KR101370790B1 - Bar type light emitting device - Google Patents
Bar type light emitting device Download PDFInfo
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- KR101370790B1 KR101370790B1 KR1020070098098A KR20070098098A KR101370790B1 KR 101370790 B1 KR101370790 B1 KR 101370790B1 KR 1020070098098 A KR1020070098098 A KR 1020070098098A KR 20070098098 A KR20070098098 A KR 20070098098A KR 101370790 B1 KR101370790 B1 KR 101370790B1
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Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, wherein a preferred embodiment of the present invention comprises: first and second wiring structures arranged parallel to each other in the longitudinal direction, at least one window formed between the first and second wiring structures, A substrate having first and second main surfaces opened by the window and facing each other, and having first and second electrodes, wherein the first and second electrodes are connected to the first and second wiring structures, respectively. The light emitting device includes at least one light emitting diode chip disposed in the at least one window, and a resin part filled in the window so that the light emitting diode chip is fixed in the window.
According to the present invention, it is possible to easily manufacture as compared to the lead frame type light emitting device, and a miniaturized light emitting device having a uniform luminance distribution can be obtained through a wide directing angle.
Package, Light Emitting Diode, White, Line Light Source, Light Emitting Device
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, and more particularly, to a light emitting device that can be used in a side view type backlight unit having a semiconductor light emitting diode chip.
In general, as a light emitting device having a light emitting diode chip, a light emitting device structure having a case in which a white resin is injection molded into a lead frame is widely used. Such a light emitting device mounts an LED chip so as to be connected to a lead frame in a groove part of a case, and then fills the groove part with resin. In particular, in order to manufacture a white light emitting device, a method of containing the phosphor powder in the resin filled in the groove portion can be used.
However, the conventional light emitting device structure has some disadvantages in terms of miniaturization and yield.
For example, in the case of a side view type light emitting device that can be surface mounted mainly used as a light source for a backlight of a display portion of a mobile phone, a thinning of the side light emitting device is also required according to the thinning of a mobile phone. have. However, in the conventional light emitting device structure, since the groove portion must be provided for mounting the LED chip, there is a difficulty in manufacturing the case having it sufficiently reduced in size.
In addition, after the injection molding of the case together with the lead frame, a complicated process of mounting the LED chip and providing the resin packaging portion to the groove portion, there is a problem that the yield is lowered and the process cost is increased.
Particularly, in the conventional white light emitting device, chromatic dispersion may be uneven due to the dispersion of the phosphor filling amount by the dispenser during the dispensing of the liquid resin containing the phosphor powder in the groove portion.
The present invention is to solve the above problems, an object of the present invention is easy to manufacture compared to the lead frame type light emitting device, and to provide a miniaturized light emitting device having a uniform luminance distribution through a wide direct angle will be.
In order to achieve the above object, a preferred embodiment of the present invention,
First and second wiring structures disposed parallel to each other in the longitudinal direction, at least one window formed between the first and second wiring structures, and first and second main surfaces opened by the windows and opposed to each other; At least one light emitting diode chip and at least one light emitting diode chip disposed at the at least one window such that the first and second electrodes are connected to the first and second wiring structures, respectively. Provided is a light emitting device including a resin part filled in a window such that a diode chip is fixed in the window.
Preferably, the window and the light emitting diode chip may be a plurality.
In this case, the plurality of windows may be formed spaced apart from each other by a predetermined distance in the longitudinal direction of the substrate.
In addition, the plurality of light emitting diode chips may be disposed on one straight line.
In addition, the plurality of light emitting diode chips are preferably connected in parallel with each other in terms of power efficiency.
Preferably, the substrate is a flexible substrate, and specifically, the substrate may be a liquid crystal polymer (LCP) substrate.
In addition, the first and second wiring structures may be electrode patterns formed on any one of the first and second main surfaces.
The first and second electrodes may be formed on one surface of the light emitting diode chip, and the light emitting diode chip may be disposed on the window such that the electrode forming surface faces the thickness direction of the substrate.
In this case, the first and second wiring structures may be electrode patterns formed on the first main surface, and the light emitting diode chip may be disposed on the window such that the electrode forming surface faces the same direction as the first main surface. .
Further, the light emitting diode chip is preferably disposed in the window so that the surface facing the electrode forming surface is on the same plane as the second main surface in terms of ensuring luminance uniformity.
In addition, the first and second electrodes and the first and second wiring structures may be connected by wire bonding, respectively. In this case, it is preferable that the said resin part was formed so that the said wire might be covered.
The resin part may be formed to cover the electrode forming surface of the light emitting diode chip and the first main surface of the substrate.
In addition, the resin part may be formed to cover the remaining surface of the light emitting diode chip except the surface opposite to the electrode formation surface.
Additionally, the light emitting diode chip may further include a transparent resin layer formed on a surface opposite to the electrode formation surface.
