CN207250931U - A kind of light guide structure - Google Patents
A kind of light guide structure Download PDFInfo
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- CN207250931U CN207250931U CN201721283619.3U CN201721283619U CN207250931U CN 207250931 U CN207250931 U CN 207250931U CN 201721283619 U CN201721283619 U CN 201721283619U CN 207250931 U CN207250931 U CN 207250931U
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Abstract
The utility model discloses a kind of light guide structure, it can be applied to individual laser package structure, the light guide structure includes transparent heat-conducting block, the transparent heat-conducting block has the plane of incidence, reflecting layer and exit facet, the one end opposite with the exit facet of the transparent heat-conducting block is recessed reflecting surface, for becoming the light of vertical direction after the light progress light shaping to horizontal positioned light-emitting component outgoing.The light guide structure can be used as heat dissipation channel, the quick export of the heat that the wavelength conversion layer transfer process being in direct contact with it is produced.
Description
Technical field
A kind of optical element is the utility model is related to, it is specially a kind of that there is heat dissipation, the light guide structure of printing opacity.
Background technology
Due to semiconductor laser（LD）There are good monochromaticjty, small, long lifespan, high power density and high speed operation
Excellent characteristics, semiconductor laser in laser ranging, laser radar, laser communication, laser analog weapon, automatically control, detect
Instrument even medical and beauty treatment etc. has been obtained for being widely applied, and forms wide market.In recent years, semiconductor laser
Application of the device in automotive lighting field also receives much concern, and becomes the new lover after xenon lamp, LED car headlights.With LED car headlights
Compare, laser car light has the light emitting anger of more highdensity light output and smaller, and irradiation distance is the former two up to 600 meters
It is remote again.
Fig. 1 shows that the encapsulating structure of known edge-emitting laser diode (edge-emitting Laser diode) shows
It is intended to.This encapsulating structure 100 is fixed on substrate of once adhering including a laser diode (Laser diode) 104
(submount) on 102.Furthermore secondary adhesion substrate 102 is fixed on circuit board 106 (such as printed circuit board (PCB), PCB), and
There are at least two layout circuits (layout trace) on circuit board 106 using as two electrode (not shown), and two electricity
Pole can be electrically connected to laser diode 104.Substantially, the mode of electric connection can be completed using various known ways,
Such as line connection (wire bond) etc..Furthermore after two electrodes provide a bias, laser diode 104 can produce
Laser beam 108.
Major part individual laser package is mainly encapsulated using TO at present（Such as Fig. 2）, but although such encapsulation volume is big, and it is right
The heat dissipation channel that chip operation produces heat is extremely limited, and heat dissipation performance can only be satisfied with low-power device.
Utility model content
For overcome the deficiencies in the prior art, the utility model provides the laser of a kind of light guide structure and the application guide structure
Device encapsulating structure.
The technical solution of the utility model is：A kind of light guide structure, including transparent heat-conducting block, the transparent heat-conducting block have
The plane of incidence, reflecting layer and exit facet, the one end opposite with the exit facet of the transparent heat-conducting block are recessed reflecting surface,
For becoming the light of vertical direction after the light progress light shaping to horizontal positioned light-emitting component outgoing.
Preferably, the thermal conductivity of the transparent heat-conducting block is more than 5W/ (mK).
Preferably, the light guide structure is with a narrow upper and lower width stepped, and light-emitting component can be embedded to inside, shortens hair
Distance of the optical element to reflecting surface.
Preferably, the plane of incidence of the light guide structure is equipped with Lenticular lens, and laser beam is collimated, for obtaining more
Small light emitting anger light source.
Preferably, the plane of incidence surface of the transparent heat-conducting block is coated with anti-reflective film.
Preferably, the refractive index of the antireflection tunic is less than 1.5.
Preferably, the transparent heat-conducting block has more than two reflectings surface.
Preferably, the reflecting surface has certain radian, and the light of diverging is converted into directional light, improves light source uniform in light emission
Property.
