WO2020034489A1

WO2020034489A1 - Touch display assembly and electronic device

Info

Publication number: WO2020034489A1
Application number: PCT/CN2018/118227
Authority: WO
Inventors: 王俊凯
Original assignee: 广州视源电子科技股份有限公司; 广州视睿电子科技有限公司
Priority date: 2018-08-14
Filing date: 2018-11-29
Publication date: 2020-02-20
Also published as: CN108920015A

Abstract

Provided are a touch display assembly and an electronic device. The touch display assembly comprises: a circuit board having a first surface; multiple light-emitting devices provided on the first surface at intervals; and at least one sensing circuit layer, comprising multiple sensing lines, wherein at least some of the sensing lines in the at least one sensing circuit layer are provided on the first surface and are located in a gap between two light-emitting devices, with one sensing line being provided in one gap. According to the touch display assembly, at least some of the sensing lines in a sensing circuit layer are provided on the surface of a circuit board and are located in a gap between light-emitting devices, that is to say, at least parts of the sensing circuit layer are integrated with a display panel, thereby improving the integration of the touch display assembly, simplifying the assembly process for the touch display assembly, reducing materials for a transparent insulating layer required by a sensing circuit, and reducing the cost of the touch display assembly.

Description

Touch display component and electronic device

Technical field

The present application relates to the field of touch display, and in particular, to a touch display component and an electronic device.

Background technique

In the prior art, a touch display component generally includes a touch panel and a display panel, and the touch panel is bonded to the display panel. The touch display component has a lower integration degree, a larger volume and a higher cost.

The above information disclosed in the background section is only used to enhance the understanding of the background technology of the technology described herein. Therefore, the background technology may contain certain information that has not been formed in the country for those skilled in the art. Known prior art.

Summary of the Invention

The main purpose of this application is to provide a touch display component and an electronic device to solve the problems of low integration and large volume of the touch display component in the prior art.

In order to achieve the above object, according to an aspect of the present application, a touch display component is provided. The touch display component includes: a circuit board having a first surface; a plurality of light emitting devices disposed at intervals on the first surface; At least one sensing circuit layer includes a plurality of sensing lines, at least a part of the sensing lines in at least one of the sensing circuit layers is disposed on the first surface and in a space between the two light emitting devices, and one of the spaces is provided in the space One of the above induction wires.

Further, there are two sensing circuit layers, namely a first sensing circuit layer and a second sensing circuit layer, the first sensing circuit layer includes a plurality of first sensing lines, and the second sensing circuit layer includes a plurality of second Induction lines, each of the first induction lines is disposed on the first surface and located in the interval.

Further, the second sensing circuit layer is located on the first surface.

Further, each of the second induction wires is an enameled wire, and each of the enameled wires is disposed on the first surface and located in the interval.

Further, the touch display assembly further includes: a packaging portion located on a side close to the first surface, at least a part of the packaging portion forming a sealed space with the circuit board, the first sensing circuit layer and each of the light emitting devices are located Above the sealed space.

Further, the circuit board includes a main body and a surrounding board, the main body includes the first surface, the surrounding board is surrounded on the first surface, the packaging portion includes a packaging adhesive layer and a filling adhesive portion, and the packaging adhesive layer is disposed on On the side of the enclosure board far from the first surface, the sealing adhesive layer, the enclosure board, and the body form the sealed space, and the filler portion is filled in a gap in the sealed space.

Further, the first surface has a plurality of grooves disposed at intervals, the light emitting devices are located in the grooves one to one correspondingly, and each of the first sensing lines is disposed on the first surface and located in two adjacent recesses. Between the slots.

Further, the second sensing circuit layer is disposed between the encapsulating adhesive layer and the filling adhesive portion.

Further, the touch display component further includes a transparent insulating layer disposed between the encapsulating adhesive layer and the filling adhesive portion, and the second sensing circuit layer is disposed on a surface of the transparent insulating layer remote from the encapsulating adhesive layer. .

Further, the circuit board is a multilayer circuit board, and each of the second induction lines is disposed in the multilayer circuit board and is located on a surface of a wiring layer having a minimum distance from the first surface.

