CN115763642A - Preparation method of lamp bead, lamp bead and backlight module - Google Patents

Abstract

The invention belongs to the technical field of display equipment, and particularly relates to a preparation method of a lamp bead, the lamp bead and a backlight module. The preparation method of the lamp bead comprises the following steps: preparing materials; preparing an electrode layer on one side plate surface of the substrate; die bonding, namely connecting the chip with the electrode layer, wherein two electrodes of the chip are respectively and electrically connected with two adjacent conductive blocks; packaging, namely preparing a packaging layer on the conductive block; the packaging layer comprises a plurality of light blocking layers arranged at intervals, and the light blocking layers extend along the second direction; two side surfaces of any chip, which are deviated from each other, are provided with light blocking layers, and the other two side surfaces of any chip are exposed out of the light blocking layers; and cutting, namely cutting the substrate, the conductive block and the packaging layer along the first direction and the second direction respectively to form the lamp bead. The preparation method of the lamp bead provided by the invention can expand the light emitting area of the lamp bead, so that the using number of the lamp beads is reduced to improve the light emitting uniformity.

Description

Preparation method of lamp bead, lamp bead and backlight module

Technical Field

The invention belongs to the technical field of display equipment, and particularly relates to a preparation method of a lamp bead, the lamp bead and a backlight module.

Background

Information is a big trend in development of the modern times, and the liquid crystal display is an important medium for information transmission. As the application of liquid crystal displays is becoming more frequent, people have made higher demands on the light quality of the liquid crystal display panels.

The backlight module is a device used for supplying illumination to display images in the liquid crystal display panel and comprises a plurality of lamp beads; in traditional backlight unit, often adopt the lamp pearl of single face top light-emitting.

However, the light-emitting area of the light beads has a large limitation, and therefore, a large amount of light beads need to be used and densely arranged on the lamp strip or the PCB to ensure that the liquid crystal display panel has sufficient display brightness, which will result in an increase in the ratio between the OD (short for optical distance, referred to as the height of the light beads in this application) and the Pitch (referred to as the distance between two adjacent light beads) on the backlight module, thereby affecting the uniformity of the light emitted therefrom.

Disclosure of Invention

An object of the embodiment of the application is to provide a preparation method of a lamp bead, the lamp bead and a backlight module, which aim at solving the problem of how to enlarge the light emitting area of the lamp bead, so that the number of the used lamp beads is reduced to improve the uniformity of light emitting.

In order to achieve the purpose, the technical scheme adopted by the application is as follows:

firstly, a preparation method of a lamp bead is provided, which comprises the following steps:

preparing materials, namely preparing a substrate and a plurality of chips;

preparing an electrode layer on one side plate surface of the substrate; the electrode layer comprises a plurality of conducting blocks arranged at intervals, and each conducting block is insulated from the substrate;

die bonding, namely connecting the chip with the electrode layer, wherein two electrodes of the chip are respectively and electrically connected with two adjacent conductive blocks; the chips are arranged at intervals along a first direction and are arranged in a plurality of rows at intervals along a second direction; the first direction and the second direction are arranged in a staggered mode;

packaging, and preparing a packaging layer on the conductive block; the packaging layer comprises a plurality of light blocking layers arranged at intervals, and the light blocking layers extend along the second direction; the two side surfaces of any chip, which are deviated from each other, are provided with the light blocking layers, and the other two side surfaces of any chip are exposed out of the light blocking layers; and

and cutting the substrate, the conductive block and the packaging layer along the first direction and the second direction respectively to form a lamp bead.

Optionally, in some embodiments, the encapsulating step comprises: and dispensing glue on the conductive block to form the light blocking layer.

Optionally, in some embodiments, a light reflecting surface is formed on one side of any light blocking layer facing the corresponding chip,

wherein, two reflecting surfaces on the same lamp bead are arranged in parallel; or the two reflecting surfaces on the same lamp bead are arranged at a preset included angle.

Optionally, in some embodiments, the predetermined included angle is 120 degrees.

