TWM608988U - Proximity sensing device - Google Patents

Proximity sensing device Download PDF

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Publication number
TWM608988U
TWM608988U TW109214235U TW109214235U TWM608988U TW M608988 U TWM608988 U TW M608988U TW 109214235 U TW109214235 U TW 109214235U TW 109214235 U TW109214235 U TW 109214235U TW M608988 U TWM608988 U TW M608988U
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Taiwan
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light
ultraviolet light
sensing device
light source
proximity sensing
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TW109214235U
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Chinese (zh)
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陳宗慶
朱信樺
王耀德
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艾笛森光電股份有限公司
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Priority to TW109214235U priority Critical patent/TWM608988U/en
Priority to CN202022845145.5U priority patent/CN214413097U/en
Publication of TWM608988U publication Critical patent/TWM608988U/en

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection

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Abstract

A proximity sensing device includes at least one substrate, an ultraviolet light source, a light sensor, and at least one light transmissive layer. The ultraviolet light source is located on a top surface of the substrate, and is configured to emit ultraviolet light. The light sensor is located on the top surface of the substrate, and is configured to receive light form an object that reflects the ultraviolet light. The light transmissive layer covers the ultraviolet light source and the light sensor.

Description

鄰近感測裝置Proximity sensing device

本揭露是有關一種鄰近感測裝置。This disclosure relates to a proximity sensing device.

一般而言，傳統鄰近感測器可發射電磁場或電磁輻射束(例如紅外線)並偵測電場或返回訊號的變化來實現特定功能。舉例來說，智慧型手機常配有鄰近感測器。當有目標物(例如人體)出現在其偵測範圍內時，手機可從睡眠模式中喚醒。又例如，在使用手機撥打電話時，鄰近感測器同步偵測目標物是否出現，因此手機放在耳邊時可自動關閉觸控式螢幕，以避免意外操作。另外，鄰近感測器也被用於一些機械裝置的振動監測。Generally speaking, traditional proximity sensors can emit electromagnetic fields or electromagnetic radiation beams (such as infrared) and detect changes in electric fields or return signals to achieve specific functions. For example, smart phones are often equipped with proximity sensors. When a target (such as a human body) appears within its detection range, the phone can wake up from sleep mode. For another example, when using a mobile phone to make a call, the proximity sensor synchronously detects whether the target is present, so when the mobile phone is placed near the ear, the touch screen can be automatically turned off to avoid accidental operations. In addition, proximity sensors are also used for vibration monitoring of some mechanical devices.

然而，傳統鄰近感測器不具有消毒功能。此外，傳統消毒用的紫外光燈通常須由開關電源來執行啟閉，因此在關閉電源前可能會照射到人體，而對人體造成傷害。However, the traditional proximity sensor does not have a disinfection function. In addition, the traditional ultraviolet light used for disinfection usually needs to be switched on and off by a switching power supply, so it may be irradiated to the human body before the power is turned off, which may cause harm to the human body.

本揭露之一技術態樣為一種鄰近感測裝置。One technical aspect of the present disclosure is a proximity sensing device.

根據本揭露一實施方式，一種鄰近感測裝置包含至少一基板、紫外光源、光感測器及至少一透光層。紫外光源位於基板的頂面上，配置以發出紫外光。光感測器位於基板的頂面上，配置以接收紫外光被目標物反射的光。透光層覆蓋紫外光源與光感測器。According to an embodiment of the present disclosure, a proximity sensing device includes at least one substrate, an ultraviolet light source, a light sensor, and at least one light-transmitting layer. The ultraviolet light source is located on the top surface of the substrate and is configured to emit ultraviolet light. The light sensor is located on the top surface of the substrate and is configured to receive the ultraviolet light reflected by the target. The light-transmitting layer covers the ultraviolet light source and the light sensor.

在本揭露一實施方式中，上述基板的數量為二，紫外光源與光感測器分別位於兩基板上。In an embodiment of the present disclosure, the number of the above-mentioned substrates is two, and the ultraviolet light source and the light sensor are respectively located on the two substrates.

