JP2004235139A - Linear light source device and its manufacturing method, as well as surface light emitting device - Google Patents

Linear light source device and its manufacturing method, as well as surface light emitting device Download PDF

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JP2004235139A
JP2004235139A JP2003337207A JP2003337207A JP2004235139A JP 2004235139 A JP2004235139 A JP 2004235139A JP 2003337207 A JP2003337207 A JP 2003337207A JP 2003337207 A JP2003337207 A JP 2003337207A JP 2004235139 A JP2004235139 A JP 2004235139A
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light
light emitting
emitting element
guide plate
wiring board
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JP2003337207A
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JP4144498B2 (en
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Yoshihiko Josa
佳彦 帖佐
Tadaaki Ikeda
忠昭 池田
Koji Hidaka
浩司 日高
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2003337207A priority Critical patent/JP4144498B2/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to CNB2004800250853A priority patent/CN100466308C/en
Priority to KR1020067004024A priority patent/KR100732267B1/en
Priority to PCT/JP2004/000210 priority patent/WO2005031883A1/en
Priority to EP04702078A priority patent/EP1670069A4/en
Priority to US10/573,877 priority patent/US7455441B2/en
Priority to TW93102510A priority patent/TWI232598B/en
Publication of JP2004235139A publication Critical patent/JP2004235139A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

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  • Led Device Packages (AREA)
  • Liquid Crystal (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a linear light in which downsizing and thinning can be carried out, and which has high brightness and few unevenness of brightness. <P>SOLUTION: A plurality of light emitting elements 5 are arranged and installed along the longitudinal direction of a narrow square bar-shape printed circuit board 4, reflecting plates 6 are arranged at both sides of respective light emitting elements 5 so that they may become alternating with the light emitting element 5, counter faces 6a of the both reflecting plates 6 are made to incline so that opening area may become larger as it goes in the orientations of outgoing of each emitting element 5, a truncated cylinder-shape or truncated cone resin sealing layer 10 is formed by filling a light transmitting resin sealing material in a recess part formed by the printed circuit board 4, the light emitting elements 5, and the reflecting plates 6. The region from the end face adjacent to a mounting face of the printed circuit board 4 to the tip end part of the reflecting plates 6 is covered by a belt-shape reflecting member consisting of a reflecting sheet 1 or a vapor deposition film 12, and a rectangular cross-sectional face of the resin sealing layer 10 positioned between the tip end parts of the reflecting plates 6 is positioned on the same plane. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

本発明は、例えば、携帯電話、ディジタルカメラなどの液晶表示パネルのバックライトとして利用できる線状光源装置及びその製造方法、並びに、面発光装置に関する。   The present invention relates to a linear light source device that can be used as a backlight of a liquid crystal display panel such as a mobile phone and a digital camera, a method for manufacturing the same, and a surface light emitting device.

従来の光源装置及び面発光装置としては、例えば、図6及び図7に示すように、携帯電話やディジタルカメラなどの液晶表示部に敷設される幅広の下反射シート20と、下反射シート20の上面に、その一側の端部が下反射シート20の一側の端部から突出した導光板21と、導光板21の側面に対峙して設けられた光源部22と、導光板21の発光面の端部、及び、光源部22を上方から覆うべく一体化された上反射シート27とから構成されている。   As a conventional light source device and a surface light emitting device, for example, as shown in FIGS. 6 and 7, a wide lower reflection sheet 20 laid on a liquid crystal display unit such as a mobile phone or a digital camera, and a lower reflection sheet 20 are provided. A light guide plate 21 whose one end protrudes from one end of the lower reflection sheet 20 on the upper surface, a light source unit 22 provided to face a side surface of the light guide plate 21, and light emission of the light guide plate 21 It comprises an end of the surface and an upper reflection sheet 27 integrated so as to cover the light source unit 22 from above.

光源部22は、導光板21の突出した端部の下面にその一部が配された配線基板としての細長い平板形状のフレキシブル基板23と、該フレキシブル基板23の上面に、導光板21の側面に近設すべく並設された横長の直方体形状のケース24と、各ケース24に収納された発光素子(図示せず)と、ケース24に充填された透明の光透過性の樹脂封止層25とを備えている。   The light source unit 22 includes an elongated flat flexible substrate 23 as a wiring board, a part of which is disposed on the lower surface of the protruding end of the light guide plate 21, and an upper surface of the flexible substrate 23 and a side surface of the light guide plate 21. Horizontally long rectangular parallelepiped cases 24 juxtaposed to be close to each other, a light emitting element (not shown) stored in each case 24, and a transparent light-transmitting resin sealing layer 25 filled in the cases 24 And

各ケース24は、導光板21の側面に平行する面、即ち主光取出し面が開口されており、各ケース24の開口部から樹脂封止材が充填され、各ケース24の開口部が樹脂封止材によって閉塞されている。さらに、各ケース24の側面には、発光素子導通用のリード端子26が導出され、フレキシブル基板23の配線パターンに半田付けされて電気的に導通接続されている。   Each case 24 has an opening on a surface parallel to the side surface of the light guide plate 21, that is, a main light extraction surface. A resin sealing material is filled through the opening of each case 24, and the opening of each case 24 is sealed with a resin. It is closed by the stopper. Further, a lead terminal 26 for conducting a light emitting element is led out from a side surface of each case 24, and is soldered to a wiring pattern of the flexible substrate 23 and electrically connected to the wiring pattern.

そして、各ケース24の主光取出し面から発光素子の光が導光板21に入射すると共に、発光素子から発光し、ケース24を通して洩れた上下の光の成分を上反射シート27によって反射させて導光板21に入射させ、光を再利用し、導光板21の発光面の高輝度化を図っている。   Then, the light of the light emitting element enters the light guide plate 21 from the main light extraction surface of each case 24 and emits light from the light emitting element, and the upper and lower light components leaking through the case 24 are reflected by the upper reflection sheet 27 to be guided. Light is reused by making the light incident on the light plate 21 to increase the luminance of the light emitting surface of the light guide plate 21.

また、他の従来の面発光装置として、例えば、図8及び図9に示すように、発光素子32を収納する凹部31が導光板30の端部に設けられると共に、配線基板としての細長い平板状のフレキシブル基板33に搭載された発光素子32の主光取出し面が導光板30の発光面と同じ向きになるようにして導光板30の凹部31に没入され、さらに、発光素子32の周囲を封止すべく導光板30の凹部31に樹脂封止層34が形成され、加えて、前記凹部31の幅員を持つ上反射シート35が導光板30の発光面の端部に形成されると共に、前記凹部31を除いた導光板30の底面にドットパターン36が形成されている。   As another conventional surface emitting device, for example, as shown in FIGS. 8 and 9, a concave portion 31 for accommodating a light emitting element 32 is provided at an end of a light guide plate 30, and an elongated flat plate as a wiring board is provided. The main light extraction surface of the light emitting element 32 mounted on the flexible substrate 33 is immersed in the concave portion 31 of the light guide plate 30 so that the main light extraction surface is oriented in the same direction as the light emission surface of the light guide plate 30. A resin sealing layer 34 is formed in the concave portion 31 of the light guide plate 30 so as to be stopped. In addition, an upper reflection sheet 35 having a width of the concave portion 31 is formed at an end of a light emitting surface of the light guide plate 30, and A dot pattern 36 is formed on the bottom surface of the light guide plate 30 excluding the concave portion 31.

そして、発光素子32から側方に放出される光の成分の一部が上反射シート35により導光板30の内部側に反射され、さらに、導光板30において、発光素子32からの光及び上反射シート35からの反射光がドットパターン36により拡散されることによって、導光板30の発光面において一様な輝度の発光が得られるようになっている(例えば、特許文献1参照)。
特開2001−67917号公報(第3−6頁、図2及び図3)
Then, a part of the component of the light emitted from the light emitting element 32 to the side is reflected by the upper reflection sheet 35 toward the inside of the light guide plate 30. The reflected light from the sheet 35 is diffused by the dot pattern 36, so that light with uniform luminance can be obtained on the light emitting surface of the light guide plate 30 (for example, see Patent Document 1).
JP-A-2001-67917 (pages 3 to 6, FIGS. 2 and 3)

しかしながら、前者の面発光装置の場合、発光素子がケース24に収納されているため、発光素子の光がケース24の上下左右の各壁面によって遮られ、発光素子の配光特性が狭いためにホットスポットの原因となり、輝度むらが発生しやすい光源部22となっている。また、フレキシブル基板23の上に発光素子のリード端子26が半田付けされているため、面発光装置の高さ寸法Aが大きくなり、全体の薄型化が図れないという問題がある。   However, in the case of the former surface light emitting device, since the light emitting element is housed in the case 24, the light of the light emitting element is blocked by the upper, lower, left and right walls of the case 24, and the light distribution characteristic of the light emitting element is narrow, so that the hot light is emitted. The light source unit 22 causes spots and tends to cause uneven brightness. Further, since the lead terminals 26 of the light emitting elements are soldered on the flexible substrate 23, the height dimension A of the surface light emitting device is increased, and there is a problem that the overall thickness cannot be reduced.

しかも、発光素子が実装されたケース24をフレキシブル基板23上で半田付けするため、実装精度を向上させるのが容易ではなく、発光素子の光軸を、ケース24の主光取出し面(導光板21の側面)に対して直交するように設けるのが容易ではなく、各ケース24に収納された発光素子の横方向の光軸の位置と、導光板21の側面の長手方向の中心線の位置とがずれ易く、導光板21への光取込み効率が低下するという問題がある。   In addition, since the case 24 on which the light emitting element is mounted is soldered on the flexible substrate 23, it is not easy to improve the mounting accuracy, and the optical axis of the light emitting element is set to the main light extraction surface of the case 24 (the light guide plate 21). It is not easy to provide the light-emitting element housed in each case 24 at right angles to the position of the lateral optical axis of the light-emitting element housed in each case 24 and the position of the longitudinal center line of the side surface of the light guide plate 21. However, there is a problem that the light is easily shifted and the efficiency of taking light into the light guide plate 21 is reduced.