Optionally, in some embodiments, the step of preparing the electrode layer comprises:

and laying a conductive film on the substrate, forming separation grooves on the conductive film through an etching process, wherein the extension path of each separation groove is arranged along the first direction and the second direction at intervals, and the conductive film is positioned between two adjacent separation grooves to form the conductive block.

Optionally, in some embodiments, the preparing the electrode layer step comprises: mounting a bracket on the substrate; the supports correspond to the chips one by one, and any one support comprises two conducting blocks; the bracket is provided with a mounting cavity; the mounting cavity is provided with two cavity walls made of transparent materials, and a containing groove for forming the light blocking layer is formed in each cavity wall;

the die bonding step further comprises: respectively installing each chip in the corresponding installation cavity;

in the packaging step, the light blocking layer is formed in the accommodating groove in a dispensing mode.

Optionally, in some embodiments, the chip is a normal chip, and both electrodes of the chip are electrically connected to the corresponding conductive blocks through gold wires; or the chip is a flip chip and is erected on two adjacent conducting blocks.

Optionally, in some embodiments, the encapsulating step further comprises:

and filling glue, namely filling fluorescent glue between every two adjacent light blocking layers, and enabling the fluorescent glue to cover the chip.

Secondly, providing a lamp bead, which is prepared by the preparation method of the lamp bead; the lamp bead comprises the chip, a power connection part and a light blocking part; the chip is electrically connected with the electric connection part and is configured to emit light; the two light blocking parts are respectively positioned on two sides of the chip and connected with the power connection part;

the electrode layer can form the electric connection part through the cutting step, and the light blocking layer can form the light blocking part through the cutting step.

And thirdly, the backlight module comprises a plurality of lamp beads and a circuit board, wherein each lamp bead is electrically installed on the circuit board.

The beneficial effect of this application lies in: according to the preparation method of the lamp bead, the chip is electrically connected with the electrode layer so as to be connected with an external power supply device to achieve light emitting through the material preparation step, the electrode layer preparation step and the crystal fixing step. Through the packaging step, light blocking layers are formed on two side surfaces of any chip, and light emitting in corresponding directions is blocked; and the other two side surfaces of any chip are exposed out of the light blocking layer, so that the chips can emit light from the two side surfaces. Through the cutting step, a lamp bead with three light-emitting surfaces can be formed. Therefore, the lamp bead prepared by the preparation method of the lamp bead has the three light emitting surfaces, and the light emitting area of the lamp bead can be effectively enlarged, so that the using amount of the lamp bead can be reduced, and the uniformity of light emitting is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a processing flow chart of a method for preparing a lamp bead according to an embodiment of the present application;

fig. 2 is a schematic diagram illustrating a substrate bonding process according to an embodiment of the present disclosure;

fig. 3 is a schematic diagram illustrating a part of a process of packaging a normal chip according to an embodiment of the present disclosure;

fig. 4 is a schematic view illustrating a part of the process of packaging a flip chip according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram of a cutting process according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a lamp bead provided in an embodiment of the present application;

fig. 7 is a schematic structural diagram of a lamp bead provided in another embodiment of the present application;

fig. 8 is a schematic structural diagram of a lamp bead provided in yet another embodiment of the present application;

fig. 9 is a schematic structural diagram of a lamp bead provided in another embodiment of the present application;

fig. 10 is a schematic structural view of a lamp bead provided in another embodiment of the present application;

fig. 11 is a schematic structural diagram of a lamp bead provided in another embodiment of the present application.

Wherein, in the figures, the various reference numbers: 100. a lamp bead; 10. a chip; 10A, positively installing a chip; 10B, flip chip; 11. a first electrode; 12. a second electrode; 13. gold thread; 20. an electrode layer; 20A, a bracket; 21. a conductive block; 22. an electric connection part; 23. a separation tank; 30. a substrate; 31. an insulating layer; 32. a support layer; 40. a packaging layer; 41. a light-blocking layer; 411. a light blocking section; 412. a light-reflecting surface; 42. fluorescent glue; 421. a light-emitting part; C. a first direction; D. a second direction; E. the included angle is predetermined.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application, and the specific meaning of the terms will be understood by those skilled in the art according to the particular situation. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

