WO2019148778A1

WO2019148778A1 - Led bead and led display structure

Info

Publication number: WO2019148778A1
Application number: PCT/CN2018/095891
Authority: WO
Inventors: 何昆鹏; 吴振志; 吴涵渠
Original assignee: 深圳市奥拓电子股份有限公司
Priority date: 2018-02-02
Filing date: 2018-07-17
Publication date: 2019-08-08
Also published as: CN208421795U

Abstract

The present invention relates to an LED bead and an LED display structure. The LED bead comprises: a lamp body, comprising a first end face and a second end face arranged opposite each other, wherein the lamp body is provided with at least one lamp cup; a light-emitting device arranged at the bottom of the lamp cup; a first conductor layer and a second conductor layer arranged on the lamp body, wherein the first conductor layer and the second conductor layer are arranged at an interval; and pins, comprising touch-control pins and display pins, wherein at least one touch-control pin is provided and is connected to the first conductor layer, and at least two display pins are provided and are connected to the light-emitting device, and wherein when the LED bead is mounted on a PCB, the touch-control pins are connected to an input pin of a touch-control chip set, the display pins are connected to a drive chip set, the second conductor layer is grounded, and a touch-control capacitor is thus formed between the first conductor layer and the second conductor layer. The LED bead and the LED display structure can realize capacitive touch-control.

Description

LED lamp bead and LED display structure

Technical field

The invention relates to the field of LED display, in particular to an LED lamp bead and an LED display structure.

Background technique

In recent years, LED display technology has developed rapidly, and products are increasingly developing in the direction of high resolution, such as high density and small pitch. With the rapid growth of small-pitch LED display products, small-pitch LED display technology is also constantly improving. More and more LED displays are used in command centers, conference rooms, multimedia classrooms, etc. The demand for functionality is also growing.

The traditional touch method on the LED display is an infrared emission receiving tubular touch frame, which blocks the infrared radiation receiving and receiving path of the infrared touch frame by the touch object, thereby locating the position of the touch object. However, the method of implementing touch by infrared is easily interfered by light, has low precision, and is difficult to apply to a large-sized LED display screen, and the experience is poor when the size of the display exceeds 150 。.

technical problem

Based on this, it is necessary to provide an LED lamp bead and an LED display structure for the touch realization problem of the LED display.

Technical solution

The first aspect of the present invention provides an LED lamp bead mounted on a PCB of a display structure, which can realize capacitive touch of the display structure, including:

The lamp body includes a first end face and a second end face which are oppositely disposed, and the lamp body is provided with at least one lamp cup;

a light emitting device disposed at a bottom of the lamp cup;

The first conductor layer and the second conductor layer are disposed on the lamp body, and the first conductor layer and the second conductor layer are spaced apart from each other; and

a pin, comprising a touch pin and a display pin, the touch pin is disposed at least one, connected to the first conductor layer, and the display pin is disposed at least two, connected to the light emitting device;

Wherein, when the LED lamp bead is mounted on the PCB, the touch pin is connected to an input pin of the touch chip set, the display pin is connected to the driving chip set, and the second conductor layer is grounded. Thereby, a touch capacitance is formed between the first conductor layer and the second conductor layer.

In one embodiment, the second conductor layer is disposed on the first end surface.

In one embodiment, the first conductor layer is disposed on a sidewall of the lamp cup; or

The first conductor layer and the second conductor layer are stacked on each other on the first end surface, and a filling layer is disposed between the first conductor layer and the second conductor layer, and the filling layer is The material is a conductive medium.

In one of the embodiments, the lamp body is drawn with a microcircuit, and the second conductor layer is grounded by a microcircuit drawn in the body of the lamp.

In one embodiment, the pin includes at least one ground pin, and the second conductor layer is electrically connected to the ground pin, and the ground is when the LED lamp bead is mounted on a PCB board. The pin is connected to the power ground.

In one embodiment, the lamp body is provided with a plurality of lamp cups, and each of the lamp cups is correspondingly provided with a light emitting device, and a first conductor layer is formed on a sidewall of each lamp cup, and the plurality of The first conductor layers are commonly connected to the same touch pin, or each of the first conductor layers is connected to one touch pin, or part of the first conductor layer is commonly connected to the same touch pin, and part of the first conductor layer is separately Connected to a touch pin.