Preferably, 30-60 ° of the tilt angle ranges of the reflecting surface.
Preferably, the reflecting surface plating is reflectance coating, its reflectivity is more than 90%.
The utility model is provided invention also provides the light guide structure of a kind of tool printing opacity, heat conduction at the same time, including by
The transparent heat-conducting block that Heat sink material is formed, the transparent heat-conducting block have the plane of incidence, reflecting layer and an exit facet, described transparent to lead
Heat block is used to become the light outgoing of vertical direction after carrying out the light of horizontal positioned laser chip light shaping, while is used as heat dissipation
Passage.
Preferably, the thermal conductivity of the transparent heat-conducting block>5W/ (mK), transmitance>80%@1mm.
Preferably, the plane of incidence of the light guide structure sets Lenticular lens, and laser beam is collimated, for obtaining smaller
Light emitting anger light source.
Preferably, the mirror surface of the light guide structure has certain radian minute surface, and the light of diverging is converted into directional light,
Improve light source light-emitting uniformity.
Preferably, the bottom of the light guide structure is stepped, can shorten chip to speculum by chip buried to inside
Distance, shorten light path of the light in light guide structure, reduce light loss.
Preferably, for one, either several speculums or its tangent line incline the reflecting surface quantity of the light guide structure
30-60 ° of angle range.
Above-mentioned light guide structure can be emitted the light for becoming vertical direction after the light of horizontal positioned LD chips progress light shaping, keep away
Exempt from chip to place vertically to difficulty caused by die bond bonding wire processing procedure, in addition, light guide structure upper surface adds the feelings of wavelength conversion material
Under condition, it is alternatively arranged as heat dissipation channel, the thermal conductivity that transfer process under wavelength conversion material produces is gone out, while adjust light guide structure
Design can be achieved low-angle and shine.
The utility model additionally provides a kind of encapsulating structure of laser, including substrate；Laser diode, is fixed on the substrate
Upper surface, a first laser light beam can be launched；Light guide structure, comprising transparent heat-conducting block and speculum, to the laser diode
The light for becoming vertical direction after the horizontal direction light progress light shaping sent projects；Wavelength conversion layer, is formed at the guide-lighting knot
The upper surface of structure, the light guide structure go out the thermal conductivity that the wavelength conversion layer transfer process produces as heat dissipation channel.
Preferably, the transparent heat-conducting block is made of high transmission, rate high thermal conductivity material Precision Machining, the thermal conductivity of its material
Rate is more than 5W/ (mK), and transmitance is more than 80%@1mm, specifically, can be high heat conduction glass, silica, sapphire
Or crystalline ceramics etc..
Preferably, the transparent heat-conducting block has the plane of incidence, reflecting surface and exit facet, and the wavelength conversion layer is formed at institute
State on exit facet.
Preferably, the light incidence facet surface of the light guide structure can be by plating the anti-reflective film of low-refraction, to reduce boundary
Face light reflection loss, the anti-reflective film refractive index are less than 1.5, and the specific can be silica, magnesium fluoride etc..
Preferably, the light of the laser diode outgoing is when inciding light guide structure, interface two layers of material（Air is transparent
Fill glue and light guide structure light incident surface）Refractive index n1、n2Meet relational expression：<5%, to ensure light in material
Expect the reflectivity at light guide structure interface<5%.
Preferably, the position of laser diode described in the plane of incidence face of the transparent heat-conducting block is equipped with Lenticular lens, right
Laser beam is collimated, and obtains smaller light emitting anger light source.
Preferably, mirror surface is high anti-by being made on the inclined-plane of the transparent heat-conducting block or curved surface in the light guide structure
The rate coating of penetrating is formed, its reflectivity is more than 90%, and material can be Ag, Al, Au or other dielectric high reflection film layer etc..
Preferably, for one, either several speculums or its tangent line incline the reflecting surface quantity of the light guide structure
30-60 ° of angle range, the shape or angle of different reflectings surface can be different.
