KR100623576B1 - SMD type opto device and Process method - Google Patents

Abstract

The present invention, the optical device chip for generating light when the power is supplied; A zener diode connected in parallel with the optical device chip and outputting a constant voltage when a breakdown voltage flows; A first substrate composed of a first circuit and a second circuit electrically connected through a through hole, and a second substrate composed of a copper foil, a receiving groove, and an external terminal, and the second substrate is formed of a second circuit. The external terminal is attached to the surface of the second substrate, the external terminal is electrically connected to the first and second circuits of the first substrate, and the optical element chip is fixed to the first circuit of the first substrate, the inside of the receiving groove of the second substrate A printed circuit board having a zener diode fixed to the second circuit of the circuit board; A first electrode line electrically connecting the first circuit and the electrode of the optical device chip; A second electrode line electrically connecting the second circuit and the electrode of the zener diode; A compound resin layer formed on one surface of the printed circuit board after injecting the liquid resin into the liquid resin by applying heat and pressure to the compound resin mixed with phosphors; And a base coating layer coated with a specific paint on the other surface of the printed circuit board on which the second circuit is formed and on a surface other than the specific surface of the compound resin layer from which light is emitted, and the metal film replaces the reflector to increase the reflection effect. In addition, it does not require expensive dedicated leadframe molds, which saves mold costs and eliminates mold manufacturing periods, enabling timely response to changes in demand.

Description

Small optical device package and manufacturing method thereof {SMD type opto device and Process method}

1A is a cross-sectional view of a side light emitting device according to the prior art,

1B is a front view of a side light emitting device according to the prior art,

2A is a plan view of a first printed circuit board according to the present invention;

2B is a rear view of the first printed circuit board,

2C is a plan view of a second printed circuit board,

3A is a front view of a small optical device according to the present invention,

3b is a rear view of a small optical device according to the present invention;

3C is a cross-sectional view of a small optical device according to the present invention;

3d is a side view of a small optical device according to the present invention,

4 is a process flowchart of a small optical device according to the present invention.

* Description of the symbols for the main parts of the drawings *

110: first substrate 111: second substrate

112: accommodation home 113, 113 ': copper foil

114, 114 ': External terminal groove 121, 121': First circuit

122, 122 ': Second circuit 123: External terminal

131: optical element 132: zener diode

141 and 141 ': optical element electrode 142: zener diode electrode

151 and 151 ': first electrode line 152: second electrode line

160: compound resin 170: base coating layer

180: metal film coating layer

The present invention relates to a small optical device package and a method for manufacturing the same, and more particularly, a base coating layer coated with a specific paint mixed with titanium dioxide on an outer surface of a compound resin layer formed on a printed circuit board and a metal film layer vacuum-deposited a metal film. By replacing the function of the conventional reflector, since the available inner diameter is wider, more optical element chips can be installed, and a small optical element package capable of increasing light efficiency due to higher efficiency of reflecting light than a conventional plastic reflector and a manufacturing method thereof It is about.

Generally, a light source system using a light emitting diode chip is mounted and used in various types of packages according to the intended use of the light emitting diode (LED) chip. Among them, a side light emitting device is used for a backlight display for a small display such as a mobile phone, because the light must be provided in parallel with the light guide plate on which the light emitting device is mounted because light must be provided from the side of the light guide plate. .

The conventional side light emitting device includes a lead frame 10 having an electrode formed thereon, a light emitting diode chip 30 which is a nitride semiconductor mounted on the electrode, and a molding molding part 50 encapsulating the light emitting diode chip. The method is as follows.

The lead frame 10 has an epoxy receptor or a reflector separately formed to accommodate the liquid epoxy, and the LED chip 30 is mounted therein and fixed on the electrode by conductive silver paste. Electrodes of the lead frame 10 and the light emitting diode chip 30 are electrically connected using the wire 40.