在本揭露一實施方式中，上述透光層的數量為二，兩透光層分別覆蓋紫外光源與光感測器。In an embodiment of the present disclosure, the number of the above-mentioned light-transmitting layers is two, and the two light-transmitting layers respectively cover the ultraviolet light source and the light sensor.

在本揭露一實施方式中，上述鄰近感測裝置更包含增高墊。增高墊位於基板上，且紫外光源位於增高墊上。In an embodiment of the present disclosure, the aforementioned proximity sensing device further includes a heightening pad. The heightening pad is located on the substrate, and the ultraviolet light source is located on the heightening pad.

在本揭露一實施方式中，上述鄰近感測裝置更包含支撐件。支撐件位於基板上，且圍繞透光層。In an embodiment of the present disclosure, the aforementioned proximity sensing device further includes a support member. The support is located on the substrate and surrounds the light-transmitting layer.

在本揭露一實施方式中，上述支撐件具有開口，且透光層從支撐件的開口裸露。In an embodiment of the present disclosure, the support member has an opening, and the light-transmitting layer is exposed from the opening of the support member.

在本揭露一實施方式中，上述鄰近感測裝置更包含隔板。隔板位於透光層與基板之間，且位於紫外光源與光感測器之間。In an embodiment of the present disclosure, the aforementioned proximity sensing device further includes a partition. The partition is located between the light-transmitting layer and the substrate, and between the ultraviolet light source and the light sensor.

在本揭露一實施方式中，上述支撐件的一部分位於紫外光源與光感測器之間，且此部分延伸至基板。In an embodiment of the present disclosure, a part of the support member is located between the ultraviolet light source and the light sensor, and this part extends to the substrate.

在本揭露一實施方式中，上述透光層為矽膠體或玻璃片。In an embodiment of the present disclosure, the light-transmitting layer is made of silicon colloid or glass sheet.

在本揭露一實施方式中，上述鄰近感測裝置更包含電路板與控制器。電路板承載基板。控制器位於電路板上，且電性連接紫外光源與光感測器。In an embodiment of the present disclosure, the aforementioned proximity sensing device further includes a circuit board and a controller. The circuit board carries the substrate. The controller is located on the circuit board and is electrically connected to the ultraviolet light source and the light sensor.

在本揭露上述實施方式中，由於鄰近感測裝置包含紫外光源，因此紫外光源發出的紫外光在無目標物遮擋的狀態下，紫外光可對鄰近感測裝置附近的環境進行消毒。當有目標物(例如人體)接近鄰近感測裝置時，光感測器可接收上述紫外光被目標物反射的光，進而根據目標物(例如人體)的距離調整紫外光源的亮度，避免人體受到傷害。也就是說，本揭露的鄰近感測裝置不僅具有消毒的能力，還具有鄰近感測目標物距離而調整紫外光源之亮度的能力，大幅提升使用安全性。In the above-mentioned embodiments of the present disclosure, since the proximity sensing device includes an ultraviolet light source, the ultraviolet light emitted by the ultraviolet light source can disinfect the environment near the proximity sensing device when the ultraviolet light emitted by the ultraviolet light source is not blocked by the target. When a target (such as a human body) approaches the adjacent sensing device, the light sensor can receive the above-mentioned ultraviolet light reflected by the target, and then adjust the brightness of the ultraviolet light source according to the distance of the target (such as the human body) to prevent the human body from being exposed to it. hurt. In other words, the proximity sensing device of the present disclosure not only has the ability to disinfect, but also has the ability to adjust the brightness of the ultraviolet light source by sensing the distance of the target object, which greatly improves the safety of use.

以下將以圖式揭露本揭露之複數個實施方式，為明確說明，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本揭露。也就是說，在本揭露部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。Hereinafter, a plurality of implementation manners of the present disclosure will be disclosed in diagrams. For clear description, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. In other words, in some implementations of this disclosure, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventionally used structures and elements will be shown in a simple schematic manner in the drawings.