さらに、フレキシブル基板23が導光板21の端部まで延設されているため、下反射シート20による反射が低減されてしまい、導光板21への光取込み効率がより低くなるという問題がある。   Further, since the flexible substrate 23 extends to the end of the light guide plate 21, the reflection by the lower reflection sheet 20 is reduced, and there is a problem that the efficiency of taking light into the light guide plate 21 is further reduced.

加えて、フレキシブル基板23の大きさによって、光源部22の設置スペースの幅寸法Bが決定されるため、全体の小型化を図るのが難しいという問題がある。   In addition, the size B of the flexible substrate 23 determines the width B of the installation space of the light source unit 22, so that it is difficult to reduce the overall size.

また、発光素子の配光特性をケース24の側壁によって変えることには限度があるため、特に発光素子の使用数を削減した場合に、輝度むらが大きくなるという問題がある。   In addition, since there is a limit in changing the light distribution characteristics of the light emitting element depending on the side wall of the case 24, there is a problem that the luminance unevenness increases particularly when the number of light emitting elements used is reduced.

また、後者の面発光装置の場合、導光板30への光取込み効率を高くすることを考慮すると、発光素子32の光を導光板30の側面から直接入射させるのが好ましいと考えられる。   In addition, in the case of the latter surface light emitting device, it is preferable that the light of the light emitting element 32 be directly incident from the side surface of the light guide plate 30 in consideration of increasing the light capturing efficiency to the light guide plate 30.

さらに、発光素子32の光を上反射シート35に反射させるだけの空間を必要とするため、全体を薄型にするには制限されるような場合もある。   Further, since a space for reflecting the light of the light emitting element 32 to the upper reflection sheet 35 is required, there is a case where the whole is limited to be thin.

そこで、本発明は上記問題点に鑑み、全体の小型化及び薄型化を図ることができ、輝度の均一化及び輝度の向上が図れると共に、発光素子の使用数が変更されても、光源部の配光特性を自由に変えることによって、輝度むらを低減できる、線状光源とその製造方法、及び、面発光装置とその製造方法を提供することを目的とする。   In view of the above-described problems, the present invention can reduce the size and thickness of the light source unit even when the number of light emitting elements used is changed, while achieving uniform luminance and improving luminance. It is an object of the present invention to provide a linear light source and a method of manufacturing the same, and a surface light emitting device and a method of manufacturing the same, which can reduce luminance unevenness by freely changing light distribution characteristics.

上記課題を解決するために、本発明の線状光源装置は、請求項1に示す如く、複数の発光素子が、細長い角棒状の配線基板の長手方向に沿って所定の間隔をおいて配設されてダイボンディングされ、しかも、該各発光素子の両側に、且つ、各発光素子と交互に位置するように反射板が配設され、さらに、該両反射板の対向面が、各発光素子の出射方向に向かうにしたがって開口面積が大きくなるように傾斜してなるものである。   In order to solve the above-mentioned problems, a linear light source device according to the present invention, as described in claim 1, has a plurality of light emitting elements arranged at predetermined intervals along the longitudinal direction of a long and narrow rectangular rod-shaped wiring board. And a light-emitting element, and a reflecting plate is disposed on both sides of each light-emitting element and alternately positioned with each light-emitting element. It is inclined so that the opening area increases toward the emission direction.

したがって、従来のように、発光素子がケースに収納されずに配線基板に直接導通接続され、さらに、発光素子からの光が反射板によって拡散されながら放出されることになり、高輝度の線状光が得られるようになる。しかも、二つの反射板によって、光源部の配光特性の調整が容易に可能となり、発光素子の使用数が変更されても光源部の長手方向の輝度の均一化が図れると共に、高輝度で且つ輝度むらが少なくなる。   Therefore, unlike the conventional case, the light-emitting element is directly connected to the wiring board without being housed in the case, and the light from the light-emitting element is emitted while being diffused by the reflection plate. Light can be obtained. Moreover, the two reflectors make it easy to adjust the light distribution characteristics of the light source unit, and even when the number of light emitting elements used is changed, the luminance in the longitudinal direction of the light source unit can be made uniform, and high luminance and Brightness unevenness is reduced.

なお、細長い角棒状の配線基板として、厚みが若干大きな略平板状の配線基板も含むものとする。   The elongated rectangular rod-shaped wiring board also includes a substantially flat wiring board having a slightly large thickness.

また、請求項2に示す如く、反射板の対向面の形状を、矩形状又は台形状のいずれかにするようにしたものである。   According to a second aspect of the present invention, the shape of the opposing surface of the reflection plate is rectangular or trapezoidal.

例えば、反射板の対向面の形状が矩形状の場合、発光素子から放出される光が略直進することになり、幅小の線状光が得られる。一方、反射板の対向面の形状が台形状の場合、発光素子から放出される光が上下方向にやや拡散されることになり、やや幅広の高輝度な線状光が得られる。   For example, when the shape of the opposing surface of the reflection plate is rectangular, light emitted from the light emitting element travels substantially straight, and linear light with a small width is obtained. On the other hand, when the shape of the opposing surface of the reflector is trapezoidal, the light emitted from the light emitting element is slightly diffused in the up-down direction, so that a somewhat wide high-luminance linear light can be obtained.

さらに、請求項3に示す如く、光透過性の樹脂封止材を、配線基板の実装面と、発光素子と、両反射板の対向面とによって形成される凹部に充填し、樹脂封止層を形成するようにしてもよい。   Further, a concave portion formed by the mounting surface of the wiring board, the light emitting element, and the opposing surfaces of the two reflection plates is filled with a light-transmissive resin encapsulant. May be formed.

そうすれば、光透過性の樹脂封止材を、配線基板の実装面と、発光素子と、両反射板の対向面とによって形成される凹部に充填することで、該凹部の空気層が排除されて発光素子からの光の取込み効率がよくなる。また、各発光素子の周囲が樹脂封止材によって覆われることになり、発光素子が周囲の環境から保護される。この樹脂封止層の形状としては、例えば、台柱形状、台錐形状、円錐台形状が好ましい。なお、これら立体形状の各側面が曲面(円弧、波形状、凹凸)である場合も含むものとする。   Then, the air layer in the concave portion is eliminated by filling the concave portion formed by the light-transmitting resin sealing material with the mounting surface of the wiring board, the light emitting element, and the opposing surfaces of the two reflection plates. As a result, the efficiency of capturing light from the light emitting element is improved. Further, the periphery of each light emitting element is covered with the resin sealing material, and the light emitting element is protected from the surrounding environment. As the shape of the resin sealing layer, for example, a trapezoidal column, a truncated cone, or a truncated cone is preferable. In addition, it is assumed that each side surface of these three-dimensional shapes is a curved surface (arc, wavy shape, unevenness).

加えて、請求項4に示す如く、各樹脂封止層において、配線基板と両反射板とで形成される部位に位置する断面を鏡面化するのが好ましい。   In addition, as described in claim 4, in each resin sealing layer, it is preferable that a cross section located at a portion formed by the wiring board and the two reflection plates is mirror-finished.

この場合、発光素子から放出される光が、鏡面化された樹脂封止層の断面に反射されて、線状光を放出する樹脂封止層の断面に向けて集光されることになり、より高輝度の線状光が得られる。この樹脂封止層の断面の形状としては、例えば、台形状が好ましい。但し、台形状の斜辺が曲線であってもよい。   In this case, light emitted from the light-emitting element is reflected on the cross section of the mirror-finished resin sealing layer, and condensed toward the cross section of the resin sealing layer that emits linear light. Higher luminance linear light is obtained. The cross-sectional shape of the resin sealing layer is preferably, for example, trapezoidal. However, the oblique side of the trapezoid may be a curve.

また、請求項5に示す如く、各樹脂封止層において、両反射板の対向面の間に位置する断面を同一面に位置させるようにしたものである。   According to a fifth aspect of the present invention, in each of the resin sealing layers, the cross section located between the opposing surfaces of the two reflection plates is positioned on the same surface.

したがって、両反射板の対向面の間に位置する各樹脂封止層の断面が同一面に位置することで、略線状の光源部が簡単に構成できる。この樹脂封止層の断面の形状としては、例えば、矩形状、楕円形状、トラック形状のいずれであってもよい。要するに、全体として、略線状の光源部を構成できる形状であればよい。   Therefore, since the cross section of each resin sealing layer located between the opposing surfaces of both the reflection plates is located on the same surface, a substantially linear light source unit can be easily configured. The cross-sectional shape of the resin sealing layer may be, for example, any of a rectangular shape, an elliptical shape, and a track shape. In short, any shape may be used as long as it can constitute a substantially linear light source unit.

さらに、請求項6に示す如く、反射シート又は蒸着膜からなる反射部材を、配線基板の実装面に隣接する長手方向の両端面から各反射板の対向面の先端部にかけての領域に設けるのがよい。   Further, as set forth in claim 6, it is preferable that the reflection member made of a reflection sheet or a vapor-deposited film is provided in a region from both end surfaces in the longitudinal direction adjacent to the mounting surface of the wiring board to the front end of the opposing surface of each reflection plate. Good.

そうすれば、配線基板の軸線に対して直交する放出される発光素子からの光が、反射シート又は蒸着膜からなる反射部材によって反射されて、線状光を放出する樹脂封止層の断面に集光されることになり、より高輝度の線状光が得られる。   Then, the light emitted from the light emitting element perpendicular to the axis of the wiring board is reflected by the reflecting member formed of the reflective sheet or the vapor-deposited film to form a cross section of the resin sealing layer that emits linear light. The light is condensed, and linear light with higher luminance can be obtained.