Further, each of the first induction lines and each of the second induction lines is an electromagnetic metal line or a capacitor metal line.

Further, there is one induction circuit layer, and the induction circuit layer is an electromagnetic circuit layer. The plurality of induction lines includes a plurality of antenna circuits and a plurality of return lines. Each of the antenna circuits is disposed on the first surface and is located on the first surface. Interval.

Further, the wiring board is a multilayer wiring board, and each of the return lines is disposed on a wiring layer in the multilayer wiring board.

Further, the circuit board is a PCB board, and the light emitting device is an LED lamp bead.

According to another aspect of the present application, an electronic device is provided. The electronic device includes any one of the touch display components described above.

Applying the technical solution of the present application, in the above-mentioned touch display component, at least a part of the sensing lines of the sensing circuit layer is arranged on the surface of the circuit board and located in the interval between the light emitting devices. It can be said that at least a part of the sensing circuit layer It is integrated in the display panel, which improves the integration of the touch display component, simplifies the assembly process of the touch display component, reduces the material of the transparent insulating layer required for the sensing circuit, and reduces the cost of the touch display component.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which form a part of this application, are used to provide further understanding of the application. The schematic embodiments of the application and the descriptions thereof are used to explain the application, and do not constitute an improper limitation on the application. In the drawings:

FIG. 1 is a schematic partial structural diagram of a touch display component according to Embodiment 1 of the present application; FIG.

FIG. 2 is a schematic partial structural diagram of a touch display component according to Embodiment 2 of the present application; FIG.

FIG. 3 is a schematic structural diagram of an induction circuit layer according to Embodiment 3 of the present application; and

FIG. 4 is a schematic structural diagram of another touch display component of the present application.

The above drawings include the following reference signs:

10. Circuit board; 11. First surface; 12. Second surface; 13. Body; 14. Board; 20; Light-emitting device; 30; First induction line; 31; Antenna circuit; 32; Return line; 33, Signal generator; 34; receiver; 35; switch; 40; second induction line; 50; package section; 51; encapsulation rubber layer; 52; filling rubber section; 60; electromagnetic induction equipment; 01; detection unit; 02, Data processing and control unit; 03. Main system.

detailed description

It should be noted that the following detailed descriptions are all exemplary and are intended to provide further explanation of the present application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

It should be noted that the terminology used herein is only for describing specific embodiments, and is not intended to limit the exemplary embodiments according to the present application. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise, and it should also be understood that when the terms "including" and / or "including" are used in this specification, they indicate There are features, steps, operations, devices, components, and / or combinations thereof.

It will be understood that when an element such as a layer, film, region, or substrate is described as being "on" another element, it can be directly on the other element or intervening elements may also be present. Moreover, in the description and in the claims, when an element is described as being "connected" to another element, the element can be "directly connected" to the other element or "connected" to the other element through a third element.

As described in the background art, in the prior art, the touch display component has low integration and large volume. In order to solve the above technical problems, the present application proposes a touch display component and an electronic device.

In a typical embodiment of the present application, a touch display component is provided. As shown in FIGS. 1 and 2, the touch display component includes a circuit board 10, a plurality of light emitting devices 20, and a sensing circuit layer. The induction circuit layer is not shown in FIGS. 1 and 2. In fact, the structure of FIG. 1 has two induction circuit layers. One induction circuit layer is composed of a plurality of first induction lines 30, and the other induction circuit layer is composed of a plurality of first induction lines. The second sensing line 40 is composed of two sensing circuit layers in the structure corresponding to FIG. 2. Only one of the sensing circuit layers is shown. The sensing circuit layer is composed of a plurality of first sensing lines 30.

Wherein, as shown in FIG. 2, the circuit board 10 has a first surface 11, which may be flat or uneven; a plurality of light emitting devices 20 are disposed on the first surface 11 at intervals; the induction circuit layer includes A plurality of induction lines, at least a part of the induction lines in the induction line layer is disposed on the first surface 11 and is located in an interval between the two light emitting devices 20, and one of the induction lines is disposed in one of the intervals, that is, any There is only one induction line in two adjacent intervals, and there are no multiple induction lines, that is, one interval can only correspond to one induction line. Specifically, this induction line can be in multiple intervals.

