CN114137768A - Thin film flip chip packaging structure, manufacturing method thereof and display device - Google Patents
Thin film flip chip packaging structure, manufacturing method thereof and display device Download PDFInfo
- Publication number
- CN114137768A CN114137768A CN202111454697.6A CN202111454697A CN114137768A CN 114137768 A CN114137768 A CN 114137768A CN 202111454697 A CN202111454697 A CN 202111454697A CN 114137768 A CN114137768 A CN 114137768A
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- Prior art keywords
- circuit board
- flexible circuit
- chip
- driving chip
- display device
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
- G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
Abstract
A chip-on-film package structure and a manufacturing method thereof, and a display device, wherein a first heat dissipation paste is pasted on a first surface of a flexible circuit board and a driving chip to achieve a good heat dissipation effect, in addition, the chip-on-film package structure further comprises a bubble area surrounding the driving chip, in order to reduce the area of the bubble area, the method further comprises the step of placing the flexible circuit board pasted with the first heat dissipation paste into a vacuum defoaming machine for defoaming, so that the area of the bubble area and the temperature of the driving chip during operation are effectively reduced, and the stability of the display device is further improved.
Description
[ technical field ] A method for producing a semiconductor device
The present disclosure relates to the field of display, and more particularly, to a chip-on-film package, a method for manufacturing the same, and a display device.
[ background of the invention ]
In the field of Liquid Crystal Display (LCD) panels, the design of a full-screen has become the mainstream of a smart phone, and in order to realize a display screen with a narrow frame, people try to arrange a driver chip at different positions in the display screen, and there are two mainstream packaging methods of the driver chip in the market at present, which are a Chip On Glass (COG) packaging technology and a Chip On Film (COF) packaging technology.
The COG packaging technology is to directly bind the driver chip around the glass surface of the display screen, and this packaging mode can greatly reduce the volume of the whole LCD module and has the advantages of high yield, low cost and favorable mass production.
The COF packaging technology is also called as a chip on film packaging technology, and binds a driving chip on a flexible circuit board connected with a display screen, and because the flexible circuit board can be bent to the back of the display screen, a space for arranging the driving chip is not required to be reserved around the flexible circuit board, compared with the COG packaging technology, the COF packaging technology can make a frame of the display panel narrower, and further realize higher screen occupation ratio.
[ summary of the invention ]
The application provides a manufacturing method of a chip-on-film package structure, which comprises the following steps: s1, providing a flexible circuit board, wherein a first surface of the flexible circuit board is provided with a pin; s2, providing a driving chip, wherein the driving chip is provided with a bump; s3, bonding the pins of the flexible circuit board with the bumps of the driving chip; s4, attaching a first heat dissipation paste on the first surface of the flexible circuit board and the driving chip; s5, placing the flexible circuit board into a vacuum defoaming machine for defoaming; the chip-on-film package structure further comprises a bubble area surrounding the driving chip.
Further, after the step S5 is completed, the method further includes the following steps: and S6, drying the flexible circuit board.
Furthermore, the area of the bubble area is less than or equal to 50mm 245mm and more than or equal to 18mm 200 mm.
Further, the step S4 further includes: and attaching a second heat dissipation paste on a second surface of the flexible circuit board opposite to the first surface of the flexible circuit board.
The present application further provides a chip on film package structure, including: a flexible circuit board; the pins are arranged on the first surface of the flexible circuit board; the driving chip is provided with a bump and is jointed with the pin of the flexible circuit board through the bump; the first heat dissipation paste is pasted on the first surface of the flexible circuit board and the driving chip; the chip-on-film package structure further comprises a bubble area surrounding the driving chip.
Furthermore, the area of the bubble area is less than or equal to 50mm 245mm and more than or equal to 18mm 200 mm.
Furthermore, a second heat dissipation patch is attached to a second surface of the flexible circuit board opposite to the first surface of the flexible circuit board.
