CN212113745U - Light source based on secondary compression molding - Google Patents
Light source based on secondary compression molding Download PDFInfo
- Publication number
- CN212113745U CN212113745U CN202021155231.7U CN202021155231U CN212113745U CN 212113745 U CN212113745 U CN 212113745U CN 202021155231 U CN202021155231 U CN 202021155231U CN 212113745 U CN212113745 U CN 212113745U
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- CN
- China
- Prior art keywords
- light
- chip
- rubber cake
- fluorescent
- substrate
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- 238000000748 compression moulding Methods 0.000 title claims abstract description 14
- 229920001971 elastomer Polymers 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 22
- 238000000465 moulding Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000003292 glue Substances 0.000 abstract description 11
- 238000007723 die pressing method Methods 0.000 abstract description 10
- 238000004020 luminiscence type Methods 0.000 abstract description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 235000014483 powder concentrate Nutrition 0.000 abstract description 4
- 238000005520 cutting process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model provides a light source based on secondary compression molding, it includes: the LED fluorescent lamp comprises a substrate, a light-emitting chip arranged on the substrate, a fluorescent rubber cake formed around the light-emitting chip in a mould pressing mode, and a black rubber cake formed on the fluorescent rubber cake in a mould pressing mode, wherein the black rubber cake is also provided with a light-emitting hole exposing the fluorescent rubber cake and the light-emitting chip below the fluorescent rubber cake. The utility model discloses a mode of twice mould pressing, the mould pressing can be controlled fluorescent glue thickness for the first time and make the phosphor powder concentrate on around the luminescence chip, and the positive dress chip is anti-beat or can be so that finished product thickness is thinner with flip chip to control product thickness, make luminous efficiency higher, the product is thinner. The light emitting holes with different shapes are subjected to secondary die pressing to realize different light emitting angles, and the die can be adjusted to realize the light emitting effect of a point light source through the secondary die pressing.
Description
Technical Field
The utility model relates to the field of packaging technology, especially, relate to a light source based on secondary compression molding.
Background
The existing PCB product is formed by molding transparent, vaporific and fluorescent powder-added epoxy resin rubber cakes. The existing PCB products have the following problems: 1. when the product is white light, the surface of the substrate is provided with the integral fluorescent glue, and the excitation efficiency of the fluorescent powder is low, so that the brightness of the finished product is low. 2. The finished product made by the one-time die pressing process has a light-emitting angle of about 120 degrees and presents scattering type light spots. 3. The receiving tubes PT and PD products are integrally sealed by black glue with a certain thickness, so that the infrared penetration rate is reduced, and the receiving sensitivity is influenced. Therefore, it is necessary to provide a further solution to the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a light source based on secondary compression molding to overcome the not enough that exists among the prior art.
In order to realize the above utility model purpose, the utility model provides a light source based on secondary compression molding, it includes: the LED fluorescent lamp comprises a substrate, a light-emitting chip arranged on the substrate, a fluorescent rubber cake formed around the light-emitting chip in a mould pressing mode, and a black rubber cake formed on the fluorescent rubber cake in a mould pressing mode, wherein the black rubber cake is also provided with a light-emitting hole exposing the fluorescent rubber cake and the light-emitting chip below the fluorescent rubber cake.
As the utility model discloses an improvement of light source based on secondary compression molding, luminous chip through just adorn chip routing or flip chip's mode set up in on the base plate.
As the utility model discloses an improvement of light source based on secondary compression molding, luminous chip through just adorn the mode of chip routing set up in when on the base plate, luminous chip's the back combination is on the base plate, just luminous chip is connected through the connecting wire with the pad that corresponds.
As the utility model discloses an improvement of light source based on secondary compression molding, luminous chip pass through flip chip's mode set up in when on the base plate, luminous chip's back combines on the base plate, just luminous chip is connected through electronic solder with the pad that corresponds.
As the utility model discloses an improvement of light source based on secondary compression molding, the light-emitting hole is along light-emitting direction aperture crescent.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a mode of twice mould pressing, the mould pressing can be controlled fluorescent glue thickness for the first time and make the phosphor powder concentrate on around the luminescence chip, and the positive dress chip is anti-beat or can be so that finished product thickness is thinner with flip chip to control product thickness, make luminous efficiency higher, the product is thinner. The light emitting holes with different shapes are subjected to secondary die pressing to realize different light emitting angles, and the die can be adjusted to realize the light emitting effect of a point light source through the secondary die pressing.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic perspective view of a light source based on secondary compression molding of the present invention;
fig. 2 is a cross-sectional view of the light source based on the two-shot molding in fig. 1.
Detailed Description
The present invention is described in detail below with reference to various embodiments, but it should be noted that these embodiments are not intended to limit the present invention, and those skilled in the art should be able to make equivalent changes or substitutions in functions, methods, or structures according to the embodiments without departing from the scope of the present invention.
As shown in fig. 1 and 2, an embodiment of the present invention provides a light source based on secondary compression molding, which includes: the fluorescent light-emitting device comprises a substrate 1, a light-emitting chip 2 arranged on the substrate 1, a fluorescent rubber cake 3 formed around the light-emitting chip 2 in a mould pressing mode, and a black rubber cake 4 formed on the fluorescent rubber cake 3 in a mould pressing mode. The black rubber cake 4 is further provided with a light outlet 41 exposing the fluorescent rubber cake 3 and the luminescent chip 2 below the fluorescent rubber cake.
