JP2003282950A - Method for manufacturing two-side emitting led - Google Patents
Method for manufacturing two-side emitting ledInfo
- Publication number
- JP2003282950A JP2003282950A JP2002080465A JP2002080465A JP2003282950A JP 2003282950 A JP2003282950 A JP 2003282950A JP 2002080465 A JP2002080465 A JP 2002080465A JP 2002080465 A JP2002080465 A JP 2002080465A JP 2003282950 A JP2003282950 A JP 2003282950A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- transparent resin
- light
- manufacturing
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、側面発光型ＬＥＤ
の製造方法に係り、特に２側面に発光窓を有する２側面
発光型ＬＥＤの製造方法に関する。TECHNICAL FIELD The present invention relates to a side surface light emitting type LED.
In particular, the present invention relates to a method for manufacturing a two-sided light emitting LED having light emitting windows on two side surfaces.
【０００２】[0002]
【従来の技術】側面発光型ダイオードは、直方体或いは
立方体の側面に発光窓を有するＬＥＤであり、従来、液
晶のバックライト等に用いられており、特に携帯電話機
の液晶用バックライトとしての需要が増加している。従
来の側面発光型ＬＥＤは、一側面にのみ発光窓を有する
ものが主流であった（例えば、特開平５−３１５６５１
号公報、特開平７−３２６７９７号公報、特開平１１−
６７７９９号公報等）。2. Description of the Related Art A side surface light emitting diode is an LED having a light emitting window on the side surface of a rectangular parallelepiped or a cube, and has been conventionally used as a liquid crystal backlight or the like, and is particularly in demand as a liquid crystal backlight for mobile phones. It has increased. Most of the conventional side surface emitting LEDs have a light emitting window on only one side surface (for example, JP-A-5-315651).
Japanese Patent Laid-Open No. 7-326797, Japanese Patent Laid-Open No. 11-
67799, etc.).
【０００３】近年、携帯電話機の液晶表示部が大型化す
る傾向にあり、一側面のみが発光する従来のＬＥＤは図
７に示すようにＬＥＤ１０の発光ビームＸの指向性が狭
いため、液晶の一辺に配置するＬＥＤの数を増やさなけ
れば、液晶画面全体の照明を行うことが困難となってき
ていた。そして、ＬＥＤの数を増やすことによって消費
電力が増し、バッテリーに与える負荷を大きくしてい
た。In recent years, the liquid crystal display portion of a mobile phone has tended to increase in size, and a conventional LED that emits light from only one side has a narrow directivity of the emission beam X of the LED 10 as shown in FIG. It has become difficult to illuminate the entire liquid crystal screen without increasing the number of LEDs arranged in. Then, by increasing the number of LEDs, the power consumption increases and the load on the battery is increased.
【０００４】そこで、多側面に発光窓を有する側面発光
型ＬＥＤが提案されている（例えば、特開２０００−３
１５８２５号公報、特開２００１−３０８３８９号公
報、特開２００１−３５８３６７号公報等）。Therefore, a side surface light emitting type LED having light emitting windows on multiple side surfaces has been proposed (for example, Japanese Patent Laid-Open No. 2000-3).
15825, JP 2001-308389 A, JP 2001-358367 A, etc.).
【０００５】そして、これらの多側面発光型ＬＥＤは、
例えば、基板にＬＥＤチップを搭載した後、該基板に不
透光性樹脂製ケースを配置し、ケース内に透明樹脂を注
入し硬化させ、ダイシングすることにより製造されてい
る（特開２００１−３０８３８９号公報）。These multi-sided light emitting LEDs are
For example, it is manufactured by mounting an LED chip on a substrate, disposing an opaque resin case on the substrate, injecting a transparent resin into the case, curing the resin, and dicing (Japanese Patent Laid-Open No. 2001-308389). Issue).
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記従
来の多側面発光型ＬＥＤの製造方法には、以下のような
問題があった。
（１）複雑な形状をしたケースのための金型を作成する
とコストが嵩む。
（２）不透光性樹脂ケースを基板上に接着させ、ケース
の隙間から透明樹脂を充填する方法では、ケースと透明
樹脂との間に空隙等を生じ易く、斯かる空隙は製品品質
を著しく低下させる。
（３）ケースと基板との接着に接着剤を使うと工程が増
える。
（４）ケースと基板との接着を透明樹脂で賄うと、ケー
スと基板との間で透明樹脂が存在しない領域に未接着領
域が生じ、その界面へ水分が侵入すると、その水分の膨
張によって、ケース剥離を生じさせるという問題等があ
った。However, the above-mentioned conventional method for manufacturing a multi-sided light emitting type LED has the following problems. (1) The cost increases when a die for a case having a complicated shape is created. (2) In the method of adhering the non-translucent resin case on the substrate and filling the transparent resin through the gap between the cases, a gap or the like is likely to occur between the case and the transparent resin, and such a gap remarkably reduces the product quality. Lower. (3) If an adhesive is used to bond the case and the substrate, the number of steps increases. (4) When the transparent resin covers the case and the substrate, a non-bonded region is formed between the case and the substrate in a region where the transparent resin does not exist, and when water enters the interface, the expansion of the water causes There has been a problem that the case is peeled off.