After wire bonding, the liquid silicone or liquid epoxy including phosphor is filled into the epoxy receptor or the reflector 20 with a dispenser or the like, and then cured at a predetermined temperature for a predetermined time.

In addition, there is a reflector made of plastic resin on the lead frame, and one light emitting diode chip and one zener diode are inserted in the lead frame, and the metal wire is connected. Since the entrance of the reflector is too small, it is very difficult to insert the optical device chip and connect the wire. There was a problem that the work speed is slow because it is difficult and affects the work. Since the light emitting diodes and the zener diodes are installed together in the receiver, light scattering, absorption, and the like occur during light emission, thereby causing a problem of lowering the luminance by 10% or more.

In addition, since the encapsulant of the molding part is a liquid, the resin may be buried next to the receiver, and the phosphor is not uniformly distributed in the liquid encapsulant, but sinks downward due to the specific gravity over time, so that the distribution ratio of the phosphor in the liquid encapsulant is increased. Therefore, problems such as color dispersion occur in one lead frame. In addition, in the process of adding the liquid encapsulant, the precipitation state of the phosphor was different according to the time required for injection, ambient conditions, etc., and it was difficult to manage a certain amount, resulting in different white color coordinates, which was the main cause of the cost increase.

The present invention has been made in view of the above-described conditions, and an object of the present invention is to mount a compound chip on a printed circuit board, and then mold the compound resin on the printed circuit board by a transfer molding method, and then form the printed circuit board. The base coating layer coated with the paint on the outer surface of the compound resin layer and the metal film layer deposited in a vacuum function as the conventional plastic reflector, but reflect 70 to 80% of the light in the base coating layer and reflect the remaining light in the metal layer. The present invention provides a compact optical device package and a method of manufacturing the same, which have a higher efficiency of reflecting light than a conventional plastic reflector, thereby improving light efficiency.

Still another object of the present invention is to provide a compact optical device package and a method of manufacturing the same, which can prevent the phosphor from being precipitated by using a solid compound resin and at the same time reduce the defective products, thereby reducing the cost.

In order to achieve the above object, the technical means according to the present invention is an optical device chip that generates light when the power is supplied, a zener diode connected in parallel with the optical device chip and outputs a constant voltage when the breakdown voltage flows, through-holes A first substrate comprising a first circuit and a second circuit electrically connected through the second substrate, and a second substrate composed of a copper foil, a receiving groove, and an external terminal, wherein the second substrate is formed on a surface of the first substrate on which the second circuit is formed. The external terminal provided on the second substrate is electrically connected to the first and second circuits of the first substrate, and the optical device chip is fixed to the first circuit of the first substrate, A printed circuit board having a zener diode fixed to two circuits, a first electrode line electrically connecting the first circuit of the printed circuit board and an electrode of an optical device chip, the second circuit of the printed circuit board and the zener diode When the second electrode wire electrically connects to the compound resin mixed with the phosphor and heat and pressure is applied to the liquid resin, the liquid resin is injected into one surface of the printed circuit board and the injected liquid resin solidifies. And a base coating layer coated with a specific paint on the other surface of the printed circuit board on which the compound resin layer and the second circuit formed on one surface and the specific surface of the compound resin layer from which light is emitted.

In addition, the technical method according to the present invention for achieving the above object is to form the first and second circuits to electrically connect both sides of the first substrate through the hole, and to connect the external terminal to the second circuit, Manufacturing a printed circuit board by adhering a second substrate to a first substrate on which two circuits are formed; Fixing the zener diode inside the receiving groove of the other surface of the printed circuit board on which the second circuit is formed and curing the adhesive to which the zener diode is fixed; Connecting an electrode of the fixed zener diode and the second circuit using a second electrode line and then injecting epoxy into the inner space of the receiving groove; Fixing the optical device chip with an adhesive on one surface of the printed circuit board on which the first circuit is formed, and then curing the adhesive fixing the optical device chip; Connecting and connecting the first circuit of the printed circuit board and the electrode of the optical device chip through the first electrode line; Injecting a compound resin in which phosphors are mixed into a printed circuit board to which an optical device chip is fixed and then molding; Adhering the tape to a particular side of the compound resin and the second substrate to emit light; Cutting the compound resin layer into a user's predetermined size; Base coating the cut surface of the compound resin layer with a paint containing titanium dioxide; Adhering a tape to the compound resin layer; Removing the tape adhered to the second substrate; Cutting the printed circuit board at a position perpendicular to the cut compound resin layer; And removing the tape adhered to the compound resin layer.