In this case, it is preferable that the transparent resin layer contains phosphor particles.
Furthermore, the thickness of the transparent resin layer is preferably 0.3 mm or less.
On the other hand, in a preferred embodiment of the present invention, the light emitting diode chip may further include a phosphor film formed to cover the remaining surfaces other than the electrode forming surface.
Preferably, the light emitting diode chip emits blue light, and the phosphor particles or the phosphor film may include a yellow phosphor.
The resin portion is preferably made of a white resin, more preferably, the resin portion may include TiO 2 .
On the other hand, the first and the second wiring structure may be provided with a connection portion connected to the first and second electrodes, respectively, to efficiently configure the coupling structure.
Finally, it is preferable to further include one or more zener diodes connected to the first and second wiring structures.
As described above, according to the present invention, it is possible to easily manufacture as compared to the lead frame type light emitting device, and a miniaturized light emitting device having a uniform luminance distribution can be obtained through a wide directing angle.
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.
1A and 1B show a light emitting device according to an embodiment of the present invention, in which FIG. 1A corresponds to a shape viewed from above and FIG. 1B corresponds to a shape viewed from the side.
1A and 1B, the
In this case, the LCP substrate has first and second wiring structures arranged in parallel in the length (l) direction, and a plurality of windows W are formed between the first and second wiring structures. Here, the window (W) is provided as a space for the arrangement of the light emitting diode chip, the light emitting diode chip (L) is the window so that the light extraction surface and the electrode forming surface opposite thereto the direction of the thickness of the LCP substrate (W) is disposed. More details on this will be described later.
In the present embodiment, the substrate used for the
In addition, LCP is suitable as a PCB material in terms of excellent electrical properties, low hygroscopicity and low dimensional change rate. In particular, LCP has a heat resistance of about 280 ° C, which is somewhat inferior in heat resistance to polyimide (PI) having a heat resistance of about 300 ° C, but exhibits high mechanical strength due to the self-reinforcing effect depending on the orientation of rigid molecular rings. Is low.
In addition to these advantages, LCP has excellent electrical insulation properties, is relatively stable to solvents such as acids and alkalis, has a low melt viscosity, and is easy to mold and can be formed to a thin thickness.
However, according to the embodiment, other materials having flexibility besides LCP, for example, FR-4, BT resin, or the like, may be used as the substrate. In addition, although it is preferable to use a flexible substrate as described above, in other embodiments, a general PCB substrate may be used instead of the flexible substrate.
On the other hand, as described above, the
The zener diode Z may be provided to prevent electrostatic discharge, and may be connected in parallel with other light emitting diode chips as described below. However, in some embodiments, the zener diode Z may not be included in the
In the present embodiment, the
As such, when the
In addition, the
In the present embodiment, the
Furthermore, as described above, the shape of the light emitting device may also be modified as necessary, such as a rectangle or a circle, rather than a bar type, as shown in FIGS. 1A and 1B.
Hereinafter, elements constituting the light emitting device will be described in detail with reference to FIGS. 2 and 3.
FIG. 2 is an enlarged view of the area A1 around the LED chip in FIG. 1A, and the right side shows the shape viewed from the side. 3 is an enlarged view of the area A2 around the light emitting diode chip L in FIG. 1B.
2 and 3, in the light emitting device according to the present embodiment, the light emitting
In this case, the light emitting
In the present embodiment, the
For example, if the
Meanwhile, the thickness t of the
Therefore, in consideration of this point, the thickness t of the
The
As shown in FIG. 3, in the present embodiment, the
In general, although the window may be filled with a transparent resin that may be employed, the
Therefore, when the
In this case, the thickness of the
On the other hand, the present invention is not limited thereto, but in the present embodiment, a silicone resin including TiO 2 is employed as the white resin forming the
First and
The first and
In this case, in order to obtain an efficient connection structure with the first and
In addition, the connection part C and the first and
4 is an equivalent circuit diagram illustrating a connection state of a light emitting diode chip and a zener diode in the light emitting device according to the above-described embodiment.
As shown in FIG. 4, in the light emitting device, it is seen that each LED chip L is connected in parallel with each other, and the zener diode Z is also connected in parallel with the LED chips. As such, connecting the diodes L and Z in parallel may provide power more efficiently than in the case of connecting in series.
5, 6, and 7 are views of a region around a light emitting diode chip in a lateral direction in a light emitting device according to another embodiment of the present invention, and may be understood as corresponding to FIG. 3 in the previous embodiment.