また、本発明の線状光源装置の製造方法は、請求項7に示す如く、発光素子を配線基板に所定の間隔をおいて配列してダイボンディングし、つぎに、発光素子の出射方向に向かうにしたがって開口面積が大きくなるように傾斜した対向面を有する反射板を、各発光素子の両側に設け、続いて、光透過性の樹脂封止材を、配線基板の実装面と、発光素子と、反射板の傾斜面とで形成される凹部に充填し、さらに、反射板が、各発光素子の両側に、且つ、各発光素子と交互に位置するようにダイシングして角棒状にするようにしたものである。   In the method of manufacturing a linear light source device according to the present invention, the light emitting elements are arranged on the wiring board at predetermined intervals and die-bonded, and then the light emitting elements are directed in the emission direction of the light emitting elements. Reflector plates having opposing surfaces inclined so that the opening area increases in accordance with are provided on both sides of each light-emitting element, and then, a light-transmissive resin encapsulant is mounted on the mounting surface of the wiring board and the light-emitting element. , Into the recess formed by the inclined surface of the reflector, and further, the reflector is diced on both sides of each light emitting element, and so as to be alternately arranged with each light emitting element so as to form a square rod shape. It was done.

よって、全体形状が角棒状であることから薄型化及び小型化された機器内部に容易に内装できる。   Therefore, since the overall shape is a square rod shape, it can be easily installed inside a thinned and miniaturized device.

さらに、請求項8に示す如く、先端の断面が二等辺三角形状のブレードによって配線基板の裏側からダイシングし、角棒状の線状光源装置の断面を台形状に加工するようにしたものである。   Further, as shown in claim 8, the cross section of the tip is diced from the back side of the wiring board by an isosceles triangular blade, and the cross section of the rectangular linear light source device is processed into a trapezoidal shape.

そうすれば、高輝度な幅広の線状光を放出する線状光源装置が容易に得られる。   Then, a linear light source device that emits high-intensity wide linear light can be easily obtained.

そして、本発明の面発光装置は、請求項9に示す如く、配線基板に導通接続された発光素子と、該発光素子からの光を取り込んで略全面を発光面とする導光板とを備えた面発光装置において、該発光素子が配線基板にダイボンディングされ、さらに、発光素子の主光取出し面が導光板の側面に対して平行するように設けられてなるものである。   The surface light emitting device according to the present invention includes a light emitting element conductively connected to the wiring board and a light guide plate that receives light from the light emitting element and has a light emitting surface substantially over the entire surface. In the surface light emitting device, the light emitting element is die-bonded to a wiring board, and the main light extraction surface of the light emitting element is provided so as to be parallel to the side surface of the light guide plate.

したがって、従来のように、発光素子がケースに収納されずに配線基板に直接導通接続され、発光素子から導光板の側面に向かって放出される光が導光板に直接取り込まれることになり、発光強度が減衰されることなく高効率で発光素子からの光を導光板に入射できることになる。   Therefore, unlike the conventional case, the light emitting element is directly connected to the wiring board without being housed in the case, and light emitted from the light emitting element toward the side surface of the light guide plate is directly taken into the light guide plate. The light from the light emitting element can be incident on the light guide plate with high efficiency without the intensity being attenuated.

また、請求項10に示す如く、発光素子の主光取出し面の中心の位置と、導光板の側面の長手方向の中心線の位置とを同じ高さになるように設けることが好ましい。   Further, it is preferable that the center position of the main light extraction surface of the light emitting element and the position of the center line in the longitudinal direction of the side surface of the light guide plate be provided at the same height.

そうすれば、最も輝度の高いとされる発光素子からの光が導光板の側面を突き進むことになり、導光板への光取込み効率がより一層高くなる。   Then, light from the light-emitting element, which is considered to have the highest luminance, advances along the side surface of the light guide plate, so that the efficiency of capturing light into the light guide plate is further increased.

さらに、請求項11に示す如く、配線基板を導光板の厚みに合わせて角棒状に加工し、角棒状の配線基板の軸線を導光板の側面に対して平行するように配するのがよい。   Furthermore, it is preferable that the wiring board is processed into a rectangular rod shape according to the thickness of the light guide plate, and the axis of the rectangular rod-shaped wiring substrate is arranged parallel to the side surface of the light guide plate.

この場合、導光板の厚みに合わせて配線基板を加工することで、導光板の厚さが全体の厚さを決定することになり、面発光装置の薄型化が図れると共に、配線基板が角棒状であるため、配線基板の設置スペースが小さくなり、全体の小型化が図れるようになる。   In this case, by processing the wiring board in accordance with the thickness of the light guide plate, the thickness of the light guide plate determines the overall thickness, and the surface emitting device can be made thinner, and the wiring board has a square rod shape. Therefore, the installation space for the wiring board is reduced, and the overall size can be reduced.

以上説明したように、本発明の線状光源装置によれば、複数の発光素子を、細長い角棒状の配線基板の長手方向に沿って所定の間隔をおいて配設されてダイボンディングするようにしたので、実装精度に関係なく各発光素子の配光特性を広くとれる。しかも、該各発光素子の両側に、且つ、各発光素子と交互に位置するように反射板を配設し、両反射板の対向面を、各発光素子の出射方向に向かうにしたがって開口面積が大きくなるように傾斜したため、各発光素子間の光が重なるように拡散できる。   As described above, according to the linear light source device of the present invention, the plurality of light emitting elements are arranged at predetermined intervals along the longitudinal direction of the elongated rectangular rod-shaped wiring board and die-bonded. Therefore, the light distribution characteristics of each light emitting element can be widened regardless of the mounting accuracy. In addition, reflectors are provided on both sides of each light emitting element and alternately positioned with each light emitting element, and the opening area of the opposing surfaces of both reflectors increases in the emission direction of each light emitting element. Since the light is inclined so as to increase, the light between the light emitting elements can be diffused so as to overlap.

また、反射板の対向面の形状を、矩形状又は台形状のいずれかにするようにしたので、線状光の幅を容易に変更できる。   Further, since the shape of the opposing surface of the reflector is made to be either rectangular or trapezoidal, the width of the linear light can be easily changed.

さらに、光透過性の樹脂封止材を、配線基板の実装面と、発光素子と、両反射板の対向面とによって形成される凹部に充填して樹脂封止層を形成するようにしたので、輝度の向上と、発光素子の保護とを実現するのに有効である。   Further, the resin sealing layer is formed by filling a light transmitting resin sealing material into a concave portion formed by the mounting surface of the wiring substrate, the light emitting element, and the opposing surfaces of the two reflection plates. This is effective for improving the luminance and protecting the light emitting element.

加えて、各樹脂封止層において、配線基板と両反射板とで形成される部位に位置する断面を鏡面化したり、両反射板の対向面の間に位置する断面を同一面に位置させたりすることで、光の取込み効率のよい線状の光源部を簡単に構成できる効果がある。   In addition, in each resin sealing layer, a cross section located at a portion formed by the wiring board and the two reflection plates is mirror-finished, or a cross section located between opposing surfaces of the two reflection plates is positioned on the same surface. By doing so, there is an effect that a linear light source unit having good light capturing efficiency can be easily configured.

さらに、反射シート又は蒸着膜からなる反射部材を、配線基板の実装面に隣接する長手方向の両端面から各反射板の対向面の先端部にかけての領域に設けることで、より高輝度の線状光を得ることができる。   Furthermore, by providing a reflective member made of a reflective sheet or a vapor-deposited film in a region from both longitudinal end surfaces adjacent to the mounting surface of the wiring board to the front end of the opposing surface of each reflective plate, a linear line with higher luminance can be obtained. Light can be obtained.

また、本発明の線状光源装置の全体の形状を、角棒状に加工するようにしたので、薄型化及び小型化された携帯電話やディジタルカメラなどの収納部に容易に内装できる。   In addition, since the entire shape of the linear light source device of the present invention is processed into a square rod shape, the linear light source device can be easily housed in a thin and small storage unit such as a mobile phone or a digital camera.

さらに、角棒状の線状光源装置の断面を台形状に加工すれば、幅広の線状光を放出でき、輝度を向上させるのに効果的である。   Further, if the cross section of the rectangular rod-shaped linear light source device is processed into a trapezoidal shape, a wide linear light can be emitted, which is effective for improving the luminance.

そして、本発明の面発光装置によれば、発光素子をダイボンディングして細長い角棒状の配線基板に実装すると共に、ダイボンディングされた発光素子の主光取出し面を導光板の側面に対して平行するようにしたため、導光板への光取込み効率を向上することができる効果がある。   According to the surface emitting device of the present invention, the light emitting element is die-bonded and mounted on the elongated rectangular rod-shaped wiring board, and the main light extraction surface of the die-bonded light emitting element is parallel to the side surface of the light guide plate. Therefore, there is an effect that the efficiency of taking light into the light guide plate can be improved.

また、発光素子の主光取出し面の中心の位置と、導光板の側面の長手方向の中心線の位置とを同じ高さになるように設け、最も輝度の高いとされる発光素子からの光を導光板の側面から取り込むようにしたので、導光板の発光面の輝度が向上するのに有効である。   In addition, the position of the center of the main light extraction surface of the light emitting element and the position of the center line in the longitudinal direction of the side surface of the light guide plate are provided at the same height, and light from the light emitting element which is considered to have the highest luminance is provided. Is taken in from the side surface of the light guide plate, which is effective for improving the luminance of the light emitting surface of the light guide plate.

さらに、配線基板を導光板の厚みに合わせて角棒状に加工すると共に、配線基板の軸線を導光板の側面に対して平行するように配すれば、全体の薄型化、及び、全体の小型化を図るのに効果的である。   Furthermore, if the wiring substrate is processed into a square rod shape according to the thickness of the light guide plate and the axis of the wiring substrate is arranged so as to be parallel to the side surface of the light guide plate, the overall thickness is reduced and the overall size is reduced. It is effective for planning.