In one embodiment, only one of the second conductor layers is disposed, and the plurality of first conductor layers share a second conductor layer, and respectively form a touch capacitor with the second conductor layer.

In one embodiment, the lamp body includes a first substrate and a second substrate, the first substrate is provided with a through hole, and the first substrate and the second substrate are stacked, so that the second The substrate seals one end of the through hole to form the lamp cup, the first conductor layer and the second conductor layer are disposed on the first substrate, and the light emitting device is disposed on the second substrate.

In one embodiment, the method further includes an encapsulation layer, the encapsulation layer includes an encapsulant layer and a photochromic adjustment layer, the photochromic adjustment layer is formed by potting in the lamp cup, and the photochromic adjustment layer is a height less than or equal to a depth of the lamp cup, the light color adjustment layer forming a seal on the light emitting device in the lamp cup, the sealant layer facing the first conductor layer, the second conductor layer, and the The light color adjustment layer forms a seal, and the phosphor color adjustment layer is mixed with a phosphor powder, and the phosphor powder is uniformly distributed in the light color adjustment layer.

A second aspect of the present invention provides an LED display structure, wherein the LED display structure is an LED display module or an LED display, and is characterized in that it comprises a PCB board, an LED lamp bead, at least one driving chip set, and at least one touch chip. The LED lamp bead is any one of the LED lamp beads described above, is mounted on one end surface of the PCB board, and a corresponding circuit structure is disposed on an end surface of the PCB board on which the LED lamp bead is mounted, the circuit The structure includes a grounding layer connected to the grounding pin of the LED lamp bead; the driving chipset and the touch chipset are disposed on an end surface of the PCB board facing away from the LED lamp bead, and the The driving chipset is connected to the display pin of the LED lamp bead, and the touch chipset is connected to the touch pin of the LED lamp bead.

Beneficial effect

The LED lamp bead and the LED display structure are provided by the first conductor layer and the second conductor layer, and the first conductor layer is connected to the touch pin, and the touch pin is mounted when the LED lamp bead is mounted on the PCB board. Connected to the input pin of the touch chipset, the second conductor layer is grounded, and a touch capacitance is formed between the first conductor layer and the second conductor layer. When the human body is placed above the LED lamp bead, the corresponding one is caused. The change in the touch capacitance is further positioned by the first conductor layer to the position of the light emitting device.

DRAWINGS

1 is a schematic perspective view showing the structure of an LED lamp bead according to an embodiment of the present invention;

2 is a schematic cross-sectional structural view of an LED lamp bead according to an embodiment of the present invention;

3 is a top plan view of an LED lamp bead according to an embodiment of the invention;

4 is a top plan view of an LED lamp bead according to still another embodiment of the present invention;

5 is a cross-sectional structural view of an LED lamp bead according to still another embodiment of the present invention;

FIG. 6 is a cross-sectional structural diagram of an LED display structure according to an embodiment of the present invention.

Embodiments of the invention

In order to facilitate the understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the invention are given in the drawings. However, the invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be more fully understood.

It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or the element can be present. When an element is considered to be "connected" to another element, it can be directly connected to the other element or. The terms "vertical", "horizontal", "left", "right", and the like, as used herein, are for the purpose of illustration and are not intended to be the only embodiment.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and/or" used herein includes any and all combinations of one or more of the associated listed items.

Referring to FIG. 1 to FIG. 3 , FIG. 1 to FIG. 3 exemplarily show a schematic structural diagram of an LED lamp bead 10 according to an embodiment of the present invention. The LED lamp bead 10 is mounted on a PCB of a display structure, which can be realized. The capacitive touch of the display structure.

