KR20100054475A - Led package - Google Patents

Abstract

PURPOSE: An LED package is provided to prevent the deterioration of brightness by including a reflection member comprised of a coating layer and a reflection wall which are arranged on the outer circumference of the fluorescent material. CONSTITUTION: In an LED package, a substrate is arranged on the both sides of the LED chip and is bonded with the LED chip through a wire. An electrode(140) is arranged in the outer side of the substrate. A resin mould unit(150) molds the LED chip, a lower part of the substrate and the electrode. The fluorescent material layer(110) is formed on the resin mould unit. The fluorescent material layer comprises a reflecting member having the coating on the external side of the fluorescent material layer.

Description

LED package {LED package}

The present invention relates to an LED package, and more particularly to an LED package having a reflecting member consisting of a coating layer or a reflective wall around the outer side of the phosphor layer.

In general, a light emitting diode (LED) is a semiconductor light emitting device that emits light when current flows, and converts electrical energy into light energy using a P-N junction diode made of GaAs and GaN optical semiconductors.

Factors determining the LED characteristics include color, brittleness and light conversion efficiency. The characteristics of such a product are primarily determined by the compound semiconductor material and its structure used in the LED device, but the secondary factor is also greatly influenced by the structure for mounting the LED chip.

Therefore, in order to obtain a luminous effect according to user requirements, it is necessary to improve the structure of the LED package and the materials used therein, in addition to the primary elements of the material or structure of the LED chip.

In particular, as the application range of LED packages is gradually expanded from small lights such as mobile terminals to indoor and outdoor general lighting, automotive lighting, and large liquid crystal display (LCD) backlights, high efficiency and brightness Efforts are underway to improve this.

1 is a cross-sectional view illustrating a structure of a general LED package, wherein the LED package 10 includes a substrate 14 having an electrode 15 formed thereon, an LED chip 12 having a substrate 14 and wire bonding 13 formed thereon, The molding part 16 formed by molding the substrate 14 and the LED chip 12 and the resin layer 11 provided on an upper surface of the molding part 16 are formed.

Here, the molding part 16 serves to reflect the light coming from the LED chip 12 and to send it out to the resin layer 11. The resin layer 11 absorbs and emits light of the LED chip 12 reflected from the molding part 16 or the surface of the substrate 14, or emits light emitted from the LED chip 12. It absorbs and emits.

However, at this time, since the side surface of the resin layer 11 is open to the outside as it is, light directed toward the side surface of the resin layer 11 is not collected and spreads while lowering the luminance to emit light of the LED package 10. There was a problem of lowering the efficiency.

Accordingly, the present invention is to solve all the disadvantages and problems of the conventional LED package, by providing a reflecting member consisting of a coating layer or a reflective wall around the outer periphery of the phosphor layer, to provide a LED package that prevents the brightness deterioration have.

The first embodiment of the present invention for achieving the above object is an LED chip; Substrates provided at both sides of the LED chip and wire-bonded with the LED chip; An electrode provided on an outer surface of the substrate; a resin molding unit molding the LED chip, the electrode, and a lower portion of the substrate; And a phosphor layer formed on an upper surface of the resin molding part and having a reflective member formed of a coating layer on an outer circumference thereof. In providing an LED package comprising a.

In addition, the coating layer may be coated with a silicone resin or an epoxy resin excellent in reflectance.

In addition, the wire bonding may connect the lower surface of the chip and the lower surface of the substrate.

A second embodiment of the present invention for achieving the above object is an LED chip; Substrates provided at both sides of the LED chip and wire-bonded with the LED chip; An electrode provided on an outer surface of the substrate; A resin molding part molding a lower part of the LED chip, an electrode, and a substrate; And a phosphor layer formed on an upper surface of the resin molding part and having a reflection member formed of a reflection wall on the outside thereof. In providing an LED package comprising a.

In addition, the reflective wall may be made of a silicone resin or an epoxy resin having excellent reflectance.

In addition, the side of the reflecting wall may be further provided with an extension portion is enlarged.

In addition, the reflective wall may be formed in a form in which an upper surface of the phosphor layer is opened and surrounds only an outer surface of the phosphor layer.

As described above, the LED package according to the present invention has an advantage of improving the luminous efficiency of the LED package by preventing a decrease in luminance by providing a reflective member made of a coating layer or a reflective wall around the outer circumference of the phosphor layer.

In addition, the reflective wall protects the interface between the phosphor layer and the light guide plate, thereby improving the reliability and durability of the LED package.

