CN207637841U - A kind of LED encapsulation structure - Google Patents
A kind of LED encapsulation structure Download PDFInfo
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- CN207637841U CN207637841U CN201721897804.1U CN201721897804U CN207637841U CN 207637841 U CN207637841 U CN 207637841U CN 201721897804 U CN201721897804 U CN 201721897804U CN 207637841 U CN207637841 U CN 207637841U
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- led chip
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- negative plate
- substrate
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Abstract
The utility model is related to mask technical fields,Refer in particular to a kind of LED encapsulation structure,Including substrate,The substrate top is equipped with sphere lens,Cover edge is equipped on the outside of the sphere lens,The substrate top center is equipped with LED chip,The LED chip outer side covering has fluorescent colloid,The fluorescent colloid periphery is equipped with reflector,And the reflector,LED chip,Fluorescent colloid is respectively positioned on sphere lens inner cavity,The base plate bottom is equipped with annular groove,The annular groove inner cavity top is equipped with several heat emission holes,And the heat emission hole runs through annular groove inner cavity top,Substrate,The heat emission hole bottom is equipped with filter screen,The LED chip bottom side is connected with positive plate one,One one end of the positive plate is equipped with positive plate two,The LED bottom sides are connected with negative plate one,One one end of the negative plate is equipped with negative plate two,The positive plate two,Two equal both ends of negative plate are arranged with connecting hole,It is good with thermal diffusivity,Illumination range is wide,The features such as service life is long.
Description
Technical field
The utility model is related to encapsulation technology fields, refer in particular to a kind of LED encapsulation structure.
Background technology
LED (LightEmittingDiode), light emitting diode are a kind of solid-states that can convert electrical energy into visible light
Semiconductor devices, it can directly be converted electricity to light, and as the light source of new generation that the current whole world attracts most attention, LED is because of it
The advantages that high brightness, low in calories, long-life, nontoxic, recyclable recycling, it is widely used in the necks such as illumination, display and backlight
Domain, but traditional LED light illumination range is small, it is poor that there is also heat dissipation effects, and lamp bead light decay is big, and lamp life is short, and thermal diffusivity is not up to
To the problems such as requirement, and traditional illumination is of less demanding to heat dissipation problem, and incandescent lamp, fluorescent lamp can be by way of radiation
It radiates, and white light LEDs are radiated based on heat transfer, LED is used as luminescent material by solid semiconductor chip
Electroluminescent distributes so its heat only has pole at least partially through radiation, for existing LED component, inputing power
80% or so be transformed into thermal energy, therefore be not only required to protection wick in LED encapsulation, increase illumination range, also to enhance
Heat dissipation.
Invention content
In view of the above problems, the utility model provides a kind of LED encapsulation structure, by being equipped with sphere lens, Ke Yili
It uses up and penetrates the principle that sphere lens can disperse light from inside to outside, increase illumination range, guarantor can also be served as to LED chip
Shield, protection LED chip is injury-free, by being equipped with reflector, can assemble the anaclasis that LED chip is sent out, improve hair
Light efficiency highlights, and by being equipped with heat emission hole, the heat generated that LED chip can shine is distributed by heat emission hole,
It prevents LED chip from decaying and color drift occurring in the case of high heat, to extend the service life of LED chip, leads to
It crosses and is equipped with filter screen, can prevent the impurity such as the dust in air from entering sphere lens inner cavity by heat emission hole, make in LED chip
Dirt is not covered, to ensure that the brightness of LED.
To achieve the goals above, the technical solution adopted in the utility model is as follows：
A kind of LED encapsulation structure, including substrate, the substrate top are equipped with sphere lens, are set on the outside of the sphere lens
There are cover edge, the substrate top center to be equipped with LED chip, the LED chip outer side covering has fluorescent colloid, the fluorescence
Colloid periphery is equipped with reflector, and the reflector, LED chip, fluorescent colloid are respectively positioned on sphere lens inner cavity, the substrate base
Portion is equipped with annular groove, and the annular groove inner cavity top is equipped with several heat emission holes, and the heat emission hole runs through annular groove inner cavity and pushes up
Portion, substrate, the heat emission hole bottom is equipped with filter screen, and the filter screen is set to annular groove inner cavity, the LED chip bottom one
Side is connected with positive plate one, and one one end of the positive plate is equipped with positive plate two, and the LED bottom sides are connected with negative plate one,
And the negative plate one is located at one respective side of positive plate, one one end of the negative plate is equipped with negative plate two, and the negative plate two,
Positive plate two is set to base plate bottom, and the positive plate two, two equal both ends of negative plate are arranged with connecting hole.