It should be noted that a part of the light-emitting devices is schematically shown in FIG. 1, in fact, in the corresponding embodiment of the figure, one light-emitting device is provided in each small rectangle formed by the first sensing line 30 and the second sensing line 40. Device.

In the above touch display component, at least part of the sensing lines of the sensing circuit layer are arranged on the surface of the circuit board and located in the interval between the light emitting devices, that is, at least part of the sensing circuit layer is integrated in the display panel, which improves The integration degree of the touch display component simplifies the assembly process of the touch display component, reduces the material of the substrate required for the sensing circuit, and reduces the cost of the touch display component.

In an embodiment of the present application, as shown in FIG. 1, there are two sensing circuit layers, namely a first sensing circuit layer and a second sensing circuit layer, and the first sensing circuit layer includes a plurality of first sensing lines. 30. The second sensing line layer includes a plurality of second sensing lines 40. Each of the first sensing lines 30 is disposed on the first surface 11 and is located in the interval. In this way, at least one of the sensing circuit layers is integrated in the display panel, which greatly improves the integration of the touch display component. Moreover, during the manufacturing process, only the corresponding sensing line needs to be printed on the first surface and located on the two surfaces. The space between the light emitting devices can be simplified, which simplifies the assembling process of the touch display component and reduces the cost of the touch display component.

Specifically, the first sensing line may be a printed circuit on the first surface of the circuit board 10 or an enameled wire. Those skilled in the art may select a suitable line as the first induction line according to the situation.

The second induction circuit layer is located on the first surface or may be disposed on a wiring layer in a multilayer circuit board. Those skilled in the art may choose to set the second induction circuit layer at an appropriate position according to the actual situation.

In a specific embodiment, in order to simplify the setting process of the second sensing circuit layer, the second sensing circuit layer is located on the first surface. Specifically, the second induction circuit layer may be disposed on a side of the first induction circuit layer remote from the first surface, or may be disposed between the first surface and the first induction circuit layer.

In order to further improve the integration degree of the touch display component, simplify the assembly process and reduce its cost, in an embodiment of the present application, as shown in FIG. 1, each of the second sensing lines 40 is an enameled wire, and each of the above enameled wires is disposed at The first surface 11 is located in the interval. The enameled wire can be well insulated from the first induction wire to avoid mutual influence of the two induction circuit layers.

Of course, in other embodiments in this application, the first sensing line and the second sensing line may both be enameled wires. Those skilled in the art can set the first sensing line and the second sensing line into a suitable structure according to the actual situation.

Of course, the second induction wire in the present application is not limited to the form of enameled wire, and may be insulated from the first induction wire in other forms. Those skilled in the art may choose to set the second induction wire into a suitable form according to the actual situation. To be insulated from the first induction line.

Of the two induction circuit layers shown in FIG. 1, the first induction line in the first induction circuit layer is horizontal, and the second induction line in the second induction circuit layer is vertical. However, the first induction line of the present application The direction of the line and the second induction line is not limited to that shown in FIG. 1, and may be any other feasible direction. A person skilled in the art may select a first induction line with a suitable direction and a first direction with a suitable direction according to the actual situation. The two induction lines form the double-layer induction circuit layer of the present application.

As shown in FIG. 2, the touch display component further includes a packaging portion 50, which is located on a side close to the first surface 11. At least a part of the packaging portion 50 forms a sealed space with the circuit board 10. An induction circuit layer and each of the light-emitting devices 20 are located in the sealed space, and the encapsulation portion 50 is used to protect the light-emitting device and the induction lines from being affected by the outside.