Details regarding the operational effects including the technical configuration of the LED package according to the present invention will be clearly understood by the following detailed description with reference to the drawings in which preferred embodiments of the present invention are shown.

2 to 4 will be described in detail with respect to the LED package according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view and a plan view of an LED package according to a first embodiment of the present invention. FIG. 2A is a cross-sectional view of an LED package having a reflective part including a coating layer, and FIG. 2B is a plan view of FIG. 2A.

Referring to FIG. 2, the LED package 100 according to the first embodiment of the present invention includes an LED chip 120, a substrate 130 provided at both sides of the LED chip 120, and the substrate 130. And formed on an upper surface of the electrode 140, the LED chip 120, the substrate 130, and the resin molding part 150 for molding the electrode 140 and the resin molding part 150. It includes a phosphor layer 110 provided with a reflective member consisting of a coating layer.

In this case, a conventional LED chip is applied to the LED chip 120, and preferably, a GaN-based LED chip may be used. In addition, the bottom surface of the LED chip 120 is electrically connected to each other by the bottom surface of the substrate 130 and the wire bonding 125, wherein the wire 125 is generally made of gold (Au).

The substrate 130 provided at both sides of the LED chip 120 may be made of any one of a printed circuit board, a ceramic substrate, and a BT resin, and the electrode 140 may be formed on an outer surface of the substrate 130. After processing the through-hole (not shown) is formed by filling the through-hole (Ag), such as an electrically conductive material. Therefore, the LED chip 120 wire-bonded with the substrate 130 emits light by receiving power from the outside through the electrode 140. In addition, a coating material (not shown) may be further applied to the surface of the substrate 130 to reflect the light emitted from the LED chip 120 to be emitted to the phosphor layer 110.

The resin molding part 150 protects the LED chip 120 and the wire bonding 125 by molding lower portions of the LED chip 120, the substrate 130, and the electrode 140, and the LED chip 120. Reflects the light emitted from the outside to the outside, that is, to the phosphor layer 110. Therefore, the resin molding part 150 is preferably made of a silicone resin or epoxy resin with excellent reflectance.

The phosphor layer 110 is a resin layer containing phosphors to absorb and emit light of the LED chip 120 reflected from the surface of the resin molding part 150 and the substrate 130, or the LED chip ( It serves to absorb and emit light emitted from the 120. Therefore, when the LED chip 120 emits light, the light of the RGB wavelength band generated by the semiconductor device constituting the LED chip 120 is converted into white light by the phosphor contained in the phosphor layer 110, so that the LED package ( 100 may be provided as a light source of white light.

However, the outer surface of the phosphor layer 110 is open to the outside as it is of the LED chip 120 emitted from the LED chip 120 or reflected from the surface of the resin molding 150 and the substrate 130 Since light may spread to the outer surface of the phosphor layer 110 without being collected, a reflective member including a coating layer 113 is provided around the outer side of the phosphor layer 110. That is, the light emitted from the LED chip 120 or reflected from the surface of the resin molding part 150 and the substrate 130 is reflected by the light of the LED chip 120 again through the coating layer 113 and the phosphor By emitting only to the upper surface of the layer 110, it is possible to prevent the lowering of the brightness.

In this case, the material of the coating layer 113 is preferably made of a silicone resin or an epoxy resin having excellent reflectance, such as the molding resin portion 150.

The thickness of the coating layer 113 is preferably 5 μm to 10 μm, and the upper surface of the phosphor layer 110 has the phosphor layer 110 through which light emitted from the LED chip 120 is emitted. Note that the coating layer 113 is not formed on the upper surface of the. In order to prevent the coating on the upper surface or other portions of the phosphor layer 110, the coating layer 113 may be formed using a mask (not shown) corresponding to the outer periphery of the phosphor layer 110. have.

In addition, the phosphor layer 110 is provided with a light guide plate (not shown), which is one of plastic molding lenses that uniformly transmits light emitted from the LED chip 120 to the outside.

3 and 4 are cross-sectional views and a plan view of the LED package according to a second embodiment of the present invention, Figure 3a is a cross-sectional view of the LED package with a reflective member made of a reflective wall, Figure 3b is a plan view of Figure 3a, Figure 4a is a cross-sectional view of the LED package with a reflecting member consisting of a reflective wall further provided with an enlargement on the side, Figure 4b is a plan view of Figure 4a.

