emitting chip 300: sensing chip 310: Receiver photosensitive area 320: Transmitter photosensitive area 400: Insulation bracket 410: The first light hole 411: large diameter section 412: small diameter section 420: Second light hole 430: glue slot 440: partition wall 500: Adhesive walls around 600: Partition glue wall 710: lens 720: the first filter 730: Second filter 801: The first positioning hole 810: The first whole board 820: The second full board 830: The first fixture board 831: The first positioning column 832: The second positioning column 840: Second fixture board 841: Second positioning hole 850: dispensing head

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the descriptions of the embodiments or conventional technologies. Obviously, the accompanying drawings in the following description are only of the present invention. For some embodiments, for those skilled in the art, other drawings can also be obtained based on these drawings without making progressive changes. FIG. 1 is an exploded view of a distance sensor in the related art; 2 is a cross-sectional view of a distance sensor in the related art; Fig. 3 is the manufacturing flowchart of the packaging method of the distance sensor in the related art; 4 is an exploded view of the packaging structure of the distance sensor in the embodiment of the present invention; Fig. 5 is a schematic diagram of the distance sensor in Fig. 4; Figure 6(a)~(h) are the manufacturing flow chart of the packaging method of the distance sensor in the embodiment of the present invention; 7 is an exploded view of the package structure of the distance sensor in the embodiment of the present invention; 8 is a cross-sectional view of the package structure of the distance sensor in FIG. 7; 9 (a) to (h) are the manufacturing flow chart of the packaging method of the distance sensor in the embodiment of the present invention; Fig. 10 is an exploded view of the packaging structure of the distance sensor in the embodiment of the present invention; and 11 ( a ) to ( h ) are the manufacturing flow charts of the packaging method of the distance sensor in the embodiment of the present invention.

100: Substrate

101: First Surface

200: light emitting chip

300: sensing chip

310: Receiver photosensitive area

320: Transmitter photosensitive area

400: Insulation bracket

410: The first light hole

420: Second light hole

500: Adhesive walls around

600: Partition glue wall

710: lens

720: the first filter

730: Second filter

Claims (10)

A package structure of a distance sensor, which includes a substrate, a light-emitting chip, a sensing chip, an insulating support and a light-blocking adhesive wall element, the light-emitting chip and the sensing chip are installed on the first part of the substrate at intervals One surface, the sensing chip includes a receiving end photosensitive area and a transmitting end photosensitive area, the insulating support is installed on the first surface of the substrate to cover the light emitting chip and the sensing chip, the insulating support has a first A light hole and a second light hole, the position of the first light hole corresponds to the position of the photosensitive area of the receiving end, the position of the second light hole corresponds to the position of the light-emitting chip, and the light-blocking plastic wall element At least one of a surrounding glue wall and a partition glue wall is included, the surrounding glue wall surrounds the side of the substrate and the side of the insulating support, the partition glue wall is connected to the sensing chip, and is located at the receiving end photosensitive Between the region and the photosensitive region of the emitting end and connected with the insulating support. The packaging structure of the distance sensor according to claim 1, wherein the insulating support has a partition wall, and the partition wall joins the partition wall to separate the inner cavity of the insulating support into a first cavity chamber and a second chamber, the light-emitting chip and the photosensitive area of the emitting end are located in the first chamber, and the photosensitive area of the receiving end is located in the second chamber. According to the packaging structure of the distance sensor described in claim 1, wherein the insulating support has a glue filling groove, the opening of the glue filling groove is arranged on the top surface of the insulating support, and the height of the glue filling groove is smaller than that of the sensor. Measuring the distance from the chip to the top surface of the insulating support, the glue filling groove separates the inner chamber of the insulating support into a first chamber and a second chamber, and the light-emitting chip and the photosensitive area of the emitting end are located in the second chamber. In one chamber, the photosensitive area of the receiving end is located in the second chamber, and the top of the partition glue wall extends into the glue filling groove. The packaging structure of the distance sensor according to any one of claims 1 to 3, wherein the packaging structure of the distance sensor further includes a lens and a first filter, and the first aperture is a The stepped hole is sequentially divided into a large diameter section and a small diameter section from top to bottom, the lens is installed on the small diameter section, and the first optical filter is installed on the large diameter section. The packaging structure of the distance sensor according to claim 4, wherein the lens is a glass lens. The packaging structure of the distance sensor according to any one of claims 1 to 3, wherein the packaging structure of the distance sensor further includes a lens, the lens is facing the first aperture, and the lens and the The insulating bracket is integrally injection molded. A packaging method for a distance sensor, comprising the following steps: providing a substrate and installing a light-emitting chip and a sensing chip on the first surface of the substrate at intervals; providing an insulating support having a first light hole and a second light hole; Installing the insulating support on the first surface of the substrate and making the insulating support cover the light-emitting chip and the sensing chip, and the position of the first optical hole is the same as that of a receiving end photosensitive area of the sensing chip Correspondingly, the position of the second light hole corresponds to the position of the light-emitting chip; and A surrounding glue wall is formed around the side of the base plate and the side of the insulating bracket through a molding process. According to the packaging method of the distance sensor described in claim 7, wherein the step of forming the surrounding glue wall around the side surface of the substrate and the side surface of the insulating support through a molding process comprises the following steps: arranging a plurality of the substrates installed with the insulating brackets, and there is a gap between the adjacent substrates; Molding the arranged plurality of substrates, and injecting a light blocking glue into the gap; and Cuts are made along the gap to form the surrounding glue wall around the side of the substrate and the side of the insulating support. According to the packaging method of the distance sensor described in Claim 7, wherein the step of providing the substrate and mounting the light-emitting chip and the sensing chip on the first surface of the substrate at intervals comprises the following steps: arranging a plurality of the substrates at intervals on a first whole board; arranging a plurality of the first full boards on a first jig board; and One light-emitting chip and one sensing chip are pasted on each substrate. According to the packaging method of the distance sensor described in Claim 9, wherein the step of providing the insulating support having the first light hole and the second light hole comprises the following steps: Injection molding a second full board comprising a plurality of the insulating supports, wherein the arrangement sequence of the plurality of insulating supports on the second full plate is the same as that of the plurality of the substrates on the first full plate; as well as The step of installing the insulating support on the first surface of the substrate and making the insulating support cover the light emitting chip and the sensing chip includes the following steps: Affixing the plurality of the second full boards to the plurality of the first full boards on the first jig board in one-to-one correspondence; Covering a second jig plate on the first jig plate, wherein a plurality of the first full plates and a plurality of the second full plates are located between the first jig plate and the second jig plate ; baking the combined body formed by the first jig plate and the second jig plate; and cutting along the interval between adjacent substrates to form a package structure of a single distance sensor.

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