Referring to fig. 1, an embodiment of the present application provides a method for preparing a lamp bead, including: the method comprises the steps of material preparation, electrode layer 20 preparation, die bonding and packaging. Referring to fig. 1 to 5, alternatively, the foregoing steps are performed in the following order:

s1: preparing materials, namely preparing a substrate 30 and a plurality of chips 10;

s2: preparing an electrode layer 20, and preparing the electrode layer 20 on one side surface of the substrate 30; the electrode layer 20 includes a plurality of conductive blocks 21 disposed at intervals, and each conductive block 21 is insulated from the substrate 30;

s3: die bonding, connecting the chip 10 to the electrode layer 20; wherein, two electrodes of the chip 10 are respectively electrically connected to two adjacent conducting blocks 21; wherein, each chip 10 is arranged along a first direction C at intervals, and is arranged along a second direction D at intervals in a plurality of rows; the first direction C and the second direction D are arranged in a staggered mode;

s4: packaging, preparing a packaging layer 40 on the conductive block 21; the encapsulation layer 40 includes a plurality of light blocking layers 41 arranged at intervals, and the light blocking layers 41 extend along the second direction D; two side surfaces of any chip 10, which are away from each other, are provided with light blocking layers 41, and the other two side surfaces of any chip 10 are exposed out of the light blocking layers 41;

s5: and cutting, namely cutting the substrate 30, the conductive block 21 and the encapsulation layer 40 along the first direction C and the second direction D respectively to form the lamp bead 100 shown in any one of fig. 6 to 11.

The two electrodes of the chip 10 are respectively a first electrode and a second electrode, and the first electrode and the second electrode are respectively electrically connected to the two different conducting blocks 21 so as to enable the lamp bead 100 to be powered on.

It can be understood that, according to the preparation method of the lamp bead provided by the application, the chip 10 can be electrically connected with the electrode layer 20 so as to be connected with an external power supply device to realize luminescence through the material preparation step, the electrode layer 20 preparation step and the crystal fixing step. Through the packaging step, light blocking layers 41 are formed on two side surfaces of any chip 10, so that light emitting in corresponding directions is blocked; and the other two side surfaces of any chip 10 are exposed out of the light blocking layer 41, so that the chips 10 can emit light from the two side surfaces. Through the cutting step, a lamp bead 100 having three light emitting surfaces can be formed. Therefore, referring to fig. 6 to 11, the lamp bead 100 prepared by the preparation method of the lamp bead of the present application has three light emitting surfaces, which can effectively expand the light emitting area of the lamp bead 100, thereby reducing the usage amount of the lamp bead 100 and improving the uniformity of light emission. Wherein, because the light-emitting area of lamp pearl 100 enlarges, can be under the prerequisite of ensureing light intensity, reduce the use amount of lamp pearl 100 to increase the interval between two adjacent lamp pearls 100, thereby reduce OD (short for of optical distance, refer to the height of lamp pearl 100 in this application) and Pitch (refer to the interval of two adjacent lamp pearls 100) the ratio, in order to improve the homogeneity of light-emitting. To sum up, this application has solved how to enlarge the light-emitting area of lamp pearl 100 to reduce the problem of the use quantity of lamp pearl 100 in order to promote the light-emitting homogeneity.

After the processing, the electrode layer 20 is peeled off from the substrate 30, and the lamp bead 100 is electrically connected to the circuit structure to realize the light emitting function.

Optionally, the chips 10 are arranged in an array, and the first direction C is perpendicular to the second direction D.

