TWI738145B - Optical sensor for distance measurement and manufacturing method thereof - Google Patents

Abstract

The present invention is suitable for the field of detection technology, and provides a distance measuring light sensor and a manufacturing method thereof. The distance measuring light sensor includes a substrate; a transmitting tube and a receiving tube arranged on the substrate and electrically connected to the substrate; The first encapsulation layer encapsulated above the transmitting tube; the second encapsulation layer encapsulated above the receiving tube; and the third encapsulation layer surrounding the first encapsulation layer and the second encapsulation layer; the material of the third encapsulation layer is different from that of the substrate , The first encapsulation layer includes a first body and a light exit portion, the third encapsulation layer is provided with a light exit hole corresponding to the light exit portion; the second encapsulation layer includes a second body and a light entry portion, and the third encapsulation layer is provided with a light entry portion Corresponding light entrance hole. The optical sensor for distance measurement of the present invention is encapsulated and molded twice, so that the receiving tube and the transmitting tube are packaged as a unit, which occupies a small space. And by opening a light exit hole corresponding to the light exit part and a light entrance hole corresponding to the light entrance part of the third encapsulation layer, light leakage and interference are avoided.

Description

Optical sensor for distance measurement and manufacturing method thereof

The present invention relates to the field of detection technology, and more specifically, to a light sensor for distance measurement and a manufacturing method thereof.

The existing LED (Light Emitting Diode, light-emitting diode) packaging technology products are mainly composed of in-line or surface mount types, and the product packaging mainly encapsulates single-function products, such as only encapsulating infrared receivers or Infrared emission tubes use common infrared rays, their corresponding speed is slow, the range is short, and when a single-package product is applied to specific products such as lamps, it will occupy a large space and make the product unable to be simplified.

The purpose of the present invention is to provide a distance measuring light sensor, which aims to solve the technical problem that the existing LED packaging technology product single package makes the entire product occupy a large area.

In order to achieve the above objective, the technical solution adopted by the present invention is to provide a distance measurement optical sensor, including Substrate The launch tube is arranged on the substrate and is electrically connected to the substrate; The receiving tube is arranged on the substrate and is electrically connected to the substrate; The first encapsulation layer is encapsulated above the launch tube; The second encapsulation layer is encapsulated above the receiving tube; and The third encapsulation layer surrounds the first encapsulation layer and the second encapsulation layer for shading, and the material of the third encapsulation layer is different from the material of the substrate; The first encapsulation layer includes a first body and a light exit portion disposed on the side of the first body away from the emission tube. The third encapsulation layer is provided with a light exit hole corresponding to the light exit portion; the second encapsulation layer includes a second body and is disposed on the second body. The light incident part on the side of the main body away from the receiving tube, and the third encapsulation layer is provided with a light incident hole corresponding to the light incident part.

Further, the light emitting portion is a first protrusion that protrudes from the first body in a direction away from the launch tube, and the longitudinal cross-sectional shape of the first protrusion is curved or rectangular.

Further, the light emitting part is a first plane part of the first body facing away from the launch tube.

Further, the light incident portion is a second protrusion that protrudes from the second body away from the receiving tube, and the longitudinal cross-sectional shape of the second protrusion is curved or rectangular.

Further, the light incident part is a second plane part of the second body facing away from the receiving tube.

Further, the light exit hole or the light entrance hole is horn-shaped, and the diameter of the end face of the horn-shaped light exit hole near the substrate is smaller than the end face diameter of the end far away from the substrate;

The diameter of the end face of the horn-shaped light entrance hole close to the substrate is smaller than the end face diameter of the end far away from the substrate.

Further, the third encapsulation layer is in contact with the side of the second body where the light incident part is provided.

Further, the material of the third encapsulation layer is different from the material of the first encapsulation layer and the material of the second encapsulation layer.

