CN218351464U - Light emitting package device and display panel - Google Patents
Light emitting package device and display panel Download PDFInfo
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- CN218351464U CN218351464U CN202222817859.4U CN202222817859U CN218351464U CN 218351464 U CN218351464 U CN 218351464U CN 202222817859 U CN202222817859 U CN 202222817859U CN 218351464 U CN218351464 U CN 218351464U
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- emitting chip
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- 239000000758 substrate Substances 0.000 claims abstract description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 230000000007 visual effect Effects 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004020 luminiscence type Methods 0.000 abstract 3
- 238000004806 packaging method and process Methods 0.000 description 16
- 239000003292 glue Substances 0.000 description 6
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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Abstract
The utility model relates to a luminous encapsulation device and display panel, include: a substrate; the first light-emitting chip is arranged on the substrate; the second light-emitting chip and the third light-emitting chip are tiled on the first light-emitting chip; among the first light emitting chip, the second light emitting chip and the third light emitting chip, the light emitting chip is a red light emitting chip, the light emitting chip is a green light emitting chip, and the light emitting chip is a blue light emitting chip. The utility model discloses a luminous encapsulation device, through with second luminescence chip and third luminescence chip tiled on first luminescence chip, single luminous encapsulation device's size is littleer. The utility model discloses an among the display panel, can integrate more luminous encapsulation devices on the display panel of the same area, the display effect is better.
Description
Technical Field
The utility model relates to a display technology especially relates to a luminous encapsulation device and display panel.
Background
Various colors can be obtained after the red light, the green light and the blue light are mixed, in the traditional display technology, a red light chip, a green light chip and a blue light chip in a single display unit are directly arranged on corresponding back plates, so that the size of a device formed by subsequent packaging of each display unit is large, and the packaging device with the large size cannot be applied to display products with the size of the packaging device limited in a small range.
Therefore, how to reduce the size of the packaged device is an urgent problem to be solved.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, it is an object of the present invention to downsize a light emitting package device to be suitable for a product with a small size requirement for the period.
A light emitting package device comprising:
a substrate;
the first light-emitting chip is arranged on the substrate;
the second light-emitting chip and the third light-emitting chip are tiled on the first light-emitting chip;
among the first light emitting chip, the second light emitting chip and the third light emitting chip, the light emitting chip is a red light emitting chip, the light emitting chip is a green light emitting chip, and the light emitting chip is a blue light emitting chip.
According to the light emitting packaging device, the second light emitting chip and the third light emitting chip are tiled on the first light emitting chip, so that the size of a single light emitting packaging device is smaller.
Optionally, each light emitting chip includes:
a chip body; and
the two electrode pads are arranged on the chip body;
the first light-emitting chip is provided with a first surface and a second surface which are opposite, the first surface faces the substrate, the second surface comprises a first area, the second light-emitting chip and the third light-emitting chip are arranged on the first area, and the two electrode pads of the first light-emitting chip are arranged in an area outside the first area.
Optionally, the two electrode pads of the first light emitting chip are disposed on the second surface.
Optionally, the two electrode pads of the first light emitting chip are disposed on the first surface, and an avoiding hole for the two electrode pads of the first light emitting chip to pass through is formed in the substrate.
Optionally, the two electrode pads of the second light emitting chip are both disposed on a side of the second light emitting chip opposite to the first light emitting chip;
the two electrode pads of the third light-emitting chip are arranged on one side of the third light-emitting chip back to the first light-emitting chip.
Optionally, the light emitting package device further includes:
a first insulating bonding layer disposed between the substrate and the first light emitting chip, the first insulating bonding layer being for bonding the substrate and the first light emitting chip; and
and a second insulating bonding layer disposed on the first region, the second insulating bonding layer being used to bond the first and second light emitting chips and to bond the first and third light emitting chips.
Optionally, a plurality of conductive electrodes are disposed on the substrate, and each electrode pad is connected to a corresponding conductive electrode.
Optionally, a through hole is formed in the substrate, the conductive electrode is filled in the through hole, and the electrode pad is connected to the corresponding conductive electrode through a wire.
Optionally, the conductive electrode has a first conductive surface and a second conductive surface opposite to each other, the wire is connected to the first conductive surface, and a nickel layer is disposed on the second conductive surface.