According to the present invention, since the optical device chip and the electrode wire are attached to the flat printed circuit board in the absence of the reflector, it has excellent mass productivity, total reflection of 70 to 80% of the light in the base coating layer, and the remaining light in the metal film layer. Because it reflects, the reflection effect can be improved than the conventional reflector, so it can reduce the light loss, and it does not need the expensive lead-frame die for expensive side light emission. have.

In addition, since the solid resin is used, the content of pigments and phosphors added in the resin can be kept constant for each product, resulting in high production yields, thereby reducing the cost burden. The transfer molding method is molded in the shape of a mold. Since a certain amount is formed each time and the time of liquefaction and solidification is made within several tens of seconds, there is no time for precipitation or separation of phosphors having different specific gravity, so that the ratio of phosphors and resins is constant for each product, thus increasing the production yield. The burden can be reduced, more easily manufactured to any desired size desired by the user, and mass production is possible.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2A illustrates one surface of the first substrate 110 and includes a through hole h and h 'electrically connecting both surfaces of the substrate, and first circuits 121 and 121' connected to the through hole. FIG. 2B illustrates the other surface of the first substrate 110, and includes a through hole (h, h ′) and a second circuit 122 electrically connected to the first circuit through the through hole. The second substrate further comprises a pair of external terminals connected to the external terminal grooves by a double-sided board composed of the accommodating groove 112, the copper foil 113, and the external terminal grooves 114 and 114 ′, and wherein the second circuit is formed. By being bonded to the other surface of the first substrate is electrically connected to the first circuit and the second circuit of the first substrate through a pair of external terminals.

Therefore, the printed circuit board is made by a method of bonding so that two double-sided boards are electrically connected.

In addition, a plurality of printed circuit boards composed of substrates, holes, external terminals, and circuits are arranged at uniform intervals in the horizontal and vertical directions at regular intervals. It is possible.

3A is a front view of a small optical device according to the present invention, FIG. 3B is a rear view of the small optical device according to the present invention, FIG. 3C is a sectional view of the small optical device according to the present invention, and FIG. 3D is a side view of the small optical device according to the present invention. , The first substrate 110 of the printed circuit board, the second substrate 111, the receiving groove 112, the copper foils 113 and 113 ′, the external terminal grooves 114 and 114 ′, and the first circuit of the first substrate (121, 121 '), second circuit (122, 122'), external terminal (123), through hole (h, h '), optical element chip (131), zener diode (132), optical element electrode (141) 141 '), the zener diode electrode 142, the first electrode lines 151 and 151', the second electrode line 152, the compound resin layer 160, the base coating layer 170, and the metal film layer 180 have.

An optical device chip 131 that generates light when power is supplied generally uses a light emitting diode (LED), and the optical device chip 131 is adhesively fixed to one surface of a printed circuit board by an adhesive. In addition, when a voltage equal to or higher than the breakdown voltage flows through the optical device, the zener diode 132 for maintaining a constant voltage is fixed to the second circuit 122 ′ of the first substrate 110 with conductive silver.

In the printed circuit board, the first and second circuits 121 and 121 'and the second circuit 122 of the first substrate 110 are connected through a pair of through holes h and h' which penetrate both surfaces of the first substrate 110. And 122 'are bonded to the other surface of the first substrate on which the second circuit is formed and the second substrate 111 on which the external terminal 123 is provided, thereby connecting the first circuit 121 and 121' and the second circuit ( 122, 22 ') are electrically connected to the external terminal 123.