第1圖繪示根據本揭露一實施方式之鄰近感測裝置100的剖面圖。如圖所示，鄰近感測裝置100包含基板110a、基板110b、紫外光源120、光感測器130、透光層140a及透光層140a。紫外光源120位於基板110a的頂面112a上，配置以發出紫外光L。光感測器130位於基板110b的頂面112b上，配置以接收紫外光L被目標物200反射的光L R。透光層140a覆蓋紫外光源120。透光層140b覆蓋光感測器130。 FIG. 1 shows a cross-sectional view of the proximity sensor device 100 according to an embodiment of the present disclosure. As shown in the figure, the proximity sensing device 100 includes a substrate 110a, a substrate 110b, an ultraviolet light source 120, a light sensor 130, a light-transmitting layer 140a, and a light-transmitting layer 140a. The ultraviolet light source 120 is located on the top surface 112a of the substrate 110a and is configured to emit ultraviolet light L. The light sensor 130 is located on the top surface 112b of the substrate 110b, and is configured to receive the ultraviolet light L reflected by the target 200 light L R. The light-transmitting layer 140a covers the ultraviolet light source 120. The light-transmitting layer 140b covers the light sensor 130.

在本實施方式中，鄰近感測裝置100包含兩基板110a、110b與兩透光層140a、140b，但在其他實施方式中，也可僅具有單一基板與單一透光層(將於後述)。紫外光源120可以為紫外光短波發光二極體(UVC LED)。光感測器130為紫外光感測器。基板110a、110b的材質可以為陶瓷，其具有良好的散熱效率，可有效排除紫外光源120與光感測器130的熱。In this embodiment, the proximity sensing device 100 includes two substrates 110a, 110b and two light-transmitting layers 140a, 140b, but in other embodiments, it may only have a single substrate and a single light-transmitting layer (described later). The ultraviolet light source 120 may be an ultraviolet short-wave light emitting diode (UVC LED). The light sensor 130 is an ultraviolet light sensor. The material of the substrate 110a, 110b may be ceramic, which has good heat dissipation efficiency and can effectively remove the heat of the ultraviolet light source 120 and the light sensor 130.

此外，透光層140a可以為玻璃片，透光層140b可以為矽膠體。也就是說，透光層140a與透光層140b的材質不同。透光層140a設置於紫外光源120上方且與紫外光源120的頂面分開一距離。透光層140b圍繞光感測器130且覆蓋繞光感測器130的頂面，透光層140b直接接觸光感測器130的側面與頂面。In addition, the light-transmitting layer 140a may be a glass sheet, and the light-transmitting layer 140b may be a silicon colloid. In other words, the materials of the light-transmitting layer 140a and the light-transmitting layer 140b are different. The light-transmitting layer 140a is disposed above the ultraviolet light source 120 and separated from the top surface of the ultraviolet light source 120 by a distance. The light-transmitting layer 140b surrounds the light sensor 130 and covers the top surface of the light sensor 130, and the light-transmitting layer 140b directly contacts the side and the top surface of the light sensor 130.

由於鄰近感測裝置100包含紫外光源120，因此紫外光源120發出的紫外光L在無目標物遮擋的狀態下，紫外光L可對鄰近感測裝置100附近的環境進行消毒。當有目標物200(例如人體)接近鄰近感測裝置100時，紫外光L可被目標物200反射，光感測器130可接收紫外光L被目標物200反射的光L R，進而根據目標物200(例如人體)的距離調整紫外光源120的亮度，避免人體因紫外光照射受到傷害。 Since the proximity sensing device 100 includes the ultraviolet light source 120, the ultraviolet light L emitted by the ultraviolet light source 120 can sterilize the environment near the proximity sensing device 100 when the ultraviolet light L emitted by the ultraviolet light source 120 is not blocked by the target. When a target 200 (such as a human body) approaches the proximity sensing device 100, the ultraviolet light L can be reflected by the target 200, and the light sensor 130 can receive the ultraviolet light L reflected by the target 200 light L R , and then according to the target The distance of the object 200 (such as the human body) adjusts the brightness of the ultraviolet light source 120 to prevent the human body from being damaged by ultraviolet light.