Furthermore, the sphere lens are transparent PC plastic cement.
Furthermore, the positive plate one, negative plate one are respectively positioned on base plate bottom, and the positive plate one, negative plate
One connect through base plate bottom with LED chip bottom.
Furthermore, the reflector luminal wall surface is covered with reflecting piece.
Furthermore, the positive plate one, negative plate one, positive plate two, negative plate two are conductive copper sheet.
The utility model advantageous effect：
1. by being equipped with sphere lens, light can be utilized to penetrate the principle that sphere lens can disperse light from inside to outside,
Increase illumination range, protective cover can also be served as to LED chip, protection LED chip is injury-free;
2. by being equipped with reflector, the anaclasis that LED chip is sent out can be assembled, improve luminous efficiency, highlight;
3. by being equipped with heat emission hole, the heat generated that LED chip can shine is distributed by heat emission hole, is prevented
Decaying and color drift occur in the case of high heat for LED chip, to extend the service life of LED chip;
4. by being equipped with filter screen, it can prevent the impurity such as the dust in air from entering in sphere lens by heat emission hole
Chamber makes not cover dirt in LED chip, to ensure that the brightness of LED.
Description of the drawings
Fig. 1 is this LED encapsulation structure diagrammatic cross-section;
Fig. 2 is this LED encapsulation structure bottom schematic view.
1. substrate;2.LED chips;3. fluorescent colloid;4. sphere lens;5. covering edge;6. reflector;7. annular groove;8. dissipating
Hot hole;9. filter screen;10. positive plate one;11. negative plate one;12. positive plate two;13, negative plate two;14. connecting hole.
Specific implementation mode
The technical solution of the utility model is illustrated with embodiment below in conjunction with the accompanying drawings.
As shown in Figure 1 to Figure 2, a kind of LED encapsulation structure described in the utility model, including substrate 1,1 top of the substrate
Equipped with sphere lens 4,4 outside of the sphere lens is equipped with cover along 5, and 1 top center of the substrate is equipped with LED chip 2, institute
Stating 2 outer side covering of LED chip has fluorescent colloid 3,3 periphery of the fluorescent colloid to be equipped with reflector 6, and the reflector 6, LED
Chip 2, fluorescent colloid 3 are respectively positioned on sphere lens inner cavity, and 1 bottom of the substrate is equipped with annular groove 7,7 inner cavity of annular groove top
Portion is equipped with several heat emission holes 8, and the heat emission hole 8 runs through 7 inner cavity top of annular groove, substrate 1, and 8 bottom of the heat emission hole is set
There is filter screen 9, and the filter screen 9 is set to 7 inner cavity of annular groove, 2 bottom side of the LED chip is connected with positive plate 1,
One 10 one end of the positive plate is equipped with positive plate 2 12, and 2 bottom side of the LED chip is connected with negative plate 1, and described
Negative plate 1 is located at one 10 respective side of positive plate, and one 11 one end of the negative plate is equipped with negative plate 2 13, and the negative plate
2 13, positive plate 2 12 is set to 1 bottom of substrate, and the positive plate 2 12,2 13 equal both ends of negative plate are arranged with connecting hole
14.The above constitutes the utility model basic structure.
The utility model can from inside to outside be penetrated using such structure setting by being equipped with sphere lens 4 using light
The principle that sphere lens 4 can disperse light, increases illumination range, and protective cover can also be served as to LED chip 2, protects LED core
Piece 2 is injury-free, by being equipped with reflector 6, can assemble the anaclasis that LED chip 2 is sent out, improve luminous efficiency, enhancing
Brightness, by being equipped with heat emission hole 8, the heat generated that LED chip 2 can shine is distributed by heat emission hole 8, prevents LED
Decaying and color drift occur in the case of high heat for chip 2, to extend the service life of LED chip 2, by being equipped with
Filter screen 9 can prevent the impurity such as the dust in air from entering 4 inner cavity of sphere lens by heat emission hole 8, make in LED chip 2 not
Dirt is covered, to ensure that the brightness of LED, connecting hole 14 is equipped with by being equipped with, it can be by welding come multiple LED in parallel or series
Lamp piece.