The present application also provides a display device, including: a display screen; and
the thin film flip chip packaging structure is connected with the display screen.
Furthermore, the area of the bubble area is less than or equal to 50mm 245mm and more than or equal to 18mm 200 mm.
Furthermore, a second heat dissipation patch is attached to a second surface of the flexible circuit board opposite to the first surface of the flexible circuit board.
The beneficial effect of this application lies in: the application provides a chip on film packaging structure and preparation method, display device cover first heat dissipation through pasting at the first surface of flexible circuit board and driver chip and paste in order to reach good radiating effect, in addition, chip on film packaging structure still includes encircleing driver chip's bubble district, for reducing the area in bubble district, this application still include with paste with first heat dissipation pastes flexible circuit board puts into the vacuum and takes off the step that the bubble machine carries out the deaeration, has reduced effectively the area in bubble district and the temperature of driver chip when the operation, and then has increased display device's efficiency stability.
In order to make the aforementioned and other objects of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
[ description of the drawings ]
Fig. 1 is a schematic flow chart illustrating a method for fabricating a chip-on-film package structure according to an embodiment of the present disclosure.
Fig. 2 is a schematic top view of a chip-on-film package structure according to an embodiment of the present disclosure.
Fig. 3 is a schematic side view of a chip-on-film package structure according to an embodiment of the present disclosure.
Fig. 4 is a schematic structural diagram of a display device according to an embodiment of the present application.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In this application, the use of directional words such as "upper" and "lower" in the absence of a contrary indication generally refers to upper and lower in the actual use or operating condition of the device.
The embodiments of the present application provide a chip on film package, a method for manufacturing the same, and a display device, which are described in detail below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
Referring to fig. 1-3, an embodiment of the present application provides a method for manufacturing a chip on film package 1, including the following steps:
s1, providing a flexible circuit board 10, wherein a first surface of the flexible circuit board 10 is provided with a pin 11; s2, providing a driving chip 12, wherein the driving chip 12 is provided with a bump 13; s3, bonding the leads 11 of the flexible circuit board 10 to the bumps 13 of the driver chip 12; s4, attaching a first heat sink 14 on the first surface of the flexible circuit board 10 and the driving chip 12; s5, placing the flexible circuit board 10 into a vacuum defoaming machine for defoaming; the chip-on-film package 1 further includes a bubble region 15 surrounding the driving chip 12.
The flip-chip on film package structure 1 may be applied to a display device such as a Liquid Crystal Display (LCD) and an organic light-emitting diode (OLED), during operation of the display device, a temperature of the driving chip 12 increases, and if the temperature of the driving chip 12 is too high, performance of the display device will be affected, and a usage experience will be affected, so in this embodiment, the first heat dissipation paste 14 is pasted on the driving chip 12 to reduce the temperature of the driving chip 12, however, referring to fig. 3, since the flexible circuit board 10 and the driving chip 12 are connected through the pins 11 and the bumps 13, a height difference exists between the flexible circuit board 10 and the driving chip 12, and due to the height difference, the first heat dissipation paste 14 cannot be completely attached to the driving chip 12, therefore, the bubble region 15 is formed in the gap between the flexible circuit board 10, the driving chip 12 and the first heat dissipation patch 14, however, the bubble region 15 may reduce the heat dissipation effect of the first heat dissipation patch 14, and therefore, the area of the bubble region 15 needs to be reduced as much as possible, in this embodiment, the area of the bubble region 15 can be greatly reduced by placing the flexible circuit board 10 into a vacuum defoaming machine for defoaming, and it is actually measured that if a vacuum defoaming step is not performed, the area of the bubble region 15 is about 50mm 245mm, the temperature of the flexible circuit board 10 is about 135 ℃ when the display device is operated, and after the vacuum defoaming step is performed, the area of the bubble region 15 can be reduced to 18mm 200mm, and the temperature of the flexible circuit board 10 is about 115 ℃ when the display device is operated, and thus, the flexible circuit board 10 is subjected to the vacuum defoaming step, the area of the bubble region 15 is significantly reduced, and the heat dissipation effect of the first heat dissipation patch 14 is effectively improved, thereby increasing the performance stability of the display device.
