JP5896758B2 - LED light emitting device - Google Patents

Description

  The present invention relates to an LED light emitting device for illumination comprising a light emitting body composed of LEDs and a reflecting frame surrounding the light emitting body.

  In recent years, LED light-emitting devices using light-emitting diode elements (LED chips) have been used as light source devices that replace light bulbs and fluorescent lamps. Since the directivity of the LED is narrower than that of the light bulb, when the LED is used for illumination, a contrivance is made to widen the directivity by using a reflective material. Such LED light-emitting devices are often configured to include a light-emitting body in which a plurality of LED chips are arranged on a substrate and sealed with a resin, and a reflection frame body that surrounds the light-emitting body (Patent Document 1, Patent Document 1). 2). Patent Document 3 discloses an LED light-emitting device that is configured by using a black resin material for a reflection frame that surrounds the light-emitting body in order to obtain a light-shielding effect.

  The light emitter provided in the LED light emitting device having the above structure is composed of a plurality of LED chips (not shown), and the plurality of LED chips are gathered at the central portion of the substrate and sealed in a circular shape. . In addition, the reflective frame body is provided with a concave portion hollowed out in a mortar shape, and a reflective surface for reflecting light emitted from the light emitter upward is provided in the concave portion.

  In the LED light-emitting device having such a structure, the front direction is directly illuminated by the light emitted from the light emitter, and the directivity corresponding to the inclination angle of the reflection surface can be obtained. .

JP 2004-327955 A JP 2010-171164 A JP 2001-144333 A

  The light emitted from the light emitter is directed upward by the reflection surface of the reflection frame and is totally reflected, but leaks to the outside through a gap formed between the substrate on which the light emitter is mounted and the reflection frame. Or may leak through the reflecting surface and leak out of the reflecting frame. In particular, like a flash light source of a camera, the stronger the light emitted from the light emitter, the more light leaks to the outside. Further, when such light leakage occurs, there is a problem that the amount of light with respect to the light emission direction is reduced accordingly.

  In the reflective frame shown in the above-mentioned patent document etc., the periphery of the light emitter is surrounded by a reflective surface, but since it is often formed on the basis of a resin material, the light shielding measure against the outside is It was not perfect. For this reason, when strong light is emitted from the light emitter, the amount of light leaking to the outside through a slight gap with the substrate surface increases, which may affect electronic components arranged in the periphery.

  Accordingly, an object of the present invention is to provide an LED light emitting device including a reflective frame that can effectively prevent light leakage to the outside without restricting light emission and reflection regions centered on the light emitter. is there.

In order to solve the above problems, an LED light-emitting device of the present invention includes a substrate, a light emitter mounted on the substrate, a reflective frame body provided on the substrate so as to surround the light emitter , In an LED light emitting device including an outer peripheral surface of a reflective frame and a light shielding member provided on at least a part of the outer peripheral surface of the substrate, a step portion is provided along the outer peripheral surface of the substrate , and the light shielding member is provided on the step portion. The lower end of is arranged .

  According to the LED light emitting device of the present invention, by providing the light shielding member from the outer peripheral surface of the reflective frame to at least a part of the outer peripheral surface of the substrate, the light emitted from the light emitter is transmitted through the inside of the reflective frame. And will not leak outside. In addition, light leaking to the outside through the mounting surface of the substrate on which the light emitter is mounted can be effectively shielded. As a result, other electronic components and the like arranged around the LED light-emitting device are not affected by malfunction or deterioration associated with light emission.

1 is a perspective view of an LED light emitting device according to a first embodiment of the present invention. It is sectional drawing of the said LED light-emitting device. It is an assembly perspective view of the LED light emitting device. It is sectional drawing of the LED light-emitting device which concerns on 2nd Embodiment of this invention. It is sectional drawing of the LED light-emitting device which concerns on 3rd Embodiment of this invention.

  1 and 2 show the structure of the LED light emitting device 11 according to the first embodiment of the present invention. The LED light-emitting device 11 is formed in a quadrangular shape using glass epoxy, BT resin, or the like, and is disposed on the substrate 12 on the surface of which an electrode pattern or an electrode terminal (not shown) is provided, and in the central portion on the substrate 12. The light-emitting body 13 is provided with a reflection frame body 16 on which a reflection surface 18 surrounding the light-emitting body 13 is formed.