The packaging part of the present application may adopt any feasible structure, and those skilled in the art may select a packaging part with a suitable structure according to the actual situation to seal the space with the circuit board shape. For example, the packaging portion may be an integrated packaging structure including a packaging cover plate and a packaging side plate. The packaging side plate is disposed on the first surface, the packaging cover plate is disposed on a surface of the packaging side plate away from the first surface, and the packaging cover plate The packaging side board and the circuit board form a sealed space; for another example, the circuit board is an integrated structure including a body and a surrounding board, the body has the above-mentioned first surface, the surrounding board is surrounded on the first surface, and the packaging part is a packaging cover plate, The cover is directly located on the side of the enclosure board away from the first surface, and the cover plate, the body and the enclosure board form a sealed space. The package cover plate and the package side plate in these two examples can be formed by using a packaging material with good water and oxygen barrier properties commonly used in the prior art.

In order to further ensure that the packaging portion can well encapsulate the light-emitting device and some of the sensing lines, thereby ensuring that the touch display component can maintain good performance for a long time, in an embodiment of the present application, as shown in FIG. 2, the circuit board 10 described above The main body 13 includes a main body 13 and a surrounding plate 14. The main body 13 has the first surface 11. The surrounding plate 14 is surrounded on the first surface 11. The encapsulation portion 50 includes an encapsulation layer 51 and a filling portion 52. The layer 51 is disposed on the side of the enclosure board 14 far from the first surface 11. The sealing adhesive layer 51, the enclosure board 14, and the body 13 form the sealed space, and the filler portion 52 is filled in the sealed space. In the gap.

The above-mentioned encapsulating adhesive layer and the filling adhesive portion may be formed of the same material, or may be formed of different materials, and during the encapsulation process, the two may be formed integrally or distributedly. Those skilled in the art may select the same or different encapsulants to form the encapsulant layer and the filler portion according to the actual situation, and may select appropriate process steps to form the encapsulant layer and the filler. Of course, in the process of manufacturing the encapsulation part, the filling glue part is firstly produced, and then the encapsulation glue layer is produced.

In another embodiment not shown in the present application, the first surface has a plurality of grooves disposed at intervals, the light emitting devices are located in the grooves one by one, and each of the first sensing lines is disposed at The first surface 11 is located between the two adjacent grooves, and is actually located in a space between the two adjacent light emitting devices.

In another embodiment of the present application, the second sensing circuit layer is disposed between the packaging adhesive layer and the filling adhesive portion. This can reduce the volume of the touch display component and simplify the assembly process of the touch display component.

In order to further facilitate the setting of the second sensing circuit layer and ensure good performance of the second sensing circuit layer, in an embodiment not shown in the figure of the present application, the touch display component further includes a transparent insulating layer. A transparent insulating layer is disposed between the encapsulating adhesive layer 51 and the filling adhesive portion 52, and the second sensing circuit layer is disposed on a surface of the transparent insulating layer remote from the encapsulating adhesive layer 51.

The material of the above-mentioned transparent insulating layer may be selected from any insulating transparent materials in the prior art. Those skilled in the art may select a suitable transparent insulating material according to the actual situation. For example, one or more of PET, PC, and PMMA may be selected. Species. In addition, the transparent insulating layer may be a single layer or a stacked structure of a plurality of structural layers.

When the physical properties such as hardness and scratch resistance of the transparent insulating layer meet the requirements of the packaging structure, the above-mentioned packaging adhesive layer may also be omitted, that is, no packaging adhesive layer is provided, and the transparent insulating layer is used as the outermost layer.

In another embodiment not shown in the present application, the second induction circuit layer is disposed on a wiring layer in a circuit board. Specifically, the circuit board is a multilayer circuit board, and each of the second induction lines is It is disposed on the wiring layer in the multilayer wiring board and is located on the surface of the wiring layer having the smallest distance from the first surface, which is generally referred to as the L2 layer of the multilayer wiring board.

In the above embodiment including two induction circuit layers, the corresponding induction circuit layer may be an electromagnetic induction circuit layer or a capacitive induction circuit layer. For the electromagnetic induction circuit layer, it includes multiple electromagnetic induction lines (ie, electromagnetic For the capacitive sensing line layer, it includes a plurality of capacitive sensing lines (ie, capacitive metal lines), that is, each of the first sensing lines and each of the second sensing lines is an electromagnetic metal line or a capacitive metal line.