【０００７】そこで、本発明は、安定した品質を保って
工程を簡略化することのできる２側面発光型ＬＥＤの製
造方法を提供することにある。Therefore, the present invention is to provide a method of manufacturing a two-sided light emitting type LED, which can maintain stable quality and simplify the process.
【０００８】[0008]
【課題を解決するための手段】本発明の上記目的は、回
路基板上に、ＬＥＤチップを縦横２列で４個一組とし
て、該組を縦、横、或いは縦横に搭載する工程と、前記
ＬＥＤチップを各組毎に透明樹脂により封止して各々が
独立した複数の透明樹脂封止体を形成し、これらの透明
樹脂封止体を硬化させる工程と、前記透明樹脂封止体を
一括して覆うようにして前記基板をその全体に亘って光
反射性を有する遮光性樹脂により封止し、該遮光性樹脂
を硬化させる工程と、前記回路基板、硬化した透明樹脂
封止体、及び硬化した遮光性樹脂を前記独立した透明樹
脂封止体間及び各透明樹脂封止体内の各ＬＥＤチップ間
で切断分割する工程と、を有することを特徴とする２側
面発光型ＬＥＤの製造方法によって達成される。The above object of the present invention is to provide a set of four LED chips in two rows and two columns on a circuit board, and to mount the groups vertically, horizontally, or vertically and horizontally. A step of encapsulating the LED chips in each set with a transparent resin to form a plurality of independent transparent resin encapsulants, and curing the transparent resin encapsulants, and the transparent resin encapsulant at once. And covering the entire substrate with a light-shielding resin having light reflectivity so as to cover the substrate, and curing the light-shielding resin, the circuit board, a cured transparent resin encapsulant, and And a step of cutting and curing the cured light-shielding resin between the independent transparent resin encapsulants and between the LED chips in each transparent resin encapsulant. To be achieved.
【０００９】前記ＬＥＤチップの各組は、孔版印刷手段
を用いて前記透明樹脂により封止することが好ましい。Each set of the LED chips is preferably sealed with the transparent resin by using a stencil printing means.
【００１０】前記遮光性樹脂は、エポキシ樹脂に対して
約１０〜約７０重量％の酸化チタンを含むものが好まし
い。The light-shielding resin preferably contains about 10 to about 70% by weight of titanium oxide with respect to the epoxy resin.
【００１１】前記基板は、孔版印刷手段を用いて前記遮
光性樹脂により封止することが好ましい。The substrate is preferably sealed with the light-shielding resin by using a stencil printing means.
【００１２】[0012]
【発明の実施の形態】本発明の好ましい実施形態につい
て以下に図面を参照して説明する。BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to the drawings.
【００１３】先ず、図１に示すように、回路配線が施さ
れた回路基板１上に、ＬＥＤチップ２を縦横２列で４個
一組として、複数個の組を縦横に搭載する。図示の例に
おいて、１組のＬＥＤチップ２は正方形の４隅に配置さ
れ、各組が一定の間隔をおいて縦３列、横６列の合計１
８組が設けられている。First, as shown in FIG. 1, four sets of LED chips 2 are mounted in two rows and two columns, and a plurality of sets are mounted vertically and horizontally on a circuit board 1 on which circuit wiring is provided. In the illustrated example, one set of LED chips 2 is arranged at the four corners of a square, and each set has a total of 1 row of 3 columns and 6 rows at regular intervals.
Eight sets are provided.
【００１４】回路基板１は、光の反射率を高めるため、
エポキシ樹脂に酸化チタンを配合した組成物をガラスク
ロスに含浸してなる白色のガラス−エポキシ基板に金属
配線をプリントしたものが好ましい。ＬＥＤチップ２
は、ワイヤーボンディングによって回路のランドとワイ
ヤー３で接続される。The circuit board 1 has a high reflectivity for light.
A white glass-epoxy substrate obtained by impregnating a glass cloth with a composition in which titanium oxide is mixed with an epoxy resin is preferably printed with metal wiring. LED chip 2
Are connected to the land of the circuit by wire 3 by wire bonding.