The present invention also provides a method for manufacturing a distance measuring light sensor, which is used to form the above-mentioned distance measuring light sensor, including the following steps:

A plurality of transmitting tubes and a plurality of receiving tubes are arranged on the substrate, wherein the plurality of transmitting tubes and the plurality of receiving tubes are arranged in plural rows, and the emitting tubes arranged in plural rows and the receiving tubes arranged in plural rows are arranged in a staggered manner. A plurality of transmitting tubes and a plurality of receiving tubes are respectively electrically connected to the substrate;

A plurality of first encapsulation layers arranged on the substrate and each covering the transmitting tube, and a plurality of second encapsulation layers arranged on the substrate and each covering the receiving tube are formed, wherein each adjacent first encapsulation layer and the first encapsulation layer Between the two encapsulation layers, between each two adjacent first encapsulation layers and between each two adjacent second encapsulation layers form an accommodating space;

A third encapsulation layer is formed in the accommodating space, wherein the third encapsulation layer surrounds the first encapsulation layer and the second encapsulation layer, and the position of the third encapsulation layer corresponding to the emission tube is provided with a light exit hole for the corresponding emission tube to be exposed. The positions of the three encapsulation layers corresponding to the receiving tubes are provided with light incident holes for the corresponding receiving tubes to be exposed; and

The third packaging layer and the substrate are cut to form a plurality of distance measuring light sensors, and each distance measuring light sensor includes a transmitting tube and a receiving tube arranged adjacently.

Further, the accommodating space is formed by cutting or moulding, and the first encapsulation layer and the second encapsulation layer have the same material.

Compared with the prior art, the optical sensor for distance measurement provided by the present invention has the beneficial effects that the transmitting tube and the receiving tube are respectively encapsulated through the first encapsulation layer and the second encapsulation layer, and then the third encapsulation layer is encapsulated in one time. On the first packaging layer and the second packaging layer, the process technology of two packaging molding is adopted, so that the receiving tube and the transmitting tube are packaged as a unit, which makes the product packaging process more concise and faster in production efficiency. Monolithic encapsulation, the monolithic encapsulated transmitting tube and receiving tube need to be separately installed on the application product, and the installation distance is relatively large. The installation distance between the pipes is relatively short, so that the overall space occupied is small.

In addition, by opening the light exit hole in the third encapsulation layer corresponding to the light exit part and the light entrance hole in the part corresponding to the light entrance part, the light from the emitting tube and the receiving tube are guaranteed, and the entire sensor is also avoided. Light leakage and interference by other light are more common in infrared sensors. The emission tube has higher spectral accuracy, fast response speed, service life and longer emission distance.

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not used to limit the present invention.

It should be noted that when a component is referred to as being "fixed on" or "installed on" another component, it can be directly or indirectly located on the other component. When a component is said to be "connected to" another component, it can be directly or indirectly connected to the other component. Terms "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. The indicated orientation or position is based on the orientation or position shown in the drawings, which is only for ease of description and cannot be understood as a limitation of the technical solution. The terms "first" and "second" are only used for ease of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more than two, unless otherwise clearly defined.

In order to illustrate the technical solutions of the present invention, detailed descriptions are given below in conjunction with specific drawings and embodiments.

It should be noted that the optical sensor 1 for distance measurement can be used in the fields of LED, mobile phone communication, consumer electronics, etc., of course, in fact, it can also be used in other suitable technical fields.

Referring to Figures 1 and 2, an embodiment of the present invention provides a distance measurement optical sensor 1, which includes a substrate 11, a transmitting tube 12, a receiving tube 13, a first encapsulation layer 14, and a second encapsulation layer 15. And the third encapsulation layer 16. Wherein, the transmitting tube 12 and the receiving tube 13 are both arranged on the substrate 11 and are electrically connected to the substrate 11. The first encapsulation layer 14 is encapsulated above the emission tube 12 to facilitate the emission of light emitted by the emission tube 12; the second encapsulation layer 15 is encapsulated above the receiving tube 13 so that the receiving tube 13 can receive the light emitted by the emission tube 12; and the third encapsulation The layer 16 surrounds the first encapsulation layer 14 and the second encapsulation layer 15 for light shielding, which can achieve no light leakage of the entire sensor and prevent interference from other light beams.