In another embodiment of the present application, there is one of the induction circuit layers, and the induction circuit layer is an electromagnetic circuit layer. As shown in FIG. 3, the plurality of the induction lines includes a plurality of antenna circuits 31 and a plurality of return lines 32. Each of the antenna circuits 31 is disposed on the first surface 11 and is located in the interval.

In order to further improve the integration of the touch display component, reduce its volume, and simplify its assembly process, in an embodiment of the present application, the circuit board is a multilayer circuit board. As shown in FIG. 2, the circuit board 10 is also A second surface 12 is provided opposite to the first surface 11, and a wiring layer is provided between the first surface 11 and the second surface 12, that is, a multilayer wiring board has a wiring layer. Layer on the wiring layer inside the circuit board. In addition, the electromagnetic circuit layer in FIG. 3 further includes a signal generator 33, a receiver 34, and a plurality of switches 35, and these devices may be disposed between the second surface 12 or the first surface 11.

FIG. 3 also shows an electromagnetic induction device 60. The device may be an electromagnetic pen. Taking the electromagnetic pen as an example to explain the induction principle of the electromagnetic circuit layer in FIG. 3, the electromagnetic pen includes a resonance circuit including an electric coil and a capacitor. The signal generator can generate a signal with a specified waveform and send it to an antenna circuit through a switch. When the electromagnetic pen approaches the antenna circuit, the electromagnetic pen generates an electromagnetic induction signal, which is sent to the receiver through the return line. Finally, the signal is processed by other processing devices to obtain the position information of the electromagnetic pen.

In a specific embodiment of the present application, the circuit board 10 is a PCB board, and the light-emitting device 20 is an LED lamp bead.

Of course, the above-mentioned circuit board of the present application is not limited to a PCB board, and the above-mentioned light-emitting device 20 is not limited to an LED lamp bead, either of which may be any available circuit board and light-emitting device in the prior art. For example, the circuit board may also be a flexible circuit board (FPC), and the light emitting device may also be an OLED chip.

In a specific embodiment, the above-mentioned LED lamp dot matrix distribution, that is, the touch display component can realize dot matrix display, this display has the advantages of ultra-high density, strong reliability, large viewing angle, and good color mixing.

As shown in FIG. 4, the touch display component of the present application further includes a data processing and control unit 02 (such as a micro control unit MCU) and a main system 03. As described above, the sensing layer of the present application forms a detection unit 01, and the detection unit 01 will The detected signal is transmitted to the data processing and control unit 02 for data processing, to obtain the position coordinate value of the object on the screen surface, and transmit it to the main system 03. In addition, the data processing and control unit 02 can also The work is controlled. After receiving the position coordinate value, the main system 03 recognizes the behavior of the object (such as a finger or an electromagnetic pen, etc.) and implements an interactive function.

In another exemplary embodiment of the present application, an electronic device is provided. The electronic device includes any one of the touch display components described above.

Because the electronic device includes the above-mentioned touch display component, the electronic device has a small volume, a high degree of integration, a simple manufacturing process, and a low cost.

In order to enable those skilled in the art to understand the technical solution of the present application more clearly, the technical solution of the present application will be described below with reference to specific embodiments.

Example 1

The touch display assembly includes a circuit board 10, a plurality of light emitting devices 20, a first sensing circuit layer, a second sensing circuit layer, and a packaging portion 50.

As shown in FIG. 1, the circuit board 10 is a PCB board, which is not shown in FIG. 1. Since the structure of this part is similar to that of Embodiment 2, reference may be made to FIG. 2. As shown in FIG. 2, the circuit board 10 includes a body 13 With the surrounding board 14, the main body has a first surface 11 and a second surface 12, and the surrounding board 14 is surrounded on the first surface. The light emitting device 20 is an LED lamp bead, and a plurality of light emitting devices 20 are arranged on the first surface 11 in a dot matrix manner at intervals. The first induction circuit layer includes a plurality of first induction lines 30 corresponding to the horizontal lines in FIG. 1, and the second induction circuit layer includes a plurality of second induction lines 40 corresponding to the vertical lines in FIG. 1. The line 30 is provided on the above-mentioned first surface 11 and is located in the above-mentioned interval. Each of the second sensing lines 40 is an enameled wire and is disposed on the first surface 11 and located in the interval.

