CN111668358A - Secondary die pressing process and light source - Google Patents
Secondary die pressing process and light source Download PDFInfo
- Publication number
- CN111668358A CN111668358A CN202010569993.XA CN202010569993A CN111668358A CN 111668358 A CN111668358 A CN 111668358A CN 202010569993 A CN202010569993 A CN 202010569993A CN 111668358 A CN111668358 A CN 111668358A
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- China
- Prior art keywords
- light
- die pressing
- fluorescent
- substrate
- chip
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- 238000007723 die pressing method Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000005520 cutting process Methods 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 19
- 238000003825 pressing Methods 0.000 claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 claims abstract description 5
- 238000000465 moulding Methods 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000843 powder Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a secondary die pressing process and a light source, wherein the secondary die pressing process comprises the following steps: providing a substrate, and packaging a fluorescent rubber cake in a mould pressing mode in the area around the light-emitting chip on the substrate; cutting the fluorescent rubber cake formed by die pressing, wherein the fluorescent rubber cake is formed by keeping the fluorescent rubber cake not to be cut completely during cutting; preparing a black rubber cake in a secondary die pressing mode; and cutting the black rubber cake formed by secondary die pressing, and completely cutting the black rubber cake during cutting. According to the invention, the white light product is subjected to two-time die pressing process, the thickness of the fluorescent glue can be controlled by the first die pressing, so that the fluorescent powder is concentrated around the light-emitting chip, the thickness of the finished product can be thinner by the reverse wiring of the forward-mounted chip or the flip chip, the thickness of the product is controlled, the light-emitting efficiency is higher, and the product is thinner. The light emitting holes with different shapes are subjected to secondary die pressing to realize different light emitting angles, and the die can be adjusted to realize the light emitting effect of a point light source through the secondary die pressing.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a secondary molding process and a light source.
Background
The existing PCB product is formed by molding transparent, vaporific and fluorescent powder-added epoxy resin rubber cakes. The existing PCB products have the following problems: 1. when the product is white light, the surface of the substrate is provided with the integral fluorescent glue, and the excitation efficiency of the fluorescent powder is low, so that the brightness of the finished product is low. 2. The finished product made by the one-time die pressing process has a light-emitting angle of about 120 degrees and presents scattering type light spots. 3. The receiving tubes PT and PD products are integrally sealed by black glue with a certain thickness, so that the infrared penetration rate is reduced, and the receiving sensitivity is influenced. Therefore, it is necessary to provide a further solution to the above problems.
Disclosure of Invention
The invention aims to provide a secondary molding process and a light source so as to overcome the defects in the prior art.
In order to achieve the above object, the present invention provides a secondary molding process, which comprises the following steps:
providing a substrate, and packaging a fluorescent rubber cake in a mould pressing mode in the area around the light-emitting chip on the substrate;
cutting the fluorescent rubber cake formed by die pressing, wherein the fluorescent rubber cake is formed by keeping the fluorescent rubber cake not to be cut completely during cutting;
preparing a black rubber cake in a secondary die pressing mode;
and cutting the black rubber cake formed by secondary die pressing, and completely cutting the black rubber cake during cutting.
As an improvement of the secondary molding process, the light-emitting chip is arranged on the substrate in a mode of forward chip routing or flip chip.
As an improvement of the secondary molding process, the forward chip routing comprises the following steps: and bonding the back surface of the light-emitting chip on the substrate, and then connecting the light-emitting chip with the corresponding bonding pad through a connecting wire.
As an improvement of the secondary molding process of the invention, the flip chip comprises the following steps: and bonding the back surface of the light-emitting chip on the substrate, and connecting the light-emitting chip and the corresponding bonding pad through electronic solder.
To achieve the above object, the present invention provides a light source manufactured by the secondary molding process as described above, the light source comprising: the fluorescent glue cake comprises a substrate, a light-emitting chip arranged on the substrate, a fluorescent glue cake formed around the light-emitting chip in a mould pressing mode, and a black glue cake formed on the fluorescent glue cake in a mould pressing mode.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, the white light product is subjected to two-time die pressing process, the thickness of the fluorescent glue can be controlled by the first die pressing, so that the fluorescent powder is concentrated around the light-emitting chip, the thickness of the finished product can be thinner by the reverse wiring of the forward-mounted chip or the flip chip, the thickness of the product is controlled, the light-emitting efficiency is higher, and the product is thinner. The light emitting holes with different shapes are subjected to secondary die pressing to realize different light emitting angles, and the die can be adjusted to realize the light emitting effect of a point light source through the secondary die pressing.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic perspective view of a light source of the present invention obtained by a secondary molding process;
fig. 2 is a cross-sectional view of the light source of fig. 1.
Detailed Description
The present invention is described in detail below with reference to various embodiments, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should be able to make modifications and substitutions on the functions, methods, or structures of these embodiments without departing from the scope of the present invention.
An embodiment of the present invention provides a secondary molding process, which includes the following steps:
and S1, providing a substrate, and packaging the fluorescent glue cake on the area around the light-emitting chip on the substrate in a mould pressing mode.