The light-emitting chip 2 is arranged on the substrate 1 in a way of normally mounting a chip wire or a flip chip. When the light-emitting chip 2 is arranged on the substrate 1 in a way of positively mounting the chip and routing, the back surface of the light-emitting chip 2 is combined on the substrate 1, and the light-emitting chip 2 is connected with the corresponding bonding pad through a connecting wire. When the light emitting chip 2 is disposed on the substrate 1 in a flip chip manner, the back surface of the light emitting chip 2 is bonded to the substrate 1, and the light emitting chip 2 and the corresponding pad are connected by an electronic solder.
So, the mould pressing can be controlled fluorescent glue thickness for the first time and make the phosphor powder concentrate on around the luminescence chip, and the positive dress chip is played the line or can be so that finished product thickness is thinner with flip chip to control product thickness, make luminous efficiency higher, the product is thinner.
The light emitting holes 41 are integrally formed by the secondary molding, so that the light emitting holes with different shapes can realize different light emitting angles by the secondary molding, and the light emitting effect of a point light source can be realized by adjusting the mold through the secondary molding.
The production process of the light source based on the secondary compression molding comprises the following steps:
and S1, providing a substrate, and packaging the fluorescent glue cake on the area around the light-emitting chip on the substrate in a mould pressing mode.
The light-emitting chip is arranged on the substrate in a mode of normally mounting a chip wire or a flip chip. The method comprises the following steps of: and bonding the back surface of the chip on the substrate, and then connecting the chip and the corresponding bonding pad through a connecting wire. The flip chip comprises the following steps: and bonding the back surface of the chip on the substrate, and connecting the chip and the corresponding bonding pad through electronic solder.
And S2, cutting the fluorescent rubber cake formed by die pressing, wherein the formed fluorescent rubber cake is kept uncut completely during cutting.
Wherein, the purpose of not cutting through is in order to reserve the glue flowing channel when making things convenient for the mould pressing of second time, makes things convenient for glue flow forming.
And S3, manufacturing the black rubber cake in a secondary die pressing mode.
Wherein, the manufactured black glue film is formed on the fluorescent glue cake in a mould pressing way. Simultaneously, can also realize different luminous angles through secondary mould pressing, specifically speaking, because secondary mould pressing can mould pressing different shapes, there is the colloid of light-emitting hole structure and centre, so through the different shapes of mould pressing, can realize the difference of light-emitting angle.
And S4, cutting the black rubber cake formed by secondary die pressing, wherein the black rubber cake is cut completely during cutting.
Wherein, the required single light source is obtained by cutting the black rubber cake thoroughly.
To sum up, the utility model discloses a mode of twice mould pressing, the mould pressing can be controlled fluorescent glue thickness for the first time and make phosphor powder concentrate on around the luminescence chip, and the positive dress chip is played the line or can be made finished product thickness thinner with flip chip to control product thickness, make luminous efficacy higher, the product is thinner. The light emitting holes with different shapes are subjected to secondary die pressing to realize different light emitting angles, and the die can be adjusted to realize the light emitting effect of a point light source through the secondary die pressing.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms, or in different colors of luminescence, first-time molding of non-fluorescent bakelite cakes, etc., without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. A light source based on two-shot molding, the light source comprising: the LED fluorescent lamp comprises a substrate, a light-emitting chip arranged on the substrate, a fluorescent rubber cake formed around the light-emitting chip in a mould pressing mode, and a black rubber cake formed on the fluorescent rubber cake in a mould pressing mode, wherein the black rubber cake is also provided with a light-emitting hole exposing the fluorescent rubber cake and the light-emitting chip below the fluorescent rubber cake.
2. The light source based on two-shot molding according to claim 1, wherein the light emitting chip is disposed on the substrate by way of a normal chip wire bonding or a flip chip.
3. The light source based on secondary compression molding as claimed in claim 2, wherein when the light emitting chip is disposed on the substrate by way of chip-on-chip wire bonding, the back surface of the light emitting chip is bonded on the substrate, and the light emitting chip is connected with the corresponding bonding pad through a connecting wire.
4. The two-shot molding based light source of claim 2, wherein when the light emitting chip is flip-chip mounted on the substrate, the back surface of the light emitting chip is bonded to the substrate, and the light emitting chip and the corresponding pad are connected by electronic solder.
5. The two-shot molding-based light source of claim 1, wherein the light exit hole has an aperture that gradually increases in the light exit direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021155231.7U CN212113745U (en) | 2020-06-21 | 2020-06-21 | Light source based on secondary compression molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021155231.7U CN212113745U (en) | 2020-06-21 | 2020-06-21 | Light source based on secondary compression molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212113745U true CN212113745U (en) | 2020-12-08 |
Family
ID=73615093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021155231.7U Ceased CN212113745U (en) | 2020-06-21 | 2020-06-21 | Light source based on secondary compression molding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212113745U (en) |
-
2020
- 2020-06-21 CN CN202021155231.7U patent/CN212113745U/en not_active Ceased
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215300 room 3, 1208 Fuchunjiang Road, Kunshan Development Zone, Suzhou City, Jiangsu Province Patentee after: Jiangsu Hongguan Photoelectric Technology Co.,Ltd. Address before: 215000 room 3, 1208 Fuchunjiang Road, Kunshan Development Zone, Suzhou City, Jiangsu Province Patentee before: Kunshan Hongguan Photoelectric Technology Co.,Ltd. |
|
| IW01 | Full invalidation of patent right | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20230118 Decision number of declaring invalidation: 60339 Granted publication date: 20201208 |