【００１５】次に、図２に拡大して示すように、ＬＥＤ
チップ２の各組毎を液状の透明樹脂４によって封止して
各々が独立した複数の透明樹脂封止体を形成させ、これ
を硬化させる。透明樹脂４は、ディスペンサーを用いて
供給することができるが、多数組を同一形状で一括して
封止するには孔版印刷手段を用いることが好ましい。透
明樹脂４に熱硬化性樹脂を用いた場合、その硬化条件
は、樹脂の種類により異なるが、例えば、８０〜１５０
℃、１５分〜２時間である。Next, as shown enlarged in FIG.
Each set of chips 2 is sealed with liquid transparent resin 4 to form a plurality of independent transparent resin sealing bodies, and these are cured. The transparent resin 4 can be supplied by using a dispenser, but it is preferable to use a stencil printing means in order to collectively seal a large number of sets in the same shape. When a thermosetting resin is used for the transparent resin 4, the curing conditions vary depending on the type of resin, but are, for example, 80 to 150.
C, 15 minutes to 2 hours.
【００１６】透明樹脂４としては、例えば、ＮＬＤ−６
０、ＮＬＤ−２１００（商品名 サンユレック社製）を
使用でき、これら封止樹脂を用いることにより、例え
ば、０．５〜１．０ｍｍの高さのレンズ状の透明樹脂封
止体を孔版印刷手段を適用して形成することができる。
孔版印刷手段を適用する場合、透明樹脂４の粘度は、
１．０〜１００Ｐａ・ｓに調整することが好ましい。As the transparent resin 4, for example, NLD-6
No. 0, NLD-2100 (trade name, manufactured by Sanyu Rec Co., Ltd.) can be used. By using these sealing resins, for example, a lens-shaped transparent resin sealing body having a height of 0.5 to 1.0 mm can be used as a stencil printing means. Can be applied to form.
When applying the stencil printing means, the viscosity of the transparent resin 4 is
It is preferably adjusted to 1.0 to 100 Pa · s.
【００１７】透明樹脂４を硬化させた後、図３に示すよ
うに、複数の透明樹脂封止体を一括して覆うようにして
基板１の全体に亘って光反射性を有する液状の遮光性樹
脂５により封止し、封止した遮光性樹脂５を硬化させ
る。遮光性樹脂５に熱硬化性樹脂を用いた場合は、その
硬化条件は、樹脂の種類により異なるが、例えば、８０
〜１５０℃、１５分〜２時間である。After the transparent resin 4 is hardened, as shown in FIG. 3, a liquid light-shielding property having a light-reflecting property over the entire substrate 1 is provided so as to collectively cover a plurality of transparent resin sealing bodies. The light-shielding resin 5 sealed with the resin 5 is cured. When a thermosetting resin is used for the light-shielding resin 5, the curing conditions vary depending on the type of resin, but for example, 80
˜150 ° C., 15 minutes to 2 hours.
【００１８】遮光性樹脂５の封止は、孔版印刷手段を用
いて行うことができ、このような孔版印刷手段による樹
脂封止技術そのものは例えば本願出願人提案の特許第３
１６３４１９号公報により公知である。前記遮光性樹脂
は、光の反射率を高めるため、エポキシ樹脂に酸化チタ
ンを含む白色系の樹脂が好ましい。酸化チタンのエポキ
シ樹脂中への含有割合は、エポキシ樹脂に対して、酸化
チタンが１０〜７０重量％であることが好ましい。The light-shielding resin 5 can be sealed by using a stencil printing means, and the resin sealing technique itself by such a stencil printing means is, for example, Patent No. 3 proposed by the present applicant.
It is known from Japanese Patent No. 163419. The light-shielding resin is preferably a white resin containing an epoxy resin containing titanium oxide in order to increase the light reflectance. The content ratio of titanium oxide in the epoxy resin is preferably 10 to 70% by weight of titanium oxide with respect to the epoxy resin.
【００１９】遮光性樹脂５を硬化させた後、回路基板
１、透明樹脂４封止体、及び遮光性樹脂５を、図４に示
す仮想線Ｃに沿って、透明樹脂４封止体の間及び各透明
樹脂４封止体内の各ＬＥＤチップ２の間で切断分割す
る。この切断は、レーザーカッター又はダイシングカッ
ターによって行うがきるが、過剰な熱が加わらないダイ
シングカッターによることが好ましい。After the light blocking resin 5 is cured, the circuit board 1, the transparent resin 4 sealing body, and the light blocking resin 5 are placed between the transparent resin 4 sealing bodies along the imaginary line C shown in FIG. And, the transparent resin 4 is cut and divided between the LED chips 2 in the sealed body. This cutting can be performed with a laser cutter or a dicing cutter, but it is preferable to use a dicing cutter that does not apply excessive heat.
