KR100745441B1 - Side view type opto device and process method - Google Patents

Abstract

A side view type optical device package and a manufacturing method thereof are provided to uniform a thickness of a reflector layer by forming the reflector layer through a transfer mold way, thereby making uniform an optical characteristic. A printed circuit board has a first substrate composed of first circuits(121,121') and second circuits(122') which are electrically connected to each other via through holes(h'), and a second substrate composed of a copper film, a receiving groove(112) and an external terminal. An optical device chip(131) is mounted on the first circuits. First electrode wire(151,151') electrically connect the first circuits with an electrode of the optical device chip. A second electrode wire(152) electrically connects the second circuits with an electrode of a zenor diode. A compound resin layer(160) is formed on one surface of the printed circuit board. A reflector layer(170) is formed with a specific resin on the other portion of the printed circuit board.

Description

Side optical device package and manufacturing method thereof {Side view type opto device and Process method}

1A is a cross-sectional view of a side light emitting device according to the prior art,

1B is a front view of a side light emitting device according to the prior art,

2A is a plan view of a first printed circuit board according to the present invention;

2B is a rear view of the first printed circuit board,

2C is a plan view of a second printed circuit board,

3A is a front view of a side light emitting device according to the present invention;

3B is a rear view of the side light emitting device according to the present invention;

3C is a cross-sectional view of a side light emitting device according to the present invention;

3d is a side view of a side light emitting device according to the present invention;

4 is a process flowchart of a side light emitting device according to the present invention.

* Description of the symbols for the main parts of the drawings *

110: first substrate 111: second substrate

112: accommodation home 113, 113 ': copper foil

114, 114 ': External terminal groove 121, 121': First circuit

122, 122 ': Second circuit 123: External terminal

131: optical element 132: zener diode

141 and 141 ': optical element electrode 142: zener diode electrode

151 and 151 ': first electrode line 152: second electrode line

160: compound resin layer 170: reflector layer

180: metal film layer

The present invention relates to a side light emitting device package and a method for manufacturing the same. More specifically, after the optical device is installed on a printed circuit board, the compound resin layer is molded by a transfer molding method, and titanium dioxide and a specific resin are formed on the outer surface of the compound resin layer. By forming the reflector layer with the mixed material, it is possible to increase the production speed, reduce the dispersion of color coordinates, improve the yield, increase the mass productivity, and also reflect the reflection by vacuum depositing metal on the surface of the light emitting resin. It relates to a side optical device package with improved efficiency and a method of manufacturing the same.

Generally, a light source system using a light emitting diode chip is mounted and used in various types of packages according to the intended use of the light emitting diode (LED) chip. Among them, a side light emitting device is used for a backlight display for a small display such as a mobile phone, and the reason is that the light emitting device package emits light in parallel with the light guide plate on which the light emitting device is mounted because light must be provided from the side of the light guide plate. Use

The conventional side light emitting device includes a lead frame 10 having an electrode, a light emitting diode chip 30 which is a nitride semiconductor mounted on the electrode, and a molding filling part 50 encapsulating the light emitting diode chip. The method is as follows.

The lead frame 10 is formed with a separate reflector that serves as an epoxy receptor to accommodate the liquid epoxy, the light emitting diode chip 30 is mounted on and fixed to the electrode connected to the external terminal therein, the lead frame The electrodes of 10 and the LED chip are electrically connected using the wire 40.

After wire bonding, a liquid silicone or a liquid epoxy including a phosphor is filled into a reflector 20 which serves as an epoxy acceptor, and then cured at a predetermined temperature for a predetermined time.

In addition, there is a reflector made of plastic resin on the lead frame, and there is a light emitting diode chip and a zener diode attached therein, and a metal wire is connected, and the entrance of the reflector is too small, so it is very difficult to insert an optical device chip and connect the wire. There is a problem that the work speed is slowed down to affect the work. In addition, since the light emitting diodes and the zener diodes are installed together in the receiver, light scattering, absorption, etc. occur during light emission, thereby causing a problem of lowering the luminance by a few percent or more.