舉例來說，當目標物200(例如人體)越接近，紫外光源120的亮度越低；當目標物200(例如人體)越遠離，紫外光源120的亮度越高。也就是說，本揭露的鄰近感測裝置100不僅具有消毒的能力，還具有鄰近感測目標物200距離而調整紫外光源120之亮度的能力，大幅提升使用安全性。For example, when the target 200 (such as a human body) is closer, the brightness of the ultraviolet light source 120 is lower; when the target 200 (such as a human body) is farther away, the brightness of the ultraviolet light source 120 is higher. That is to say, the proximity sensing device 100 of the present disclosure not only has the ability to sterilize, but also has the ability to adjust the brightness of the ultraviolet light source 120 by sensing the distance from the target 200, which greatly improves the safety of use.

在本實施方式中，鄰近感測裝置100更包含支撐件150a。支撐件150a位於基板110a上，且圍繞透光層140a與紫外光源120。支撐件150a配置以支撐透光層140a，使透光層140a位於紫外光源120上方。支撐件150a的材質可以為金屬(例如銅)，但並不用以限制本揭露。In this embodiment, the proximity sensing device 100 further includes a support 150a. The support 150 a is located on the substrate 110 a and surrounds the light-transmitting layer 140 a and the ultraviolet light source 120. The support 150 a is configured to support the light-transmitting layer 140 a so that the light-transmitting layer 140 a is located above the ultraviolet light source 120. The material of the support 150a may be metal (for example, copper), but it is not used to limit the disclosure.

鄰近感測裝置100更包含電路板160與控制器170。電路板160承載基板110a、110b。控制器170位於電路板160上，且電性連接紫外光源120與光感測器130。在本實施方式中，控制器170可經由導電墊180a、180b分別電性連接紫外光源120與光感測器130。控制器170可根據光感測器130接收到被目標物200反射的光L R判斷目標物200(例如人體)的距離，進而調整紫外光源120之亮度。 The proximity sensing device 100 further includes a circuit board 160 and a controller 170. The circuit board 160 carries the substrates 110a and 110b. The controller 170 is located on the circuit board 160 and is electrically connected to the ultraviolet light source 120 and the light sensor 130. In this embodiment, the controller 170 may be electrically connected to the ultraviolet light source 120 and the light sensor 130 via the conductive pads 180a and 180b, respectively. The controller 170 may receive the object 200 reflected the optical light sensor 130 determines the target L R 200 (e.g., human) distance, so as to adjust the brightness of the UV light source 120.

應瞭解到，已敘述過的元件連接關係、材料與功效將不再重複贅述，合先敘明。在以下敘述中，將說明其他形式的鄰近感測裝置，且以下各鄰近感測裝置可亦可包含第1圖之電路板160與控制器170。It should be understood that the connection relationship, materials and effects of the components that have been described will not be repeated, and will be described first. In the following description, other types of proximity sensing devices will be described, and each of the following proximity sensing devices may also include the circuit board 160 and the controller 170 in FIG. 1.

第2圖繪示根據本揭露另一實施方式之鄰近感測裝置100a的剖面圖。如圖所示，鄰近感測裝置100a包含基板110、紫外光源120、光感測器130、透光層140及支撐件150。基板110與透光層140的數量均為一。紫外光源120、光感測器130及支撐件150皆位於基板110的頂面112上。透光層140位於支撐件150上，且覆蓋紫外光源120與光感測器130。透光層140未與紫外光源120、光感測器130接觸。FIG. 2 shows a cross-sectional view of a proximity sensor device 100a according to another embodiment of the present disclosure. As shown in the figure, the proximity sensing device 100a includes a substrate 110, an ultraviolet light source 120, a light sensor 130, a light-transmitting layer 140, and a support 150. The number of the substrate 110 and the light-transmitting layer 140 are both one. The ultraviolet light source 120, the light sensor 130 and the support 150 are all located on the top surface 112 of the substrate 110. The light-transmitting layer 140 is located on the support 150 and covers the ultraviolet light source 120 and the light sensor 130. The light-transmitting layer 140 is not in contact with the ultraviolet light source 120 and the light sensor 130.