The material of the third encapsulation layer 15 is different from that of the substrate 11, the substrate 11 uses an ultra-thin aluminum nitride substrate 11 material, and the third encapsulation layer 15 uses a vinyl layer. In order to facilitate the emitting tube 12 to emit light and the receiving tube 13 to collect light, the first encapsulation layer 14 includes a first body 140 and a light emitting portion 141 disposed on the side of the first body 140 away from the emitting tube 12, and the third encapsulation layer 16 is provided with and emits light. The light exit hole 161 corresponding to the portion 141 does not completely block the light by the third encapsulation layer 16 and is inconvenient for light exit. The second encapsulation layer 15 includes a second body 150 and an entrance provided on the side of the second body 150 away from the receiving tube 13 The light portion 151 and the third encapsulation layer 16 are provided with a light incident hole 162 corresponding to the light incident portion 151, so that the third encapsulation layer 16 will not completely block the light, which is inconvenient for light collection.

In this embodiment, the first encapsulation layer 14 and the second encapsulation layer 15 are primary encapsulation, mainly to facilitate the emitting tube 12 to emit light and the receiving tube 13 to receive light, and further pass through the third encapsulation layer 16 for secondary encapsulation, and respectively A light hole 161 is opened in the third encapsulation layer 16 at a position corresponding to the light exit portion 141 and a light entrance hole 162 is opened in a portion corresponding to the light entrance portion 151. While ensuring that the emitting tube 12 emits light and the receiving tube 13 receives light, it also avoids the overall feeling. The problem of light leakage from the detector and interference by other light.

Obviously, the optical sensor 1 for distance measurement in the embodiment of the present invention encapsulates the transmitting tube 12 and the receiving tube 13 through the first encapsulation layer 14 and the second encapsulation layer 15 respectively, and then the third encapsulation layer 16 is encapsulated in one time. On the first encapsulation layer 14 and the second encapsulation layer 15, that is, the process technology of two encapsulation molding is adopted, so that the receiving tube 13 and the transmitting tube 12 are packaged as a unit, making the product packaging process more concise and faster in production efficiency Compared with the monolithic package, the monolithic packaged transmitter tube and the receiver tube need to be separately installed on the application product, and the installation distance is larger. When the packaged transmitter tube 12 and the receiver tube 13 of the present invention are applied to the product, The installation distance between the transmitting tube 12 and the receiving tube 13 can be made closer, so that the overall space occupied is small;

In addition, by opening the light exit hole 161 at the position corresponding to the light exit portion 141 of the third encapsulation layer 16 and the light entrance hole 162 at the position corresponding to the light entrance portion 151 respectively, while ensuring that the emitting tube 12 emits light and the receiving tube 13 receives light, it also This avoids the problem of light leakage and interference by other light from the light sensor 1 for distance measurement. Because it is not interfered by other light, the light sensor 1 for distance measurement is better than the existing infrared sensor and its transmitting tube 12 has higher spectral accuracy, fast response speed, longer service life and longer emission distance.

In a specific application, the receiving tube 13 is an infrared receiving tube 13 and the transmitting tube 12 is an infrared emitting tube 12.

In combination with FIGS. 2 to 4, in this embodiment, the light emitting portion 141 is a first protrusion 1411 protruding from the first body 140 away from the launch tube 12. By arranging the light emitting portion 141 as the first convex portion 1411, the irradiated surface is reduced, so that the emitted light is concentrated as much as possible and hits the detection object, so that it is reflected and is easily received by the receiving tube 13.

In this embodiment, the light-emitting portion 141 in Figures 2 to 4 all protrude from the first body 140 away from the transmitter tube 12, but the top of the light-emitting portion 141 in Figure 2 is lower than that of the third package. The upper surface of the layer 16, the top end of the light emitting portion 141 in Figure 3 is flush with the upper surface of the third encapsulation layer 16; the bottom end of the light emitting portion 141 in Figure 4 is flush with the upper surface of the third encapsulation layer 16 Flush.