In addition, since the encapsulant of the molded molding part is a liquid, the phosphor is not uniformly distributed in the liquid encapsulant, but sinks downward by specific gravity over time, and thus the distribution ratio of the phosphor in the liquid encapsulant varies, so that about 100 products are left and right. Even in one connected lead frame, a wide spread of color coordinates occurs.

In addition, in the process of adding the liquid encapsulant, depending on the time required for injection, ambient conditions, etc., the precipitation state of the phosphor is different for each product, and the constant amount is difficult to manage, so the color coordinates are different. Because of this, the cost is increased, the biggest problem is to reduce the scatter of color coordinates in the manufacturing process of the side light emitting device package.

The present invention has been made in view of the above-described conditions, and an object of the present invention is to mount an optical device chip on a printed circuit board without a reflector, and then to form a compound resin on the printed circuit board by a transfer molding method, and to form a molded compound. By forming a reflector layer made of a resin mixed with titanium dioxide on the outer surface of the resin layer, it is possible to increase the working speed when mounting an optical device chip, and to realize color coordinates with high yield and high yield. It is to provide a side light emitting device package and a method of manufacturing the same that can further improve the reflection function by further forming a film layer.

Another object of the present invention is to mold the optical device package using a solid compound resin at the same time in the transfer mold mold to thousands of pieces of resin can be made constant for each product, mass production is easy and the phosphor is precipitated The present invention provides a side light emitting device package and a method of manufacturing the same, which can prevent the cost thereof.

It is still another object of the present invention to form a compound resin layer and then to form a reflector layer by injection or transfer mold method, so that the thickness of the reflector layer can be uniform and optical properties can be made uniform. It is to provide a method of manufacturing the same.

Technical means according to the present invention for achieving the above object is an optical device chip for generating light when the power is supplied; A first substrate composed of a first circuit and a second circuit and electrically connected through a through hole, and a second substrate composed of a copper foil, a receiving groove, and an external terminal, wherein the second substrate and the second circuit are provided. Is bonded to the surface of the first substrate, the external terminal of the second substrate is electrically connected to the first and second circuits of the first substrate, the optical element chip is fixed to the first circuit of the first substrate Printed circuit board; A first electrode line electrically connecting the first circuit of the printed circuit board and the electrode of the optical device chip; A second electrode line electrically connecting the second circuit of the printed circuit board and the electrode of the zener diode; A compound resin layer in which a compound resin in which phosphors are mixed is molded on one surface of the printed circuit board; And a reflector layer in which a specific resin is formed on the other surface of the printed circuit board on which the second circuit is formed and on a surface other than the specific surface of the compound resin layer from which light is emitted.

In addition, the technical method according to the present invention for achieving the above object is to form a first circuit, a second circuit so that both sides of the first substrate is electrically connected through the hole, and the second circuit is formed on the first substrate Manufacturing a printed circuit board by adhering the substrate; Fixing the zener diode to the inside of the receiving groove of the other surface of the printed circuit board on which the second circuit is formed and curing the adhesive to which the zener diode is fixed; Injecting a protective epoxy into the inner space of the receiving groove after connecting the fixed zener diode electrode and the second circuit using a second electrode line; Fixing the optical device chip with an adhesive on one surface of the printed circuit board on which the first circuit is formed, and then curing the adhesive fixing the optical device chip; Connecting the first circuit of the printed circuit board and the electrode of the optical device chip through a first electrode line; Transferring a compound resin containing a phosphor mixed on a printed circuit board to which the optical device chip is fixed; First cutting the compound resin layer into a predetermined size; Forming a reflector layer on a cut surface of the compound resin layer with a specific resin; And secondly cutting the optical device in which the reflector layer is formed to a predetermined standard.