Referring to FIGS. 3 and 4, the LED package 100 according to the second embodiment of the present invention includes an LED chip 120, a substrate 130 provided at both sides of the LED chip 120, and An electrode 140, an LED chip 120, a substrate 130, and a resin molding part 150 for molding the electrode 140 provided on an outer surface of the substrate 130 and an upper surface of the resin molding part 150. And a phosphor layer 110 having a reflective member formed of a reflective wall 117.

The LED package of the second embodiment has a reflective member different from that of the LED package of the first embodiment, and the components having the same functions as those of FIG. 2 described above have the same reference numerals, and will not be repeated. .

The phosphor layer 110 includes a reflective member formed of a reflective wall 117 on the outer side of the phosphor layer 110 as shown in FIG. 3 to emit light from the LED chip 120 or the resin molding part 150 and the The light of the LED chip 120 reflected from the surface of the substrate 130 is reflected again through the reflective wall 117 is emitted only to the upper surface of the phosphor layer 110, it is possible to prevent the lowering of the brightness. At this time, the material of the reflective wall 117 is preferably made of a silicone resin or epoxy resin excellent in the same reflectance as the molding resin portion 150.

In addition, as shown in FIG. 4, the reflective wall 117 may be formed in a form in which an enlarged portion 118 having an upper portion is enlarged at a side thereof to sufficiently secure a directing angle. As described above, the reflective wall 117 is not limited to the shape as shown, and may be variously modified into a shape capable of improving the reflectance within the technical scope of the present invention. The reflective wall 117 is processed by a mold or an extrusion method in which the upper surface of the phosphor layer 110 is opened and surrounds only the outer surface of the phosphor layer 110, and the height of the reflective wall 117 is It is preferably formed higher than the height of the phosphor layer 110.

In addition, the reflective wall 117 may serve as a bumper between the light guide plates provided on the phosphor layer 110 to protect the LED package 100.

like this. The LED package according to the present invention includes a reflecting member made of a coating layer 113 or a reflecting wall 117 around the outer side of the phosphor layer 110, thereby preventing luminance degradation to improve the luminous efficiency of the LED package 100. can do. In addition, the reflective wall 117 protects the interface between the phosphor layer 110 and the light guide plate to improve the reliability and durability of the LED package 100.

Although the preferred embodiments of the present invention described above have been described in detail, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

Accordingly, the scope of the present invention is not limited to the disclosed embodiments, but various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims should also be considered as belonging to the scope of the present invention. .

1 is a cross-sectional view showing the structure of a typical LED package.

2 is a cross-sectional view and a plan view of the LED package according to the first embodiment of the present invention, Figure 2a is a cross-sectional view of the LED package with a reflective member consisting of a coating layer, Figure 2b is a plan view of Figure 2a.

3 and 4 are a cross-sectional view and a plan view of the LED package according to a second embodiment of the present invention, Figure 3a is a cross-sectional view of the LED package with a reflective member made of a reflective wall, Figure 3b is a plan view of Figure 3a, Figure 4a is a cross-sectional view of the LED package with a reflecting member consisting of a reflecting wall further having an enlargement on the side, Figure 4b is a plan view of Figure 4a.

<Explanation of Signs of Major Parts of Drawings>

100: LED package 110: phosphor layer

113: coating layer 117: reflective wall

118: expansion part 120: LED chip

125: wire 130: substrate

140: electrode 150: resin molding

Claims (7)

LED chip; Substrates provided at both sides of the LED chip and wire-bonded with the LED chip; An electrode provided on an outer surface of the substrate; A resin molding part molding a lower part of the LED chip, an electrode, and a substrate; And A phosphor layer formed on an upper surface of the resin molding part and having a reflective member formed of a coating layer on an outer circumference thereof; LED package comprising a. The method of claim 1, The coating layer is a LED package coated with a silicone resin or epoxy resin excellent in reflectance. The method of claim 1, The wire bonding is an LED package connecting the lower surface of the chip and the substrate. LED chip; Substrates provided at both sides of the LED chip and wire-bonded with the LED chip; An electrode provided on an outer surface of the substrate; A resin molding part molding a lower part of the LED chip, an electrode, and a substrate; And A phosphor layer formed on an upper surface of the resin molding part and provided with a reflective member formed of a reflective wall on an outer side thereof; LED package comprising a. The method of claim 4, wherein The reflective wall is an LED package composed of a silicone resin or an epoxy resin excellent in reflectance. The method of claim 4, wherein LED side package is further provided on the side of the reflective wall is an extension portion is expanded. The method of claim 4, wherein The reflective wall is an LED package in a form in which the upper surface of the phosphor layer is opened, surrounding only the outer surface of the phosphor layer.

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