As shown in FIG. 1 , the LED lamp bead 10 includes a lamp body 110 , a light emitting device 120 , a lead pin 130 , a first conductor layer 140 , and a second conductor layer 150 . The lamp body 110 is provided with a lamp cup 111 . The light emitting device 120 is disposed at the bottom of the lamp cup 111, the first conductor layer 140 and the second conductor layer 150 are disposed on the lamp body 110, and the first conductor layer 140 and the first The two conductor layers 150 are spaced apart, the pins 130 are provided in plurality, the LED lamp beads 10 are connected to the circuit through the pins 130, and the light emitting device 120 is connected to at least two pins 130, the first A conductor layer 140 is coupled to at least one of the leads 130, and the second conductor layer 150 is grounded.

The lamp body 110 includes a first end surface 110a and a second end surface 110b. The first end surface 110a sinks toward the second end surface 110b to form the lamp cup 111. The lamp cup 111 has a bottom. a wall 111a and a side wall 111b, the bottom wall 111a is substantially parallel to the first end surface 110a, the side wall 111b is connected to the first end surface 110a and the bottom wall 111a, and the light emitting device 120 is disposed on the On the bottom wall 111a.

The cross-sectional shape of the lamp cup 111 may be any one of a trapezoidal shape, an inverted trapezoidal shape, and a rectangular shape. Of course, other shapes may be used, and may be specifically determined according to product requirements.

The light emitting device 120 includes at least one of a red light chip (R chip), a green light chip (G chip), and a blue light chip (B chip). In some embodiments, the light emitting device 120 includes a red light chip (R chip), a green light chip (G chip), and a blue light chip (B chip). The display structure formed by the LED light bead 10 is full. Color display.

In some embodiments, the light emitting device 120 and the first conductor layer 140 are connected to the lead pins 130 by wires. The lamp body 110 is provided with a passage therein, and the wires are accommodated in the passage. In other embodiments, a microcircuit is drawn in the lamp body 110, and the first conductor layer 140 and the light emitting device 120 are connected to the microcircuit, and are implemented by the microcircuit with the pin 130. Electrical connection.

In some embodiments, the first conductive layer 140 is disposed on the sidewall 111b and electrically connected to one of the pins 130, and when the LED bead 10 is mounted on the PCB, The pin 130 connected to the first conductor layer 140 is connected to the input pin of the touch chip set; the second conductor layer 150 is disposed on the first end surface 110a.

Referring to FIG. 4, in other embodiments, the first conductor layer 140 and the second conductor layer 150 are disposed on the first end surface 110a of the substrate, and are spaced apart from each other on the first end surface 110a. .

It can be understood by those skilled in the art that the above two positional relationships of the first conductor layer 140 and the second conductor layer 150 are merely exemplary, and the first conductor layer 140 is spaced apart from the second conductor layer 150. The positional relationship of the first conductor layer 140 and the second conductor layer 150 on the substrate may be arbitrary, exemplified, in the first conductor layer 140 and the second conductor layer 150. At least one of the first conductor layer 140 and the second conductor layer 150 are stacked on the first end surface 110a, and at least one of the first conductor layer 140 and the second conductor layer 150 are disposed on the first end surface 110a. A filling layer is disposed between the two conductor layers 150, and the material of the filling layer is a conductive medium.

Since the second conductor layer 150 is grounded, and the first conductor layer 140 is spaced apart from the second conductor layer 150, a touch capacitance is formed between the first conductor layer 140 and the second conductor layer 150. When the human body (such as a finger) is placed above the LED lamp bead 10, the second capacitor is formed between the first conductor layer 140 and the human body due to the grounding of the human body, and the second capacitor is connected in parallel with the touch capacitor, thereby causing the touch. The change in capacitance, which in turn can be located by positioning the first conductor layer 140 to the light emitting device 120, completes the positioning.

In some embodiments, the first conductor layer 140 and the second conductor layer 150 may be metal layers, and the metal may be copper, iron, etc., of course, other metal materials may also be used. In general, in order to reduce costs and reduce the weight of LED displays, materials that are lighter in weight, lower in price, and easily accessible are generally used. Of course, in other embodiments, the first conductor layer 140 and the second conductor layer 150 may also be made of a non-metal conductive material as long as it can be between the first conductor layer 140 and the second conductor layer 150. Form a touch capacitor.