本発明を実施するための最良の形態として、以下の実施例1及び実施例2につき、図1〜図9を参照して説明する。   As the best mode for carrying out the present invention, the following first and second embodiments will be described with reference to FIGS.

本発明の線状光源装置の概要について説明する。複数の発光素子を、細長い角棒状の配線基板の長手方向に沿って配設し、各発光素子の両側に、各発光素子と交互になるように反射板を配置し、しかも、両反射板の対向面を、各発光素子の出射方向に向かうにしたがって開口面積が大きくなるように傾斜させ、さらに、配線基板、発光素子、両反射板によって形成される凹部に光透過性の樹脂封止材を充填し、該凹部における空気層を排除し、加えて、配線基板の実装面に隣接する端面から反射板の先端部にかけての領域を、帯状の反射部材によって被覆すると共に、反射板の先端部間に位置する樹脂封止層の矩形状の断面を同一面に位置させて、高輝度で且つ輝度むらの少ない線状の光源を得るようにしたものである。   The outline of the linear light source device of the present invention will be described. A plurality of light emitting elements are arranged along the longitudinal direction of the elongated rectangular rod-shaped wiring board, and on both sides of each light emitting element, a reflector is arranged so as to be alternate with each light emitting element. The facing surface is inclined so that the opening area increases toward the emission direction of each light-emitting element, and furthermore, a light-transmissive resin sealing material is provided in the recess formed by the wiring board, the light-emitting element, and the two reflection plates. Filling, eliminating the air layer in the concave portion, and in addition, covering the area from the end face adjacent to the mounting surface of the wiring board to the tip of the reflector with a belt-shaped reflecting member, and between the tip of the reflector. Are arranged on the same plane to obtain a linear light source with high luminance and less luminance unevenness.

本発明の線状光源装置の構成につき、図1〜図3を参照して説明する。図1(A)は本発明の実施例1に係る線状光源装置の斜視図、(B)は反射シートが設けられた線状光源の側断面図、(C)は、蒸着膜が設けられた線状光源の側断面図を示し、図2(A)は複数の発光素子が配線基板に配設された状態の斜視図、(B)は発光素子がダイボンディングされた状態の斜視図、(C)は、反射体が配線基板に貼着された状態の斜視図、(D)は図2(C)の一部を拡大した状態の斜視図、(E)は、樹脂封止材が充填された状態の斜視図、(F)は、ダイシングされる状態の斜視図を示し、図3(A)は先端部の形状が二等辺三角形のブレードによって配線基板の裏側からダイシングされる状態の側断面図、(B)は樹脂封止層が台錐形状の線状光源の斜視図、(C)は図3(B)の側断面図を示す。   The configuration of the linear light source device of the present invention will be described with reference to FIGS. FIG. 1A is a perspective view of a linear light source device according to a first embodiment of the present invention, FIG. 1B is a side sectional view of a linear light source provided with a reflection sheet, and FIG. 2A is a perspective view showing a state in which a plurality of light emitting elements are arranged on a wiring board, FIG. 2B is a perspective view showing a state in which the light emitting elements are die-bonded, FIG. 2C is a perspective view showing a state in which the reflector is attached to the wiring board, FIG. 2D is a perspective view showing a state in which a part of FIG. 2C is enlarged, and FIG. FIG. 3 (F) is a perspective view of a state in which dicing is performed, and FIG. 3 (A) is a state in which dicing is performed from the back side of the wiring substrate by a blade having a tip having an isosceles triangular shape. FIG. 3B is a side sectional view, FIG. 3B is a perspective view of a linear light source having a truncated cone-shaped resin sealing layer, and FIG. 3C is a side sectional view of FIG.

図1〜図3に示すように、本発明の線状光源装置は、細長い角棒状の配線基板としてのプリント基板4と、該プリント基板4に所定の間隔をおいて並設された複数の発光素子5と、該各発光素子5の左右の両側に形成された反射板6と、該反射板6、及び、プリント基板4の間に形成された台柱状の凹部7に充填されて形成された光透過性の樹脂封止層10と、プリント基板4の上面及び下面から反射板6の先端部にかけて貼着された反射部材としての帯状の反射シート101とから構成されている。   As shown in FIGS. 1 to 3, the linear light source device according to the present invention includes a printed board 4 as an elongated rectangular rod-shaped wiring board, and a plurality of light emitting devices arranged in parallel on the printed board 4 at predetermined intervals. The element 5, a reflector 6 formed on both left and right sides of each light emitting element 5, and a columnar recess 7 formed between the reflector 6 and the printed board 4 are formed to be filled. It comprises a light-transmissive resin sealing layer 10 and a belt-shaped reflection sheet 101 as a reflection member adhered from the upper and lower surfaces of the printed circuit board 4 to the tip of the reflection plate 6.

プリント基板4は、図2(A)に示す平面視四角形状のプリント基板40が、図1(A)に示すように、ダイシングによって細長く角棒状に形成されたもので、その上面(実装面)には、複数の発光素子5が、細長い角棒状のプリント基板4の長手方向に沿って所定の間隔をおいて一列に配設されている。さらに、プリント基板4の両端部から各発光素子5に通電するための+及び−の電極端子がそれぞれ導出されている(図示せず)。   As shown in FIG. 1A, the printed circuit board 4 is formed by forming a rectangular printed circuit board 40 shown in FIG. 2A into an elongated rectangular bar shape by dicing as shown in FIG. , A plurality of light emitting elements 5 are arranged in a line at predetermined intervals along the longitudinal direction of the elongated rectangular bar-shaped printed board 4. Further, from both ends of the printed circuit board 4, + and-electrode terminals for supplying electricity to the respective light emitting elements 5 are respectively led out (not shown).

発光素子5は、例えば、GaN系化合物半導体を利用した白色発光のもので、透明のサファイア基板に積層したn型層及びp型層のそれぞれの表面に、n型電極及びp型電極が形成され、該両電極は、ワイヤ9によって、プリント基板4の配線パターンにダイボンディングされ、蛍光体を含有する透明樹脂で被覆された各発光素子5が電気的に直列接続されている。   The light-emitting element 5 emits white light using, for example, a GaN-based compound semiconductor. An n-type electrode and a p-type electrode are formed on the respective surfaces of an n-type layer and a p-type layer laminated on a transparent sapphire substrate. The two electrodes are die-bonded to the wiring pattern of the printed circuit board 4 by wires 9, and the light emitting elements 5 covered with a transparent resin containing a phosphor are electrically connected in series.

反射板6は、図2(D)に示すように、台柱形状及び山形状の突条体61,62を複数有する反射体60が、図1(A)に示すように、発光素子5の両側に、且つ、各発光素子5と交互に位置するように板状にダイシングされている。そして、ダイシングされた反射板6の厚み寸法と、細長い角棒状のプリント基板4の厚み寸法とが同一寸法になっている(例えば、0.3〜1.0mm)。さらに、各発光素子5の両側に位置する反射板6の傾斜面(対向面)6a,6aが、発光方向に向かうにしたがって開口面積が大きくなるように形成されており、各発光素子5の光が反射板6の傾斜面6a,6aに反射され、且つ、拡散されながら発光することになる。したがって、輝度の乏しい各発光素子5の間においては、拡散された各発光素子5の入射光が重なり合うことで、輝度が均一になる。この反射板6の傾斜面6a,6aの形状は矩形状で、その傾斜角度は、輝度むらをなくすべく適宜調整可能である。   As shown in FIG. 2D, a reflector 60 having a plurality of pillar-shaped and mountain-shaped ridges 61 and 62 is provided on both sides of the light emitting element 5 as shown in FIG. The plate is diced so as to be alternately arranged with the light emitting elements 5. Then, the thickness of the diced reflector 6 and the thickness of the elongated rectangular rod-shaped printed board 4 are the same (for example, 0.3 to 1.0 mm). Further, the inclined surfaces (opposed surfaces) 6a, 6a of the reflection plate 6 located on both sides of each light emitting element 5 are formed so that the opening area becomes larger in the light emitting direction. Is reflected by the inclined surfaces 6a of the reflection plate 6, and emits light while being diffused. Therefore, between the light emitting elements 5 having low luminance, the diffused incident light of each light emitting element 5 overlaps, so that the luminance becomes uniform. The shape of the inclined surfaces 6a, 6a of the reflecting plate 6 is rectangular, and the angle of inclination can be appropriately adjusted to eliminate uneven brightness.

樹脂封止層10は、エポキシ樹脂などの透明の樹脂封止材が充填されて形成されている。そして、この樹脂封止層10が、プリント基板4、発光素子5、反射板6によって形成される凹部7に注入充填される際、樹脂封止材が充填された凹部7の空気層は排除されることになり、発光素子5からの光の取込み効率がよくなる。   The resin sealing layer 10 is formed by filling a transparent resin sealing material such as an epoxy resin. When the resin sealing layer 10 is injected and filled into the recess 7 formed by the printed board 4, the light emitting element 5, and the reflection plate 6, the air layer in the recess 7 filled with the resin sealing material is removed. As a result, the efficiency of capturing light from the light emitting element 5 is improved.