First, in the case of the light emitting device according to the embodiment of FIG. 5, like the previous embodiment, the light emitting
In the case of this embodiment, the difference with the previous embodiment is that the area | region in which the said
Next, the light emitting device according to the embodiment of FIG. 6 includes the light emitting
Unlike the embodiment of FIG. 3, the light emitting
In the case of the embodiment of Fig. 6, compared with the case of forming the phosphor layers on the light extraction surface of the light emitting diode chip, the height of the light extraction surface can be obtained by using the light emitting
FIG. 7 is a somewhat modified embodiment of the embodiment of FIG. 6. In the case of the light emitting device shown in FIG. 7, the light emitting
However, in the embodiment of FIG. 7, the light emitting
As described above, the light emitting device can reduce the size and manufacturing cost of the light emitting device such as a conventional lead frame package, and can mount the light emitting diode chip at a uniform height to improve the uniformity of the luminance distribution. It is possible to minimize the occurrence of the dark portion due to the space between the diode chips.
8 and 9 illustrate an electrode structure that can be employed in the light emitting device according to the present invention. 8 and 9 may replace the
First, referring to FIGS. 8A and 8B, the
As shown in FIG. 8A, the conductive through hole has a shape close to a quadrant. This is for the convenience of the process by manufacturing a plurality of light emitting devices at a time, by using four circular light emitting devices which are adjacent to each other by sharing one circular conductive through hole in four equal parts. However, depending on the precision of the process, the shape of the conductive through hole may not be exactly a quadrant, for example, an elliptical conductive through hole may be divided into four quarters. Alternatively, conductive vias filled with a material such as Ag may be used instead of the conductive through holes.
Next, the electrode structures shown in FIGS. 9A and 9B are slightly modified electrode structures in FIG. 8, and the first and
As in the embodiment of FIG. 8, the first and
10 is a plan view schematically illustrating a backlight unit employing a light emitting device according to the present invention.
The light emitting device employed in the backlight unit corresponds to the light emitting device described in FIG. 1 in the above-described embodiment. In this case, the backlight unit may be used as a backlight such as an LCD panel, and may also be used as a white lighting device.
Referring to FIG. 10, the light emitting device is mounted to the backlight unit to be in a side view type.
In addition, the backlight unit includes a
The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited only by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.
1A and 1B show a light emitting device according to an embodiment of the present invention, in which FIG. 1A corresponds to a shape viewed from above and FIG. 1B corresponds to a shape viewed from the side.
FIG. 2 is an enlarged view of the area A1 around the LED chip in FIG. 1A, and the right side shows the shape viewed from the side.
3 is an enlarged view of the area A2 around the LED chip in FIG. 1B.
4 is an equivalent circuit diagram illustrating a connection state of a light emitting diode chip and a zener diode in the light emitting device according to the embodiment of FIG. 1A.
5, 6, and 7 show a side view of a region around a light emitting diode chip in a light emitting device according to another embodiment of the present invention.
8 and 9 illustrate electrode patterns that can be employed in the light emitting device according to the present invention.
10 is a plan view schematically illustrating a backlight unit employing a light emitting device according to the present invention.
Description of the Related Art
11: light emitting
12:
14: resin portion 15: transparent resin layer
W: Window Z: Zener Diode
Claims (24)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020070098098A KR101370790B1 (en) | 2007-09-28 | 2007-09-28 | Bar type light emitting device |
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KR1020070098098A KR101370790B1 (en) | 2007-09-28 | 2007-09-28 | Bar type light emitting device |
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KR20090032667A KR20090032667A (en) | 2009-04-01 |
KR101370790B1 true KR101370790B1 (en) | 2014-03-10 |
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KR1020070098098A KR101370790B1 (en) | 2007-09-28 | 2007-09-28 | Bar type light emitting device |
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KR102568252B1 (en) * | 2016-07-21 | 2023-08-22 | 삼성디스플레이 주식회사 | Light emitting device and fabricating method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002124705A (en) * | 2000-10-17 | 2002-04-26 | Citizen Electronics Co Ltd | Light emitting diode and its manufacturing method |
KR200414385Y1 (en) | 2005-12-21 | 2006-04-20 | 파라 라이트 일렉트로닉스 컴퍼니 리미티드 | Structure of light emitting diode |
KR20060093069A (en) * | 2005-02-18 | 2006-08-23 | 니치아 카가쿠 고교 가부시키가이샤 | Light emitting device with light distribution characteristic controlling lens |
KR20070047680A (en) * | 2005-11-02 | 2007-05-07 | 가부시끼가이샤 도리온 | Light emitting diode mounting substrate |
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2007
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002124705A (en) * | 2000-10-17 | 2002-04-26 | Citizen Electronics Co Ltd | Light emitting diode and its manufacturing method |
KR20060093069A (en) * | 2005-02-18 | 2006-08-23 | 니치아 카가쿠 고교 가부시키가이샤 | Light emitting device with light distribution characteristic controlling lens |
KR20070047680A (en) * | 2005-11-02 | 2007-05-07 | 가부시끼가이샤 도리온 | Light emitting diode mounting substrate |
KR200414385Y1 (en) | 2005-12-21 | 2006-04-20 | 파라 라이트 일렉트로닉스 컴퍼니 리미티드 | Structure of light emitting diode |
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