The first conductor layer 140 and the second conductor layer 150 may be directly formed on the lamp body 110. For example, when the material of the first conductor layer 140 and the second conductor layer 150 is copper, it may be formed on the lamp body 110 by electroplating. Of course, it is not limited to electroplating, and may be other molding. Ways such as print forming, coating forming, and the like. Of course, the first conductor layer 140 and the second conductor layer 150 may be pre-formed and then fixed to the sidewall 111b of the lamp cup 111.

The pin 130 is disposed on the second end surface 110b. In some embodiments, in order to facilitate mounting of the LED lamp bead 10 on the PCB, a plurality of the pins 130 are fixed to the second end surface 110b of the lamp body 110, and are spaced apart from the edge of the second end surface 110b. Settings.

The pin 130 includes a touch pin 131 and a display pin 133. The touch pin 131 is disposed at least one, and is connected to the first conductive layer 140. The display pin 133 is provided with at least two, and is connected. The light emitting device 120. When the LED lamp bead 10 is mounted on the PCB, the touch pin 131 is connected to an input pin of the touch chip set, and the display pin 133 is connected to the driving chip set. When the human body touches the LED lamp bead 10, the touch chip group senses the change of the touch capacitance formed by the first conductor layer 140 and the second conductor layer 150, and locates the corresponding first conductor layer 140 through the first conductor. The layer 140 is positioned to the light emitting device 120, that is, the corresponding touch operation can be realized by controlling the light output of the light emitting device 120.

In some embodiments, the second conductor layer 150 is grounded by a microcircuit drawn within the lamp body 110. The second conductor layer 150 is connected to the microcircuit and grounded through the microcircuit.

In other embodiments, the pin 130 includes at least one ground pin 135, and the second conductor layer 150 is electrically connected to the ground pin 135 when the LED lamp bead 10 is mounted on a PCB. When the grounding pin 135 is connected to the power ground, the grounding of the second conductor layer 150 is achieved. The electrical connection between the second conductor layer 150 and the grounding pin 135 may be through a wire connection or may be through a microcircuit connection in the lamp body 110.

In some embodiments, a plurality of light cups 111 are disposed on the lamp body 110, and a light emitting device 120 is disposed in each of the light cups 111. A first conductor layer 140 is formed on the side wall 111b of each of the lamp cups 111. A plurality of the first conductor layers 140 may be commonly connected to the same touch pin 131, or one touch pin 131 may be disposed corresponding to each of the first conductive layers 140, or a part of the first conductive layer 140 may be commonly used. Connected to the same touch pin 131, a portion of the first conductive layer 140 is separately connected to the touch pin 131.

The second conductive layer 150 may be disposed in a single one, and the plurality of the first conductive layers 140 share a second conductive layer 150 and form a touch capacitance with the second conductive layer 150 respectively. The light emitting device 120 is positioned by positioning the first conductor layer 140. Of course, a second conductor layer 150 may also be disposed corresponding to each of the first conductor layers 140.

By arranging a plurality of light-emitting devices 120 on one lamp body 110, the mounting efficiency is high when mounted on a PCB board, and mounting once is equivalent to completing the mounting of a plurality of conventional LED lamp beads 10. At the same time, it is easy to realize the small pitch.

In some embodiments, the lamp body 110 includes a first substrate 113 and a second substrate 115. The first substrate 113 is provided with a through hole 113a. The first substrate 113 and the second substrate 115 are stacked. Therefore, the second substrate 115 seals one end of the through hole 113a to form a lamp cup 111. The first conductor layer 140 is formed on the sidewall 111b of the through hole 113a, and the light emitting device 120 is disposed at the The first conductor layer 140 and the second conductor layer 150 are disposed on the first substrate 113 on the second substrate 115.

The lamp body 110 is formed by laminating the first substrate 113 and the second substrate 115. The first conductor layer 140 or the second conductor layer 150 can be realized on the first substrate 113 while the light emitting device 120 is mounted on the second substrate 115. Forming, which greatly improves the processing efficiency. In some embodiments, in order to avoid the light loss emitted by the light emitting device 120, a light shielding layer (not shown) may be coated between the first substrate 113 and the second substrate 115. Preferably, the light shielding is performed. The layer is adhesive so that bonding between the first substrate 113 and the second substrate 115 can be achieved by the light shielding layer. By providing the light shielding layer, it is possible to prevent the light emitted from the light emitting device 120 from being strung into the adjacent lamp cup 111 while avoiding light loss.