Referring to fig. 1 and fig. 3, optionally, in the present embodiment, the packaging step includes: glue is dispensed on the conductive block 21 to form the light blocking layer 41. The glue used to form the light blocking layer 41 is an opaque material. It can be understood that after the glue is cured, a stable cavity-shaped light blocking layer 41 can be formed; the height of the light blocking layer 41 can be adjusted by controlling the amount of glue and the glue dispensing mode, and the light blocking layer is matched with the height of the chip 10, so that the height of the lamp bead 100 is reduced; through this mode, reduce the height of lamp pearl 100, can thereby reduce OD/Pitch value to improve the homogeneity of light-emitting. In addition, when the lamp bead 100 is used for producing a display panel, the thickness of the display panel can be effectively reduced due to the reduction of the height of the lamp bead 100; because the quantity of lamp pearl 100 reduces, display panel's manufacturing cost can effectively reduce.

Alternatively, the glue used to form the light blocking layer 41 is a white high-reflective glue containing titanium dioxide, zinc oxide and silicon dioxide materials, which can block light from passing through and has high reflectivity. It can be understood that, in this embodiment, the light blocking layer 41 can converge light toward the chip 10, so as to help to improve the illumination intensity of the lamp bead 100, and further reduce the usage amount of the lamp bead 100.

Referring to fig. 6 to 11, optionally, in some embodiments, a light reflecting surface 412 is formed on one side of any light blocking layer 41 facing the corresponding chip 10. It can be appreciated that any one of the reflective surfaces 412 has a light-focusing effect, thereby enhancing the luminous intensity of the lamp bead 100.

Referring to fig. 6, 8, 9 and 11, optionally, in some embodiments, two light reflecting surfaces 412 on the same lamp bead 100 are disposed in parallel. It is understood that the chip 10 in the conductive state emits light to the periphery and top thereof; wherein, the two sides of the light blocking layer 41 are arranged, and after the light irradiates to the reflecting surface 412, the light emitting surface can reflect the light towards the chip 10, and the illumination intensity of the lamp bead 100 in the light emitting area is enhanced.

Referring to fig. 7 and 10, optionally, in some embodiments, two reflecting surfaces 412 on the same lamp bead 100 are disposed at a predetermined included angle E. It is understood that the angle of the light reflected by the light reflecting surface 412 can be adjusted by controlling the predetermined included angle E, so that the light converges toward a specific area.

Optionally, in this embodiment, the predetermined included angle E is 120 degrees. It can be understood that, in the present embodiment, the light can be converged toward the light exit surface of the chip 10 under the reflection action of the light reflection surface 412, so as to enhance the illumination intensity.

Referring to fig. 2, optionally, the method for preparing a lamp bead further includes: a substrate 30 is prepared and an insulating layer 31 is laid on a support layer 32. The electrode layer 20 is disposed on the surface of the insulating layer 31, and the insulating layer 31 may be connected to the supporting layer 32 by molding; the insulating layer 31 is made of an insulating material, and may be a PET material; the support layer 32 may be made of a metal material, which has a relatively high hardness and is capable of providing a stable support effect to the structure provided thereon.

Referring to fig. 3 to fig. 5, optionally, in the present embodiment, the step of preparing the electrode layer 20 includes: a conductive film is laid on the substrate 30, separation grooves 23 are formed on the electrode layer 20 through an etching process, the extension path of each separation groove 23 is along the first direction C, a plurality of separation grooves 23 are arranged at intervals along the second direction D, and a conductive block 21 is formed at a portion of the conductive film between two adjacent separation grooves 23. The conductive film is made of a conductive material, and may be disposed on the substrate 30 by molding. It can be understood that, in the embodiment, the chip 10 can be directly electrically mounted on the conductive film, so that the support 20A is not required to be arranged, and the height of the lamp bead 100 can be reduced; on one hand, the OD/Pitch value can be reduced, and the uniformity of light emission is further improved; on the other hand, the thickness of the backlight module and the display panel can be effectively reduced, and the light and thin of the display panel and the display can be further realized.

Optionally, the conductive film is a copper foil. The copper foil has good conductive performance, is convenient to bond on the substrate 30, and can effectively reduce the difficulty in manufacturing the lamp bead 100.