Preferably, the light of laser diode outgoing exit direction and encapsulating structure normal direction after reflecting surface
Angle be less than 30 °.
Preferably, the light guide structure has multiple speculums, according to different application demand, adjusts bevel angle and controls
The overlapping degree of the light extraction hot spot of more laser diodes, realizes the light source of different light emitting angers.
Preferably, the encapsulating structure has more than two laser diodes, can by adjusting light guide structure it
The bevel angle and reflecting surface in reflecting layer realize that two or more hot spot registrations reach apart from the distance of the wavelength conversion layer
To more than 50%.
Preferably, the laser diode part is directly contacted with the light guide structure, shortens laser diode to speculum
Distance.In some embodiments, the bottom of the light guide structure in step-like, under narrow upper width, the laser diode leads positioned at described
Below the step of photo structure.
Preferably, the short-wavelength light that the laser diode is sent is converted into long wavelength light by the wavelength conversion layer, such as
By blue light, either purple light or black light are converted into green/yellow orange/feux rouges.
Preferably, the wavelength conversion layer includes glass flourescent sheet, ceramic fluorescent piece or monocrystalline flourescent sheet.
Preferably, the light of laser diode outgoing light emitting anger after the wavelength conversion layer is less than 90 °, and normal direction
Luminous intensity it is maximum.
Preferably, the combination of high heat conduction is used between the wavelength conversion layer and light guide structure, to realize well
Heat dissipation, includes SAB（Surface Activated Bonding）, the mode such as ADB (Atomic Diffusion Bonding).
In some embodiments, can also transparent silica gel or thermal conductivity be used to be more than between wavelength conversion material and light guide structure
>The material of 1W/ (m K) bonds.
Preferably, the wavelength conversion layer is bonded with the upper surface of the light guide structure and the substrate top at the same time, from
And the laser diode, light guide structure are sealed in inside the substrate.Such as control the height of the light guide structure with
Substrate height is concordant, and the wavelength conversion layer is bonded with light guide structure and upper surface of base plate at the same time, wavelength conversion layer directly as
Cover board seals encapsulating structure, simplifies encapsulation procedure, while can reduce the interface in light path conduction, lifts light extraction efficiency.
In certain embodiments, the encapsulating structure further includes transparent cover plate, is formed on the substrate, by the laser
Element, conductive structure and wavelength conversion layer are closed in inside the substrate.
Preferably, cover board lower surface non-outgoing area plates reflecting layer, prevents chip light-emitting at light guide structure interface
Reflected light be emitted through cover board, while reduce packaging body light emitting anger.
Above-mentioned individual laser package structure can be applied to headlight, bulkhead lamp, laser television or projecting apparatus etc..
Compared with prior art, a kind of individual laser package structure provided by the utility model, is imitated including at least following technology
Fruit：
（1）Encapsulated using SMD, light source device thermal conductivity is high, perfect heat-dissipating, reduces the shadow of the hot generation that shines to laser
Ring, lift the reliability of packaging body.
（2）Using the light guide structure of high transmittance high heat conductance, the light sent to laser diode excites after carrying out light shaping
Wavelength conversion material, light outgoing is high, while light guide structure can be as the heat dissipation channel of wavelength conversion material, by wavelength conversion material
The thermal conductivity that lower transfer process produces goes out.
（3）Lenticular lens are added in light guide structure side or mirror surface is made into curved surface, to the laser beam of diverging
Collimated, smaller light emitting anger light source can be obtained.
（4）In the multiple mirror surfaces of light guide structure indoor design, corresponding multi-chip package, makes packaging body overall brightness in again
Number increase.
Other features and advantages of the utility model will illustrate in the following description, also, partly from specification
In become apparent, or understood by implementing the utility model.The purpose of this utility model and other advantages can pass through
Specifically noted structure is realized and obtained in specification, claims and attached drawing.