Referring to FIG. 5 , in some embodiments, the LED lamp bead 10 further includes an encapsulation layer 160 formed on the lamp body 110 to encapsulate the light emitting device 120 in the lamp cup 111 . At the same time, the first conductor layer 140 and the second conductor layer 150 are encapsulated on the lamp body. By providing the encapsulation layer 160, the light emitting device 120, the first conductor layer 140, and the second conductor layer 150 can be isolated from the external environment, thereby preventing damage of the light emitting device 120, the first conductor layer 140, and the second conductor layer 150 due to exposure.

The encapsulation layer 160 may be made of epoxy resin or silicone resin, and may be selected according to the actual production needs of the product.

In an embodiment, the encapsulation layer 160 includes an encapsulant layer 161 and a light color adjustment layer 163. The photo color adjustment layer 163 is formed by potting in the lamp cup 111, and the photo color adjustment layer 163 is The height is less than or equal to the depth of the lamp cup 111. The light color adjustment layer 163 forms a seal on the light emitting device 120 in the lamp cup 111, and the sealant layer 161 faces the first conductor layer 140, the second conductor layer 150, and the light color adjustment layer. 163 forms a seal.

Phosphors are mixed in the light color adjustment layer 163, and the phosphors are evenly distributed in the light color adjustment layer 163. The specific mixing ratio of the phosphors and the glue depends on the depth of the lamp cup 111. When the light emitted from the light-emitting device 120 passes through the light color adjustment layer 163, it is scattered by the phosphor, uniformly enters the encapsulant layer 161, and is emitted from the encapsulant layer 161, and the light uniformity is good.

The LED lamp bead 10 is provided with the first conductor layer 140 and the second conductor layer 150, and the first conductor layer 140 is connected to the touch pin 131. When the LED lamp bead 10 is mounted on the PCB, the touch is performed. The pin 131 is connected to the input pin of the touch chipset, the second conductor layer 150 is grounded, and a touch capacitance is formed between the first conductor layer 140 and the second conductor layer 150. When the human limb is placed on the LED lamp bead When the top of 10 is above, the change in the touch capacitance is caused, and the position of the light emitting device 120 is further positioned by the first conductor layer 140.

Referring to FIG. 6 , FIG. 6 exemplarily shows a cross-sectional structural view of an LED display structure 20 according to an embodiment of the present invention. The LED display structure 20 may be an LED display module or an LED display screen, including a PCB board 210 . The LED lamp bead 10, the at least one driving chipset 220, and the at least one touch chipset 230. The LED lamp bead 10 is the LED lamp bead 10 of any of the above embodiments, and is mounted on one of the PCB boards 210. An end surface, and an end surface of the PCB board 210 on which the LED lamp bead 10 is mounted is provided with a corresponding circuit structure, the circuit structure including a ground layer connected to the ground pin 135 of the LED lamp bead 10; The driving chipset 220 and the touch chipset 230 are disposed on an end surface of the PCB board 210 facing away from the LED lamp bead 10, and the driving chipset 220 is connected to the display pin 133 of the LED lamp bead 10, The touch chip set 230 is connected to the touch pin 131 of the LED lamp bead 10 .

The LED display structure 20 is configured by providing the first conductor layer 140 and the second conductor layer 150 and connecting the first conductor layer 140 to the touch pin 131. When the LED lamp bead 10 is mounted on the PCB board 210, the touch is performed. The control pin 131 is connected to the input pin of the touch chipset 230, the second conductor layer 150 is grounded, and a touch capacitance is formed between the first conductor layer 140 and the second conductor layer 150. When the human body is placed on the LED When the lamp bead 10 is above, the change in the touch capacitance is caused, and the position of the light emitting device 120 is further positioned by the first conductor layer 140.