Optionally, the light emitting package device further includes:
the light-blocking enclosing wall is arranged on the substrate and is enclosed on the side surface of each light-emitting chip; and
and the transparent insulating sealing body is filled in the area enclosed by the light blocking enclosing walls.
Optionally, in a view angle perpendicular to the substrate surface, the area ratio of the first light-emitting chip, the second light-emitting chip and the third light-emitting chip is X/Y/Z, wherein X is greater than or equal to Y + Z, and Y/Z is greater than or equal to 1/3 and less than or equal to 3.
Based on the same inventive concept, the utility model provides a display panel, include:
driving the back plate;
and the plurality of light-emitting packaging devices are arranged on the driving back plate, and the light-emitting packaging devices are any one of the light-emitting packaging devices.
In the display panel, the second light-emitting chip and the third light-emitting chip in the light-emitting packaging device are tiled on the first light-emitting chip, so that the size of a single light-emitting packaging device is smaller, more light-emitting packaging devices can be integrated on the display panel with the same area, and the display effect is better.
Drawings
Fig. 1 is a schematic diagram of an exemplary structure of a light emitting package device according to the present invention;
FIG. 2 is a top view of FIG. 1;
fig. 3 is a schematic view of another exemplary structure of a light emitting package device according to the present invention;
FIG. 4 is a top view of FIG. 3;
fig. 5 is a schematic view of another exemplary structure of a light emitting package device according to the present invention; (ii) a
Fig. 6 is a schematic structural diagram of an exemplary display panel provided with the light emitting package device of fig. 1 according to the present invention;
description of reference numerals:
100-substrate, 110-conductive electrode, 111-first conductive surface, 112-second conductive surface, 120-nickel layer;
200-first light emitting chip, 201-first surface, 202-second surface, 210-chip body, 220-electrode pad, 221-first electrode pad, 222-second electrode pad;
300-a second light emitting chip;
400-a third light emitting chip;
500-a first insulating bonding layer;
600-a second insulating bonding layer;
700-light blocking enclosure;
800-transparent insulating seal;
900-driving back plate, 901-first electrode, 902-second electrode.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
The problem of current scheme lies in: the red light chip, the green light chip and the blue light chip in the existing single display unit are directly arranged on the corresponding back plates, so that the size of a device formed by subsequent packaging of each display unit is large, and the packaging device with the large size cannot be applied to display products with the size of the packaging device limited in a small range.
Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
Referring to fig. 1 to 5, the present invention provides a light emitting package device, including a substrate 100, a first light emitting chip 200, a second light emitting chip 300 and a third light emitting chip 400, wherein the first light emitting chip 200 is disposed on the substrate 100; the second light emitting chip 300 and the third light emitting chip 400 are tiled on the first light emitting chip 200; among the first, second, and third light emitting chips 200, 300, and 400, a light emitting chip is a red light emitting chip, a light emitting chip is a green light emitting chip, and a light emitting chip is a blue light emitting chip.
In practical implementation, a red light chip may be used as the first light emitting chip 200, a blue light chip and a green light chip may be used as the second light emitting chip 300 and the third light emitting chip 400, respectively, or a blue light chip or a green light chip may be used as the first light emitting chip 200.
In the light emitting package device, the second light emitting chip 300 and the third light emitting chip 400 are tiled on the first light emitting chip 200, so that the size of a single light emitting package device is smaller.
The light emitting package devices of the above and below embodiments may be applied to a display panel, and referring to fig. 6 in combination, the display panel includes a driving backplane 900 and a plurality of light emitting package devices, the light emitting package devices are disposed on the driving backplane 900, and the light emitting package devices may adopt any one of the above or below embodiments. In the display panel, due to the adoption of the light-emitting packaging device with the smaller size, more light-emitting packaging devices can be integrated on the display panel with the same area, and the display effect is better.
In some embodiments, the area ratio of the first light emitting chip 200, the second light emitting chip 300, and the third light emitting chip 400 is X/Y/Z at a viewing angle perpendicular to the surface of the substrate 100, wherein X is greater than or equal to Y + Z, and 1/3 is greater than or equal to Y/Z is less than or equal to 3.
In some embodiments, referring to fig. 1 to 5 in combination, each light emitting chip includes a chip body 210 and two electrode pads 220 disposed on the chip body 210, the first light emitting chip 200 has a first surface 201 and a second surface 202 opposite to each other, the first surface 201 faces the substrate 100, the second surface 202 faces away from the substrate 100, the second surface 202 includes a first region, the second light emitting chip 300 and the third light emitting chip 400 are disposed on the first region, and both of the electrode pads 220 of the first light emitting chip 200 are disposed in a region outside the first region.