In this embodiment, referring to FIGS. 2 to 5, the longitudinal cross-sectional shape of the first protrusion 1411 is curved or rectangular. Preferably, the longitudinal cross-sectional shape of the first protrusion 1411 is semicircular, and the semicircular first protrusion 1411 is more conducive to the convergence of the emitted light, so that it is concentrated and emitted to the detection object, and is reflected to The receiving tube 13 receives.

Specifically, in this embodiment, the shape of the first protrusion 1411 in FIGS. 2 to 5 is different, and the longitudinal cross-sectional shape of the first protrusion 1411 in FIGS. 2 and 5 is half. It is circular, and the shape of the first protrusion 1411 in FIG. 3 is a rectangle.

In one embodiment, please refer to FIG. 4, when the light-emitting portion 141 is a first convex portion 1411 with a curved longitudinal cross-sectional shape, the bottom end of the first convex portion 1411 and the third encapsulation layer 16 The upper surface of the light emitting device is flush, that is, the light emitted by the light emitting portion 141 directly emits light.

Of course, in other embodiments, please refer to FIG. 2, FIG. 3, and FIG. 5. When the light emitting portion 141 is the first protrusion, the top end of the first protrusion 1411 is not higher than the third protrusion. The upper surface of the encapsulation layer 16.

In one embodiment, please refer to FIG. 6, which is different from the above-mentioned light-emitting portion 141. The light-emitting portion 141 in FIG. The side that emits light is a flat surface.

In one embodiment, referring to Figures 2 and 3, in order to facilitate the receiving tube 13 to receive light signals, the light incident portion 151 is a second protrusion 1511 protruding in a direction away from the receiving tube 13 from the second body 150 , And the top end of the second protrusion 1511 is not higher than the upper surface of the third encapsulation layer 16, so that when the incident light passes through the second protrusion 1511, the light can be collected as much as possible, so that the light is as far as possible The receiving tube 13 detects it, that is, making the receiving tube 13 collect light as much as possible.

In this embodiment, the longitudinal cross-sectional shape of the second protrusion 1511 is curved or rectangular, and when the longitudinal cross-sectional shape of the second protrusion 1511 is curved, the top end of the second protrusion 1511 is lower than the first protrusion 1511. On the upper surface of the third encapsulation layer 16, when the longitudinal cross-sectional shape of the second protrusion 1511 is rectangular, the top end of the second protrusion 1511 is flush with the upper surface of the third encapsulation layer 16. Preferably, the second protrusion 1511 is flush with the upper surface of the third encapsulation layer 16. The longitudinal cross-sectional shape of the protrusion 1511 is semicircular. The semicircular second protrusion 1511 facilitates the incident light to be collected as much as possible when passing through the second protrusion 1511, so that the receiving tube 13 can receive light even when the receiving tube 13 receives light.

In one embodiment, referring to FIGS. 4 to 6, there is a difference from the light incident portion 151 described above. The light incident portion 151 of this embodiment is a second flat portion 1512 of the second body 150 facing away from the receiving tube 13 , That is, the side used to enter the light is a flat surface.

In one embodiment, please refer to Figures 2, 5, and 6, in order to make the emitted light exit as much as possible, that is, in order to prevent the emitted emitted light from irradiating the third encapsulation layer 16, the third encapsulation layer 16 absorbed. The shape of the light exit hole 161 is horn-shaped, and the diameter of the end face of the horn-shaped light exit hole 161 near the substrate 11 is smaller than the end face diameter of the end far away from the substrate 11, that is, the end of the light exit hole 161 away from the substrate 11 has a larger opening. In this way, as much light as possible can emit light without being blocked by the third encapsulation layer 16.

In one embodiment, please refer to FIG. 2, FIG. 4, FIG. 5 and FIG. 6, in order to make the incident light irradiate into the light hole 162 as much as possible and be received by the receiving tube 13. The shape of the light incident hole 162 is horn-shaped, and the diameter of the end face of the horn-shaped light incident hole 162 close to the substrate 11 is smaller than the end face diameter of the end far away from the substrate 11, that is, the opening of the end of the light incident hole 162 away from the substrate 11 Larger. In this way, as much light as possible can be incident through the light entrance hole 162 without being blocked by the third encapsulation layer 16.