According to the present invention, since any size can be immediately changed and produced from a side light emitting device package having a thickness of 0.3 to 1.0 mm according to cutting of the compound resin layer, an expensive lead frame mold for expensive side light emitting is not necessary, thereby reducing mold cost. Of course, since the mold manufacturing period is omitted, it is timely to respond to changes in demand.

In addition, the compound resin layer is formed by using a transfer molding method. Since the transfer molding method uses a solid resin, the content of pigments and phosphors added in the resin can be kept constant for each product. And because the molding is made in the shape of the mold, it is possible to maintain a constant optical properties for each product, the ratio of phosphor and resin is constant for each product, the yield of color coordinate production increases, thereby reducing the cost burden, the user wants It can be more easily manufactured in any desired size, allowing mass production.

In addition, by forming the compound resin layer and then molding the reflector layer by injection or transfer mold method, the thickness of the reflector layer can be made constant and optical characteristics can be made uniform.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2A illustrates one surface of the first substrate 110 and includes a through hole h and h 'electrically connecting both surfaces of the substrate, and first circuits 121 and 121' connected to the through hole. 2B is a second surface of the first substrate 110, and includes a through hole (h, h '), and a second circuit (122, 122') electrically connected to the first circuit through the through hole. 2C further includes a pair of external terminals connected to the external terminal groove by a double-sided board including a receiving groove 112, a copper foil 113, 113 ′, and an external terminal groove 114, 114 ′ as a second substrate. The second circuit is bonded to the other surface of the first substrate on which the second circuit is formed to be electrically connected to the first circuit and the second circuit of the first substrate through a pair of external terminals.

Therefore, the printed circuit board is made by a method of bonding so that two double-sided boards are electrically connected.

In addition, a plurality of printed circuit boards composed of substrates, holes, external terminals, and circuits are arranged at uniform intervals in the horizontal and vertical directions at regular intervals. It is possible.

3A is a front view of a side light emitting device according to the present invention, FIG. 3B is a rear view of a side light emitting device according to the present invention, FIG. 3C is a cross-sectional view of a side light emitting device according to the present invention, and FIG. 3D is a side light emission according to the present invention. As a side view of the device, the first substrate 110, the second substrate 111, the receiving groove 112, the copper foil 113, 113 'of the printed circuit board, the external terminal grooves 114, 114', the first substrate First circuits 121 and 121 ', second circuits 122 and 122', external terminals 123, through holes h and h ', optical element chips 131, zener diodes 132, and optical Element electrodes 141 and 141 ', zener diode electrode 142, first electrode lines 151 and 151', second electrode line 152, compound resin layer 160, reflector layer 170, metal film layer 180 )

An optical device chip 131 that generates light when power is supplied, generally uses a light emitting diode (LED), and the optical device chip 131 is adhesively fixed to one surface of a printed circuit board by an adhesive.

In addition, when a voltage equal to or higher than the breakdown voltage flows through the optical device, the zener diode 132 for maintaining a constant voltage is fixed to the second circuit 122 of the first substrate 110 by a conductive silver adhesive. In addition, since a zener diode is not an essential component in this invention, it does not need to be provided according to the manufacturer's arbitrary.

The first substrate 110 of the printed circuit board has a first circuit 121, 121 ′ and a second circuit 122 of the first substrate 110 through a pair of through holes h and h ′ penetrating both surfaces thereof. And 122 'are electrically connected to each other, and the second circuit 111 on which the external terminal 123 is provided is bonded to the other surface of the first substrate on which the second circuit is formed. Electrically connected to the external terminal 123 via the (122, 122 ').

In addition, the second circuit 111 is bonded to the other surface of the substrate on which the second circuits 122 and 22 'are formed by bonding the second substrate 111 on which the receiving grooves 112, the copper foil 113, and the external terminal grooves 114 and 114' are formed. The external terminals of the 122 and 122 ′ and the second substrate 111 are connected to each other to electrically connect the first and second substrates 110 and 111.

