CN216288500U

CN216288500U - Full-color display screen SMD LED device

Info

Publication number: CN216288500U
Application number: CN202122340759.2U
Authority: CN
Inventors: 李海; 欧锋; 张宏
Original assignee: Zhejiang Inteled Optoeletronic Technology Co ltd
Current assignee: Zhejiang Inteled Optoeletronic Technology Co ltd
Priority date: 2021-09-24
Filing date: 2021-09-24
Publication date: 2022-04-12
Anticipated expiration: 2031-09-24

Abstract

The utility model discloses a full-color display SMD LED device. The problems that a light-emitting surface and pins of an existing full-color LED device are not located on the same surface, so that the heat dissipation effect is poor, or a layer of glass mask is added in front of the device, so that the transparency of a transparent screen is reduced and the like are solved; the utility model adopts a structure comprising a bracket, pins, a die bond pad and RGB (red, green and blue) tricolor chips, wherein a bowl cup structure is arranged at the center of the bracket, a plurality of pins are arranged at the cup edge of the bowl cup of the bracket, the die bond pad is arranged at the bottom of the bowl cup of the bracket, a plurality of conduction through holes are arranged in the bracket, the pins are connected with the die bond pad through the conduction through holes in the bracket, and the RGB tricolor chips are welded on the die bond pad. Compared with the traditional CHIP SMD LED, the luminous surface and the pins are positioned on the same surface and can be attached in the panel; the permeability of the transparent screen can be increased; the heat dissipation effect is increased; the cost of the transparent screen is reduced.

Description

Full-color display screen SMD LED device

Technical Field

The utility model relates to the field of LED display screens, in particular to an SMD LED device of a full-color display screen.

Background

When traditional full-color LED device is applied to transparent display screen, its pin face pastes dress to glass panels, and the device light emitting area exposes outside the panel, receives external colliding with easily and causes the device to drop. The existing solution is to add a layer of glass or other protective face mask in front of the device to protect the device, but adding the face mask will also produce other disadvantages, such as 1, the transparency of the screen body is reduced, 2, the heat dissipation effect is deteriorated, 3, and the cost is increased.

For example, a "SMD chip LED display screen" disclosed in chinese patent literature, whose publication number CN202394466U, the publication date is 2012/8/22/l, includes a planar support, on which an LED unit is disposed, the LED unit includes a mold cup, an LED chip is disposed in the mold cup, the LED chip is connected to a gold wire, the gold wire is connected to pins on both sides of the LED chip, a die attach adhesive is disposed between the LED chip and the mold cup, an encapsulation adhesive is disposed on the LED chip, and the LED unit is connected to a PCB circuit board and a driving power supply. The LED module is poor in heat dissipation effect, has no protection measures for the LED unit, and is easy to drop due to collision from the outside.

Disclosure of Invention

The utility model mainly solves the problems that the light-emitting surface and the pins of the existing full-color LED device are not positioned on the same surface, which causes poor heat dissipation effect, or a layer of glass mask is added in front of the device, which causes the transparency of the transparent screen to be reduced, and the like; a full color display SMD LED device is provided.

The technical problem of the utility model is mainly solved by the following technical scheme:

the LED chip comprises a support, pins, a die bonding pad and RGB (red, green and blue) tricolor chips, wherein a bowl cup structure is arranged at the center of the support, a plurality of pins are arranged at the cup edge of the bowl cup structure of the support, the die bonding pad is arranged at the bottom of the bowl cup structure of the support, a plurality of conduction through holes are formed in the support, the pins are connected with the die bonding pad through the conduction through holes in the support, and the RGB tricolor chips are welded on the die bonding pad. Adopt this scheme to make light emitting area and pin be in the same side, increased the radiating effect, RGB three primary colors chip mounting has played the effect of protection to luminous element like this in the bottom of the bowl cup in the support, also increases transparent screen's permeability and has reduced transparent screen's cost simultaneously.

Preferably, the height of the bracket is 0.4mm-1.3 mm. By adopting the scheme, the mounting space of the SMD LED device can be saved.

Preferably, the structural depth of the bowl cup in the bracket is 0.2-1.0 mm. By adopting the scheme, the RGB three-primary-color chip can be well protected and cannot penetrate through the whole support.

Preferably, the RGB tricolor chips are normal mounted process chips, and then gold wires, alloy wires or copper wires are welded on the die attach pad. The scheme is adopted to lead the RGB three-primary-color chip to be better welded on the die bonding pad.

Preferably, the RGB three-primary-color chip is a flip-chip, and is soldered to the die attach pad by using solder paste. The scheme is adopted to lead the RGB three-primary-color chip to be better welded on the die bonding pad, so that the electrical circuit of the RGB three-primary-color chip is conducted.

Preferably, the inner wall of the support bowl cup structure is provided with a reflective coating. By adopting the scheme, light rays emitted by the RGB three-primary-color chip can be reflected more, and the brightness of the light source is improved.

Preferably, the bracket is a PCB made of BT material or FR-4 material. By adopting the scheme, the SMD LED devices can be better supported, and better connection is provided for the devices.