For example, referring to fig. 1, fig. 2, and fig. 5, the two electrode pads 220 of the first light emitting chip 200 are disposed on the second surface 202.
For another example, referring to fig. 3 and fig. 4, the two electrode pads 220 of the first light emitting chip 200 are disposed on the first surface 201, and the substrate 100 is provided with an avoiding hole for the two electrode pads 220 of the first light emitting chip 200 to pass through.
It should be noted that, when the light emitting package device is disposed on the driving backplane, the electrode pads of the light emitting chips need to be correspondingly connected to the electrodes on the driving backplane through other conductive connecting members. Specifically, referring to fig. 6, the light emitting chip has a first electrode pad 221 and a second electrode pad 222, the driving backplane 900 has a driving circuit thereon, a first electrode 901 connected to the driving circuit, and a second electrode 902 connected to the driving circuit, the first electrode 901 is connected to the first electrode pad 221, and the second electrode 902 is connected to the second electrode pad 222, so that the driving circuit can drive and control the light emitting chip.
In some embodiments, referring to fig. 1, 3 and 5, the two electrode pads 220 of the second light emitting chip 300 are disposed on a side of the second light emitting chip 300 opposite to the first light emitting chip 200; both of the electrode pads 220 of the third light emitting chip 400 are disposed on a side of the third light emitting chip 400 opposite to the first light emitting chip 200.
In some embodiments, referring to fig. 1, 3, and 5, the light emitting package device further includes a first insulating bonding layer 500 and a second insulating bonding layer 600, the first insulating bonding layer 500 being disposed between the substrate 100 and the first light emitting chip 200, the first insulating bonding layer 500 serving to adhere the substrate 100 and the first light emitting chip 200; a second insulating bonding layer 600 is disposed on the first region, and the second insulating bonding layer 600 is used to adhere the first and second light emitting chips 200 and 300 and to adhere the first and third light emitting chips 200 and 400. In practical implementation, the first insulating and bonding layer 500 and the second insulating and bonding layer 600 may both use adhesive glue; in addition, referring to fig. 1 and 3, the second insulating layer may be distributed at intervals in the second light emitting chip 300 and a region corresponding to the second light emitting chip 300; referring to fig. 5, the second insulating layer may also adopt a one-chip structure, covering regions corresponding to the second light emitting chip 300 and the third light emitting chip 400.
In some embodiments, referring to fig. 1 to 5 in combination, a plurality of conductive electrodes 110 are disposed on the substrate 100, and each electrode pad 220 is connected to a corresponding conductive electrode 110. Referring to fig. 6 in combination, when the light emitting package device is disposed on the driving back plane 900 of the display panel, the electrode pad 220 and the electrode on the driving back plane 900 are connected through the conductive electrode 110.
For example, referring to fig. 1 to 5 in combination, through holes are provided on the substrate 100, the conductive electrodes 110 are filled in the through holes, and the electrode pads 220 are connected to the corresponding conductive electrodes 110 through wires. Here, a connection line is not formed by using the PVD method to connect the electrode pad 220 and the conductive electrode 110, but the connection between the electrode pad 220 and the conductive electrode 110 is performed by using a conductive wire, so that the problem that the PVD (Physical Vapor Deposition) line cannot climb to the chip thickness can be solved.
Note that, in general, the electrode pads 220 correspond to the conductive electrodes 110 one to one; it should be noted that the conductive electrode 110 filled in the via hole may be made of a metal having high conductivity, such as copper or silver.
In some embodiments, referring to fig. 1, 3 and 5, the conductive electrode 110 has a first conductive surface 111 and a second conductive surface 112 opposite to each other, the conductive wire is connected to the first conductive surface 111, and a nickel layer 120 is disposed on the second conductive surface 112.
In some embodiments, referring to fig. 1 to 5, the light emitting package device further includes a light blocking wall 700 and a transparent insulating sealing body 800, the light blocking wall 700 is disposed on the substrate 100, the light blocking wall 700 is blocked at a side of each light emitting chip, and the transparent insulating sealing body 800 is filled in an area surrounded by the light blocking wall 700.