In addition, in order to increase the adhesion between the compound resin layer and the first substrate 110, the metal lines are designed so that the metal lines do not remain to a certain distance from the edge of one surface of the first substrate 110 on which the first circuits 121 and 121 'are formed. .

In general, the circuit is mainly plated with gold, and since the gold is mixed with the light emitting color of the blue optical device, the light efficiency is reduced, so the circuit lines of the first circuits 121 and 121 'are plated with silver.

When the external terminal 123 is attached to a specific electronic device, the soldering terminal is a soldering terminal. In this embodiment, the soldering terminal is formed only by a predetermined size from the back side, but the side optical device package is lifted when soldering to the soldering terminal. Soldering terminals can be formed from the rear to the front in order to solve the problem.

In addition, a plurality of optical device chips may be mounted on a single printed circuit board according to a use purpose, and as the plurality of optical device chips are fixed, electrode lines for supplying power to the plurality of optical device chips may be increased. The external terminals corresponding to the two optical elements are also increased.

Instead of the light emitting diodes described above, it is possible to use a light emitting diode of RGB color, and when using a light emitting diode of RGB color, one surface of the printed circuit board is formed of a transparent compound resin in which phosphors are not mixed.

The optical device chip 131 is fixed to one surface of the substrate 110 by an adhesive, and the zener diode 132 is fixed to the other surface of the substrate 110 by a silver adhesive.

The first electrode lines 151 and 151 'may be configured to electrically connect an optical device chip fixed on one surface of the printed circuit board to an electrically conductive state, and the first circuit 121 of the printed circuit board and the electrodes 141 and 141' of the optical device chip. , 121 '), and the second electrode line 152 connects the electrode 142 of the zener diode and the second electrode of the printed circuit board to electrically conduct the zener diode 132 fixed to the other surface of the printed circuit board. The circuit 122 'is connected to each other, and the first electrode line and the second electrode line use gold wires having excellent conductivity.

In addition, the other electrode wire (not shown) of the zener diode is present on the bottom surface of the zener diode and is connected to the second circuit 122 at the time of bonding because the zener diode is bonded with conductive silver when the zener diode is fixed to the substrate. do.

In addition, in order to protect the zener diode 132 and the second electrode line 152 provided on the other surface of the substrate 110 on which the second circuits 122 and 122 'are formed, an opaque epoxy is formed inside the receiving groove 123 of the second substrate. Is filled to form an epoxy layer.

The compound resin layer 160 is a layer in which a liquid resin liquefied by applying heat and pressure to a compound compound of a solid form in which phosphors are mixed for a short time within several tens of seconds on one surface of a printed circuit board. That is, when heat and pressure are applied to a solid compound resin, a resin is liquefied and a transfer mold method is molded on one surface of a printed circuit board.

The reflector layer 170 may include titanium dioxide (TiO ₂ ) and the like on the surface of the compound resin formed on one surface of the printed circuit board except for a specific surface emitting light and the other surface of the printed circuit board on which the compound resin is not molded. It is the layer shape | molded to predetermined thickness using the mixture which mixed specific resin. Here, the molding method is formed by selecting any one of a transfer mold or an injection method.

Spraying, impregnation, transfer mold, or injection method can be performed by molding the reflector layer. However, in order to make the thickness of the reflector layer constant and to make the optical properties uniform, the method may be formed by transfer mold or injection method rather than spray or impregnation method. It is more preferable to form by transfer mold or injection method since it is more effective.

In more detail with respect to the resin forming the reflector layer, the mixture of the reflector layer formed by the transfer mold method is a thermosetting resin, that is, commonly used resin 58% ± 3%, silica 20-30% titanium dioxide 20 The mixture of reflector layer, formed by -30% and additives and formed by injection method, is thermoplastic resin, i.e. 58% ± 3% of polyamide, 20-30% of glass filler, dioxide 20-30% titanium and additives.