In order to avoid that the flexible circuit board 10 absorbs excessive water vapor after vacuum degassing and further affects the yield of the chip on film package structure 1, in another embodiment, after the step S5 is completed, the method may further include the following steps: and S6, drying the flexible circuit board 10.
In order to further reduce the temperature of the flexible circuit board 10, the step S4 may further include: and attaching a second heat dissipation paste on a second surface of the flexible circuit board 10 opposite to the first surface of the flexible circuit board 10. By attaching a layer of heat dissipation paste to both the upper surface and the lower surface of the flexible circuit board 10, a better heat dissipation effect is achieved.
It should be noted that, during the vacuum defoaming step, the temperature inside the vacuum defoaming machine needs to be lower than the storage temperature of the thin film flip chip package structure 1, and the cleanliness inside the vacuum defoaming machine needs to be ensured to prevent the pins 11 of the flexible circuit board 10 from being contaminated, thereby causing problems such as poor electrical contact.
Referring to fig. 2-3, another embodiment of the present application further provides a chip on film package structure 1, including: a flexible circuit board 10; the pins 11 are arranged on the first surface of the flexible circuit board 10; a driving chip 12 provided with a bump 13, the driving chip 12 being joined to the lead 11 of the flexible circuit board 10 through the bump 13; the first heat dissipation paste 14 is pasted on the first surface of the flexible circuit board 10 and the driving chip 12; the chip-on-film package 1 further includes a bubble region 15 surrounding the driving chip 12.
The flip-chip on film package structure 1 can be applied to a display device such as a liquid crystal display and an organic light emitting diode display, and during the operation of the display device, the temperature of the driving chip 12 will increase, and if the temperature of the driving chip 12 is too high, the performance of the display device will be affected, and the usage experience of the user will be affected, so in this embodiment, the first heat dissipation patch 14 is attached to the driving chip 12 to reduce the temperature of the driving chip 12, in this embodiment, the area of the bubble region 15 is between 50mm 245mm to 18mm 200mm, and when the display device operates, the temperature of the flexible circuit board 10 is between 115 ℃ to 135 ℃.
In another embodiment of the present application, a second heat dissipation patch is attached to a second surface of the flexible circuit board 10 opposite to the first surface of the flexible circuit board 10. By attaching a layer of heat dissipation paste to both the upper surface and the lower surface of the flexible circuit board 10, a better heat dissipation effect is achieved.
Referring to fig. 4, the present application further provides a display device, including: a display screen 2; and the chip-on-film package 1 provided by the above embodiments connected to the display screen 2.
The application provides a chip on film packaging structure and preparation method, display device cover first heat dissipation through pasting at the first surface of flexible circuit board and driver chip and paste in order to reach good radiating effect, in addition, chip on film packaging structure still includes encircleing driver chip's bubble district, for reducing the area in bubble district, this application still include with paste with first heat dissipation pastes flexible circuit board puts into the vacuum and takes off the step that the bubble machine carries out the deaeration, has reduced effectively the area in bubble district and the temperature of driver chip when the operation, and then has increased display device's efficiency stability. The foregoing describes in detail a chip-on-film package structure, a method for manufacturing the same, and a display device provided in the embodiments of the present application, and a specific example is applied in the description to explain the principles and embodiments of the present application, and the description of the foregoing embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A method for manufacturing a chip on film package structure is characterized by comprising the following steps:
s1, providing a flexible circuit board, wherein a first surface of the flexible circuit board is provided with a pin;
s2, providing a driving chip, wherein the driving chip is provided with a bump;
s3, bonding the pins of the flexible circuit board with the bumps of the driving chip;
s4, attaching a first heat dissipation paste on the first surface of the flexible circuit board and the driving chip; and
s5, placing the flexible circuit board into a vacuum defoaming machine for defoaming;
the chip-on-film package structure further comprises a bubble area surrounding the driving chip.