在本實施方式中，鄰近感測裝置100a更包含增高墊190。增高墊190位於基板110上，且紫外光源120位於增高墊190上。換句話說，增高墊190位於紫外光源120與基板110之間。這樣的設計，可讓紫外光源120高於光感測器130，避免光感測器130接收到紫外光源120的側向光，造成誤判或干擾。In this embodiment, the proximity sensing device 100 a further includes a heightening pad 190. The heightening pad 190 is located on the substrate 110, and the ultraviolet light source 120 is located on the heightening pad 190. In other words, the height-enhancing pad 190 is located between the ultraviolet light source 120 and the substrate 110. Such a design can make the ultraviolet light source 120 higher than the light sensor 130, and prevent the light sensor 130 from receiving the side light of the ultraviolet light source 120, which may cause misjudgment or interference.

第3圖繪示根據本揭露又一實施方式之鄰近感測裝置100b的剖面圖。如圖所示，鄰近感測裝置100b包含基板110、紫外光源120、光感測器130、透光層140及支撐件150。與第2圖實施方式不同的地方在於，鄰近感測裝置100b更包含隔板155。隔板155位於透光層140與基板110之間，且位於紫外光源120與光感測器130之間。隔板155的材質可以為金屬或塑膠，並不用以限制本揭露。隔板155可避免光感測器130接收到紫外光源120的側向光，造成誤判或干擾。FIG. 3 is a cross-sectional view of a proximity sensor device 100b according to another embodiment of the present disclosure. As shown in the figure, the proximity sensing device 100b includes a substrate 110, an ultraviolet light source 120, a light sensor 130, a light-transmitting layer 140, and a support 150. The difference from the embodiment in FIG. 2 is that the proximity sensing device 100 b further includes a partition 155. The partition 155 is located between the light-transmitting layer 140 and the substrate 110 and between the ultraviolet light source 120 and the light sensor 130. The material of the partition 155 can be metal or plastic, which is not used to limit the disclosure. The partition 155 can prevent the light sensor 130 from receiving the lateral light of the ultraviolet light source 120, causing misjudgment or interference.

第4圖繪示根據本揭露再一實施方式之鄰近感測裝置100c的剖面圖。如圖所示，鄰近感測裝置100c包含基板110、紫外光源120、光感測器130、透光層140a、透光層140b及支撐件150。支撐件150的一部分(如中央部分)位於紫外光源120與光感測器130之間，且此部分延伸至基板110。支撐件150圍繞紫外光源120與光感測器130。第4圖的支撐件150可以為一體成型的塑膠，其中央部分具有第3圖之隔板155的功能，可避免光感測器130接收到紫外光源120的側向光，造成誤判或干擾。此外，在本實施方式中，透光層140a與透光層140b皆為玻璃片，皆位於支撐件150上且分別位於紫外光源120與光感測器130上方。FIG. 4 is a cross-sectional view of a proximity sensor device 100c according to still another embodiment of the present disclosure. As shown in the figure, the proximity sensing device 100c includes a substrate 110, an ultraviolet light source 120, a light sensor 130, a light-transmitting layer 140a, a light-transmitting layer 140b, and a support 150. A part (such as the central part) of the support 150 is located between the ultraviolet light source 120 and the light sensor 130, and this part extends to the substrate 110. The support 150 surrounds the ultraviolet light source 120 and the light sensor 130. The support 150 in FIG. 4 may be an integrally formed plastic, and its central part has the function of the partition 155 in FIG. 3, which can prevent the light sensor 130 from receiving the side light of the ultraviolet light source 120, which may cause misjudgment or interference. In addition, in this embodiment, both the light-transmitting layer 140a and the light-transmitting layer 140b are glass sheets, which are both located on the support 150 and above the ultraviolet light source 120 and the light sensor 130, respectively.

第5圖繪示根據本揭露一實施方式之鄰近感測裝置100d的剖面圖。如圖所示，鄰近感測裝置100d包含基板110、紫外光源120、光感測器130、透光層140a、透光層140b及支撐件150。與第4圖實施方式不同的地方在於，第5圖的透光層140a與透光層140b皆為矽膠體，皆位於支撐件150中。透光層140a與透光層140b由位在紫外光源120與光感測器130之間的支撐件150隔開。FIG. 5 shows a cross-sectional view of a proximity sensor device 100d according to an embodiment of the present disclosure. As shown in the figure, the proximity sensing device 100d includes a substrate 110, an ultraviolet light source 120, a light sensor 130, a light-transmitting layer 140a, a light-transmitting layer 140b, and a support 150. The difference from the embodiment in FIG. 4 is that the light-transmitting layer 140a and the light-transmitting layer 140b in FIG. 5 are both silicone colloids, and both are located in the support 150. The light-transmitting layer 140a and the light-transmitting layer 140b are separated by a support 150 located between the ultraviolet light source 120 and the light sensor 130.