Of course, in other embodiments, referring to FIG. 3, the shape of the light exit hole 161 and the light entrance hole 162 may be other shapes. Specifically, the light exit hole 161 is a cylindrical hole, that is, the longitudinal section shape of the light exit hole 161 is a rectangle; the light entrance hole 162 is a cylindrical hole, that is, the longitudinal section shape of the light entrance hole 162 is a rectangle.

In one embodiment, referring to FIGS. 2 to 6 for details, the third encapsulation layer 16 is in contact with the side of the second body 150 where the light incident portion 151 is provided, and is used to define the size of the light incident hole 162.

In one embodiment, the material of the third encapsulation layer 16 is different from the material of the first encapsulation layer 14 and the material of the second encapsulation layer 15. Specifically, the first encapsulation layer 14 and the second encapsulation layer 15 are both transparent encapsulation layers, and the third encapsulation layer 16 is a vinyl layer.

In one embodiment, referring to Figure 2, the substrate 11 is a printed circuit board (Printed circuit board), and a transmitting tube 12, a receiving tube 13 and a circuit are attached to the top of the substrate 11, and the transmitting tube 12 passes through the first A lead 171 is electrically connected to the substrate 11, and the receiving tube 13 is electrically connected to the substrate 11 through a second lead 172.

In one embodiment, further combining Figures 8 and 9, four soldering pads are connected to the bottom of the substrate 11, and polarities are connected between each two soldering pads, and the four soldering pads respectively form an electrical connection with an external circuit. Sexual connection. Specifically, the four soldering pads are respectively a first soldering pad 181, a second soldering pad 182, a third soldering pad 183, and a fourth soldering pad 184. A first soldering pad 181 and a second soldering pad 182 are provided between the One polarity 191, a second polarity 192 is provided between the third solder pad 183 and the fourth solder pad 184, the direction of the first polarity 191 faces the first solder pad 181, and the direction of the second polarity 192 faces the second solder pad 182.

In this embodiment, further combining FIG. 1 0 and FIG. 1, a first connection pad 185 is provided on the top of the substrate 11 corresponding to the first solder pad 181, and a second connection pad 185 is provided corresponding to the second solder pad 182. 186. The first solder pad 181 is connected to the first connection solder pad 185, and the second solder pad 182 is connected to the second connection solder pad 186. The launch tube 12 is disposed at one end of the first connection pad 185 close to the second connection pad 186. The launch tube 12 is connected to the second connection pad 186 through a first lead 171, avoiding the use of two first leads 171. Specifically, the negative electrode of the launch tube 12 and the first connection pad 185 are welded together, and the negative electrode of the launch tube 12 is electrically connected to the first connection pad 185, and the positive electrode of the launch tube 12 is connected to the first connection pad 185 by welding. One end of the first lead 171 is welded together, and the other end of the first lead 171 is welded to the second connection pad 186 so that the anode of the launch tube 12 is electrically connected to the second connection pad 186.

The upper part of the substrate 11 is provided with a third connection pad 187 corresponding to the third solder pad 183, and a fourth connection pad 188 is provided corresponding to the fourth solder pad 184. The third solder pad 183 is electrically connected to the third connection pad 187. The bonding pad 184 is electrically connected to the fourth connection bonding pad 188. The receiving tube 13 is disposed at one end of the third connecting pad 187 close to the fourth connecting pad 188, and the receiving tube 13 is connected to the fourth connecting pad 188 through a second lead 172, avoiding the use of two second leads 172. Specifically, the negative electrode of the receiving tube 13 and the third connecting pad 187 are welded together, and the negative electrode of the receiving tube 13 is electrically connected to the third connecting pad 187, and then the positive electrode of the receiving tube 13 is connected to the third connecting pad 187 by welding. One end of the second lead 172 is welded together, and the other end of the second lead 172 is welded to the fourth connection pad 188, so that the positive electrode of the receiving tube 13 is electrically connected to the fourth connection pad 188.