さらに、樹脂封止層10は、台柱形状を呈し、発光素子5を有するプリント基板4の実装面と同一形状の断面と、両反射板の傾斜面と同一形状の断面と、プリント基板4の端縁部と、両反射板6の傾斜面6a,6aの端縁部とで形成される部位に位置する台形状の断面と、両反射板6の傾斜面6a,6aの先端部間に位置する矩形状の断面とを備えている。さらに、各樹脂封止層10の台形状の断面は鏡面化されて反射効率がよくなると共に、各樹脂封止層10の矩形状の断面は同一面に位置して線状の発光面が形成されることになる。   Further, the resin sealing layer 10 has a trapezoidal shape, and has a cross section having the same shape as the mounting surface of the printed board 4 having the light emitting element 5, a cross section having the same shape as the inclined surfaces of both the reflection plates, and an end of the printed board 4. A trapezoidal section located at a portion formed by the edge and the end surfaces of the inclined surfaces 6a, 6a of both reflectors 6, and a tip portion of the inclined surfaces 6a, 6a of both reflectors 6. And a rectangular cross section. Further, the trapezoidal cross section of each resin sealing layer 10 is mirror-finished to improve reflection efficiency, and the rectangular cross section of each resin sealing layer 10 is located on the same plane to form a linear light emitting surface. Will be.

反射シート101は、鏡面状のテープ、又は、白色などの光反射率の高いテープ状のもので、プリント基板4の実装面に隣接する端面(上面及び下面)から反射板6の傾斜面6a,6aの先端部にかけての領域が覆われることになる。このため、発光素子5から上下方向に放出する光が余すことなく両反射シート101で反射されて前方に集光されて線状に発光されることになる。   The reflection sheet 101 is a mirror-like tape or a tape-like tape having a high light reflectance such as white, and has an inclined surface 6 a of the reflection plate 6 from an end surface (upper surface and lower surface) adjacent to the mounting surface of the printed circuit board 4. The area extending to the tip of 6a is covered. For this reason, the light emitted in the vertical direction from the light emitting element 5 is reflected by the two reflection sheets 101 without any excess, is collected forward, and is emitted linearly.

つぎに線状光源装置の使用態様について説明する。プリント基板4の配線パターンを介して各発光素子5に通電されると、各発光素子5の半導体層の中の活性層から光が放出される。活性層からの光は、発光素子5の主光取出し面、即ちワイヤ9をダイボンディングする電極を形成した面から放射状に放出される。   Next, the usage of the linear light source device will be described. When current is applied to each light emitting element 5 via the wiring pattern of the printed circuit board 4, light is emitted from an active layer in the semiconductor layer of each light emitting element 5. Light from the active layer is radially emitted from the main light extraction surface of the light emitting element 5, that is, the surface on which the electrode for die bonding the wire 9 is formed.

発光素子5から放出される光のうち、上下方向の光は、反射シート101によって反射されて前方へ進み、前方向の光は、そのまま直進し、左右方向の光は、両側の反射板6の傾斜面6a,6aに反射されると共に、拡散されて前方へ進むことになる。そして、左右方向の光が拡散されることで、各発光素子5の間の輝度が補間されて輝度の均一化が図れる。さらに、各発光素子5を樹脂封止することで、光の取込み効率が高くなり、輝度が向上する。   Of the light emitted from the light emitting element 5, the light in the up and down direction is reflected by the reflection sheet 101 and travels forward, the light in the forward direction goes straight as it is, and the light in the left and right direction passes through the reflection plates 6 on both sides. The light is reflected by the inclined surfaces 6a, 6a, diffused, and proceeds forward. Then, by diffusing the light in the left-right direction, the luminance between the light emitting elements 5 is interpolated, and the luminance can be made uniform. Furthermore, by encapsulating each light emitting element 5 with resin, the light capturing efficiency is increased and the luminance is improved.

つぎに線状光源装置の製造方法について説明する。例えば、白色のガラスBT(ビスマレイミド トリアジン)銅張積層基板に導電パターンを形成する。そして、LCP(液晶ポリマー)、PPA(ポリフタルアミド)などの樹脂を用いて反射板(実施例においては反射板6の傾斜面6a)を成形する。つぎに、図2(A)に示すように、平面視四角形状のプリント基板40の実装面に発光素子5を配列し、各発光素子5を接着剤によって機械的に取り付ける。その後、図2(B)に示すように、発光素子5をダイボンディングして電気的に接続を行い、続いて、図2(C)に示すように、成形された反射体60を接着剤などによってプリント基板40に貼り合わせる。この反射体60は、図2(D)に示すように、両端部には、断面が台形状の突条体61が形成され、両端部の突条体61の間には、断面が山形状の複数の突条体62が形成されている。さらに、図2(E)に示すように、透明の樹脂封止材10を、プリント基板4と反射板6の傾斜面6a,6aとによって形成された凹部7に充填して発光素子5を封止する。つぎに、図2(F)に示すように、平面視四角形状のプリント基板40を細長い角棒状になるようにダイシングを行う。その後、細長い角棒状のプリント基板4の端縁部と、両反射板6の傾斜面6a,6aの端縁部とで形成される部位に位置する各樹脂封止層の台形状の断面を鏡面化する。例えば、粒度が800番以上のブレードを選択し、回転スピードを20,000〜30,000rpmとすると共に、切削スピードを5mm/secとして鏡面化を行う。その他、研磨材によって鏡面化を行うようにしてもよい。つぎに、反射シート101によって、プリント基板4の実装面に隣接する端面(上面及び下面)から反射板6の傾斜面6a,6aの先端部にかけての領域を覆う。   Next, a method for manufacturing the linear light source device will be described. For example, a conductive pattern is formed on a white glass BT (bismaleimide triazine) copper-clad laminate substrate. Then, a reflecting plate (in the embodiment, the inclined surface 6a of the reflecting plate 6) is formed using a resin such as LCP (liquid crystal polymer) and PPA (polyphthalamide). Next, as shown in FIG. 2A, the light emitting elements 5 are arranged on the mounting surface of the printed board 40 having a rectangular shape in plan view, and each light emitting element 5 is mechanically attached with an adhesive. After that, as shown in FIG. 2B, the light emitting element 5 is electrically connected by die bonding, and then, as shown in FIG. To the printed circuit board 40. As shown in FIG. 2 (D), the reflector 60 has a ridge 61 having a trapezoidal cross section at both ends, and a mountain-shaped cross section between the ridges 61 at both ends. Are formed. Further, as shown in FIG. 2 (E), a transparent resin sealing material 10 is filled in the concave portion 7 formed by the printed board 4 and the inclined surfaces 6a, 6a of the reflector 6, and the light emitting element 5 is sealed. Stop. Next, as shown in FIG. 2 (F), dicing is performed on the printed circuit board 40 having a square shape in plan view so as to have an elongated rectangular bar shape. After that, the trapezoidal cross section of each resin sealing layer located at a portion formed by the edge of the elongated rectangular rod-shaped printed circuit board 4 and the edge of the inclined surfaces 6a, 6a of both reflectors 6 is mirror-finished. Become For example, a blade having a grain size of 800 or more is selected, the rotation speed is set to 20,000 to 30,000 rpm, and the cutting speed is set to 5 mm / sec to perform mirror finishing. In addition, mirror polishing may be performed using an abrasive. Next, the reflection sheet 101 covers an area from the end surface (upper surface and lower surface) adjacent to the mounting surface of the printed circuit board 4 to the distal end portions of the inclined surfaces 6a, 6a of the reflection plate 6.

なお、前記実施例1の場合、反射シート101によって、プリント基板4の実装面に隣接する端面(上面及び下面)から反射板6の傾斜面6a,6aの先端部にかけての領域を覆うようにしたが、図1(C)に示すように、当該領域を銀やアルミニウムからなる蒸着膜12によって覆うようにしてもよい。この場合、スパッタ若しくは真空蒸着によって数ミクロン程度の薄膜が形成される。そして、反射シート101と同様に、輝度の向上が図れる。また、鏡面化した後に、蒸着膜12を形成してもよい。   In the case of the first embodiment, the reflection sheet 101 covers the region from the end surface (upper surface and lower surface) adjacent to the mounting surface of the printed circuit board 4 to the end portions of the inclined surfaces 6a, 6a of the reflection plate 6. However, as shown in FIG. 1C, the region may be covered with a deposition film 12 made of silver or aluminum. In this case, a thin film of about several microns is formed by sputtering or vacuum evaporation. Then, similarly to the reflection sheet 101, the luminance can be improved. Further, the vapor deposition film 12 may be formed after mirror finishing.

さらに、前記実施例1の場合、反射板6の傾斜面6a,6aを矩形状にすると共に、樹脂封止層の形状を台柱形状にしたが、図3(A)に示すように、先端部が二等辺三角形状のブレード15によって、プリント基板4の裏側からダイシングして、反射板6の傾斜面6a,6aを台形状にすると共に、樹脂封止層の形状を台錐形状にしてもよい(図3(B)参照)。この場合、図3(C)に示すように、図1(B)及び(C)の場合に比して、上下左右方向に広角に拡散されることになり、高輝度な幅広の線状の発光面が形成されることになる。また、反射板6の傾斜面6a,6aが台形状で、樹脂封止層の形状が台錐形状であっても、樹脂封止層の断面の鏡面化、反射シート101の貼着、蒸着膜12の形成はいずれも可能である。   Further, in the case of the first embodiment, the inclined surfaces 6a, 6a of the reflection plate 6 are rectangular, and the shape of the resin sealing layer is columnar. However, as shown in FIG. May be diced by the isosceles triangular blade 15 from the back side of the printed circuit board 4 to make the inclined surfaces 6a, 6a of the reflection plate 6 trapezoidal, and the shape of the resin sealing layer to a truncated cone shape. (See FIG. 3B). In this case, as shown in FIG. 3C, compared to the case of FIGS. 1B and 1C, the light is diffused in a wide angle in the vertical, horizontal, and horizontal directions, and a wide line with high luminance is obtained. A light emitting surface will be formed. Even if the inclined surfaces 6a and 6a of the reflecting plate 6 are trapezoidal and the shape of the resin sealing layer is a truncated cone, the cross section of the resin sealing layer is mirror-finished, the reflecting sheet 101 is adhered, and the deposition film is formed. 12 can be formed.