The encapsulation portion 50 includes an encapsulation layer 51 and a filling portion 52. The encapsulation layer 51 is disposed on a side of the enclosing plate 14 away from the first surface 11. The encapsulating layer 51, the enclosing plate 14 and the body 13 To form the sealed space, the first sensing circuit layer, the second sensing circuit layer, and each of the light emitting devices 20 are located in the sealed space, and the filler portion 52 is filled in a gap in the sealed space.

During the production, the first induction wires 30 are evenly arranged in the interval of the first surface 11, and the second induction wires 40 are evenly arranged in the interval of the first surface 11 using an enameled wire, and the groups are uniformly coated and glued.

Example 2

The touch display component includes a circuit board 10, a plurality of light emitting devices 20, a first sensing circuit layer, a second sensing circuit layer, a packaging portion 50, and a transparent insulating layer.

As shown in FIG. 2, the circuit board 10 is a PCB board. The circuit board 10 includes a main body 13 and a surrounding board 14. The main body has a first surface 11 and a second surface 12. The surrounding board 14 surrounds the first surface. The light emitting device 20 is an LED lamp bead, and a plurality of LED lamp beads are arranged on the first surface 11 in a dot matrix manner at intervals.

The first sensing circuit layer includes a plurality of first sensing lines 30, and the second sensing circuit layer includes a plurality of second sensing lines 40. As shown in FIG. 2, each of the first sensing lines 30 is disposed on the first surface 11. Up and in the above interval.

The encapsulation portion 50 includes an encapsulation layer 51 and a filling portion 52. The encapsulation layer 51 is disposed on a side of the enclosing plate 14 away from the first surface 11. The encapsulating layer 51, the enclosing plate 14, and the body 13 are provided. The sealed space is formed, the first sensing circuit layer and each of the light emitting devices 20 are located in the sealed space, and the filler portion 52 is filled in a gap in the sealed space.

The transparent insulating layer is not shown in FIG. 2. In fact, the transparent insulating layer is disposed between the encapsulating adhesive layer 51 and the filling adhesive portion 52. The second sensing circuit layer is disposed on the transparent insulating layer away from the encapsulating adhesive layer 51. On the surface.

During production, the first sensing lines 30 are evenly arranged in the interval of the first surface 11, and after the PCB is coated with an adhesive, the second sensing lines 40 are attached to the surface of the packaging adhesive layer 51 with a single transparent insulating layer. .

Example 3

The difference from Embodiment 2 is that the circuit board is a multilayer circuit board, and the touch display component includes an induction circuit layer, which is an electromagnetic circuit layer. As shown in FIG. 3, the induction circuit layer includes multiple antennas. The loop 31, a plurality of return lines 32, a signal generator 33, a receiver 34, and a plurality of switches 35. Each of the antenna circuits 31 is disposed on the first surface 11 and is located in the interval, and each of the return lines 32 and signals is generated. The receiver 33, the receiver 34, and the plurality of switches 35 are provided inside the multilayer wiring board.

During production, the antenna loops 31 are evenly arranged in the interval of the first surface 11, and the return line 32 is routed through the inner layer of the PCB board.

Example 4

The difference from Embodiment 1 is that the circuit board is a multilayer circuit board, and each second induction line is disposed on the L2 layer in the multilayer circuit board.

The touch display components corresponding to the above four embodiments have higher integration, simpler assembly process and lower cost.

From the above description, it can be seen that the foregoing embodiments of the present application achieve the following technical effects:

1) In the touch display component of the present application, at least part of the sensing lines of the sensing circuit layer are arranged on the surface of the circuit board and located in the interval between the light emitting devices. It can be said that at least part of the sensing circuit layer is integrated in the display In the panel, this improves the integration of the touch display components, simplifies the assembly process of the touch display components, reduces the material of the transparent insulating layer required for the sensing circuit, and reduces the cost of the touch display components.