In one embodiment, further combining with FIG. 1 and FIG. 7, a notch 163 is further provided on one side of the third encapsulation layer 16. Specifically, the notch 163 is strip-shaped, and the notch 163 is correspondingly disposed on one side of the negative electrode, so as to facilitate the distinction between the positive and negative electrodes of the product.

The manufacturing process of the optical sensor 1 for distance measurement in this embodiment will be described in detail below:

Step 1: First, prepare a substrate 11, and set a plurality of transmitting tubes 12 and a plurality of receiving tubes 13 on the substrate 11. Among them, the plurality of transmitting tubes 12 and the plurality of receiving tubes 13 are arranged in plural rows, respectively. The transmitting tubes 12 and the receiving tubes 13 arranged in a plurality of rows are arranged in a staggered manner, and the plurality of transmitting tubes 12 and the plurality of receiving tubes 13 are electrically connected to the substrate 11 respectively.

Specifically, the negative electrode of the launch tube 12 and the first connection pad 185 are welded together, and the negative electrode of the launch tube 12 is electrically connected to the first connection pad 185, and the positive electrode of the launch tube 12 is connected to the first connection pad 185 by welding. One end of the first lead 171 is welded together, and the other end of the first lead 171 is welded to the second connection pad 186 so that the anode of the launch tube 12 is electrically connected to the second connection pad 186. The negative electrode of the receiving tube 13 and the third connecting pad 187 are welded together, and the negative electrode of the receiving tube 13 is electrically connected to the third connecting pad 187, and then the positive electrode of the receiving tube 13 is connected to the second lead by welding. One end of the 172 is welded together, and the other end of the second lead 172 is welded to the fourth connection pad 188, so that the positive electrode of the receiving tube 13 is electrically connected to the fourth connection pad 188.

Step 2: Form a plurality of first encapsulation layers 14 arranged on the substrate 11 and respectively envelop the launch tube 12, and a plurality of second encapsulation layers 15 arranged on the substrate 11 and respectively envelop the receiving tube 13, wherein each phase An accommodating space is formed between the adjacent first encapsulation layer 14 and the second encapsulation layer 15, between each two adjacent first encapsulation layers 14 and between each two adjacent second encapsulation layers 15;

Specifically, the first packaging layer 14 and the second packaging layer 15 are respectively formed on the transmitting tube 12 and the receiving tube 13 mainly through injection molding;

Step 3: A third encapsulation layer 16 is formed in the accommodating space, wherein the third encapsulation layer 16 surrounds the first encapsulation layer 14 and the second encapsulation layer 15, and the third encapsulation layer 16 is provided at a position corresponding to the launch tube 12 The light exit hole 161 for the corresponding emitting tube 12 to be exposed is provided, and the third encapsulation layer 16 is provided with a light entrance hole 162 for the corresponding receiving tube 13 to be exposed at a position corresponding to the receiving tube 13; and

Step 4: Cut the third encapsulation layer 16 and the substrate 11 to form a plurality of distance measuring light sensors 1. Each distance measuring light sensor 1 includes a transmitting tube 12 and a receiving tube 13 arranged adjacently .

Specifically, the third encapsulation layer 16 is injected on the first encapsulation layer 14 and the second encapsulation layer 15 by means of secondary injection molding, and the third encapsulation layer 16 corresponds to the position of the transmitting tube 12 and the receiving tube 13 through a mold. Corresponding light exit holes 161 and light entrance holes 162 are opened; the shapes of the light exit holes 161 and the light entrance holes 162 can be designed according to specific requirements, for example, the shapes of the light exit holes 161 and the light entrance holes 162 are both horn-shaped or both The longitudinal cross-sectional shape is rectangular.