In addition, the second circuit 111 is bonded to the other surface of the substrate on which the second circuits 122 and 22 'are formed by bonding the second substrate 111 on which the receiving grooves 112, the copper foil 113, and the external terminal grooves 114 and 114' are formed. And an external terminal of the second substrate are connected to each other to electrically connect the first substrate and the second substrate.

In addition, the metal circuit is designed to leave a metal wire at a predetermined distance from the edge of one surface of the first substrate on which the first circuit is formed, and the circuit is mainly plated with gold. The circuit wire of is plated with silver.

When the external terminal 123 is attached to a specific electronic device, the external terminal 123 is a soldering terminal which is a soldering part.

In addition, a plurality of optical device chips may be mounted on a single printed circuit board according to a use purpose, and as the plurality of optical device chips are fixed, electrode lines for supplying power to the plurality of optical device chips may be increased. The external terminals corresponding to the two optical elements are also increased.

In addition, it is possible to use a light emitting diode of RGB color, and when using a light emitting diode of RGB color, one surface of the printed circuit board is formed of a transparent compound resin in which phosphors are not mixed.

The optical device chip 131 is fixed to one surface of the substrate 110 by an adhesive, and the zener diode 132 is fixed to the other surface of the substrate 110 by a silver adhesive.

The first electrode lines 151 and 151 'may be configured to electrically connect an optical device chip fixed on one surface of the printed circuit board to an electrically conductive state, and the first circuit 121 of the printed circuit board and the electrodes 141 and 141' of the optical device chip. , 121 '), and the second electrode line 152 connects the electrode 142 of the zener diode and the second electrode of the printed circuit board to electrically conduct the zener diode 132 fixed to the other surface of the printed circuit board. The circuit 122 'is connected to each other, and the first electrode line and the second electrode line use gold wires having excellent conductivity.

In addition, the other electrode line (not shown) of the zener diode is connected to the second circuit 122 at the time of adhesion because the zener diode is bonded with silver having conductivity when the zener diode is fixed to the substrate.

In addition, an epoxy layer is formed by filling an epoxy in the receiving groove 123 of the second substrate to protect the zener diode 132 and the second electrode line 152 provided on the other surface of the substrate 110 on which the second circuit is formed. .

The compound resin layer 160 is a layer formed by forming a liquid resin liquefied by applying heat and pressure to a compound compound of a solid form in which phosphors are mixed on a surface of a printed circuit board in a short time within several tens of seconds.

The base coating layer 170 is formed of a compound resin surface formed on one surface of the printed circuit board except for a surface that emits light and the compound resin is not molded, that is, a surface except the other surface of the printed circuit board titanium dioxide (TiO ₂ ) Is a layer formed by coating a mixture of a paint and a spray or impregnation method.

The metal film layer 180 is a layer formed by vacuum depositing a metal on a surface of the base coating 170, that is, a surface except for a specific surface emitting light and the other surface of the printed circuit board. In addition, a metal selects and uses either aluminum or silver.

The base coating layer is a layer that functions as a conventional plastic reflector, and totally reflects 70 to 80% of light generated in the optical device, and enhances the adhesion of the metal film when the metal for total reflection of the remaining light is vacuum deposited.

Therefore, when power is applied to the small optical device, the light generated inside the compound resin layer is totally reflected inside the compound resin by the base coating layer, and the light that is not totally reflected is totally reflected inside the compound resin by the metal film layer, and the base coating layer and the metal By emitting light through the compound resin layer in which the film layer is not formed, the light reflecting efficiency is higher than that of the conventional plastic reflector, so that the light efficiency can be increased and the problem of loss of emitted light can be improved.

