TW202220235A - High-power light source packaging structure and manufacturing method thereof - Google Patents

Abstract

The invention relates to the technical field of semiconductor light sources, and provides a high-power light source packaging structure and a manufacturing method thereof. The high-power light source packaging structure comprises a substrate, a metal block device, light emitting chips and a packaging cover; the metal block device is provided with a main body block and a mounting block; a plurality of mounting surfaces are arranged on the peripheral side of the mounting block; the light emitting chips are fixed on the mounting surfaces; the light-emitting directions of the light emitting chips are the same; the packaging cover is arranged on the substrate and covers the metal block device and the multiple light emitting chips; the packaging cover is provided with a light-transmitting part; the light-transmitting part is located on the light-emitting path of the light emitting chips; a first conducting strip and a second conducting strip are arranged on the lower surface of the substrate at intervals; the first conducting strip and the second conducting strip are both electrically connected with the metal block device. According to the high-power light source packaging structure, the metal block device with the plurality of mounting surfaces is arranged on the substrate, so that the plurality of light emitting chips can be simultaneously arranged to improve the power; the metal block device can also improve the heat dissipation effect, so that the high-power light source packaging structure has the advantages of high power and good heat dissipation effect.

Description

High-power light source package structure and manufacturing method thereof

The present invention relates to the technical field of semiconductor light sources, in particular to a high-power light source packaging structure and a manufacturing method thereof.

Light emitting diode (LED) is a solid-state semiconductor device that can convert electrical energy into visible light. For example, high-power LED light sources or high-power laser light sources are used in micro-products such as micro-projectors or micro-car lights. Among them, high-power LED light sources need to use large-sized light-emitting chips, and the radiation power can only reach 5W to 8W, and in the miniature product, the space is small, the heat dissipation of high-power LED light source is inconvenient and expensive, or the heat dissipation treatment effect is not good, which affects the service life of the miniature product. The laser light source uses a power of 3W. To a 5W TO-CAN package, on the one hand, the power is small, and on the other hand, the TO-CAN package is a plug-in device. At the same time, if the welding feet are not allowed to connect, it will easily cause bending and other phenomena, which will affect the assembly efficiency.

The purpose of the embodiments of the present invention is to provide a high-power light source package structure, so as to solve the technical problems of poor heat dissipation effect and low power in the light source package body in the prior art on miniature products.

In order to achieve the above purpose, the technical solution adopted in the present invention is to provide a high-power light source packaging structure, comprising:

substrate;

a metal block device arranged on the upper surface of the base plate, the metal block device has a main body block and an installation block, the installation block is fixed on one side of the main body block, and the peripheral side of the installation block is provided with a plurality of installation surfaces;

a plurality of light-emitting chips, each light-emitting chip is fixed on each mounting surface and is electrically connected to the metal block device, and the light-emitting direction of each light-emitting chip is the same; and

The package cover is arranged on the substrate and covers the metal block device and a plurality of light-emitting chips. The package cover has a light-transmitting part, and the light-transmitting part is located on the light-emitting path of each light-emitting chip. The lower surface of the substrate is provided with first conductive sheets and The second conductive sheet, the first conductive sheet and the second conductive sheet are all electrically connected to the metal block device.

In one embodiment, the metal block device is a copper block device.

In one embodiment, the main body block is disposed on a substrate, and the substrate is a ceramic substrate.

In one embodiment, the mounting block is a right prism.

In one embodiment, the packaging cover is a metal cover or a glass cover.

In one embodiment, the encapsulation cover is a rectangular cover, the encapsulation cover includes four side plates and a top plate which are connected to each other and enclose a cavity, and the light-transmitting member is one of the four side plates.

In one embodiment, the light-transmitting member includes a convex lens, and the convex lens is located on the light-emitting path of each light-emitting chip.

In one embodiment, the metal block device is provided with metal pole pieces, the plurality of light-emitting chips are electrically connected to the metal pole pieces, the metal pole pieces extend to the bottom surface of the main block, and the upper surface of the substrate is provided with metal pole pieces that are electrically connected to the metal pole pieces The third conductive sheet and the fourth conductive sheet are connected, the third conductive sheet is electrically connected with the first conductive sheet, and the fourth conductive sheet is electrically connected with the second conductive sheet.

In one embodiment, the upper surface of the substrate is provided with a circle of mounting grooves for mounting the package cover.