The light-emitting chip is arranged on the substrate in a mode of normally mounting a chip wire or a flip chip. The method comprises the following steps of: and bonding the back surface of the light-emitting chip on the substrate, and then connecting the light-emitting chip with the corresponding bonding pad through a connecting wire. The flip chip comprises the following steps: and bonding the back surface of the light-emitting chip on the substrate, and connecting the light-emitting chip and the corresponding bonding pad through electronic solder.
And S2, cutting the fluorescent rubber cake formed by die pressing, wherein the formed fluorescent rubber cake is kept uncut completely during cutting.
Wherein, the purpose of not cutting through is in order to reserve the glue flowing channel when making things convenient for the mould pressing of second time, makes things convenient for glue flow forming.
And S3, manufacturing the black rubber cake in a secondary die pressing mode.
Wherein, the manufactured black glue film is formed on the fluorescent glue cake in a mould pressing way. Simultaneously, can also realize different luminous angles through secondary mould pressing, specifically speaking, because secondary mould pressing can mould pressing different shapes, there is the colloid of light-emitting hole structure and centre, so through the different shapes of mould pressing, can realize the difference of light-emitting angle.
And S4, cutting the black rubber cake formed by secondary die pressing, wherein the black rubber cake is cut completely during cutting.
Wherein, the required single light source is obtained by cutting the black rubber cake thoroughly.
Another embodiment of the present invention, as shown in fig. 1 and 2, provides a light source manufactured by the two-shot molding process as described above, the light source comprising: the fluorescent light-emitting device comprises a substrate 1, a light-emitting chip 2 arranged on the substrate 1, a fluorescent rubber cake 3 formed around the light-emitting chip 2 in a mould pressing mode, and a black rubber cake 4 formed on the fluorescent rubber cake 3 in a mould pressing mode.
In summary, in the invention, the white light product is molded twice, the thickness of the fluorescent glue can be controlled by the first molding process to concentrate the fluorescent powder around the light-emitting chip, and the thickness of the finished product can be thinner by the reverse wiring of the forward-mounted chip or the flip chip, so that the thickness of the product is controlled, the light-emitting efficiency is higher, and the product is thinner. The light emitting holes with different shapes are subjected to secondary die pressing to realize different light emitting angles, and the die can be adjusted to realize the light emitting effect of a point light source through the secondary die pressing.
It will be clear to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms, or with a different color of the emitted light, a first-time molding of a non-fluorescent glue cake, etc., without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. The secondary die pressing process is characterized by comprising the following steps of:
providing a substrate, and packaging a fluorescent rubber cake in a mould pressing mode in the area around the light-emitting chip on the substrate;
cutting the fluorescent rubber cake formed by die pressing, wherein the fluorescent rubber cake is formed by keeping the fluorescent rubber cake not to be cut completely during cutting;
preparing a black rubber cake in a secondary die pressing mode;
and cutting the black rubber cake formed by secondary die pressing, and completely cutting the black rubber cake during cutting.
2. The secondary molding process according to claim 1, wherein the light emitting chip is disposed on the substrate by way of a flip-chip or a flip-chip wire bonding.
3. The secondary molding process of claim 2, wherein the forward chip wire bonding comprises the steps of: and bonding the back surface of the light-emitting chip on the substrate, and then connecting the light-emitting chip with the corresponding bonding pad through a connecting wire.
4. The overmolding process according to claim 2, characterized in that the flip-chip comprises the steps of: and bonding the back surface of the light-emitting chip on the substrate, and connecting the light-emitting chip and the corresponding bonding pad through electronic solder.
5. A light source manufactured by the double molding process according to any one of claims 1 to 4, comprising: the fluorescent glue cake comprises a substrate, a light-emitting chip arranged on the substrate, a fluorescent glue cake formed around the light-emitting chip in a mould pressing mode, and a black glue cake formed on the fluorescent glue cake in a mould pressing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010569993.XA CN111668358A (en) | 2020-06-21 | 2020-06-21 | Secondary die pressing process and light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010569993.XA CN111668358A (en) | 2020-06-21 | 2020-06-21 | Secondary die pressing process and light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111668358A true CN111668358A (en) | 2020-09-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010569993.XA Pending CN111668358A (en) | 2020-06-21 | 2020-06-21 | Secondary die pressing process and light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111668358A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112820812A (en) * | 2021-02-04 | 2021-05-18 | 谷麦光电科技股份有限公司 | Manufacturing process of side light leakage prevention LED and LED obtained by same |
-
2020
- 2020-06-21 CN CN202010569993.XA patent/CN111668358A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112820812A (en) * | 2021-02-04 | 2021-05-18 | 谷麦光电科技股份有限公司 | Manufacturing process of side light leakage prevention LED and LED obtained by same |
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| CB02 | Change of applicant information |
Address after: 215300 room 3, 1208 Fuchunjiang Road, Kunshan Development Zone, Suzhou City, Jiangsu Province Applicant after: Jiangsu Hongguan Photoelectric Technology Co.,Ltd. Address before: 215000 room 3, 1208 Fuchunjiang Road, Kunshan Development Zone, Suzhou City, Jiangsu Province Applicant before: Kunshan Hongguan Photoelectric Technology Co.,Ltd. |
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