Brief description of the drawings
Attached drawing is used to provide a further understanding of the present invention, and a part for constitution instruction, with this practicality
New embodiment is used to explain the utility model together, does not form the limitation to the utility model.In addition, attached drawing data are
Summary is described, is not drawn to scale.
Fig. 1 is the encapsulating structure schematic diagram of known edge-emitting laser diode.
Fig. 2 is the plane radial type laser schematic diagram of known transistors appearance tubular encapsulation.
Fig. 3 is the encapsulating structure first embodiment of the utility model.
Fig. 4 is the encapsulating structure second embodiment of the utility model.
Fig. 5 is the encapsulating structure 3rd embodiment of the utility model.
Fig. 6 is the encapsulating structure fourth embodiment of the utility model.
Fig. 7 is the 5th embodiment of encapsulating structure of the utility model.
Fig. 8 is the encapsulating structure sixth embodiment of the utility model.
Fig. 9 is the 7th embodiment of encapsulating structure of the utility model.
Figure 10 ~ 11 are the manufacturing process schematic diagram of the encapsulating structure shown in Fig. 5.
Figure 12 is the Application Example of the utility model.
Wherein, the reference numerals are as follows：
100：Encapsulating structure；102：Secondary adhesion substrate；104：Laser diode；106：Circuit board；108、120：Laser beam
122：Metal shell；124：Window；126：Space；130：Metab；130a：Protrusion；132：Laser diode；
134：Secondary adhesion substrate；150：Electrode；210：Substrate；211：The lower curtate of base plate bottom；212：The high portion of base plate bottom；213：Base
The top surface of plate；214：Cavity；215：The sidepiece of substrate；216：The bottom of substrate；220：Laser diode；230：Light guide structure；
231：The plane of incidence；232：Reflecting surface；233：Exit facet；234：Lenticule；240：Wavelength turns long layer；250：Transparent cover plate；251：
The non-outgoing area of transparent cover plate lower surface；260：Electrode connecting line；300：Using light source module group；310：Laser light source encapsulates；
320：Module lens；330：Illumination region scope.
Embodiment
The individual laser package structure of the utility model is described in detail with reference to schematic diagram, is being further described
Before the utility model, it will be appreciated that due to can transform specific embodiment, the utility model is simultaneously unlimited
In following specific embodiments.It is also understood that since the scope of the utility model is only defined by the following claims, institute
The embodiment of use is introductory, rather than restricted.
Relevant term such as " in " or " " or " on " or " under " or " top " or " just putting " or " placing vertically " " are fallen
Put " it can be used to describe such as attached an element, Ceng Huo areas and another element described in figure, Ceng Huo areas in the utility model
Between relative position relation.It is to be understood that these terms are intended to comprising the device in addition to the orientation described in attached drawing not
Same orientation.
Term used in the utility model is merely for the purpose for describing embodiment, without being intended to limit this reality
With new.As used in the utility model, singulative "a", "an" and "the" is also intended to including plural form, is removed
Outside context clearly illustrates.It is to be further understood that when in the utility model using term "comprising", " including ", " contain
Have " when, for showing the feature of statement, entirety, step, operation, the presence of element, and/or packaging part, and be not excluded for one or
Other multiple features, entirety, step, operation, the presence or increase of element, packaging part, and/or combinations thereof.
Unless defined otherwise, all terms used in the utility model（Including technical term and scientific terminology）Have
The implication identical with the implication that the utility model those of ordinary skill in the art are generally understood.It is to be further understood that this
Term used in utility model should be understood to have with these terms in the context and association area of this specification
Implication consistent implication, and should not being understood with the meaning of idealization or overly formal, except in the utility model clearly so
Outside definition.
Embodiment 1
As shown in figure 3, the present embodiment provides a kind of individual laser package structure, it includes substrate 210, laser diode 220, leads
Photo structure 230, light conversion layer 240 and transparent cover plate 250.
Wherein, substrate 210 uses bowl substrate, is made of bottom 216 and sidepiece 215, and builds a cavity 214.