The technical features of the above-described embodiments may be arbitrarily combined. For the sake of brevity of description, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be considered as the scope of this manual.

The above-described embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.

Claims

An LED lamp bead is mounted on a PCB of a display structure, and can realize capacitive touch of a display structure, and is characterized in that:

The lamp body includes a first end face and a second end face which are oppositely disposed, and the lamp body is provided with at least one lamp cup;

a light emitting device disposed at a bottom of the lamp cup;

The first conductor layer and the second conductor layer are disposed on the lamp body, and the first conductor layer and the second conductor layer are spaced apart from each other; and

a pin, comprising a touch pin and a display pin, the touch pin is disposed at least one, connected to the first conductor layer, and the display pin is disposed at least two, connected to the light emitting device;

Wherein, when the LED lamp bead is mounted on the PCB, the touch pin is connected to an input pin of the touch chip set, the display pin is connected to the driving chip set, and the second conductor layer is grounded. Thereby, a touch capacitance is formed between the first conductor layer and the second conductor layer.
The LED lamp bead according to claim 1, wherein the second conductor layer is disposed on the first end surface.
The LED lamp bead according to claim 2, wherein the first conductor layer is disposed on a sidewall of the lamp cup; or

The first conductor layer and the second conductor layer are stacked on each other on the first end surface, and a filling layer is disposed between the first conductor layer and the second conductor layer, and the filling layer is The material is a conductive medium.
The LED lamp bead according to any one of claims 1 to 3, characterized in that the lamp body is drawn with a microcircuit, and the second conductor layer is grounded by a microcircuit drawn in the lamp body.
The LED lamp bead according to any one of claims 1 to 3, wherein the pin comprises at least one ground pin, and the second conductor layer is electrically connected to the ground pin when the LED When the lamp bead is mounted on the PCB, the ground pin is connected to the power ground.
The LED lamp bead according to claim 1, wherein the lamp body is provided with a plurality of lamp cups, and each of the lamp cups is correspondingly provided with a light emitting device, and a sidewall is formed on each side wall of each lamp cup. a conductor layer, a plurality of the first conductor layers are commonly connected to the same touch pin, or each of the first conductor layers is connected to a touch pin, or part of the first conductor layer is commonly connected to the same touch A part of the first conductor layer is separately connected to a touch pin.
The LED lamp bead according to claim 6, wherein only one of said second conductor layers is disposed, and said plurality of said first conductor layers share a second conductor layer and are respectively associated with said second conductor The layer forms a touch capacitor.
The LED lamp bead according to claim 1, wherein the lamp body comprises a first substrate and a second substrate, and the first substrate is provided with a through hole, the first substrate and the second substrate Laminating, such that the second substrate seals one end of the through hole to form the lamp cup, the first conductor layer and the second conductor layer are disposed on the first substrate, and the light emitting device is disposed at the On the second substrate.
The LED lamp bead according to claim 1, further comprising an encapsulation layer, the encapsulation layer comprising an encapsulant layer and a photochromic adjustment layer, wherein the photochromic adjustment layer is formed by potting in the lamp cup, And the height of the light color adjustment layer is less than or equal to the depth of the lamp cup, the light color adjustment layer forms a seal on the light emitting device in the lamp cup, and the sealant layer faces the first conductor layer And forming a seal between the second conductor layer and the light color adjustment layer, wherein the light color adjustment layer is mixed with a phosphor, and the phosphor is uniformly distributed in the light color adjustment layer.
An LED display structure, wherein the LED display structure is an LED display module or an LED display, comprising: a PCB board, an LED lamp bead, at least one driving chip set, at least one touch chip set, and the LED lamp The LED lamp bead according to any one of claims 1-9 is mounted on one end surface of the PCB board, and a corresponding circuit structure is disposed on an end surface of the PCB board on which the LED lamp bead is mounted, and the circuit structure includes a ground layer, the ground layer is connected to a ground pin of the LED lamp bead; the driving chip set and the touch chip set are disposed on an end surface of the PCB board facing away from the LED lamp bead, and the driving chip The group is connected to the display pin of the LED lamp bead, and the touch chip set is connected to the touch pin of the LED lamp bead.