Since the reflector layer is very thin (about 0.05 to 0.1 mm) and there is a problem in appearance when light is transmitted, the metal film may be further vacuum-deposited on the inner and outer surfaces of the reflector layer in order to block light.

Since the metal film layer is not necessarily required, it is not necessary to vacuum-deposit the metal when total reflection of the light generated by the optical device is performed only by the reflector layer.

The metal film layer 180 is a layer in which the metal is vacuum-deposited on the surface except the specific surface emitting light and the other surface of the printed circuit board among the surface on which the reflector layer is formed or the surface on which the compound resin layer is formed. In addition, the metal vacuum-deposited here selects and uses either aluminum or silver with high reflectance.

The reflector layer, which functions as a conventional plastic reflector, totally reflects 80 to 90% of the light emitted from the optical device, and totally reflects the remaining light in the metal layer.

Therefore, when power is applied to the side light emitting device, light generated inside the compound resin layer is reflected into the compound resin by the reflector layer, and light that is not totally reflected is totally reflected or blocked inside the compound resin layer by the metal film layer, There is no light to the outside. On the other hand, a metal film layer is vacuum-deposited on a compound resin layer, and a reflector layer can be shape | molded outside.

Therefore, when the light emits light, the reflector layer and the metal layer are double-managed, so that the light reflecting efficiency is higher than that of the conventional plastic reflector, so that the light efficiency can be improved and the light loss problem can be improved.

In addition, the thickness of the reflector layer and the metal film layer can be formed very thin, such as 5 / 100mm to 10 / 100mm, and when the same as the outer dimensions of the conventional device, the available inner diameter is large, so that more and more optical device chips can be installed.

4 is a process flowchart of a side light emitting device according to the present invention.

The first circuits 121 and 121 'and the second circuits 122 and 122' of the substrate 110 are electrically connected through the through holes h and h ', and the second circuits 122 and 122' are connected to each other. The external terminal 123 connected to the second circuit of the first substrate and the copper foil 113 and the external terminal grooves 114 and 114 'of the second substrate by adhering the formed first substrate 110 and the second substrate 111 to each other. After manufacturing the printed circuit board electrically connected through (S1), and fixing the zener diode using the conductive silver on the other surface of the printed circuit board, that is, the second circuit (122, 122 ') is formed At the same time the zener diode is fixed, the electrode of the zener diode (not shown) is electrically connected to the second circuit 122, and the zener diode 132 is electrically after the silver which fixed the zener diode 132 is cured (S2) The second circuit 122 'of the printed circuit board and the electrode 142 of the zener diode are connected to the second electrode line 152 so as to be in a conductive state (S3). 2 around the Zener diode is fixed to protect the zener diode 132 and the electrode line 152 connected to the circuit 122, that is cured by injection (S4) an epoxy into the inner space of the receiving groove (112).

After that, the optical device chip is fixed to one surface of the printed circuit board, that is, the printed circuit board on which the first circuit is formed by using an adhesive, and then the adhesive to which the optical device chip 131 is fixed is cured (S5). It is left for a predetermined time of 30 minutes to 1 hour at a temperature of.

Thereafter, the first circuit 121 of the printed circuit board and the electrodes 141 and 141 'of the optical device chip are connected to the second electrode lines 151 and 151' so that the optical device chip 131 is electrically conductive. After (S6), the substrate is mounted on the mold mold, and the compound resin mixed with the phosphor is placed in the injection hole of the mold mold, and the pressure is applied. As soon as it enters again, the physical properties change to solidity (S7).

In addition, since compound resin is solid, it is easy to handle, and since the additives in the resin are in a solid state, they are always distributed in the same density and are made within a few seconds until they are liquefied and molded. It is much more uniform than the method and can produce a homogeneous product.