In the present embodiment, preferably, bottom 216 is in step-like, it is divided into lower curtate 211, high portion 212.Substrate 210 is excellent in the present embodiment
Choosing uses ceramic substrate, such as Al2O3, the material such as AlN, which is provided with circuit.Laser diode 220 is placed horizontally at substrate 210
In lower surface, the high portion surface 212 of bottom is preferably set directly at, light guide structure 230 is arranged on the lower curtate of base plate bottom
On 211 surfaces.
In the present embodiment, light guide structure 230 be a high transmittance, the optical element of high heat conductance, can will be horizontal positioned
Laser diode light carry out light shaping after become vertical direction light outgoing.Specifically, the main body of the light guide structure 230 is one
Transparent heat-conducting block, surface include the plane of incidence 231, reflecting surface 232 and exit facet 233, and the wherein plane of incidence 231 faces laser diode
220, plane of incidence surface can be by plating the anti-reflective film of low-refraction, and to reduce interface light reflection loss, reflecting layer 232 is inclined for one
Slant height mirror surface, the light beam L1 of horizontal direction for being sent to laser diode become after light shaping the light of vertical direction
Beam L2, is projected from exit facet 233.Specifically, transparent heat-conducting block is made of high transmission, rate high thermal conductivity material Precision Machining, it is excellent
Its thermal conductivity of choosing is more than 5W/ (m K), and transmitance is more than 80%@1mm, material can be high heat conduction glass, silica,
Sapphire, crystalline ceramics etc..Specifically, anti-reflective film refractive index is less than 1.5, material can be silica, magnesium fluoride etc..Swash
The light that optical element 220 is emitted incides light guide structure 230, interface two layers of material（Air in cavity 214 or transparent filling glue with
Light guide structure light incident surface）Refractive index n1、n2Meet relational expression：<5%, to ensure light in the guide-lighting knot of material
The reflectivity at structure interface<5%, the mirror surface 232 of light guide structure on the inclined-plane of transparent heat-conducting block by making high reflectance coating shape
Into material can be Ag, Al, Au or other dielectric high reflection film layer etc..In the application of some small light emitting angles of needs, such as
Headlight, bulkhead lamp, laser television, projecting apparatus, the value range of the inclined angle alpha of mirror surface 232 is 30 ~ 60 °, and light is by anti-
The angle for penetrating exit direction and packaging body normal direction behind face 232 is preferred less than 30 °.
Light conversion layer 240 is arranged on the light-emitting surface 233 of light guide structure 230, and is directly contacted with light guide structure 230.Ripple
Long conversion layer 240 can use glass flourescent sheet, ceramic fluorescent piece, monocrystalline flourescent sheet etc., the shortwave that laser diode 220 is sent
Long light is converted into long wavelength light, such as either purple light or black light are converted into green/yellow orange/feux rouges by blue light.Preferably,
The combination of high heat conduction, to realize good heat dissipation, its mode bag are used between wavelength conversion layer 240 and light guide structure 230
Containing SAB（Surface Activated Bonding）, the mode such as ADB (Atomic Diffusion Bonding).Wavelength convert
Also the transparent material of high thermal conductivity can be used to bond between layer 240 and light guide structure 230, its thermal conductivity is more than 1W/ (m K) to be
It is good.In embodiment, the laser beam L2's that the laser beam L1 that laser diode 220 is emitted outwards is projected by wavelength conversion layer 240
Light emitting anger is less than 90 °, and the luminous intensity of normal direction is maximum.
Transparent cover plate 250 is arranged on the top 213 of substrate 210, for all elements in hermetic sealing substrate bowl.Transparency cover
It can seal packaging body by the way of silica gel or Au-Sn eutectics between plate 250 and the bowl of substrate.Transparent cover plate material
Can be glass, quartz, sapphire, crystalline ceramics etc..It should illustrate, it is not limited to which sealing base is carried out using transparent cover plate
Each element on plate, some embodiments also can be by silicone fillers in covering all elements on substrate 210, with protective substrate
All elements on 210.