Referring to fig. 8 and 11, optionally, in some embodiments, the step of preparing the electrode layer 20 includes: mounting the bracket 20A on the substrate 30; the supports 20A correspond to the chips 10 one by one, and any one of the supports 20A includes two conducting blocks 21; the bracket 20A also has a mounting cavity; the installation cavity is provided with two cavity walls made of transparent materials, and a containing groove for forming the light blocking layer 41 is formed in any cavity wall; the die bonding step further comprises: installing each chip 10 in the corresponding installation cavity respectively; in the packaging step, the light blocking layer 41 is formed in the accommodating groove by dispensing. It can be understood that, in the present embodiment, on one hand, the support 20A has greater rigidity, and can provide a protective effect for the chip 10, the light blocking layer 41, and other structures; on the other hand, the light blocking layer 41 can be arranged by changing the shape, size and depth of the accommodating groove, so that the light blocking device has high flexibility.

Referring to fig. 3, 6 to 8, optionally, in some embodiments, the chip 10 is a normal chip 10A, and both electrodes of the chip 10 are electrically connected to the corresponding conductive blocks 21 through gold wires 13. For the convenience of understanding, the two electrodes of the chip 10 are a first electrode and a second electrode, respectively, and in these embodiments, the first electrode and the second electrode are connected to the corresponding conducting areas 21 through a gold wire 13, so that the chip 10 can be connected in a circuit to realize a light emitting function. Referring to fig. 4, 9 to 11, optionally, in some embodiments, the chip 10 is a flip chip 10B and is mounted on two adjacent conductive blocks 21. It is understood that the first electrode and the second electrode are respectively connected to a conductive block 21, which can also make the chip 10 connect to the circuit.

It can be understood that the preparation method of the lamp bead provided by the embodiment of the application can be used for installing the front-mounted chip 10A and the flip chip 10B, has strong flexibility, and can ensure good luminous intensity and a large light-emitting area through the above mode.

Referring to fig. 3 and 4, in the present embodiment, the packaging step further includes: and filling glue, namely filling fluorescent glue 42 between two adjacent light blocking layers 41, and enabling the fluorescent glue 42 to cover the chip 10. The fluorescent glue 42 contains fluorescent powder material, and blue light emitted by the chip 10 can be filtered by the fluorescent glue 42 to form white light to be emitted; in addition, the fluorescent glue 42 covers the outside of the chip 10 after being cured, and has a certain protection effect on the chip 10. Referring to fig. 6 to 10, the fluorescent glue 42 is cut to form a light-emitting portion 421 capable of forming a lamp bead 100; the outer surface of the light emitting portion 421 is designed to be planar or have a predetermined radian, so that a corresponding light emitting effect can be realized.

Referring to fig. 6 to 11, the present application further provides a lamp bead 100, where the lamp bead 100 is manufactured by the foregoing method for manufacturing a lamp bead, and the method for manufacturing a lamp bead refers to the foregoing embodiments, and since the lamp bead 100 can be manufactured by all technical solutions of all the foregoing embodiments, all beneficial effects brought by the technical solutions of the foregoing embodiments are also achieved, and are not described in detail herein. Specifically, the lamp bead 100 includes a chip 10, an electrical connection part 22, and a light blocking part 411; the chip 10 is electrically connected with the electric connection part 22 and configured to emit light; two light blocking parts 411 are arranged, are respectively positioned at two sides of the chip 10 and are connected with the electric connection parts 22; among them, the electrode layer 20 can be used to form the electrical connection portion 22, and the light blocking layer 41 can form the light blocking portion 411.

The application also provides a backlight module, which comprises a plurality of lamp beads 100 and a circuit board, wherein each lamp bead 100 is electrically installed on the circuit board. It can be understood that the lamp beads 100 adopted by the backlight module have a larger light-emitting range, so that two lamp beads 100 can be reduced on the premise of ensuring the preset illumination intensity, the distance between two adjacent lamp beads 100 on the circuit board is increased, and the OD/Pitch value is reduced, thereby improving the uniformity of light-emitting of the backlight module.

The above are merely alternative embodiments of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.