The compound resin layer is then first cut (S8) to a predetermined standard with a diamond wheel sawing machine (DIAMOND WHEEL SAWING MACHINE) to any desired size desired by the user.

After mounting the light emitting device having the compound resin layer formed on the mold, the reflector layer is formed by either a transfer mold or an injection method using a coating agent in which titanium dioxide and a resin are mixed on the cut surface of the compound resin layer (S9). ), And vacuum deposition (S10) at a pressure of 10 ^-3 to 10 ^-6 torr using a specific metal outside the reflector layer.

In addition, after the compound resin layer is molded according to the manufacturer's arbitrary, a metal film layer may be formed by vacuum depositing a metal on the outer surface of the compound resin layer, and the reflector layer may be formed with a specific resin on the outer surface of the metal film layer.

That is, since only the reflector layer formed of titanium dioxide and a specific resin can effectively totally reflect the light, it is not necessary to vacuum-deposit the metal according to the manufacturer, and optionally, the metal may be vacuum-deposited first to form the reflector layer.

Thereafter, when the metal is not vacuum-deposited, the second cut with the diamond wheel sawing device is performed to the same vertical line, that is, the bottom of the printed circuit board according to a predetermined size, plus the thickness of the reflector layer formed on the outer side of the molded compound resin surface. S11) and then remove the tape on the bottom of the printed circuit board to separate the products.

If the metal is vacuum-deposited, secondary diamond cutting (S11) is performed from the same vertical line to the bottom of the printed circuit board by adding the thickness of the reflector layer and the metal film layer formed on the outer side of the cut compound resin surface. After that, remove the tape on the bottom of the printed circuit board and separate the products.

As described above, when forming the reflector layer by the transfer mold or injection method, after mounting the side light emitting element with the compound resin layer to the mold to form a reflector layer for reflection with a mixture of titanium dioxide and a specific resin Therefore, the post-process is simple, unlike when spraying or impregnation is used.

The present invention is not limited to the above-described side optical device package, and may be implemented in general optical device packages, and those skilled in the art without departing from the gist of the present invention claimed in the following claims. Anyone could make various changes.

As described in detail above, the present invention has excellent mass productivity because of attaching the optical element chip and the electrode line on the flat printed circuit board without the reflector, and after molding the resin, 80 to 90 light from the coated reflector layer Total reflection and reflecting the remaining light from the metal film layer can enhance the reflection effect than the conventional reflector, resulting in higher light efficiency, eliminating the need for expensive side emitting dedicated leadframe molds and eliminating mold production period. Therefore, it can respond to changes in demand in a timely manner.

In addition, since solid resins are used, the dispersion and content of pigments and phosphors added in the resins can be kept constant for each product, and the solid resins are molded in a constant amount for each product by molding using a transfer mold method. Since the solidification takes place within a few tens of seconds, there is no time for the phosphors with different resins and specific gravity to precipitate, so the ratio of phosphors and resins is constant for each product, so that the luminance is uniform and the scattering ratio of color coordinates is narrowed, thus increasing the production yield. It is possible to reduce the burden of, and to easily manufacture the side light emitting device to any predetermined size, the material is simplified, but also bonded to the production of small quantities of various kinds, and mass production is easy.

In addition, when the zener diode is installed on the bottom surface of the printed circuit board, when the optical device and the zener diode are installed on the same surface, light generated from the optical device may be prevented from being scattered and reflected by the zener diode, thereby increasing the light efficiency. .

In addition, by forming the compound resin layer and then molding the reflector layer by injection or transfer mold method, the thickness of the reflector layer can be made constant and optical characteristics can be made uniform.