Another object of the present invention is to provide a method for manufacturing a high-power light source package structure, which includes the following steps:

S1, making a package cover, a substrate and a metal block device; the package cover is provided with a light-transmitting member, the substrate is provided with a first conductive sheet and a second conductive sheet, and the metal block device is provided with a plurality of mounting surfaces;

S2, fixing the plurality of light-emitting chips on each mounting surface respectively and electrically connecting the metal block device, and making the light-emitting directions of the light-emitting chips the same;

S3, fixing the metal block device on the substrate, and making the metal block device electrically connected to the first conductive sheet and the second conductive sheet;

S4 , fixing the package cover on the substrate and covering the metal block device and the plurality of light-emitting chips, and making the light-transmitting member located on the light-emitting path of each light-emitting chip.

The high-power light source packaging structure and the manufacturing method thereof provided by the present invention have the beneficial effects that: by arranging the metal block device on the substrate, the mounting block of the metal block device is provided with a plurality of mounting surfaces, so that the same light emitting direction can be set simultaneously. A plurality of light-emitting chips can improve the power, and the metal block device can also improve the heat dissipation effect. The first conductive sheet and the second conductive sheet arranged on the lower surface of the substrate can realize the automatic bonding and welding of the high-power light source packaging structure through the surface mount technology process. On the circuit board, the assembly quality and production efficiency are improved.

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

It should be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inside", "outside" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that A device or element must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the invention.

In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined with "first" and "second" may expressly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.

As shown in FIG. 1 to FIG. 3 , a high-power light source packaging structure provided by an embodiment of the present invention will now be described. The high-power light source package structure includes a substrate 1 , a metal block device 2 , a plurality of light-emitting chips 3 and a package cover 4 . The metal block device 2 is disposed on the upper surface of the base plate 1 . Specifically, the metal block device 2 includes a main body block 21 and an installation block 22 . The main body block 21 is disposed on the base plate 1 , and the installation block 22 is disposed on one side of the main body block 21 . , the peripheral side of the mounting block 22 is provided with a plurality of mounting surfaces 221 . The main body block 21 and the mounting block 22 are integrally formed or welded, and the main body block 21 is welded on the substrate 1 .

Wherein, the lower surface of the substrate 1 is provided with a first conductive sheet 11 and a second conductive sheet 12 which are electrically connected to the metal block device 2 at intervals. The first conductive sheet 11 and the second conductive sheet 12 are respectively used for connecting with the circuit board. The positive electrode pad and the negative electrode pad are welded, the number of the plurality of mounting surfaces 221 on the mounting block 22 is the same as the number of the plurality of light-emitting chips 3, and each mounting surface 221 is electrically connected and fixed with a light-emitting chip 3. The light-emitting chips 3 are electrically connected to the metal block device 2, and the light-emitting surfaces 31 of each light-emitting chip 3 are located on the same side of the metal block device 2 so that the light-emitting directions of the light-emitting chips 3 are the same. The light-emitting chips 3 can be LED light sources or laser light sources. .

The package cover 4 is fixed on the upper surface of the substrate 1 and used to cover the metal block device 2 and the plurality of light-emitting chips 3, so as to protect the metal block device 2 and the light-emitting chips 3. The package cover 4 has a light-transmitting member 41. The light-transmitting member 41 is located on the light-emitting path of each light-emitting chip 3 , and the light-transmitting member 41 is used for the light of the light-emitting chip 3 to exit the encapsulation cover 4 for lighting.

In the high-power light source package structure provided by the embodiment of the present invention, by arranging the metal block device 2 on the substrate 1, the mounting block 22 of the metal block device 2 has a plurality of mounting surfaces 221, so that a plurality of light-emitting chips with the same light-emitting direction can be simultaneously installed 3 to improve the power of the light source packaging structure, and at the same time, the metal block device 2 can also improve the heat dissipation effect, so that the high power light source packaging structure has the advantages of high power and good heat dissipation effect. The first conductive sheet 11 and the second conductive sheet 12 arranged on the lower surface of the substrate 1 can be automatically attached and welded to the circuit board through the Surface Mounted Technology (SMT) process to realize high power The automatic assembly of the package structure improves the production efficiency and assembly quality.