In this example, packaging body can be on ceramic substrate platform, horizontal positioned laser diode, the letter of die bond bonding wire processing procedure
It is single；Using the light guide structure of high transmission high rate thermal conductivity, the horizontal direction light sent to laser diode becomes after carrying out light shaping
The light outgoing of vertical direction, improving extraction efficiency；Wavelength conversion layer is directly contacted with light guide structure, light guide structure at the same time as
Heat dissipation channel, the thermal conductivity that wavelength conversion material transfer process produces is gone out, and packaging body integral heat sink ability is encapsulated far above TO, together
When can realize that low-angle shines.
Embodiment 2
As shown in figure 4, as different from Example 1, the light guide structure 230 of the present embodiment is located at the centre bit of substrate 210
Put, the one end opposite with exit facet 233 of the light guide structure 230 is recessed multiple mirror surface 232a, 232b etc., corresponding
More laser chip encapsulation, make packaging body overall brightness in multiple increase.The shape or angle of different reflecting surface 232a, 232b
Can be different, the value range of mirror surface inclined angle alpha is 30 ~ 60 °.Preferably, light exit direction and envelope after reflecting surface
The angle for filling body normal direction is less than 30 °.Preferably, the distance of bevel angle α and reflecting slant apart from wavelength conversion layer is adjusted,
Realize that two or more hot spot registrations reach more than 50%.
In the present embodiment, the bevel angle α of the speculum according to different application demand, can be adjusted, to control more
The overlapping degree of the light extraction hot spot of laser diode, realizes the light source of different light emitting angers.Specifically：α angular values get over small light spot friendship
Folded ratio is higher, and it is higher that α angular values on the contrary more large spot overlaps ratio；Adjust reflecting slant（In being emitted with laser diode
Heart light and inclined-plane crosspoint are as a reference point）With the friendship of the light extraction hot spot of more laser diodes of the distance controlling of wavelength conversion layer
Folded degree：It is higher that distance more large spot overlaps ratio, apart from smaller overlapping smaller.Two or more laser diode hot spots overlap ratio
Example is bigger, and it is smaller to obtain light-source angle.
Embodiment 3
As shown in figure 5, as different from Example 2, the 231 face laser of incidence surface of the light guide structure 230 of the present embodiment
The position of element is provided with Lenticular lens 234, is carried out after the laser beam L1 that laser diode is emitted is by Lenticular lens 234
Collimation forms collimated light beam L1 ', so as to obtain smaller light emitting anger light source L2.
Embodiment 4
As shown in fig. 6, as different from Example 3, the light guide structure 230 of the present embodiment with a narrow upper and lower width is in step
Shape, caves in the position flushed with laser diode 220 so that laser diode 220 is partly embedded into inside light guide structure, directly with
The lower side 231b contacts of light guide structure 230, and be incident to from 231b inside light guide structure, shorten laser diode 220 to instead
The distance of minute surface 232 is penetrated, shortens light path of the laser beam in light guide structure 230, reduces light loss.Further, the present embodiment, is protected
The size for holding light guide structure top is more than the size of lower part, and wavelength conversion layer 250 directly connects with the upper surface 233 of light guide structure
Touch, ensure that the heat dissipation area of the long layer of wavelength turn is sufficiently large, so as to the thermal conductivity for quickly producing wavelength conversion layer transfer process
Go out.
Embodiment 5
As shown in fig. 7, as different from Example 3, the structure mirror surface of the light guide structure 230 of this present embodiment makes one
Determine radian minute surface, the light of diverging is converted into directional light, improves light source light-emitting uniformity.In the present embodiment, it is small for some
The application of light emitting angle, 30-60 ° of the tilt angle ranges of mirror surface 232a/232b tangent lines, light exit direction after reflecting surface
It is less than 30 ° with the angle of packaging body normal direction.