In addition, the light-emitting portion 141 is set corresponding to the position of the light-emitting hole 161, and its shape and height can be designed according to specific requirements. For example, in this embodiment, the longitudinal cross-sectional shape of the light-emitting portion 141 may be rectangular or semicircular, and may be convex. It can also be flat. The shape and height of the light incident portion 151 can also be designed according to specific requirements. The longitudinal cross-sectional shape of the light incident portion 151 is semicircular or rectangular, and may be convex or flat. Thus, the optical sensor 1 for distance measurement in this embodiment is obtained.

The above-mentioned multiple different injection molding (molding) molding process technology methods are used to make the emitted light beam more condensed, and the light receiving device collects more light, that is, the first encapsulation layer 14 can ensure that the emitted light beam of the emitting tube 12 is more condensed, and the second encapsulation layer 15 can ensure that the receiving tube 13 receives the light beam more.

In one embodiment, the above-mentioned accommodating space is formed by cutting or moulding, and the first packaging layer 14 and the second packaging layer 15 have the same material. For example, the first packaging layer 14 and the second packaging layer 15 are both transparent adhesive layers. .

The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention shall be included in the application of the present invention. Within the scope of the patent.

Among them, the symbols in the drawings are as follows: 1: Light sensor for distance measurement 11: substrate 12: Launch tube 13: receiving tube 14: The first encapsulation layer 140: The first body 141: Light Emitting Department 1411: first protrusion 1412: The first plane 15: The second encapsulation layer 150: The second body 151: Light incident 1511: second protrusion 1512: The second plane 16: The third encapsulation layer 161: light hole 162: Light hole 163: Gap 171: first lead 172: second lead 181: The first pad 182: second pad 183: third pad 184: Fourth pad 185: The first connection pad 186: The second connection pad 187: third connection pad 188: Fourth connection pad 191: first polarity 192: second polarity A-A: Direction

In order to more clearly describe the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some of the present invention. In the embodiments, for those with ordinary knowledge in the technical field, other drawings may be obtained based on these drawings without creative work. Figure 1 is a schematic diagram of a front view of the optical sensor for distance measurement provided by an embodiment of the present invention; Figure 2 is a first embodiment of a schematic sectional view taken along the A-A direction in Figure 1; Figure 3 is a second embodiment of the schematic cross-sectional structure along the A-A direction in Figure 1; Figure 4 is a third embodiment of the schematic cross-sectional structure along the A-A direction in Figure 1; Figure 5 is a fourth embodiment of the schematic cross-sectional structure along the A-A direction in Figure 1; Figure 6 is a fifth embodiment of the schematic cross-sectional structure along the A-A direction in Figure 1; Figure 7 is a schematic side view of the optical sensor for distance measurement in Figure 1; Fig. 8 is a schematic bottom view of the structure of the substrate in Fig. 1; Figure 9 is a schematic diagram of the polar structure of the substrate in Figure 8; Figure 10 is the internal circuit diagram of the launch tube in Figure 1; Figure 11 is an internal circuit diagram of the receiving tube in Figure 1.

1: Light sensor for distance measurement

11: substrate

12: Launch tube

13: receiving tube

14: The first encapsulation layer

140: The first body

141: Light Emitting Department

1411: first protrusion

15: The second encapsulation layer

150: The second body

151: Light incident

1511: second protrusion

16: The third encapsulation layer

161: light hole

162: Light hole

171: first lead

172: second lead

Claims (10)