In this embodiment, the metal block device 2 is a copper block device, and the copper block device has the advantages of good electrical conductivity and good heat dissipation. In other embodiments, the metal block device 2 is an aluminum block device. As shown in FIG. 1 to FIG. 3 , a metal pole piece 23 is arranged on the metal block device 2 , each light-emitting chip 3 is electrically connected and fixed on the metal pole piece 23 , and the metal pole piece 23 extends from the mounting surface 221 to the main body block On the bottom surface of 21, the metal pole piece 23 located on the bottom surface of the main body block 21 is used for electrical connection with the first conductive piece 11 and the second conductive piece 12. Therefore, the function of the metal pole piece 23 is to connect each light-emitting chip 3 with the first conductive piece 12. The conductive sheet 11 and the second conductive sheet 12 are electrically connected, and the metal pole piece 23 is a copper sheet to ensure electrical conductivity.

As shown in FIGS. 4 to 6 , in this embodiment, the mounting block 22 is a regular prism, and the side surface of the regular prism is the mounting surface 221 . As shown in FIG. 4 , the mounting block 22 is a regular triangular prism, the regular triangular prism has three side surfaces, and the three side surfaces are three mounting surfaces 221 . In this case, the plurality of light-emitting chips 3 has three. As shown in FIG. 5 , the mounting block 22 is a regular quadrangular prism, and the regular quadrangular prism has four mounting surfaces 221 . In this case, the plurality of light-emitting chips 3 have four. As shown in FIG. 6 , the mounting block 22 is a regular pentagonal prism, and the regular five prism has five mounting surfaces 221 , and at this time, the plurality of light-emitting chips 3 have five. Of course, the regular prisms can also be regular hexagonal prisms, regular octagonal prisms, etc., and the structure can be selected according to the usage amount of the light-emitting wafer 3 . In this embodiment, the light-emitting chip 3 may be an edge-emitting laser light-emitting chip, a red light-emitting chip, a green light-emitting chip, a blue light-emitting chip, or an infrared light-emitting chip. The package structure can emit light of various colors or functions. The side of the light-emitting chip 3 attached to the mounting surface 221 is provided with a positive electrode, and the side of the light-emitting chip 3 away from the positive electrode is provided with a negative electrode. The pole piece 23 is electrically connected, and the positive electrode is electrically connected with the metal pole piece 23 by means of conductive adhesive bonding, tin welding or eutectic.

As shown in FIG. 1 to FIG. 3 , in this embodiment, the package cover 4 is a metal cover. The metal cover has the advantages of good heat dissipation effect and high structural strength, and can protect the metal block device 2 and the light-emitting chip 3 well. cooling effect. Wherein, the metal cover is made of aluminum material or steel material. In other embodiments, the package cover 4 is a glass cover, and the glass cover is made of K7 glass material or K9 glass material.

Specifically, the encapsulation cover 4 is a rectangular cover, which has the advantage of being simple to manufacture. The encapsulation cover 4 includes four side plates 42 and one top plate 43 that are connected to each other and enclose a cavity. The four side plates 42 and one top plate 43 are punched or The connection is fixed by welding or gluing.

In one embodiment, the light-transmitting member is one of the four side plates 42 , which is used as a light-transmitting member of the entire side plate 42 , such as a light-transmitting glass material, which is bonded to the adjacent side plates 42 and the top plate 43 , and furthermore , the light-transmitting member as a side plate includes a lens, the lens is integrally formed on the light-transmitting member, and the lens is located on the light-emitting path of each light-emitting chip 3 to adjust the light shape of the light emitted by the light-emitting chip 3 .

As shown in FIG. 2 , in one embodiment, the light-transmitting member 41 is installed on the side plate 42 , and the light-transmitting member 41 is a lens, and the lens can be a convex lens, a concave lens or a Nefer lens. The lens is located on the light-emitting path of each light-emitting chip 3, and the function of the lens is to adjust the light shape of the light emitted by the light-emitting chip 3, so that the light emitted by the high-power light source package structure can achieve different use effects. In this embodiment, the light-transmitting member 41 is made of glass material, specifically, quartz glass material. In this embodiment, a copper layer or a tin layer is disposed on the surface of the light-transmitting member 41 for connecting with the side plate 42, so that the light-transmitting member 41 and the side plate 42 can be eutectic fixed, or the light-transmitting member 41 can pass through the adhesive It is fixed on the side plate 42 in the manner of , and the side plate 42 is provided with a mounting hole for installing the light-transmitting member 41 .