The base coating layer and the metal film layer replace the conventional plastic reflector, and because the thickness of the base coating layer and the metal film layer is very thin, such as 3/100 mm, the available inner diameter is large when the outer dimension condition of the conventional device, the larger and more optical element chip Can be installed.

In addition, when the user wants to totally reflect the light generated from the optical device using only the base coating layer, it is not necessary to vacuum-deposit the metal.

4 is a process flowchart of a small optical device according to the present invention.

The first circuits 121 and 121 'and the second circuits 122 and 122' of the substrate 110 are electrically connected through the through holes h and h ', and the second circuits 122 and 122' are connected to each other. The external terminal 123 connected to the second circuit of the first substrate and the copper foil 113 and the external terminal grooves 114 and 114 'of the second substrate by adhering the formed first substrate 110 and the second substrate 111 to each other. After manufacturing the printed circuit board electrically connected through (S1), the zener diode is fixed by using a conductive silver on the other surface of the printed circuit board, that is, the printed circuit board on which the second circuit 122 is formed At the same time, the electrode of the zener diode (not shown) is electrically connected to the second circuit 122, and the silver of the zener diode 132 is hardened (S2) and then the zener diode 132 is electrically conductive. The second circuit 122 'of the printed circuit board and the electrode 142 of the zener diode are connected to each other by the second electrode line 152 (S3). In order to protect the zener diode 132 and the electrode wire 152 connected to the furnace 122, epoxy is injected (S4) around the zener diode to which the zener diode is fixed, that is, the inner space of the receiving groove 112.

After that, the optical device chip is fixed to one surface of the printed circuit board, that is, the printed circuit board on which the first circuit is formed by using an adhesive, and then the adhesive to which the optical device chip 131 is fixed is cured (S5). It is left for a predetermined time of 30 minutes to 1 hour at a temperature of?.

Thereafter, the first circuit 121 of the printed circuit board and the electrodes 141 and 141 'of the optical device chip are connected to the second electrode lines 151 and 151' so that the optical device chip 131 is electrically conductive. After (S6), the substrate is mounted on the mold mold, and the compound resin mixed with the phosphor is put into the injection hole of the mold mold (S7). When the pressure is applied, the compound resin, which was in the solid form, is liquefied by high heat and high pressure. While flowing instantaneously changes the physical properties to solid again is molded (S8).

In addition, the compound resin is a solid resin mainly used in semiconductor packages (eg IC and TR) that cannot be worked with liquid resins. The compound resin is liquefied instantaneously by applying heat and pressure to a mold to be molded into the mold. It is a resin material which flows in and shape | molds, and transfer molding method is used as a shaping | molding method which works using a compound resin. Here, the transfer molding method is used when manufacturing a side optical device, in particular of the optical device.

In addition, since compound resin is solid, it is easy to handle, and since the additives in the resin are in a solid state, they are always distributed in the same density and are made within a few seconds until they are liquefied and molded. It is much more uniform than the method and can produce a homogeneous product.

Thereafter, when the compound resin is molded on one surface of the printed circuit board, the tape is adhered to the specific surface on which the light is emitted from the compound resin surface and the other surface of the printed circuit board on which the second circuit is formed (S9).

Thereafter, the compound resin layer is first cut (S10) with a diamond wheel sawing device (DIAMOND WHEEL SAWING MACHINE) to any desired size, and the cut printed circuit board is coated with a coating material of titanium dioxide and paint. After the base coating (S11) by spraying or impregnation using a metal to the base coating layer is vacuum deposition (S12) at a pressure of 10 ^-3 to 10 ^-6 torr (torr).

In addition, since only the base coating layer coated with a coating material mixed with titanium dioxide and a specific paint can totally reflect light effectively, it is not necessary to vacuum-deposit metals according to the user's discretion.