Claims (10)

1. The preparation method of the lamp bead is characterized by comprising the following steps:

preparing materials, namely preparing a substrate (30) and a plurality of chips (10);

preparing an electrode layer (20), and preparing the electrode layer (20) on one side plate surface of the substrate (30); the electrode layer (20) comprises a plurality of conducting blocks (21) arranged at intervals, and each conducting block (21) is insulated from the substrate (30);

die bonding, wherein the chip (10) is connected with the electrode layer (20), and two electrodes of the chip (10) are respectively and electrically connected with two adjacent conductive blocks (21); wherein the chips (10) are arranged at intervals along a first direction (C) and are arranged at intervals along a second direction (D); the first direction (C) and the second direction (D) are staggered;

packaging, and preparing a packaging layer (40) on the conductive block (21); the encapsulation layer (40) comprises a plurality of light blocking layers (41) arranged at intervals, and the light blocking layers (41) extend along the second direction (D); the light blocking layers (41) are arranged on two side faces, which are deviated from each other, of any chip (10), and the rest two side faces of any chip (10) are exposed out of the light blocking layers (41); and

cutting the substrate (30), the conductive block (21) and the encapsulation layer (40) along the first direction (C) and the second direction (D) respectively to form a lamp bead (100).

2. The method for preparing a lamp bead of claim 1, wherein the encapsulating step comprises: and dispensing glue on the conductive block (21) to form the light blocking layer (41).

3. The method for preparing a lamp bead according to claim 1, wherein any one of the light-blocking layers (41) is formed with a light-reflecting surface (412) on a side facing the corresponding chip (10),

wherein, two reflecting surfaces (412) positioned on the same lamp bead (100) are arranged in parallel; or the two reflecting surfaces (412) on the same lamp bead (100) are arranged at a preset included angle (E).

4. The method for preparing a lamp bead according to claim 3, wherein the predetermined included angle (E) is 120 degrees.

5. The method for preparing a lamp bead according to any one of claims 1-4, wherein the step of preparing the electrode layer (20) comprises:

and a conductive film is laid on the substrate (30), separation grooves (23) are formed on the conductive film through an etching process, the extension paths of the separation grooves (23) are arranged along the first direction (C) and along the second direction (D) at intervals, and the conductive film is positioned between two adjacent separation grooves (23) to form the conductive block (21).

6. The method for preparing a lamp bead according to any one of claims 1 to 4,

the preparing of the electrode layer (20) step includes: mounting a bracket (20A) on the substrate (30); the supports (20A) correspond to the chips (10) one by one, and any one support (20A) comprises two conducting blocks (21); the bracket (20A) is provided with a mounting cavity; the mounting cavity is provided with two cavity walls made of transparent materials, and a containing groove for forming the light blocking layer (41) is formed in each cavity wall;

the die bonding step further comprises: respectively installing the chips (10) in the corresponding installation cavities;

in the packaging step, the light blocking layer (41) is formed in the accommodating groove in a dispensing manner.

7. The method for preparing a lamp bead according to any one of claims 1-4, wherein the chip (10) is a front-mounted chip (10A), and both electrodes of the chip (10) are electrically connected to the corresponding conductive blocks (21) by gold wires (13); or the chip (10) is a flip chip (10B) and is erected on two adjacent conductive blocks (21).

8. The method for preparing a lamp bead according to any one of claims 1-4, wherein the step of encapsulating further comprises:

and filling glue, namely filling fluorescent glue (42) between two adjacent light blocking layers (41), and enabling the fluorescent glue (42) to cover the chip (10).

9. A lamp bead (100), characterized by being made by the method of making a lamp bead according to any one of claims 1-8; the lamp bead (100) comprises the chip (10), an electric connection part (22) and a light blocking part (411); the chip (10) is electrically connected with the electric connection part (22) and is configured to emit light; the two light blocking parts (411) are respectively positioned at two sides of the chip (10) and connected with the power connection part (22);

wherein the electrode layer (20) can form the electrical connection part (22) through the cutting step, and the light blocking layer (41) can form the light blocking part (411) through the cutting step.

10. A backlight module, comprising a plurality of the lamp beads (100) of claim 9, and a circuit board, wherein each of the lamp beads (100) is electrically mounted on the circuit board.

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