2) Since the electronic device of the present application includes the above-mentioned touch display component, its volume is small, its integration is high, its manufacturing process is simple, and its cost is low.

The above description is only a preferred embodiment of the present application, and is not intended to limit the present application. For those skilled in the art, this application may have various modifications and changes. Any modification, equivalent replacement, or improvement made within the spirit and principle of this application shall be included in the protection scope of this application.

Claims

A touch display component, wherein the touch display component includes:

A circuit board (10) having a first surface (11);

A plurality of light emitting devices (20) disposed on the first surface (11) at intervals; and

The at least one sensing circuit layer includes a plurality of sensing lines, and at least a part of the sensing lines in at least one of the sensing circuit layers is disposed on the first surface (11) and located between two of the light emitting devices (20). Among the intervals, one of the sensing lines is provided in one of the intervals.
The touch display assembly according to claim 1, wherein there are two sensing circuit layers, namely a first sensing circuit layer and a second sensing circuit layer, and the first sensing circuit layer includes a plurality of first sensing circuit layers. An induction line (30), the second induction line layer includes a plurality of second induction lines (40), each of the first induction lines (30) is disposed on the first surface (11) and is located on the first surface (11) Interval.
The touch display component according to claim 2, wherein the second sensing circuit layer is located on the first surface (11).
The touch display assembly according to claim 3, wherein each of the second sensing wires (40) is an enameled wire, and each of the enameled wires is disposed on the first surface (11) and is located in the interval. .
The touch display component according to claim 2, wherein the touch display component further comprises:

A packaging portion (50) is located on a side close to the first surface (11), and at least a part of the packaging portion (50) forms a sealed space with the circuit board (10), the first sensing circuit layer and each The light emitting device (20) is located in the sealed space.
The touch display assembly according to claim 5, wherein the circuit board (10) includes a body (13) and a surrounding board (14), and the body (13) includes the first surface (11) The enclosure board (14) is surrounded on the first surface (11), the packaging part (50) includes an encapsulating adhesive layer (51) and a filling adhesive part (52), and the encapsulating adhesive layer (51) ) Is disposed on a side of the enclosure board (14) remote from the first surface (11), and the encapsulant layer (51), the enclosure board (14) and the body (13) form the The sealed space is filled with the rubber portion (52) in a gap in the sealed space.
The touch display assembly according to claim 5, wherein the first surface has a plurality of grooves disposed at intervals, and the light emitting devices are located in the grooves one to one correspondingly, and each of the first An induction line (30) is disposed on the first surface (11) and is located between two adjacent grooves.
The touch display assembly according to claim 6, wherein the second sensing circuit layer is disposed between the encapsulating adhesive layer (51) and the filling adhesive portion (52).
The touch display component according to claim 6, wherein the touch display component further comprises:

A transparent insulating layer is disposed between the sealing adhesive layer (51) and the filling adhesive portion (52), and the second induction circuit layer is disposed on the transparent insulating layer away from the sealing adhesive layer (51). on the surface.
The touch display assembly according to claim 2, wherein the circuit board is a multi-layer circuit board, and each of the second sensing lines (40) is disposed in the multi-layer circuit board and is located in the same place as the multi-layer circuit board. The first surface is on the surface of the wiring layer having the smallest distance.
The touch display assembly according to claim 2, wherein each of the first sensing lines (30) and each of the second sensing lines (40) are electromagnetic metal lines or capacitive metal lines.
The touch display assembly according to claim 1, wherein there is one sensing circuit layer, and the sensing circuit layer is an electromagnetic circuit layer, and a plurality of the sensing lines includes a plurality of antenna loops (31) and A plurality of return lines (32), each of the antenna loops (31) is disposed on the first surface (11) and is located in the interval.
The touch display assembly according to claim 12, wherein the circuit board is a multilayer circuit board, and each of the return lines (32) is disposed on a wiring layer in the multilayer circuit board.
The touch display assembly according to any one of claims 1 to 13, wherein the circuit board (10) is a PCB board, and the light emitting device (20) is an LED lamp bead.
An electronic device, wherein the electronic device comprises the touch display component according to any one of claims 1 to 14.