本発明の面発光装置の概要について説明する。ダイボンディングされた発光素子の主光取出し面、及び、発光素子がダイボンディングされた配線基板を、導光板の側面に平行させることで、導光板の光取込み効率を向上させ、しかも、二つの反射板を、発光素子の両側に、導光板の側面に向かうにしたがって開口面積が大きくなるように傾斜して配設し、導光板の側面の長手方向に沿って放出される発光素子の光を導光板に取り込み、さらに、配線基板、発光素子、二枚の反射板によって形成される凹部に樹脂封止材を充填し、該凹部における空気層を排除し、加えて、導光板の一方の発光面から配線基板までの領域を平板状の反射シートによって被覆すると共に、導光板の他方の発光面の端部から配線基板までの領域を帯状の反射シートによって被覆し、導光板の発光面の輝度の向上、及び、輝度の均一化を図るようにしたものである。   The outline of the surface emitting device of the present invention will be described. The main light extraction surface of the die-bonded light-emitting element and the wiring substrate to which the light-emitting element is die-bonded are parallel to the side surface of the light guide plate, so that the light guide efficiency of the light guide plate is improved, and two reflections are provided. The plates are arranged on both sides of the light emitting element so as to be inclined so that the opening area increases toward the side surface of the light guide plate, and guide the light of the light emitting element emitted along the longitudinal direction of the side surface of the light guide plate. It is taken into the light plate, and further, a concave portion formed by the wiring board, the light emitting element, and the two reflective plates is filled with a resin sealing material to eliminate an air layer in the concave portion, and additionally, one light emitting surface of the light guide plate. And the area from the end of the other light emitting surface of the light guide plate to the wiring board is covered with a band-shaped reflective sheet, and the brightness of the light emitting surface of the light guide plate is covered. Improvement, Beauty, is obtained by the so achieve uniform brightness.

つぎに本発明の面発光装置の構成について図4及び図5を参照して説明する。図4は本発明の実施例2に係る面発光装置の斜視図、図5は発光素子の実装部分を、導光板とプリント基板の取付け構造と共に示す要部の縦断面図であり、これらの図において、図1〜図3と同一符号であるものは同一もしくは相当するものとする。図4及び図5に示すように、本発明の面発光装置は、平面視矩形状の下反射シート1と、該下反射シート1の上面においてその一側の端部を除く部位に貼着された平板状の導光板2と、下反射シート1の一側の端部に、且つ、導光板2の側面に沿って設けられた線状の光源部3と、線状の光源部3及び導光板2の上面、即ち発光面の端部を覆うべく貼着された細長い帯状の上反射シート11とから構成されている。   Next, the configuration of the surface light emitting device of the present invention will be described with reference to FIGS. FIG. 4 is a perspective view of a surface light emitting device according to Embodiment 2 of the present invention, and FIG. 5 is a longitudinal sectional view of a main part showing a mounting portion of a light emitting element together with a mounting structure of a light guide plate and a printed circuit board. , The same reference numerals as those in FIGS. 1 to 3 are the same or equivalent. As shown in FIGS. 4 and 5, the surface light-emitting device of the present invention is adhered to a lower reflective sheet 1 having a rectangular shape in a plan view and a portion of the upper surface of the lower reflective sheet 1 except for an end on one side thereof. A flat light guide plate 2, a linear light source unit 3 provided at one end of the lower reflection sheet 1 and along the side surface of the light guide plate 2, a linear light source unit 3, It comprises an elongated strip-shaped upper reflection sheet 11 adhered to cover the upper surface of the light plate 2, that is, the end of the light emitting surface.

下反射シート1は、例えば、鏡面状のテープ、又は、白色などの光反射率の高いテープ状のもので、下反射シート1によって、導光板2からプリント基板4までの領域、即ち、導光板2の一方の発光面からプリント基板4の下面が覆われることになる。このため、線状の光源部3から下方向に放出する光が下反射シート1で反射されて導光板2の中に戻される。   The lower reflection sheet 1 is, for example, a mirror-like tape or a tape-like tape having a high light reflectance such as white, and the lower reflection sheet 1 causes an area from the light guide plate 2 to the printed circuit board 4, that is, the light guide plate. The lower surface of the printed circuit board 4 is covered from one of the two light emitting surfaces. Therefore, light emitted downward from the linear light source unit 3 is reflected by the lower reflection sheet 1 and returned to the light guide plate 2.

導光板2は、例えば、アクリル樹脂やポリカーボネイト樹脂によって0.3〜1.0mmの厚みに形成された透明の板であり、導光板2の上方に設けられる液晶表示パネル(図示せず)の下面に沿って配置される。   The light guide plate 2 is a transparent plate formed of, for example, an acrylic resin or a polycarbonate resin to a thickness of 0.3 to 1.0 mm, and a lower surface of a liquid crystal display panel (not shown) provided above the light guide plate 2. It is arranged along.

線状の光源部3は、その軸線が導光板2の側面に平行するように設けられた配線基板としての細長い角棒状のプリント基板4と、導光板2の側面に対峙するプリント基板4の側面に、導光板2の側面に沿って所定の間隔をおいて並設された発光素子5と、各発光素子5の間に配設された平面視台形状の反射板6と、プリント基板4、発光素子5、反射板6により形成される断面が略台形状の凹部7に設けられた樹脂封止層10とを備えている。   The linear light source unit 3 includes an elongated rectangular rod-shaped printed board 4 as a wiring board provided with its axis parallel to the side surface of the light guide plate 2, and a side surface of the printed board 4 facing the side surface of the light guide plate 2. A light emitting element 5 arranged side by side at a predetermined interval along the side surface of the light guide plate 2, a reflecting plate 6 having a trapezoidal shape in a plan view disposed between the light emitting elements 5, a printed board 4, It has a resin sealing layer 10 provided in a recess 7 having a substantially trapezoidal cross section formed by the light emitting element 5 and the reflection plate 6.

プリント基板4は、発光素子5をマトリックス状に実装した平板状のプリント基板が、導光板2の厚みに合わせてダイシングされており、ダイシングされたプリント基板4において、各発光素子5が横一列に並んでいる。このプリント基板4の厚さは導光板2の厚さと略同一であり、面発光装置の厚さ寸法Aが決定される。この厚さ寸法Aは、図7に示す面発光装置の厚さ寸法Aに比して大幅に小さくなっている。さらに、プリント基板4の両端部から発光素子5に通電するための+及び−の電極端子8a,8bがそれぞれ導出されて、該両電極端子8a,8bは、携帯電話などの機器側の回路(図示せず)に導通接続される。   The printed circuit board 4 has a flat printed circuit board on which the light emitting elements 5 are mounted in a matrix shape, and is diced according to the thickness of the light guide plate 2. In the diced printed circuit board 4, each light emitting element 5 is arranged in a horizontal line. Lined up. The thickness of the printed circuit board 4 is substantially the same as the thickness of the light guide plate 2, and the thickness dimension A of the surface light emitting device is determined. The thickness A is significantly smaller than the thickness A of the surface light emitting device shown in FIG. Further, + and-electrode terminals 8a and 8b for conducting electricity to the light emitting element 5 are respectively derived from both ends of the printed circuit board 4, and the both electrode terminals 8a and 8b are connected to a circuit (e.g. (Not shown).

各発光素子5は、プリント基板4の配線パターンにダイボンディングされ、その主光取出し面が、導光板2の側面に対して平行するように並設され、しかも、並設された各発光素子5の横方向の光軸が同一直線状に位置すると共に、導光板2の側面の長手方向の中心線と同一高さの位置で対峙している。   Each light emitting element 5 is die-bonded to the wiring pattern of the printed circuit board 4 and its main light extraction surface is arranged side by side so as to be parallel to the side surface of the light guide plate 2. Are located in the same straight line and at the same height as the longitudinal center line of the side surface of the light guide plate 2.

反射板6は、その両側の傾斜面6a,6aが反射板として発光素子5の両側方に位置し、導光板2の側面に向かうにしたがって開口面積が大きくなるように形成されており、各発光素子5の光が反射板6の傾斜面6aに反射され、且つ、拡散されながら導光板2の側面から入射することになる。したがって、各発光素子5の入射光が広角に拡散されて導光板2の側面から入射するため、導光板2において、輝度の乏しい各発光素子5の間においては、拡散された各発光素子5の入射光が重なり合うことで、線状の光源部3の輝度が均一になり、導光板2における面発光の輝度が略均一になる。この反射板6の傾斜面6aの傾斜角度は、導光板2の輝度むらをなくすべく適宜調整可能である。   The reflecting plate 6 is formed such that the inclined surfaces 6a, 6a on both sides thereof are located on both sides of the light emitting element 5 as reflecting plates, and the opening area increases toward the side surface of the light guide plate 2. The light of the element 5 is reflected from the inclined surface 6 a of the reflection plate 6 and enters from the side surface of the light guide plate 2 while being diffused. Therefore, since the incident light of each light emitting element 5 is diffused at a wide angle and enters from the side surface of the light guide plate 2, in the light guide plate 2, between each light emitting element 5 having low brightness, When the incident lights overlap, the luminance of the linear light source unit 3 becomes uniform, and the luminance of the surface light emission in the light guide plate 2 becomes substantially uniform. The angle of inclination of the inclined surface 6a of the reflection plate 6 can be appropriately adjusted so as to eliminate uneven brightness of the light guide plate 2.

樹脂封止層10は、エポキシ樹脂などの透明の樹脂封止材が充填されて形成されている。そして、この樹脂封止材が、プリント基板4、発光素子5、反射板6によって形成される凹部7に注入充填される際、樹脂が充填された凹部7の空気層は排除されることになり、発光素子5から導光板2への光の取込み効率がよくなる。   The resin sealing layer 10 is formed by filling a transparent resin sealing material such as an epoxy resin. Then, when this resin sealing material is injected and filled into the concave portion 7 formed by the printed board 4, the light emitting element 5, and the reflecting plate 6, the air layer of the concave portion 7 filled with the resin is eliminated. In addition, the efficiency of capturing light from the light emitting element 5 to the light guide plate 2 is improved.