在本實施方式中，透光層140a與透光層140b分別圍繞且覆蓋紫外光源120與光感測器130。支撐件150具有開口O1、O2，且透光層140a從支撐件150的開口O1裸露，透光層140b從支撐件150的開口O2裸露。透光層140a的頂面142a可以為凸面，透光層140b的頂面142b可以為平面，但並不用以限制本揭露，依設計需求而定。In this embodiment, the light-transmitting layer 140a and the light-transmitting layer 140b respectively surround and cover the ultraviolet light source 120 and the light sensor 130. The supporting member 150 has openings O1 and O2, and the light-transmitting layer 140a is exposed from the opening O1 of the supporting member 150, and the light-transmitting layer 140b is exposed from the opening O2 of the supporting member 150. The top surface 142a of the light-transmitting layer 140a may be a convex surface, and the top surface 142b of the light-transmitting layer 140b may be a flat surface, but it is not used to limit the disclosure and depends on design requirements.

雖然本揭露已以實施方式揭露如上，然其並非用以限定本揭露，任何熟習此技藝者，在不脫離本揭露之精神和範圍內，當可作各種之更動與潤飾，因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although this disclosure has been disclosed in the above implementation manner, it is not intended to limit the disclosure. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, this disclosure is protected The scope shall be subject to the definition of the attached patent application scope.

100:鄰近感測裝置 100a:鄰近感測裝置 100b:鄰近感測裝置 100c:鄰近感測裝置 100d:鄰近感測裝置 110:基板 110a:基板 110b:基板 112:頂面 112a:頂面 112b:頂面 120:紫外光源 130:光感測器 140:透光層 140a:透光層 140b:透光層 142a:頂面 142b:頂面 150:支撐件 150a:支撐件 155:隔板 160:電路板 170:控制器 180a:導電墊 180b:導電墊 190:增高墊 200:目標物 L:紫外光 L R:反射的光 O1:開口 O2:開口100: Proximity sensing device 100a: Proximity sensing device 100b: Proximity sensing device 100c: Proximity sensing device 100d: Proximity sensing device 110: Substrate 110a: Substrate 110b: Substrate 112: Top surface 112a: Top surface 112b: Top Surface 120: ultraviolet light source 130: light sensor 140: light-transmitting layer 140a: light-transmitting layer 140b: light-transmitting layer 142a: top surface 142b: top surface 150: support 150a: support 155: partition 160: circuit board 170: Controller 180a: Conductive pad 180b: Conductive pad 190: Increased pad 200: Target L: Ultraviolet light L R : Reflected light O1: Opening O2: Opening

第1圖繪示根據本揭露一實施方式之鄰近感測裝置的剖面圖。 第2圖繪示根據本揭露另一實施方式之鄰近感測裝置的剖面圖。 第3圖繪示根據本揭露又一實施方式之鄰近感測裝置的剖面圖。 第4圖繪示根據本揭露再一實施方式之鄰近感測裝置的剖面圖。 第5圖繪示根據本揭露一實施方式之鄰近感測裝置的剖面圖。 FIG. 1 shows a cross-sectional view of a proximity sensing device according to an embodiment of the present disclosure. FIG. 2 is a cross-sectional view of a proximity sensing device according to another embodiment of the present disclosure. FIG. 3 shows a cross-sectional view of a proximity sensing device according to another embodiment of the present disclosure. FIG. 4 is a cross-sectional view of a proximity sensor device according to still another embodiment of the present disclosure. FIG. 5 is a cross-sectional view of the proximity sensing device according to an embodiment of the present disclosure.