Preferably, the pins and the die bonding pads are gold plated, silver plated, gold immersion or tin plated. By adopting the scheme, the conductivity of the pin and the die bonding pad can be improved.

The utility model has the beneficial effects that:

1. compared with the traditional CHIP SMD LED, the luminous surface is positioned on the same surface with the pins and can be attached in the panel.

2. The transparency of the transparent screen can be increased.

3. The heat dissipation effect can be increased.

4. The cost of the transparent screen is reduced.

Drawings

Fig. 1 is a front view of the present invention.

Fig. 2 is a front sectional view of the present invention.

Fig. 3 is a side sectional view of the present invention.

In the figure, 1, a bracket, 2, pins, 3, die bond pads, 4, a through via, 5, an RGB three primary color chip,

Detailed Description

The technical scheme of the utility model is further specifically described by the following embodiments and the accompanying drawings.

Example (b):

the utility model provides a full-color display screen SMD LED device, as shown in fig. 1, including support 1, pin 2, gu brilliant pad 3 and RGB tricolor chip 5, support 1 is the square, the central point of support 1 puts and is equipped with bowl cup structure, bowl cup structure cup edge department is provided with 4 pin 2 in the support 1, gu brilliant pad 3 sets up the bottom at 1 bowl cup structure of support, be equipped with 4 in the support 1 and switch on through-hole 4, pin 2 is connected with gu brilliant pad 3 through the through-hole 4 that switches on in the support 1, the material that switches on in the through-hole 4 is copper, pin 2 is connected with copper through the mode of electroplating, RGB tricolor chip 5 welds on gu brilliant pad 3. The height of the bracket 1 is 0.4mm-1.3mm, the length and the width are not limited, the structural depth of the bowl cup in the bracket 1 is 0.2-1.0mm, and the length and the width of the bowl cup are not limited.

The bracket 1 is a PCB (printed circuit board) made of BT (BT) material or FR-4 material, and the inner wall of the bracket cup structure is provided with a reflective coating, so that light emitted by the RGB (red, green and blue) tricolor chip can be reflected more, and the brightness of a light source is improved. Four pins 2 are arranged on the edge of the bowl-cup structure of the bracket 1 and respectively correspond to a common anode (or a common cathode) and other RGB (red, green and blue) three-color electrodes, the pins 2 and the luminous surface of the RGB three-color chip 5 are positioned in the same direction, and the pins 2 and the die bonding pad 3 are gold-plated, silver-plated, gold-plated or tin-plated. The RGB three-primary-color chip 5 may be a face-up process chip or a flip-chip process chip. The forward-mounted process chip is welded on the die attach pad 3 by gold wires, alloy wires or copper wires to conduct an electrical circuit, and the reverse-mounted process chip is welded on the die attach pad 3 by solder paste to conduct the electrical circuit. The packaging method of the RGB three-primary-color chip 5 may be molding, vacuum glue brushing, or conventional metering type glue dispensing, and the packaging glue material includes solid or liquid epoxy resin, silicone resin, epoxy modified material, and other conventional materials.

The new scheme can enable the device to be pasted in the glass panel on the premise of not increasing the cost. Compared with the traditional CHIP SMD LED, the luminous surface and the pins are positioned on the same surface and can be attached in the panel; the permeability of the transparent screen can be increased; the heat dissipation effect can be increased; the cost of the transparent screen is reduced.

It should be understood that the examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and such equivalents may fall within the scope of the present invention as defined in the appended claims.

Claims

1. The utility model provides a full-color display screen SMD LED device, includes support, pin and solid brilliant pad, its characterized in that still includes RGB tricolor chip, the central point of support put and is equipped with a bowl cup structure, the cup of support bowl cup structure along the department be provided with a plurality of pin, solid brilliant pad set up the bottom of support bowl cup structure, the support in be provided with a plurality of and switch on the through-hole, the pin pass through in the support switch on the through-hole with solid brilliant pad connect, RGB tricolor chip weld in solid brilliant pad on.

2. The full-color display SMD LED device according to claim 1, characterized in that said stand height is 0.4mm-1.3 mm.

3. The full-color display SMD LED device according to claim 1, characterized in that said depth of said bowl-in-holder structure is 0.2-1.0 mm.

4. The full-color display SMD LED device according to claim 1, characterized in that said RGB three primary colors chips are normal mounted process chips, and are soldered on said die attach pad by gold or alloy or copper wires.

5. The full-color display SMD LED device according to claim 1, characterized in that said RGB three primary colors chip is a flip chip, and is soldered on said die attach pad by solder paste.

6. The full-color display SMD LED device according to claim 1, characterized in that said frame cup structure has a reflective coating on its inner wall.

7. The full-color display SMD LED device according to claim 1, characterized in that said support is a PCB board made of BT material or FR-4 material.

8. The full-color display SMD LED device according to claim 1, characterized in that said leads and die attach pads are gold plated or silver plated or gold immersion or tin plated.