The light-blocking wall 700 herein can reduce the amount of light overflowing from the side, and when the light-emitting package device is applied to a display panel, the light-blocking wall 700 can avoid mixed light crosstalk between adjacent devices.
In an actual implementation process, the light-blocking enclosure 700 may be made of opaque glue such as white glue or black glue, and the transparent insulating sealing body 800 may be formed by introducing transparent liquid glue into the light-blocking enclosure 700 and standing and solidifying the transparent liquid glue.
It should be understood that the application of the present invention is not limited to the above examples, and that modifications or changes can be made by those skilled in the art based on the above description, and all such modifications and changes are intended to fall within the scope of the appended claims.
Claims (10)
1. A light emitting package device, comprising:
a substrate;
the first light-emitting chip is arranged on the substrate;
the second light-emitting chip and the third light-emitting chip are tiled on the first light-emitting chip;
among the first, second, and third light emitting chips, a light emitting chip is a red light emitting chip, a light emitting chip is a green light emitting chip, and a light emitting chip is a blue light emitting chip.
2. The light emitting package device of claim 1, wherein each light emitting chip comprises:
a chip body; and
the two electrode pads are arranged on the chip body;
the first light-emitting chip is provided with a first surface and a second surface which are opposite, the first surface faces the substrate, the second surface faces back to the substrate, the second surface comprises a first area, the second light-emitting chip and the third light-emitting chip are arranged on the first area, and the two electrode pads of the first light-emitting chip are arranged in an area outside the first area.
3. The light emitting package device of claim 2, wherein:
the two electrode pads of the second light-emitting chip are arranged on one side, back to the first light-emitting chip, of the second light-emitting chip;
the two electrode pads of the third light-emitting chip are arranged on one side of the third light-emitting chip back to the first light-emitting chip.
4. The light emitting package device of claim 2, further comprising:
a first insulating bonding layer disposed between the substrate and the first light emitting chip, the first insulating bonding layer being for bonding the substrate and the first light emitting chip; and
and a second insulating bonding layer disposed on the first region, the second insulating bonding layer being used to bond the first and second light emitting chips and to bond the first and third light emitting chips.
5. The light emitting package device of claim 2, wherein: a plurality of conductive electrodes are arranged on the substrate, and each electrode pad is connected with the corresponding conductive electrode.
6. The light emitting package device of claim 5, wherein: the substrate is provided with a through hole, the conductive electrode is filled in the through hole, and the electrode pad is connected with the corresponding conductive electrode through a lead.
7. The light emitting package device of claim 6, wherein: the conductive electrode is provided with a first conductive surface and a second conductive surface which are opposite, the wire is connected with the first conductive surface, and a nickel layer is arranged on the second conductive surface.
8. The light emitting package device of claim 1, further comprising:
the light-blocking enclosing wall is arranged on the substrate and is enclosed on the side surface of each light-emitting chip; and
and the transparent insulating sealing body is filled in the area enclosed by the light blocking enclosing walls.
9. The light emitting package device of any one of claims 1-8, wherein: under the visual angle vertical to the surface of the substrate, the area ratio of the first light-emitting chip to the second light-emitting chip to the third light-emitting chip is X/Y/Z, wherein X is more than or equal to Y + Z, and Y/Z is more than or equal to 1/3 and less than or equal to 3.
10. A display panel, comprising:
driving the back plate;
a plurality of light emitting package devices disposed on the driving backplane, the light emitting package devices being as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222817859.4U CN218351464U (en) | 2022-10-25 | 2022-10-25 | Light emitting package device and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222817859.4U CN218351464U (en) | 2022-10-25 | 2022-10-25 | Light emitting package device and display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218351464U true CN218351464U (en) | 2023-01-20 |
Family
ID=84899730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222817859.4U Active CN218351464U (en) | 2022-10-25 | 2022-10-25 | Light emitting package device and display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218351464U (en) |
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2022
- 2022-10-25 CN CN202222817859.4U patent/CN218351464U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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| CP03 | Change of name, title or address |
Address after: 402760 No.69, Wushan Road, Biquan street, Bishan District, Chongqing Patentee after: Chongqing Kangjia Optoelectronic Technology Co.,Ltd. Country or region after: China Address before: 402760 No.69, Wushan Road, Biquan street, Bishan District, Chongqing Patentee before: Chongqing Kangjia Photoelectric Technology Research Institute Co.,Ltd. Country or region before: China |