A photo sensor for distance measurement, comprising: a substrate; a transmitting tube arranged on the substrate and electrically connected to the substrate; a receiving tube arranged on the substrate and electrically connected to the substrate; A first encapsulation layer encapsulated above the transmitting tube; a second encapsulation layer encapsulated above the receiving tube; and a third encapsulation layer surrounding the first encapsulation layer and the second encapsulation layer for shading, the The material of the third encapsulation layer is different from the material of the substrate; the first encapsulation layer includes a first body and a light-emitting portion disposed on the side of the first body away from the emission tube, and the third encapsulation layer is provided with A light exit hole corresponding to the light exit part; the second encapsulation layer includes a second body and a light entrance part disposed on the side of the second body away from the receiving tube, and the third encapsulation layer is provided with a corresponding light entrance part A light entrance hole in the, wherein the light entrance hole is horn-shaped, and the diameter of the end surface of the horn-shaped light entrance hole close to the substrate is smaller than the end surface diameter of the end far away from the substrate. A photo sensor for distance measurement, comprising: a substrate; a transmitting tube arranged on the substrate and electrically connected to the substrate; a receiving tube arranged on the substrate and electrically connected to the substrate; A first encapsulation layer is encapsulated above the transmitting tube; a second encapsulation layer is encapsulated above the receiving tube; and A third encapsulation layer surrounds the first encapsulation layer and the second encapsulation layer for shading. The material of the third encapsulation layer is different from the material of the substrate; the first encapsulation layer includes a first body and is disposed on A light exit portion of the first body facing away from the emission tube, the third encapsulation layer is provided with a light exit hole corresponding to the light exit portion; the second encapsulation layer includes a second body and is disposed away from the second body A light incident portion on one side of the receiving tube, the third encapsulation layer is provided with a light incident hole corresponding to the light incident portion, and the light output portion is a first protruding portion from the first body away from the transmitting tube. A protrusion, the longitudinal cross-sectional shape of the first protrusion is curved or rectangular. According to the light sensor described in item 1 of the scope of patent application, the light emitting portion is a first plane portion of the first body facing away from the emitting tube. The light sensor according to item 1 of the scope of patent application, wherein the light incident portion is a second protrusion that protrudes from the second body in a direction away from the receiving tube, and the second protrusion is The longitudinal cross-sectional shape is curved or rectangular. According to the light sensor described in item 1 of the scope of patent application, the light incident part is a second flat part of the second body facing away from the receiving tube. According to the light sensor described in claim 1, wherein the light exit hole is horn-shaped, and the end surface diameter of the horn-shaped light exit hole near the substrate is smaller than the end surface diameter of the end far away from the substrate. According to the light sensor described in item 1 of the scope of patent application, the third encapsulation layer is in contact with the side of the second body where the light incident portion is provided. According to the light sensor described in claim 1, wherein the material of the third encapsulation layer is different from the material of the first encapsulation layer and the material of the second encapsulation layer. A method for manufacturing a distance measuring light sensor, wherein the light sensor for distance measuring as described in any one of items 1 to 8 of the scope of the patent application is formed, comprising the following steps: A plurality of the transmitting tubes and a plurality of the receiving tubes are arranged on the upper side, wherein the plurality of the transmitting tubes and the plurality of the receiving tubes are arranged in a plurality of rows, and the transmitting tubes arranged in a plurality of rows and the receiving tubes arranged in a plurality of rows are arranged in a plurality of rows. Arranged in a staggered manner, a plurality of the transmitting tubes and a plurality of the receiving tubes are respectively electrically connected to the substrate; a plurality of the first encapsulation layers arranged on the substrate and each covering the emitting tube are formed, and a plurality of the first encapsulation layers are arranged on the The substrate is covered with the second encapsulation layer of the receiving tube, and between each adjacent first encapsulation layer and the second encapsulation layer, and between each two adjacent first encapsulation layers An accommodating space is formed between each two adjacent second encapsulation layers; the third encapsulation layer is formed in the accommodating space, wherein the third encapsulation layer surrounds the first encapsulation layer and the second encapsulation layer The position of the third encapsulation layer corresponding to the emitting tube is provided with the light-exiting hole for the corresponding emitting tube to be exposed, and the position of the third encapsulating layer corresponding to the receiving tube is provided with the correspondingly exposed receiving tube The light entrance hole; and the third encapsulation layer and the substrate are cut to form a plurality of light sensors for measuring the distance, each of the light sensors for measuring the distance includes an adjacently disposed one of the emitting tube and One such receiving tube. According to the manufacturing method of the light sensor described in claim 9, wherein the accommodating space is formed by cutting or moulding, and the first encapsulation layer and the second encapsulation layer have the same material.

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