【００２０】こうして、図５に示すように、２側面に発
光窓を有する２側面発光型ＬＥＤ６が製作される。本発
明方法によって製造された２側面発光型ＬＥＤ６は、図
６に示すように、発光ビームＸ’が、ほぼ１８０°の発
光指向性を有している。Thus, as shown in FIG. 5, a two-sided light emitting LED 6 having light emitting windows on two side surfaces is manufactured. In the two-side light emitting LED 6 manufactured by the method of the present invention, as shown in FIG. 6, the light emitting beam X ′ has a light emitting directivity of about 180 °.
【００２１】上記した２面発光型ＬＥＤの製造方法によ
れば、遮光性樹脂は未硬化の液状で封止するから、基板
との隙間無く密着させることができるし、従来のように
別途接着剤で接着する工程は不要である。更に、樹脂封
止に孔版印刷手段を採用することにより、スキージの押
圧により密着性が確保されるし、空隙も生じにくい。According to the above-mentioned method for manufacturing a two-sided light emitting LED, the light-shielding resin is sealed in an uncured liquid, so that it can be adhered to the substrate without any gap, and a separate adhesive agent as in the conventional case. The step of adhering with is unnecessary. Further, by adopting a stencil printing means for resin sealing, the squeegee is pressed to secure the adhesiveness, and voids are less likely to occur.
【００２２】[0022]
【発明の効果】以上の説明から明らかなように、本発明
によれば、２側面発光型ＬＥＤの製造工程を簡略化しつ
つも製品品質を保持することができる。As is apparent from the above description, according to the present invention, it is possible to maintain the product quality while simplifying the manufacturing process of the two-side light emitting LED.
【図１】本発明に係る２側面発光型ＬＥＤの製造方法の
製造工程を説明する図であり、基板に複数のＬＥＤチッ
プを搭載し、ワイヤーボンディングを施した状態を示す
平面図である。FIG. 1 is a diagram illustrating a manufacturing process of a method for manufacturing a two-side light emitting LED according to the present invention, and is a plan view showing a state in which a plurality of LED chips are mounted on a substrate and wire bonding is performed.
【図２】本発明に係る２側面発光型ＬＥＤの製造方法の
製造工程を説明する図であり、図１の４個一組のＬＥＤ
チップを透明樹脂で封止した透明樹脂封止体を拡大して
示す平面図である。FIG. 2 is a diagram for explaining a manufacturing process of a method for manufacturing a two-side light emitting LED according to the present invention, wherein the set of four LEDs shown in FIG.
It is a top view which expands and shows the transparent resin sealing body which sealed the chip with transparent resin.
【図３】本発明に係る２側面発光型ＬＥＤの製造方法の
製造工程を説明する図であり、図２の基板及び透明樹脂
封止体を遮光性樹脂で封止した状態を示す縦断面図であ
る。FIG. 3 is a view for explaining the manufacturing process of the method for manufacturing the two-side light emitting LED according to the present invention, which is a vertical cross-sectional view showing a state in which the substrate and the transparent resin sealing body of FIG. 2 are sealed with a light shielding resin. Is.
【図４】図４の状態にしたものを切断するための切断線
を仮想線で示す平面図である。FIG. 4 is a plan view showing a cutting line for cutting the product in the state of FIG. 4 by an imaginary line.
【図５】本発明の製造方法により製造された２側面発光
型ＬＥＤを示す斜視図である。FIG. 5 is a perspective view showing a two-sided light emitting LED manufactured by a manufacturing method of the present invention.
【図６】図５の２側面ＬＥＤの指向性を示す平面図であ
る。FIG. 6 is a plan view showing the directivity of the two-sided LED of FIG.
【図７】従来の側面ＬＥＤの指向性を示す平面図であ
る。FIG. 7 is a plan view showing the directivity of a conventional side LED.