  The light emitter 13 includes a plurality of light emitting elements (LED chips) 14 that are mounted in an array in the vertical and horizontal directions, and a resin member 15 that seals the plurality of LED chips 14 in a circular shape. The LED chip 14 is made of a gallium nitride-based compound semiconductor as an example, and is squarely arranged with a constant interval of about several tens according to the set light emission amount, luminance, and the like. The plurality of LED chips 14 are all connected in series or in parallel, and the LED chips 14 at both ends are connected to a pair of terminal electrodes (not shown) formed of an anode and a cathode formed on the substrate 12. The resin member 15 is formed of a transparent or translucent resin material, and contains a predetermined amount of various fluorescent agents, diffusing agents, and the like according to the light emitting application.

  The reflection frame 16 has a frame body 17 made of a resin material having a recess 20 surrounding the light emitter 13 at the center, and a reflection surface 18 provided on the inner peripheral surface of the recess 20. . As shown in FIG. 3, the reflection frame 16 is placed and fixed on the substrate 12 so that the light emitter 13 is exposed from the recess 20. In order to uniformly collect the light emitted from the light emitter 13, the concave portion 20 has an inner peripheral surface formed in a circular shape, and the reflecting surface 18 is tapered upward along the inner peripheral surface. It has spread.

  The reflection frame 16 having the above-described configuration is provided with a light shielding member 21 made of a black resin having a high light shielding property on the outer peripheral surface 23 of the frame body 17. The light shielding member 21 includes four wall portions 24 made of black resin that are in close contact with the outer peripheral surface 23 of the frame body 17. The light shielding member 21 is formed, for example, by adding a light shielding member such as carbon black to a resin material molded to have a predetermined thickness, and covers the outer peripheral surface 23 of the frame body 17 without a gap. Provided. In the embodiment shown in FIG. 2, a step 22 is provided along the outer peripheral surface of the mounting surface 12 a of the substrate 12 so that no gap is generated between the substrate 12 and the reflection frame 16. The lower end 21 a of the light shielding member 21 is fitted and fixed to the portion 22. Accordingly, light leaking out of the substrate 12 through the mounting surface 12a can be reliably shielded.

  By providing the light shielding member 21 so as to extend from the outer peripheral surface of the reflective frame 16 to a part of the substrate 12, the reflective surface 18 side and the outside can be completely shielded from light. Thereby, even if light emitted from the light emitter 13 passes through the frame main body 17 or enters the frame main body 17 along the mounting surface 12a of the substrate 12, light leakage does not occur outside. In addition, since external disturbance light does not enter the reflection surface 18 side, unintentional reflection from the reflection surface 18 can be prevented.

  The reflective surface 18 is subjected to surface processing by a metal film having high light reflectivity, nickel plating or other silver plating. Further, the upper surface 19 of the reflecting frame 16 is also subjected to a metal film or plating process so as to be continuous with the reflecting surface 18, whereby the entire upper portion of the light emitting body 13 can emit light brightly. The shape and the inclination angle of the reflection surface 18 are appropriately set according to the optical specifications of the LED light emitting device 11, but in order to irradiate light uniformly over a certain distance like a flash light source of a camera. The shape is circular with the light emitter 13 as the center, and a range of 40 ° to 80 ° is suitable upward, and it is desirable to set the inclination in the range of up to 120 ° for indoor lighting.

  FIG. 3 shows an assembly structure of the LED light emitting device 11. The substrate 12 is formed in a square shape in accordance with the planar shape of the LED light emitting device 11, a die bond pattern (not shown) for mounting and arranging a plurality of LEDs 14 in series or in parallel at the center, and the die bond pattern at the outer periphery. A pair of terminal electrodes (not shown) including an anode and a cathode that are electrically connected to each other are patterned by etching or the like. And after mounting LED14 on the said die-bonding pattern, the circular light-emitting body 13 is formed by mounting a metal mold | die on the said board | substrate 12, and filling a resin material.

  A reflective frame 16 is placed on the substrate 12 on which the light emitting body 13 is formed, and is joined by an adhesive or the like. The reflection frame 16 is formed with a circular through-hole accommodating the light-emitting body 13 at the bottom and a reflection surface 18 extending obliquely upward from the through-hole by molding or cutting.