2. The method for manufacturing the chip-on-film package structure according to claim 1, further comprising the following steps after the step S5 is completed:
and S6, drying the flexible circuit board.
3. The method of claim 1, wherein the area of the bubble region is less than or equal to 50mm x 245mm and greater than or equal to 18mm x 200 mm.
4. The method for manufacturing the chip-on-film package structure according to claim 1, wherein the step S4 further includes: and attaching a second heat dissipation paste on a second surface of the flexible circuit board opposite to the first surface of the flexible circuit board.
5. A chip-on-film package manufactured by the method according to claim 1, comprising:
a flexible circuit board;
the pins are arranged on the first surface of the flexible circuit board;
the driving chip is provided with a bump and is jointed with the pin of the flexible circuit board through the bump; and
the first heat dissipation paste is pasted on the first surface of the flexible circuit board and the driving chip;
the chip-on-film package structure further comprises a bubble area surrounding the driving chip.
6. The COF package of claim 5, wherein the area of the bubble region is 50mm x 245mm and 18mm x 200 mm.
7. The COF package structure of claim 5, wherein a second heat sink is attached to a second surface of the flexible circuit board opposite to the first surface of the flexible circuit board.
8. A display device, comprising:
a display screen; and
the COF package of claim 5 connected to the display screen.
9. The display device according to claim 8, wherein an area of the bubble region is 50mm × 245mm or less and 18mm × 200mm or more.
10. The display device according to claim 8, wherein a second surface of the flexible circuit board opposite to the first surface of the flexible circuit board is coated with a second heat dissipation paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111454697.6A CN114137768A (en) | 2021-12-01 | 2021-12-01 | Thin film flip chip packaging structure, manufacturing method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111454697.6A CN114137768A (en) | 2021-12-01 | 2021-12-01 | Thin film flip chip packaging structure, manufacturing method thereof and display device |
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| Publication Number | Publication Date |
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| CN114137768A true CN114137768A (en) | 2022-03-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111454697.6A Pending CN114137768A (en) | 2021-12-01 | 2021-12-01 | Thin film flip chip packaging structure, manufacturing method thereof and display device |
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| CN (1) | CN114137768A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114721188A (en) * | 2022-03-29 | 2022-07-08 | 颀中科技（苏州）有限公司 | Forming method of flip chip packaging structure, flip chip packaging structure and display device |
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| KR20200141321A (en) * | 2019-06-10 | 2020-12-18 | 주식회사 실리콘웍스 | Heat radiating chip on film package |
| CN212485303U (en) * | 2020-07-31 | 2021-02-05 | 河南烯力新材料科技有限公司 | Thin film flip chip packaging structure and display device |
| CN212783419U (en) * | 2020-07-31 | 2021-03-23 | 河南烯力新材料科技有限公司 | Thin film flip chip packaging structure and display device |
| CN213459708U (en) * | 2019-11-26 | 2021-06-15 | Nepes株式会社 | Heat sink for chip on film package |
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- 2021-12-01 CN CN202111454697.6A patent/CN114137768A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101131988A (en) * | 2006-08-22 | 2008-02-27 | 南茂科技股份有限公司 | Radiating type thin-film flip-chip packaging construction |
| JP2009302384A (en) * | 2008-06-16 | 2009-12-24 | Seiko Epson Corp | Wiring board, and semiconductor device |
| CN106816419A (en) * | 2015-12-02 | 2017-06-09 | 联咏科技股份有限公司 | Chip-on-film package |
| US20190198417A1 (en) * | 2017-03-07 | 2019-06-27 | Novatek Microelectronics Corp. | Chip on film package |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114721188A (en) * | 2022-03-29 | 2022-07-08 | 颀中科技（苏州）有限公司 | Forming method of flip chip packaging structure, flip chip packaging structure and display device |
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