100:鄰近感測裝置 100: Proximity sensing device

110a:基板 110a: substrate

110b:基板 110b: substrate

112a:頂面 112a: Top surface

112b:頂面 112b: top surface

120:紫外光源 120: UV light source

130:光感測器 130: light sensor

140a:透光層 140a: light-transmitting layer

140b:透光層 140b: light-transmitting layer

150a:支撐件 150a: Support

160:電路板 160: circuit board

170:控制器 170: Controller

180a:導電墊 180a: conductive pad

180b:導電墊 180b: conductive pad

200:目標物 200: target

L:紫外光 L: Ultraviolet light

LR:反射的光 L R : reflected light

Claims (10)

一種鄰近感測裝置，包含： 至少一基板； 一紫外光源，位於該至少一基板的一頂面上，配置以發出一紫外光； 一光感測器，位於該至少一基板的該頂面上，配置以接收該紫外光被一目標物反射的光；以及 至少一透光層，覆蓋該紫外光源與該光感測器。 A proximity sensing device, including: At least one substrate; An ultraviolet light source located on a top surface of the at least one substrate and configured to emit an ultraviolet light; A light sensor located on the top surface of the at least one substrate and configured to receive the ultraviolet light reflected by a target; and At least one light-transmitting layer covers the ultraviolet light source and the light sensor. 如請求項1所述的鄰近感測裝置，其中該至少一基板的數量為二，該紫外光源與該光感測器分別位於該兩基板上。The proximity sensing device according to claim 1, wherein the number of the at least one substrate is two, and the ultraviolet light source and the light sensor are respectively located on the two substrates. 如請求項1所述的鄰近感測裝置，其中該至少一透光層的數量為二，該兩透光層分別覆蓋該紫外光源與該光感測器。The proximity sensing device according to claim 1, wherein the number of the at least one light-transmitting layer is two, and the two light-transmitting layers respectively cover the ultraviolet light source and the light sensor. 如請求項1所述的鄰近感測裝置，更包含： 一增高墊，位於該至少一基板上，且該紫外光源位於該增高墊上。 The proximity sensing device according to claim 1, further comprising: An elevation pad is located on the at least one substrate, and the ultraviolet light source is located on the elevation pad. 如請求項1所述的鄰近感測裝置，更包含： 一支撐件，位於該至少一基板上，且圍繞該至少一透光層。 The proximity sensing device according to claim 1, further comprising: A supporting member is located on the at least one substrate and surrounds the at least one light-transmitting layer. 如請求項5所述的鄰近感測裝置，其中該支撐件具有一開口，且該至少一透光層從該支撐件的該開口裸露。The proximity sensing device according to claim 5, wherein the support has an opening, and the at least one light-transmitting layer is exposed from the opening of the support. 如請求項5所述的鄰近感測裝置，更包含： 一隔板，位於該支撐件與該至少一基板之間，且位於該紫外光源與該光感測器之間。 The proximity sensing device according to claim 5, further comprising: A partition is located between the support and the at least one substrate, and between the ultraviolet light source and the light sensor. 如請求項5所述的鄰近感測裝置，其中該支撐件的一部分位於該紫外光源與該光感測器之間，且該部分延伸至該至少一基板。The proximity sensing device according to claim 5, wherein a part of the supporting member is located between the ultraviolet light source and the photo sensor, and the part extends to the at least one substrate. 如請求項1所述的鄰近感測裝置，其中該至少一透光層為矽膠體或玻璃片。The proximity sensing device according to claim 1, wherein the at least one light-transmitting layer is silicon colloid or glass sheet. 如請求項1所述的鄰近感測裝置，更包含： 一電路板，承載該至少一基板；以及 一控制器，位於該電路板上，且電性連接該紫外光源與該光感測器。 The proximity sensing device according to claim 1, further comprising: A circuit board carrying the at least one substrate; and A controller is located on the circuit board and is electrically connected to the ultraviolet light source and the light sensor.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI782715B (en) * 2021-08-17 2022-11-01 大陸商弘凱光電（江蘇）有限公司 Distance sensor package structure
TWI803896B (en) * 2021-07-01 2023-06-01 香港商冠捷投資有限公司 display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI803896B (en) * 2021-07-01 2023-06-01 香港商冠捷投資有限公司 display device
TWI782715B (en) * 2021-08-17 2022-11-01 大陸商弘凱光電（江蘇）有限公司 Distance sensor package structure

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