Thereafter, the tape is secondarily adhered to a specific surface where light is emitted from the compound resin layer (S13), and the other side of the printed circuit board, that is, the tape adhered to the second substrate 111 is removed (S14), and then the first cut is performed. Cut the printed circuit board with a diamond wheel sawing device (D15) and remove the tape bonded to the compound resin layer (S16) at the same position as that of the cut compound resin surface. .

In addition to the method of sawing with a diamond wheel sawing device in the first and second cuts, the laser-bonded tape may be removed.

In addition, the secondary bonded tape is bonded to prevent scattering of the small optical device cut when the printed circuit board is cut. When the secondary bonded tape is removed, the secondary bonded tape is attached to the compound resin layer. Removed.

In addition, when the first tape and the second tape are not adhered to a specific surface of the compound resin layer that emits light, the number of compounds that emit light after vacuum coating the base coating and the metal on all the surfaces of the compound resin layer. The base coating layer and the metal film layer coated on a specific surface of the ground layer are removed by selecting one of grinding or send paper (S17).

The present invention is not limited to the above-described embodiments, and various changes can be made by those skilled in the art without departing from the gist of the present invention as claimed in the following claims.

As described in detail above, the present invention has excellent mass productivity because of attaching the optical element chip and the electrode wire on the flat printed circuit board without the reflector, total reflection of 70 to 80% of the light in the base coating layer, the metal film layer Because it reflects the rest of the light from the conventional reflector, it can improve the reflection effect, thereby reducing the light loss, and the need for expensive side emitting dedicated leadframe mold is not required. Can respond to the timely.

In addition, since the solid resin is used, the content of pigments and phosphors added in the resin can be kept constant for each product, resulting in high production yields, thereby reducing the cost burden. The transfer molding method is molded in the shape of a mold. Since a certain amount is formed each time and the time of liquefaction and solidification is achieved within several tens of seconds, there is no time for precipitation or separation of phosphors having different specific gravity, so that the ratio of phosphors and resins is constant for each product, thus increasing the production yield. It is possible to reduce the burden of the, and to easily manufacture a small optical device to any desired size desired by the user and mass production is possible.

In addition, by installing a zener diode on a printed circuit board, it is possible to protect an optical device chip due to overvoltage, and by installing an optical device chip on one side of the printed circuit board and a zener diode on the other side, the optical element and the zener diode are placed on the same side. When installed, the light generated from the optical device can be prevented from being scattered and reflected by the zener diode, thereby improving the light efficiency.

Claims (20)