Claims (16)

An optical device chip that generates light when power is supplied; A first substrate composed of a first circuit and a second circuit and electrically connected through a through hole, and a second substrate composed of a copper foil, a receiving groove, and an external terminal, wherein the second substrate and the second circuit are provided. Is bonded to the surface of the first substrate, the external terminal of the second substrate is electrically connected to the first and second circuits of the first substrate, the optical element chip is fixed to the first circuit of the first substrate Printed circuit board; A first electrode line electrically connecting the first circuit of the printed circuit board and the electrode of the optical device chip; A second electrode line electrically connecting the second circuit of the printed circuit board and the electrode of the zener diode; A compound resin layer in which a compound resin in which phosphors are mixed is molded on one surface of the printed circuit board; And Including a reflector layer in which a specific resin is molded on the other surface of the printed circuit board on which the second circuit is formed and a specific surface of the compound resin layer from which light is emitted, When power is supplied to the optical device chip, the light generated from the optical device chip is totally reflected inside the compound resin by the reflector layer, and emits light through a specific surface of the compound resin in which the reflector layer is not formed. Side optical device package, characterized in that. The method of claim 1, And a metal film layer vacuum-deposited with metal on an outer surface of the reflector layer. The method of claim 1, And a metal film layer on which the metal is vacuum deposited between the transfer mold resin layer and the reflector layer. The method of claim 2 or 3, wherein the metal Side optical device package, characterized in that either aluminum or silver. The method of claim 1, wherein the optical device chip Side optical device package, characterized in that the light emitting diode. The method of claim 1, wherein the specific resin A side light emitting device package comprising a mixture of titanium dioxide. The method of claim 6, wherein the specific resin A side light emitting device package, characterized in that any one of a thermoplastic resin or a thermosetting resin. The method of claim 1, wherein the optical device chip Side light emitting device package, characterized in that any one of a plurality of single-color optical device chip or RGB color optical device chip. The method of claim 1, wherein the first circuit Side optical device package, characterized in that plated with silver. Forming a first circuit and a second circuit so that both surfaces of the first substrate are electrically connected through the holes, and attaching the second substrate to the first substrate on which the second circuit is formed, thereby manufacturing the printed circuit board; Fixing the zener diode to the inside of the receiving groove of the other surface of the printed circuit board on which the second circuit is formed and curing the adhesive to which the zener diode is fixed; Injecting a protective epoxy into the inner space of the receiving groove after connecting the fixed zener diode electrode and the second circuit using a second electrode line; Fixing the optical device chip with an adhesive on one surface of the printed circuit board on which the first circuit is formed, and then curing the adhesive fixing the optical device chip; Connecting the first circuit of the printed circuit board and the electrode of the optical device chip through a first electrode line; Transferring a compound resin containing a phosphor mixed on a printed circuit board to which the optical device chip is fixed; First cutting the compound resin layer into a predetermined size; Forming a reflector layer on a cut surface of the compound resin layer with a specific resin; And And secondly cutting the optical device on which the reflector layer is formed to a predetermined standard. The method of claim 10, wherein the forming of the reflector layer with the specific resin, The method of manufacturing a side light emitting device package, characterized in that formed by any one of the transfer molding or injection molding. The method according to claim 10 and 11, The specific resin used in the case of forming the reflector layer by the transfer molding method is a method of manufacturing a side optical device package, characterized in that a predetermined titanium dioxide, thermosetting resin, glass filler and additives are mixed. The method according to claim 10 and 11, The specific resin used in the case of forming the reflector layer by the injection method is a method of manufacturing a side light emitting device package, characterized in that a predetermined titanium dioxide, a thermoplastic resin, a glass filler and an additive is mixed. The method of claim 10, wherein forming the reflector layer from the cut surface of the compound resin layer using a specific resin, And vacuum depositing an outer surface of the reflector layer with a metal. The method of claim 10, wherein forming the compound resin layer, Vacuum depositing the outer surface of the compound resin layer with a metal; the method of manufacturing a side light emitting device package further comprising. The method of claim 15, wherein vacuum depositing the metal, Method of manufacturing a side light emitting device package, characterized in that the vacuum deposition at a pressure of 10 ^-3 to 10 ^-6 Torr.

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