上反射シート11は、下反射シート1と同一の材質が使用されており、導光板2の端部からプリント基板4までの領域、即ち導光板2における発光素子5側の端部、発光素子5の上方、反射板6の上面、プリント基板4の上面がそれぞれ覆われることになる。このため、下反射シート1及び上反射シート11によって、上下方向に放出される各発光素子5の光が、導光板2と線状の光源部3との隙間からの光の漏れがないように反射されることになり、各発光素子5からの光を余すことなく導光板2に入射できるようになっている。また、上反射シート11からプリント基板4が露呈せず、上反射シート11の幅寸法Bが、光源部3の設置スペースの幅寸法となっているため、図7に示す面発光装置の光源部22の設置スペースの幅寸法Bに比して大幅に縮小されている。   The upper reflective sheet 11 is made of the same material as the lower reflective sheet 1, and is a region from the end of the light guide plate 2 to the printed circuit board 4, that is, the end of the light guide plate 2 on the light emitting element 5 side, the light emitting element 5 , The upper surface of the reflector 6 and the upper surface of the printed circuit board 4 are respectively covered. Therefore, the light of each light emitting element 5 emitted in the vertical direction by the lower reflection sheet 1 and the upper reflection sheet 11 does not leak from the gap between the light guide plate 2 and the linear light source unit 3. As a result, the light from each light emitting element 5 can be incident on the light guide plate 2 without any excess. Further, since the printed board 4 is not exposed from the upper reflection sheet 11 and the width dimension B of the upper reflection sheet 11 is the width dimension of the installation space of the light source section 3, the light source section of the surface light emitting device shown in FIG. 22 is significantly reduced in comparison with the width B of the installation space.

つぎに面発光装置の使用態様について説明する。プリント基板4の配線パターンを介して各発光素子5に通電されると、各発光素子5の半導体層の中の活性層から光が放出される。活性層からの光は、発光素子5の主光取出し面、即ちワイヤ9をダイボンディングする電極を形成した面から放出される。   Next, a usage mode of the surface light emitting device will be described. When current is applied to each light emitting element 5 via the wiring pattern of the printed circuit board 4, light is emitted from an active layer in the semiconductor layer of each light emitting element 5. Light from the active layer is emitted from the main light extraction surface of the light emitting element 5, that is, the surface on which the electrode for die bonding the wire 9 is formed.

導光板2の側面に対して直交する方向に放出される光は、導光板2の中をそのまま進み、導光板2の側面に対して平行して放出される光は、両側の反射板6の傾斜面6a,6aによって、導光板2に戻され、各発光素子5の主光取出し面から上下方向にそれぞれ放出される光は、上反射シート11及び下反射シート1によって導光板2に戻される。   The light emitted in the direction orthogonal to the side surface of the light guide plate 2 proceeds through the light guide plate 2 as it is, and the light emitted in parallel to the side surface of the light guide plate 2 The light returned to the light guide plate 2 by the inclined surfaces 6 a and 6 a and emitted vertically from the main light extraction surface of each light emitting element 5 is returned to the light guide plate 2 by the upper reflection sheet 11 and the lower reflection sheet 1. .

このように、各発光素子5から放射される光が導光板2に取り込まれて、導光板2の発光面の輝度むらがなく、導光板2の発光面の輝度の均一化が図れる。加えて、各発光素子5を樹脂封止することで、導光板2への光取込み効率が高くなり、輝度が向上する。   As described above, the light emitted from each light emitting element 5 is taken into the light guide plate 2, so that the light emission surface of the light guide plate 2 has no uneven brightness and the light emission surface of the light guide plate 2 can have uniform brightness. In addition, by encapsulating each light emitting element 5 with resin, the efficiency of capturing light into the light guide plate 2 increases, and the luminance improves.

つぎに面発光装置の製造方法について説明する。まず、線状の光源部3では、例えば、白色のガラスBT(ビスマレイミド トリアジン)銅張積層基板に導電パターンを形成する。そして、LCP(液晶ポリマー)、PPA(ポリフタルアミド)などの樹脂を用いて反射板(実施例においては反射板6の傾斜面6a)を成形し、接着剤などによってプリント基板4に反射板を貼り合わせる。その後、所定の位置に発光素子5を接着剤によって機械的に取り付ける。つぎに、発光素子5をダイボンディングして電気的に接続を行い、発光素子5を透明樹脂にて封止した後、導光板2の厚みに合わせてプリント基板4を角棒状にダイシングし、製品の分割を行う。   Next, a method for manufacturing the surface light emitting device will be described. First, in the linear light source unit 3, for example, a conductive pattern is formed on a white glass BT (bismaleimide triazine) copper-clad laminate substrate. Then, a reflecting plate (in the embodiment, the inclined surface 6a of the reflecting plate 6) is formed using a resin such as LCP (liquid crystal polymer) or PPA (polyphthalamide), and the reflecting plate is mounted on the printed circuit board 4 with an adhesive or the like. to paste together. Thereafter, the light emitting element 5 is mechanically attached to a predetermined position by an adhesive. Next, the light emitting element 5 is electrically connected by die bonding, the light emitting element 5 is sealed with a transparent resin, and then the printed circuit board 4 is diced into a square rod shape in accordance with the thickness of the light guide plate 2. Is divided.

つぎに、平板状の下反射シート1の端部を除く部位に導光板2を貼着し、角棒状のプリント基板4、及び、各発光素子5の主光取出し面を導光板2の側面に対して平行するように設け、導光板2の一方の発光面からプリント基板4までの領域を平板状の下反射シート1によって被覆すると共に、導光板2の他方の発光面の端部からプリント基板4までの領域を帯状の上反射シート11によって被覆する。   Next, the light guide plate 2 is adhered to a portion excluding the end of the flat lower reflection sheet 1, and the main light extraction surface of the square rod-shaped printed board 4 and each light emitting element 5 is attached to the side surface of the light guide plate 2. The area from one light-emitting surface of the light guide plate 2 to the printed board 4 is covered with the flat lower reflective sheet 1 and the other end of the light-emitting plate of the light guide plate 2 is connected to the printed board. Up to four areas are covered with a belt-shaped upper reflection sheet 11.

なお、前記実施例の場合、平面視台形状の反射板6の傾斜面6a,6aを利用したが、図示に限定されるものではなく、平面視三角形状の反射板6の傾斜面6a,6aを利用してもよく、細長く切断加工された反射板を用いてもよい。また、いずれの反射板6も角度調整な構成にするのが好ましい。要するに、反射板6の形状や角度は、各発光素子5の光を効率よく反射して、隣り合う発光素子5,5の光が重なり合う領域を大きくすることで、導光板2において、光の乏しい各発光素子5,5の間の輝度を補完し、導光板2の面発光の輝度を略均一にできればよい。   In the above embodiment, the inclined surfaces 6a, 6a of the reflecting plate 6 having a trapezoidal shape in a plan view are used, but the present invention is not limited to the illustration, and the inclined surfaces 6a, 6a of the reflecting plate 6 having a triangular shape in a plan view are used. May be used, and a long and thin reflecting plate may be used. In addition, it is preferable that each of the reflection plates 6 is configured to be adjustable in angle. In short, the shape and angle of the reflector 6 are such that the light of each light emitting element 5 is efficiently reflected and the area where the light of the adjacent light emitting elements 5 and 5 overlaps is enlarged, so that the light guide plate 2 has poor light. It suffices if the brightness between the light emitting elements 5 and 5 can be complemented and the brightness of the surface light emission of the light guide plate 2 can be made substantially uniform.

また、光透過性の樹脂封止層10に、ガラスビーズなどの光分散材を混合させ、導光板2の輝度特性を高めることも可能である。   Further, it is also possible to increase the luminance characteristics of the light guide plate 2 by mixing a light dispersing material such as glass beads into the light-transmitting resin sealing layer 10.

さらに、前記実施例では、帯状の上反射シート11によって導光板2の略端部からプリント基板4までの領域を覆うようにしたが、導光板2の周縁部からプリント基板4までの領域をコ字形状、又は、枠状の上反射シートによって覆うようにしてもよい。   Further, in the above embodiment, the region from the edge of the light guide plate 2 to the printed circuit board 4 is covered by the belt-shaped upper reflection sheet 11, but the region from the peripheral edge of the light guide plate 2 to the printed circuit board 4 is covered. You may make it cover with a character-shaped or frame-shaped upper reflective sheet.

本発明の線状光源装置及び面発光装置は、例えば、小型化及び薄型化された携帯電話やディジタルカメラなどの液晶表示パネルのバックライトとして利用でき、高輝度で且つ輝度むらの少ない表示部と成り得る。   The linear light source device and the surface light emitting device of the present invention can be used as, for example, a backlight of a liquid crystal display panel such as a miniaturized and thinned mobile phone or a digital camera, and has a display portion with high luminance and less luminance unevenness. Can be made.