Embodiment 6
As shown in figure 8, as different from Example 3, the 250 lower surface non-outgoing area 251 of transparent cover plate of the present embodiment
Reflecting layer is plated, prevents reflected light of the laser diode light extraction at light guide structure interface from going out through the non-outgoing area of transparent cover plate
Penetrate, reduce packaging body light emitting anger.
Embodiment 7
As shown in figure 9, as different from Example 3, the upper surface 233 and the top of bowl of the present embodiment control light guide structure
Portion surface 213 is concordant, and wavelength conversion layer 240 is bonded with light guide structure upper surface 233 and bowl upper surface 213 at the same time, and wavelength turns
Change layer to seal packaging body directly as cover board, simplify encapsulation procedure, while the interface in light path conduction can be reduced, lifting light takes
Go out efficiency.
Embodiment 8
Figure 10 and 11 shows the manufacturing process schematic diagram of the encapsulating structure shown in Fig. 5.First, there is provided a bowl substrate
210；Then, laser diode 220 is installed over the substrate 210, and carries out die bond, bonding wire；Followed by, there is provided a light guide structure 230,
It is installed on the surface of substrate 210；Then wavelength is made on the light-emitting surface 233 of light guide structure 230 and turns long layer 240, most
Transparent cover plate 250 is installed afterwards, so that the element on substrate 210 be sealed, completes the encapsulation of laser diode.
The combination of high heat conduction can be used between the present embodiment, wavelength conversion layer 240 and light guide structure 230, with
Realize good heat dissipation, include SAB（Surface Activated Bonding）、ADB(Atomic Diffusion
The mode such as Bonding), can be also more than using thermal conductivity>The transparent material of 1W/ (m K) bonds；Transparent cover plate 250 and substrate 210
Between can seal packaging body by the way of silica gel or Au-Sn eutectics.
Embodiment 9
Area illumination is specified since low-angle light source is easier to realize, low-angle laser light source is illuminated or led in high directivity
Letter field has a clear superiority, such as headlight, bulkhead lamp, fishing lamp, Navigation Lamp, projecting apparatus, laser television, optic communication.It is special
Not, as shown in figure 12, in matrix form light source module group 300, more laser light sources 310a, 310b, 310c etc. are set through oversampling circuit
Meter can independent control its switch, light source emergent light passes through lens 320 or speculum（It is not drawn into figure）After optical system processing；
Can be in the region such as range of exposures 330a, 330b, 330c, realizing is needing to specify the illumination in region.Specifically, as car headlight should
In, closely meeting or when running into pedestrian, it is necessary to the distance light in other side's driving range is closed, ensure road traffic peace
Entirely.The present embodiment propose scheme can by control open light source 330b, 330c, so as to fulfill only illumination region 330b,
Illuminated in 330c, not only met itself vehicling lighting, but also the security risk that other side can be avoided to be subject to strong illumination to bring.
It should be appreciated that above-mentioned specific embodiment is only the part preferred embodiment of the utility model, the above is implemented
Example can also carry out various combinations, deformation.The scope of the utility model is not limited to above example, all to be done according to the utility model
Any change, all belong to the scope of protection of the utility model within.
Claims (10)
1. a kind of light guide structure, including transparent heat-conducting block, the transparent heat-conducting block has the plane of incidence, reflecting layer and exit facet, institute
The one end opposite with the exit facet for stating transparent heat-conducting block is recessed reflecting surface, for horizontal positioned light-emitting component
Become the light of vertical direction after the light progress light shaping of outgoing.
2. light guide structure according to claim 1, it is characterised in that：The thermal conductivity of the transparent heat-conducting block is 5W/ (m
K more than).
3. light guide structure according to claim 1, it is characterised in that：The light guide structure is with a narrow upper and lower width stepped,
Light-emitting component can be embedded to inside, shorten light-emitting component to the distance of reflecting surface.