  As described above, the light shielding member 21 includes the four wall portions 24 made of a black resin material containing carbon black. The wall portion 24 of the light shielding member 21 is fitted from above so that the wall portion 24 is in close contact with the outer peripheral surface 23 of the frame body 17, and the lower end 21a is fixed to the step portion 22 provided on the substrate 12 with an adhesive or the like. Since carbon black has a light shielding property and an effect of absorbing ultraviolet rays, the frame body 17 can be effectively prevented from being deteriorated by light received from the outside. Even if carbon black is not used, the necessary light-shielding effect can be obtained by forming the light-shielding member 21 from a black resin and bringing it into close contact except for the reflective surface 18. In the present embodiment, the light shielding member 21 is configured separately from the reflection frame 16, but the thickness of the light shielding member 21 is increased by directly applying a black resin containing carbon black to the outer peripheral surface 23 of the frame body 17. A film can also be formed.

  FIG. 4 shows a cross-sectional configuration of the LED light emitting device 31 of the second embodiment. In this embodiment, the light shielding member 21 is provided so as to continuously cover the entire outer peripheral surface 23 of the frame main body 17 and the entire side surface 12b of the substrate 12 without a gap. As a result, light transmitted below the substrate 12 can be completely blocked so as not to leak outside, which is effective when a thin substrate or a translucent substrate is used.

  FIG. 5 shows a cross-sectional configuration of the LED light emitting device 41 of the third embodiment. In this embodiment, the substrate 42 has a laminated structure having a light shielding layer 43 inside. The light shielding layer 43 is formed of a black sheet-like resin material that does not transmit light, and is sandwiched between a lower resin layer 42a placed on a motherboard and an upper resin layer 42b on which a circuit pattern is formed. Formed. The upper resin layer 42b is formed with a stepped portion 44 that is recessed to such a depth that the end of the light shielding layer 43 appears at the outer peripheral edge. The frame body 17 of the reflective frame 16 disposed on the substrate 42 is formed so that the outer peripheral surface 23 is orthogonal to the upper side from the inner surface of the step portion 44, and the entire outer peripheral surface 23 and the step portion are formed. The light shielding member 21 is provided so as to fill 44. As a result, the lower end 21a of the light shielding member 21 covers the end of the light shielding layer 43, so that the entire outer peripheral surface 23 of the frame body 17 exposed to the outside can be shielded without gaps. The light shielding layer 43 may be a metal film that prevents light from being transmitted by reflection. Such a metal film may be formed by depositing a circuit pattern metal film on the entire surface of the lower resin layer 42a and laminating the upper resin layer 42b on the lower resin layer 42a when the substrate 42 is formed. it can.

  As described above, the light shielding member is disposed on the outer peripheral surface of the reflecting frame surrounding the light emitter, so that the light that has entered the reflecting frame or the light that diffuses through the mounting surface of the substrate can be transmitted. It is possible to effectively prevent leakage to the outside. Accordingly, it is possible to increase the intensity of light emitted upward from the light emitter through the reflecting surface without power loss.

  In this embodiment, since the reflecting surface of the reflecting frame is in an open state, it can be incorporated in the lighting device as it is, but by combining a convex or concave lens on the reflecting surface, the amount of emitted light Can be adjusted, and various light emitting effects can be obtained.

DESCRIPTION OF SYMBOLS 11, 31, 41 LED light-emitting device 12 Board | substrate 12a Mounting surface 12b Side surface 13 Light-emitting body 14 LED chip 15 Resin member 16 Reflective frame body 17 Frame main body 18 Reflecting surface 19 Upper surface 20 Recessed part 21 Light-shielding member 21a Lower end 22 Step part 23 Outer peripheral surface 24 Wall part 42 Substrate 42a Lower resin layer 42b Upper resin layer 43 Light shielding layer 44 Step part

Claims (3)

A substrate, a light emitter mounted on the substrate, a reflective frame provided on the substrate so as to surround the light emitter, an outer peripheral surface of the reflective frame, and at least a part of an outer peripheral surface of the substrate In the LED light emitting device comprising a light shielding member provided in
A LED light emitting device , wherein a step portion is provided along an outer peripheral surface of the substrate, and a lower end of the light shielding member is disposed on the step portion .   The LED light-emitting device according to claim 1, wherein the light shielding member is provided on the entire outer peripheral surface of the reflective frame and the entire outer peripheral surface of the substrate. The LED light-emitting device according to claim 1 , wherein the substrate has a laminated structure in which a light shielding layer is sandwiched, an end portion of the light shielding layer appears at a step portion of the substrate, and the end portion is covered with a lower end of the light shielding member.

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