As shown in FIG. 1 to FIG. 3 , in this embodiment, the upper surface of the substrate 1 is provided with a third conductive sheet 13 and a fourth conductive sheet 14 that are both electrically connected to the metal block device 2 . The third conductive sheet 13 and the The first conductive sheet 11 is electrically connected, and the fourth conductive sheet 14 is electrically connected with the second conductive sheet 12 . Specifically, the third conductive sheet 13 and the fourth conductive sheet 14 are respectively electrically connected to the metal pole piece 23 , wherein the first conductive sheet 11 , the second conductive sheet 12 , the third conductive sheet 13 and the fourth conductive sheet 14 are all Embedded in the substrate 1 when the substrate 1 is formed.

As shown in FIG. 1 and FIG. 3 , a mounting groove 15 for mounting the package cover 4 is provided on the upper surface of the substrate 1 . One end of the package cover 4 is inserted into the mounting groove 15 and then bonded by metal welding or dispensing. way and the substrate 1 is fixedly connected.

In this embodiment, the substrate 1 is any one of a ceramic substrate, a silicon carbide substrate or a graphene substrate.

As shown in FIG. 7 , the present embodiment further provides a method for manufacturing a high-power light source package structure. The manufacturing method is used to manufacture the high-power light source package structure described above. The manufacturing method specifically includes the following steps:

S1, making the package cover 4, the substrate 1 and the metal block device 2; wherein, the package cover 4 is provided with a light-transmitting member 41, the substrate 1 is provided with a first conductive sheet 11 and a second conductive sheet 12, and the metal block device 2 is provided with A plurality of mounting surfaces 221 are provided;

S2, the plurality of light-emitting chips 3 are respectively fixed on each mounting surface 221 of the metal block device 2 and electrically connected to the metal block device 2, so that the light-emitting directions of the light-emitting chips 3 are the same;

S3, fixing the metal block device 2 on the substrate 1, and making the metal block device 2 electrically connected to the first conductive sheet 11 and the second conductive sheet 12;

S4 , the package cover 4 is fixed on the substrate 1 and covers the metal block device 2 and the plurality of light-emitting chips 3 , and the light-transmitting member 41 is located on the light-emitting path of each light-emitting chip 3 .

In the above step S1, the package cover 4 and the light-transmitting member 41 are fixed by means of eutectic or adhesive, the light-transmitting member 41 is a lens structure, the first conductive sheet 11 and the second metal conductive sheet are located on the lower surface of the substrate 1, A third conductive sheet 13 and a fourth conductive sheet 14 are arranged on the upper surface of the substrate 1 , and a metal pole piece 23 is arranged on the metal block device 2 . The metal block device 2 includes a main body block 21 and a mounting block 22 integrally formed on one side of the main body block 21 , and each mounting surface 221 is a peripheral side surface of the mounting block 22 .

In the above step S2, the positive electrode of the light-emitting chip 3 is electrically connected to the metal block device 2 by means of conductive adhesive bonding, tin welding or eutectic, and the negative electrode of the light-emitting chip 3 is electrically connected to the metal block device 2 by welding gold wires. sexual connection. The light-emitting side of the light-emitting chip 3 is located on the same side of the metal block device 2 to ensure that the light-emitting direction is the same.

In the above-mentioned step S3, the metal block device 2 is fixed on the substrate 1 by welding, so that the third conductive sheet 13 and the fourth conductive sheet 14 are respectively electrically connected to the metal pole pieces 23 on the metal block device 2. The soldering process includes eutectic process, solder paste and flux eutectic process.

In the above step S4, during the manufacturing process of the substrate 1, a ring of mounting grooves 15 is formed on the upper surface of the substrate 1, and one end of the package cover 4 is inserted into the mounting groove 15 and then fixed by metal welding or dispensing. on the substrate 1.

The high-power light source package structure of the embodiment of the present invention has the advantages of good heat dissipation effect and high power, and at the same time, it can be automatically attached and welded on the circuit board through the SMT process, which realizes automation and improves assembly quality and production efficiency.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

1: Substrate 11: The first conductive sheet 12: Second conductive sheet 13: The third conductive sheet 14: Fourth conductive sheet 15: Mounting slot 2: Metal block device 21: Body Block 22: Mounting Blocks 221: Mounting surface 23: Metal pole piece 3: Light-emitting chip 31: light-emitting surface 4: Encapsulation cover 41: Translucent parts 42: Side panels 43: Top Plate S1~S4: Steps