       An optical device chip that generates light when power is supplied;        A zener diode connected in parallel with the optical device chip and outputting a constant voltage when a breakdown voltage flows;        A first substrate composed of a first circuit and a second circuit electrically connected through a through hole, and a second substrate composed of a copper foil, a receiving groove, and an external terminal, wherein the second substrate is formed of the second substrate. The external terminal is attached to the surface of the first substrate, the external terminal provided on the second substrate is electrically connected to the first and second circuits of the first substrate, the optical element chip is fixed to the first circuit of the first substrate, A printed circuit board having the zener diode fixed to a second circuit inside a receiving groove of a second substrate;        A first electrode line electrically connecting the first circuit of the printed circuit board and the electrode of the optical device chip;        A second electrode line electrically connecting the second circuit of the printed circuit board and the electrode of the zener diode;         When the compound is converted into a liquid resin by applying heat and pressure to a compound resin mixed with phosphors, the compound resin layer is formed on one surface of the printed circuit board while the injected liquid resin is solidified after the liquid resin is injected into one surface of the printed circuit board. ; And       And a base coating layer coated with a specific paint on the other surface of the printed circuit board on which the second circuit is formed and on a surface other than a specific surface of the compound resin layer from which light is emitted, and when the power is supplied to the optical device chip, the optical device The light generated from the chip is totally reflected inside the compound resin by the base coating layer, and emits light through a specific surface of the compound resin that is not the base coating, and when a breakdown voltage or more flows through the zener diode Small optical device package, characterized in that the constant voltage is supplied to the chip. The method of claim 1, Small optical device package further comprises a metal film layer vacuum-deposited with a metal on the outer surface of the base coating layer. The method of claim 2, wherein the metal Small optical device package, characterized in that either aluminum or silver. The method of claim 1, wherein the optical device chip Small optical device package, characterized in that the light emitting diode. The method of claim 1, wherein the first electrode line and the second electrode line Small optical device package, characterized in that the gold wire. The method of claim 1, wherein the external terminal of the printed circuit board Small optical device package, characterized in that the soldering terminal is soldered when attached to a particular electronic device. The method of claim 1, wherein the base coating layer Small optical device package, characterized in that the coating material mixed with titanium dioxide in a specific paint. The method of claim 1, wherein the optical device chip Small optical device package, characterized in that a plurality of different colors are fixed. The method of claim 1, wherein the optical device chip A small optical device package, characterized in that a plurality of RGB color optical device chips. The method according to claim 8 or 9, Small optical device package, characterized in that the external terminal corresponding to the plurality of optical devices are further installed. The method of claim 1, wherein the second circuit is Small optical device package, characterized in that plated with silver. The method of claim 9, When mounting the optical element chip of the RGB color to the printed circuit board, a small optical device package, characterized in that the compound resin is not mixed with the phosphor on the printed circuit board. Forming a first circuit and a second circuit so that both surfaces of the first substrate are electrically connected through the holes, and attaching the second substrate to the first substrate on which the second circuit is formed, thereby manufacturing the printed circuit board; Fixing the zener diode to the inside of the receiving groove of the other surface of the printed circuit board on which the second circuit is formed and curing the adhesive to which the zener diode is fixed; Injecting a protective epoxy into the inner space of the receiving groove after connecting the fixed zener diode electrode and the second circuit using a second electrode line; Fixing the optical device chip with an adhesive on one surface of the printed circuit board on which the first circuit is formed, and then curing the adhesive fixing the optical device chip; Connecting the first circuit of the printed circuit board and the electrode of the optical device chip through a first electrode line; Injecting a compound resin in which phosphors are mixed into a printed circuit board to which the optical device chip is fixed and then molding;  Adhering a first tape to a specific surface of the compound resin to emit light and the second substrate; Cutting the compound resin layer; Base coating the cut surface of the compound resin layer with a paint containing titanium dioxide; Adhering a second tape to the compound resin layer; Removing the first tape adhered to the second substrate; Cutting the printed circuit board at a position perpendicular to the cut compound resin layer; And And removing the second tape adhered to the compound resin layer. The method of claim 13, And vacuum depositing the outer surface of the base coating layer with a metal in the above. The method of claim 14, wherein vacuum depositing the metal comprises: A method of manufacturing a small optical device package, characterized in that the vacuum deposition at a pressure of 10 ^-3 to 10 ^-6 Torr. The method of claim 13, wherein the compound resin is formed on the printed circuit board. When molding the side optical device, a method of manufacturing a small optical device package, characterized in that the molding by a transfer molding method. The method of claim 13, wherein the base coating step, A method of manufacturing a small optical device package, characterized in that the coating by any one method of spraying or impregnation. The method of claim 13, wherein the cutting of the compound resin layer and the printed circuit board comprises: Method of manufacturing a small optical device package, characterized in that the cutting by any one of diamond wheel sawing or laser. 14. The method of claim 13, wherein the step of adhering the first tape and the second tape to the specific surface of the compound resin to emit light in the second substrate When the first tape and the second tape are not adhered to each other, the base coating layer coated on a specific surface of the resin layer to which light is emitted is removed by grinding or send paper. Manufacturing method. The method of claim 13, wherein the manufacturing of the printed circuit board comprises: The manufacturing method of a small optical device package, characterized in that the metal wire is designed to remain at a predetermined distance from the edge of one surface of the first substrate on which the compound resin layer is formed.

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