(A)は、本発明の実施例1に係る線状光源装置の斜視図、(B)は、反射シートが設けられた線状光源装置の側断面図、(C)は、蒸着膜が設けられた線状光源装置の側断面図(A) is a perspective view of the linear light source device according to the first embodiment of the present invention, (B) is a side cross-sectional view of the linear light source device provided with the reflection sheet, and (C) is provided with a deposition film. Sectional view of the linear light source device (A)は、複数の発光素子が配線基板に配設された状態の斜視図、(B)は、発光素子がダイボンディングされた状態の斜視図、(C)は、反射体が配線基板に貼着された状態の斜視図、(D)は、図2(C)の一部を拡大した状態の斜視図、(E)は、樹脂封止材が充填された状態の斜視図、(F)は、ダイシングされる状態の斜視図(A) is a perspective view showing a state in which a plurality of light emitting elements are arranged on a wiring board; (B) is a perspective view showing a state in which the light emitting elements are die-bonded; FIG. 2D is a perspective view showing a state where a part of FIG. 2C is enlarged, FIG. 2E is a perspective view showing a state where a resin sealing material is filled, and FIG. ) Is a perspective view of the dicing state (A)は、先端部の形状が二等辺三角形のブレードによって配線基板の裏側からダイシングされる状態の側断面図、(B)は、樹脂封止層が台錐形状の線状光源の斜視図、(C)は、図3(B)の側断面図(A) is a side cross-sectional view of a state in which the tip portion is diced from the back side of the wiring board by an isosceles triangular blade, and (B) is a perspective view of a linear light source having a resin sealing layer having a truncated cone shape. , (C) is a side sectional view of FIG. 本発明の実施例2に係る面発光装置の斜視図FIG. 4 is a perspective view of a surface emitting device according to a second embodiment of the present invention. 発光素子の実装部分を、導光板とプリント基板の取付け構造と共に示す要部の縦断面図Longitudinal sectional view of the main part showing the mounting part of the light emitting element together with the mounting structure of the light guide plate and the printed circuit board 従来例の面発光装置の斜視図Perspective view of a conventional surface emitting device 発光素子の実装部分を、導光板とフレキシブル基板の取付け構造と共に示す要部の縦断面図Longitudinal sectional view of the main part showing the mounting part of the light emitting element together with the mounting structure of the light guide plate and the flexible substrate 他の従来例の面発光装置の一部切欠側面図Partially cutaway side view of another conventional surface emitting device 発光素子の実装部分を、導光板とフレキシブル基板の取付け構造と共に示す要部の縦断面図Longitudinal sectional view of the main part showing the mounting part of the light emitting element together with the mounting structure of the light guide plate and the flexible substrate

符号の説明Explanation of reference numerals

1、20 下反射シート
2、21、30 導光板
3、22 光源部
4 プリント基板(配線基板)
5、32 発光素子
6 反射板
6a 傾斜面(反射板)
7 凹部
8a,8b 電極端子
9 ワイヤ
10、25、34 樹脂封止層
11、27、35 上反射シート
12 蒸着膜
15 ブレード
23、33 フレキシブル基板(配線基板)
24 ケース
26 リード端子
31 凹部
36 ドットパターン
40 プリント基板
60 反射体
61 突条体
62 突条体
101 反射シート
A 面発光装置の厚さ寸法
B 光源部の設置スペースの幅寸法
1,20 lower reflection sheet 2,21,30 light guide plate 3,22 light source 4 printed circuit board (wiring board)
5, 32 Light-emitting element 6 Reflector 6a Inclined surface (reflector)
7 Depression 8a, 8b Electrode terminal 9 Wire 10, 25, 34 Resin sealing layer 11, 27, 35 Upper reflective sheet 12 Deposited film 15 Blade 23, 33 Flexible board (wiring board)
Reference Signs List 24 case 26 lead terminal 31 recess 36 dot pattern 40 printed board 60 reflector 61 ridge 62 ridge 101 reflection sheet A thickness of surface light emitting device B width of light source unit installation space

Claims (11)

複数の発光素子が、細長い角棒状の配線基板の長手方向に沿って所定の間隔をおいて配設されてダイボンディングされ、しかも、該各発光素子の両側に、且つ、各発光素子と交互に位置するように反射板が配設され、さらに、該両反射板の対向面が、各発光素子の出射方向に向かうにしたがって開口面積が大きくなるように傾斜してなることを特徴とする線状光源装置。 A plurality of light emitting elements are arranged at predetermined intervals along the longitudinal direction of the elongated rectangular rod-shaped wiring board and die-bonded, and on both sides of each light emitting element, and alternately with each light emitting element. A reflection plate is disposed so as to be positioned, and the opposing surfaces of the two reflection plates are inclined such that the opening area increases toward the emission direction of each light emitting element. Light source device. 反射板の対向面の形状が、矩形状又は台形状のいずれかであることを特徴とする請求項1に記載の線状光源装置。 The linear light source device according to claim 1, wherein the shape of the opposing surface of the reflection plate is one of a rectangular shape and a trapezoidal shape. 光透過性の樹脂封止材が、配線基板の実装面と、発光素子と、両反射板の対向面とによって形成される凹部に充填されて樹脂封止層が形成されてなることを特徴とする請求項1又は2に記載の線状光源装置。 A resin sealing layer is formed by filling a concave portion formed by a light-transmitting resin sealing material with a mounting surface of a wiring board, a light-emitting element, and an opposing surface of both reflectors. The linear light source device according to claim 1. 前記各樹脂封止層において、配線基板と両反射板とで形成される部位に位置する断面が鏡面化されてなることを特徴とする請求項3に記載の線状光源装置。 4. The linear light source device according to claim 3, wherein in each of the resin sealing layers, a cross section located at a portion formed by the wiring board and the two reflection plates is mirror-finished. 5. 前記各樹脂封止層において、両反射板の対向面の間に位置する断面が同一面に位置してなることを特徴とする請求項3又は4に記載の線状光源装置。 5. The linear light source device according to claim 3, wherein in each of the resin sealing layers, a cross section located between opposing surfaces of both the reflection plates is located on the same surface. 6. 配線基板の実装面に隣接する長手方向の両端面から各反射板の対向面の先端部にかけての領域には、反射シート又は蒸着膜からなる反射部材が設けられてなることを特徴とする請求項1乃至5のいずれか1項に記載の線状光源装置。 A reflection member comprising a reflection sheet or a vapor-deposited film is provided in a region from both end surfaces in the longitudinal direction adjacent to the mounting surface of the wiring board to a front end portion of the opposing surface of each reflection plate. The linear light source device according to any one of claims 1 to 5. 発光素子を配線基板に所定の間隔をおいて配列してダイボンディングし、つぎに、発光素子の出射方向に向かうにしたがって開口面積が大きくなるように傾斜した対向面を有する反射板を、各発光素子の両側に設け、続いて、光透過性の樹脂封止材を、配線基板の実装面と、発光素子と、反射板の傾斜面とで形成される凹部に充填し、さらに、反射板が、各発光素子の両側に、且つ、各発光素子と交互に位置するようにダイシングして角棒状にすることを特徴とする線状光源装置の製造方法。 The light emitting elements are arranged on the wiring board at predetermined intervals and die-bonded. Next, a reflecting plate having a facing surface inclined so that the opening area becomes larger toward the emission direction of the light emitting element is formed by each light emitting element. Provided on both sides of the element, subsequently, a light-transmissive resin sealing material is filled into the concave portion formed by the mounting surface of the wiring board, the light-emitting element, and the inclined surface of the reflector, and further, the reflector is A method of manufacturing a linear light source device, wherein dicing is performed on both sides of each light emitting element and alternately with each light emitting element to form a square rod shape. 先端の断面が二等辺三角形状のブレードによって配線基板の裏側からダイシングし、角棒状の線状光源装置の断面を台形状に加工することを特徴とする請求項7に記載の線状光源装置の製造方法。 8. The linear light source device according to claim 7, wherein the cross section of the tip is diced from the back side of the wiring board by an isosceles triangular blade, and the cross section of the square rod-shaped linear light source device is processed into a trapezoidal shape. Production method. 配線基板に導通接続された発光素子と、該発光素子からの光を取り込んで略全面を発光面とする導光板とを備えた面発光装置において、該発光素子が配線基板にダイボンディングされ、さらに、発光素子の主光取出し面が導光板の側面に対して平行するように設けられてなることを特徴とする面発光装置。 In a surface-emitting device including a light-emitting element conductively connected to a wiring board and a light guide plate that takes in light from the light-emitting element and has a substantially entire light-emitting surface, the light-emitting element is die-bonded to the wiring board. And a main light extraction surface of the light emitting element is provided so as to be parallel to a side surface of the light guide plate. 発光素子の主光取出し面の中心の位置と、導光板の側面の長手方向の中心線の位置とが同一高さになるように設けられてなることを特徴とする請求項1に記載の面発光装置。 The surface according to claim 1, wherein the center position of the main light extraction surface of the light emitting element and the position of the center line in the longitudinal direction of the side surface of the light guide plate are provided at the same height. Light emitting device. 前記配線基板は、導光板の厚みに合わせて角棒状に加工され、角棒状の配線基板の軸線が導光板の側面に対して平行するように配されてなることを特徴とする請求項1又は2に記載の面発光装置。 The said wiring board is processed in the shape of a square rod according to the thickness of a light-guide plate, and is arrange | positioned so that the axis of a square-bar-shaped wiring board may become parallel with the side surface of a light-guide plate. 3. The surface emitting device according to 2.
JP2003337207A 2002-10-01 2003-09-29 Linear light source device, method for manufacturing the same, and surface light emitting device Expired - Fee Related JP4144498B2 (en)

Priority Applications (7)

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JP2003337207A JP4144498B2 (en) 2002-10-01 2003-09-29 Linear light source device, method for manufacturing the same, and surface light emitting device
KR1020067004024A KR100732267B1 (en) 2003-09-29 2004-01-14 Linear light source and production method therefor and surface emission device
PCT/JP2004/000210 WO2005031883A1 (en) 2003-09-29 2004-01-14 Linear light source and production method therefor and surface emission device
EP04702078A EP1670069A4 (en) 2003-09-29 2004-01-14 Linear light source and production method therefor and surface emission device
CNB2004800250853A CN100466308C (en) 2003-09-29 2004-01-14 Linear light source and production method therefor and surface emission device
US10/573,877 US7455441B2 (en) 2003-09-29 2004-01-14 Linear light source, method for manufacturing the same and surface emitting device
TW93102510A TWI232598B (en) 2002-10-01 2004-02-04 Linear light source apparatus, its manufacturing method and surface light-emitting apparatus

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