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings required in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only for the present invention. In some embodiments, for those with ordinary knowledge in the technical field, other drawings can also be obtained based on these drawings without any creative effort. 1 is a schematic diagram of an oblique top view of an exploded structure of a high-power light source packaging structure provided by an embodiment of the present invention; 2 is a schematic diagram of a slanted upward-looking explosion structure of a high-power light source packaging structure provided by an embodiment of the present invention; 3 is a schematic structural diagram of a metal block device, a light-emitting chip, and a substrate in a high-power light source packaging structure provided by an embodiment of the present invention; 4 is a schematic side view of a structure in which a mounting block is an equilateral triangle in a high-power light source packaging structure provided by an embodiment of the present invention; 5 is a schematic side view of a structure in which a mounting block is a regular quadrilateral in a high-power light source packaging structure provided by an embodiment of the present invention; FIG. 6 is a schematic side view of a structure in which the mounting block is a regular pentagon in the high-power light source packaging structure provided by an embodiment of the present invention; FIG. 7 is a schematic flowchart of a method for manufacturing a high-power light source packaging structure according to an embodiment of the present invention.

1: Substrate

13: The third conductive sheet

14: Fourth conductive sheet

15: Mounting slot

2: Metal block device

21: Body Block

22: Mounting Blocks

221: Mounting surface

23: Metal pole piece

3: Light-emitting chip

31: light-emitting surface

4: Encapsulation cover

41: Translucent parts

42: Side panels

43: Top Plate

Claims (10)

A high-power light source packaging structure, comprising: a substrate; A metal block device arranged on the upper surface of the base plate, the metal block device has a main body block and an installation block, the installation block is fixed on one side of the main body block, and the peripheral side of the installation block is provided with a plurality of installation blocks noodle; A plurality of light-emitting chips, each of the plurality of light-emitting chips is fixed on each of the plurality of mounting surfaces and electrically connected to the metal block device, and the light-emitting direction of each of the plurality of light-emitting chips is the same; and A package cover disposed on the substrate and covering the metal block device and the plurality of light-emitting chips, the package cover has a light-transmitting member, and the light-transmitting member is located on the light-emitting path of each of the plurality of light-emitting chips , a first conductive sheet and a second conductive sheet are arranged on the lower surface of the substrate at intervals, and both the first conductive sheet and the second conductive sheet are electrically connected with the metal block device. The high-power light source package structure according to claim 1, wherein the metal block device is a copper block device. The high-power light source package structure as claimed in claim 1, wherein the main body block is disposed on the substrate, and the substrate is a ceramic substrate. The high-power light source package structure according to claim 1, wherein the mounting block is a right prism. The high-power light source package structure according to claim 1, wherein the package cover is a metal cover or a glass cover. The high-power light source package structure according to claim 5, wherein the package cover is a rectangular body cover, the package cover includes four side plates and a top plate that are connected to each other and enclose a cavity, and the light-transmitting member is four side plates one of them. The high-power light source package structure according to claim 1, wherein the light-transmitting member comprises a convex lens, and the convex lens is located on the light-emitting path of each of the plurality of light-emitting chips. The high-power light source package structure as claimed in claim 1, wherein the metal block device has a metal pole piece, the plurality of light-emitting chips are electrically connected to the metal pole piece, and the metal pole piece extends to the bottom surface of the main block , the upper surface of the substrate is provided with a third conductive sheet and a fourth conductive sheet that are both electrically connected to the metal pole piece, the third conductive sheet is electrically connected to the first conductive sheet, and the fourth conductive sheet is electrically connected to the second conductive sheet. The high-power light source package structure as claimed in claim 1, wherein a mounting groove for mounting the package cover is provided on the upper surface of the substrate. A manufacturing method of a high-power light source packaging structure, comprising the following steps: S1, making a package cover, a substrate and a metal block device; the package cover is provided with a light-transmitting member, the substrate is provided with a first conductive sheet and a second conductive sheet, and the metal block device is provided with a plurality of Mounting surface; S2, each of the plurality of light-emitting chips is respectively fixed on each of the plurality of mounting surfaces and electrically connected to the metal block device, and the light-emitting direction of each of the plurality of light-emitting chips is the same; S3, fixing the metal block device on the substrate, and making the metal block device electrically connected to the first conductive sheet and the second conductive sheet; S4 , fixing the package cover on the substrate and covering the metal block device and the plurality of light-emitting chips, and making the light-transmitting member located on the light-emitting path of each of the plurality of light-emitting chips.

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