１ 基板 ２ ＬＥＤチップ ３ ワイヤー ４ 透明樹脂 ５ 遮光性樹脂 ６ ２側面発光型ＬＥＤ 1 substrate 2 LED chips 3 wires 4 transparent resin 5 Light-shielding resin 6 2 side emitting LED
───────────────────────────────────────────────────── フロントページの続き (72)発明者 宮脇 善照 京都府宇治市木幡西浦31−１ パテシオン 宇治木幡424号 Ｆターム(参考） 5F041 DA19 DA44 DA46 DA57 DA58 DA92 EE23 EE24 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Yoshiteru Miyawaki 31-1 Kinata Nishiura, Uji City, Kyoto Prefecture Uji Kibata No.424 F-term (reference) 5F041 DA19 DA44 DA46 DA57 DA58 DA92 EE23 EE24
Claims (4)
で４個一組として搭載する工程と、 前記ＬＥＤチップの各組毎を透明樹脂によって封止し、
それら封止体の各々が独立した複数の透明樹脂封止体を
形成し、これらの透明樹脂封止体を硬化させる工程と、 前記透明樹脂封止体を一括して覆うようにして前記基板
をその全体に亘って光反射性を有する遮光性樹脂により
封止し、該遮光性樹脂を硬化させる工程と、 前記回路基板、硬化した透明樹脂封止体、及び硬化した
遮光性樹脂を、前記独立した透明樹脂封止体間及び各透
明樹脂封止体内の各ＬＥＤチップ間で切断分割する工程
と、 を有することを特徴とする２側面発光型ＬＥＤの製造方
法。1. A step of mounting four LED chips on a circuit board in two rows and two columns as a set, and sealing each set of the LED chips with a transparent resin,
A step of forming a plurality of independent transparent resin sealing bodies for each of the sealing bodies and curing the transparent resin sealing bodies; and The step of sealing the whole with a light-shielding resin having light reflectivity and curing the light-shielding resin, the circuit board, the cured transparent resin encapsulant, and the cured light-shielding resin And a step of cutting and dividing between the transparent resin encapsulants and between the LED chips in each transparent resin encapsulant.
段を用いて前記透明樹脂により封止されることを特徴と
する請求項１記載の２側面発光型ＬＥＤの製造方法。2. The method of manufacturing a two-sided light emitting LED according to claim 1, wherein each set of the LED chips is sealed with the transparent resin by using a stencil printing unit.
０〜約７０重量％の酸化チタンを含む請求項１又は２に
記載の２側面発光型ＬＥＤの製造方法。3. The light-shielding resin is an epoxy resin of about 1
The method for manufacturing a two-sided light emitting LED according to claim 1, comprising 0 to about 70% by weight of titanium oxide.
遮光性樹脂により封止されることを特徴とする請求項１
〜３の何れかに記載の２側面発光型ＬＥＤの製造方法。4. The substrate is sealed with the light-shielding resin by using a stencil printing unit.
4. The method for manufacturing a two-sided light emitting LED according to any one of 3 to 3.
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| JP2002080465A JP4006578B2 (en) | 2002-03-22 | 2002-03-22 | Method for manufacturing two side-emitting LEDs |
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| JP2002080465A JP4006578B2 (en) | 2002-03-22 | 2002-03-22 | Method for manufacturing two side-emitting LEDs |
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| JP4006578B2 JP4006578B2 (en) | 2007-11-14 |
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Cited By (7)
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| JP2005175039A (en) * | 2003-12-09 | 2005-06-30 | Kenichiro Miyahara | Light emitting element and substrate for mounting the same |
| WO2007004486A1 (en) * | 2005-06-30 | 2007-01-11 | Nitto Denko Corporation | Led display |
| KR100801008B1 (en) | 2005-11-24 | 2008-02-04 | 한국 고덴시 주식회사 | A COB type LED lamp and method for manufacturing the same |
| JP2008507135A (en) * | 2004-07-15 | 2008-03-06 | ゲルコアー リミテッド ライアビリティ カンパニー | LED lighting system having reflector |
| JP2008193018A (en) * | 2007-02-08 | 2008-08-21 | Wen-Gung Sung | Method for manufacturing side light emitting diode and its structure |
| JP2015133369A (en) * | 2014-01-10 | 2015-07-23 | アピックヤマダ株式会社 | Optical device and method of manufacturing the same |
| JP2015181181A (en) * | 2010-05-27 | 2015-10-15 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ | Electronic system and method of manufacturing electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005175039A (en) * | 2003-12-09 | 2005-06-30 | Kenichiro Miyahara | Light emitting element and substrate for mounting the same |
| JP2008507135A (en) * | 2004-07-15 | 2008-03-06 | ゲルコアー リミテッド ライアビリティ カンパニー | LED lighting system having reflector |
| WO2007004486A1 (en) * | 2005-06-30 | 2007-01-11 | Nitto Denko Corporation | Led display |
| KR100801008B1 (en) | 2005-11-24 | 2008-02-04 | 한국 고덴시 주식회사 | A COB type LED lamp and method for manufacturing the same |
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