More specifically, the sphere lens 4 are transparent PC plastic cement, and PC plastic cement has heat-resisting, fire-retardant, impact resistance
Well, the features such as high refractive index, processing performance are good can serve as protective cover to LED chip 2, and protection LED chip 2 is injury-free, from
And extend the service life of LED chip 2, the positive plate 1, negative plate 1 are respectively positioned on 1 bottom of substrate, and it is described just
Pole plate 1, negative plate 1 are connect through 1 bottom of substrate with 2 bottom of LED chip, and 6 luminal wall surface of the reflector covers
It is stamped reflecting piece, the anaclasis that LED chip 2 is sent out can be assembled, be improved luminous efficiency, highlight, the positive plate one
10, negative plate 1, positive plate 2 12, negative plate 2 13 are conductive copper sheet, by copper is conductive can good and thermal conductivity
Can be good the advantages that, conductive copper sheet not only can be the transmission electric energy of LED chip 2, but also the heat that can will be generated LED chip 2
It conducts, further enhances the thermal diffusivity of this structure.Using such structure setting, operation principle：Pass through positive plate
Two, the connecting hole at two both ends of negative plate, can multiple LED pieces in parallel or series, after being powered to LED pieces, LED chip is sent out
Light reflected by sphere lens and disperse light, increase illumination range, while light is radiated on reflector, reflector inner cavity
Wall surface is covered with reflecting piece, can assemble the anaclasis that LED chip is sent out, improve luminous efficiency, highlight, LED core
The piece thermal energy generated that shines is distributed by heat emission hole, and the conductive copper sheet of LED chip bottom, and can while transmitting electric energy
The heat that LED chip generates will be conducted, the thermal diffusivity of this structure is further enhanced.
The embodiments of the present invention are described above in association with attached drawing, but the utility model be not limited to it is above-mentioned
Specific implementation mode, the above mentioned embodiment is only schematical, rather than restrictive, the common skill of this field
Art personnel are not departing from the utility model aims and scope of the claimed protection situation under the enlightenment of the utility model
Under, many forms can be also made, these are belonged within the scope of protection of the utility model.
Claims (5)
1. a kind of LED encapsulation structure, including substrate（1）, it is characterised in that：The substrate（1）Top is equipped with sphere lens（4）,
The sphere lens（4）Outside is equipped with cover edge（5）, the substrate（1）Top center is equipped with LED chip（2）, the LED
Chip（2）Outer side covering has fluorescent colloid（3）, the fluorescent colloid（3）Periphery is equipped with reflector（6）, and the reflector
（6）, LED chip（2）, fluorescent colloid（3）It is respectively positioned on sphere lens inner cavity, the substrate（1）Bottom is equipped with annular groove（7）, institute
State annular groove（7）Inner cavity top is equipped with several heat emission holes（8）, and the heat emission hole（8）Run through annular groove（7）Inner cavity top,
Substrate（1）, the heat emission hole（8）Bottom is equipped with filter screen（9）, and the filter screen（9）Set on annular groove（7）Inner cavity, it is described
LED chip（2）Bottom side is connected with positive plate one（10）, the positive plate one（10）One end is equipped with positive plate two（12）, institute
State LED chip（2）Bottom side is connected with negative plate one（11）, and the negative plate one（11）Positioned at positive plate one（10）It is corresponding
Side, the negative plate one（11）One end is equipped with negative plate two（13）, and the negative plate two（13）, positive plate two（12）It is set to
Substrate（1）Bottom, the positive plate two（12）, negative plate two（13）Equal both ends are arranged with connecting hole（14）.
2. a kind of LED encapsulation structure according to claim 1, it is characterised in that：The sphere lens（4）It is moulded for transparent PC
Glue.
3. a kind of LED encapsulation structure according to claim 2, it is characterised in that：The positive plate one（10）, negative plate one
（11）It is respectively positioned on substrate（1）Bottom, and the positive plate one（10）, negative plate one（11）Run through substrate（1）Bottom and LED core
Piece（2）Bottom connects.
4. a kind of LED encapsulation structure according to claim 1, it is characterised in that：The reflector（6）Luminal wall surface covers
It is stamped reflecting piece.
5. a kind of LED encapsulation structure according to claim 1, it is characterised in that：The positive plate one（10）, negative plate one
（11）, positive plate two（12）, negative plate two（13）It is conductive copper sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721897804.1U CN207637841U (en) | 2017-12-29 | 2017-12-29 | A kind of LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721897804.1U CN207637841U (en) | 2017-12-29 | 2017-12-29 | A kind of LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207637841U true CN207637841U (en) | 2018-07-20 |
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ID=62851455
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721897804.1U Active CN207637841U (en) | 2017-12-29 | 2017-12-29 | A kind of LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207637841U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112366201A (en) * | 2020-11-06 | 2021-02-12 | 弘凯光电(深圳)有限公司 | High-power light source packaging structure and manufacturing method thereof |
-
2017
- 2017-12-29 CN CN201721897804.1U patent/CN207637841U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112366201A (en) * | 2020-11-06 | 2021-02-12 | 弘凯光电(深圳)有限公司 | High-power light source packaging structure and manufacturing method thereof |
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