4. light guide structure according to claim 1, it is characterised in that：It is saturating that the plane of incidence of the light guide structure is equipped with micro-structure
Mirror, collimates laser beam, for obtaining smaller light emitting anger light source.
5. light guide structure according to claim 1, it is characterised in that：The plane of incidence surface of the transparent heat-conducting block is coated with anti-
Reflectance coating.
6. light guide structure according to claim 5, it is characterised in that：The refractive index of the antireflection tunic is less than 1.5.
7. light guide structure according to claim 1, it is characterised in that：The transparent heat-conducting block has more than two reflections
Face.
8. light guide structure according to claim 1, it is characterised in that：The reflecting surface has certain radian, by diverging
Light is converted into directional light, improves light source light-emitting uniformity.
9. light guide structure according to claim 1, it is characterised in that：30-60 ° of the tilt angle ranges of the reflecting surface.
10. light guide structure according to claim 1, it is characterised in that：The reflecting surface is coated with reflectance coating, its reflectivity is
More than 90%.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721283619.3U CN207250931U (en) | 2017-09-30 | 2017-09-30 | A kind of light guide structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721283619.3U CN207250931U (en) | 2017-09-30 | 2017-09-30 | A kind of light guide structure |
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| CN207250931U true CN207250931U (en) | 2018-04-17 |
Family
ID=61889642
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| CN201721283619.3U Active CN207250931U (en) | 2017-09-30 | 2017-09-30 | A kind of light guide structure |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019061371A1 (en) * | 2017-09-30 | 2019-04-04 | 厦门市三安光电科技有限公司 | Packaging structure for laser device |
| CN113064136A (en) * | 2020-01-02 | 2021-07-02 | 隆达电子股份有限公司 | Light emitting element and light emitting module |
| CN113467172A (en) * | 2021-07-15 | 2021-10-01 | 青岛海信激光显示股份有限公司 | Laser and projection system |
| WO2022062947A1 (en) * | 2020-09-22 | 2022-03-31 | 青岛海信激光显示股份有限公司 | Laser device |
| JP2022545365A (en) * | 2019-08-14 | 2022-10-27 | エイエムエス－オスラム インターナショナル ゲーエムベーハー | optoelectronic element |
| US11920752B2 (en) | 2019-12-25 | 2024-03-05 | Sony Group Corporation | Light source device, headlight, display apparatus, and illumination apparatus |
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2017
- 2017-09-30 CN CN201721283619.3U patent/CN207250931U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019061371A1 (en) * | 2017-09-30 | 2019-04-04 | 厦门市三安光电科技有限公司 | Packaging structure for laser device |
| JP2022545365A (en) * | 2019-08-14 | 2022-10-27 | エイエムエス－オスラム インターナショナル ゲーエムベーハー | optoelectronic element |
| JP7331244B2 (en) | 2019-08-14 | 2023-08-22 | エイエムエス－オスラム インターナショナル ゲーエムベーハー | optoelectronic element |
| US11920752B2 (en) | 2019-12-25 | 2024-03-05 | Sony Group Corporation | Light source device, headlight, display apparatus, and illumination apparatus |
| CN113064136A (en) * | 2020-01-02 | 2021-07-02 | 隆达电子股份有限公司 | Light emitting element and light emitting module |
| WO2022062947A1 (en) * | 2020-09-22 | 2022-03-31 | 青岛海信激光显示股份有限公司 | Laser device |
| CN113467172A (en) * | 2021-07-15 | 2021-10-01 | 青岛海信激光显示股份有限公司 | Laser and projection system |
| CN113467172B (en) * | 2021-07-15 | 2022-09-02 | 青岛海信激光显示股份有限公司 | Laser and projection system |
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Effective date of registration: 20231114 Address after: Yuanqian village, Shijing Town, Nan'an City, Quanzhou City, Fujian Province Patentee after: QUANZHOU SAN'AN SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Address before: 361009 no.1721-1725, Luling Road, Siming District, Xiamen City, Fujian Province Patentee before: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |