CN106505089A - Display device with a light-shielding layer - Google Patents
Display device with a light-shielding layer Download PDFInfo
- Publication number
- CN106505089A CN106505089A CN201610931458.8A CN201610931458A CN106505089A CN 106505089 A CN106505089 A CN 106505089A CN 201610931458 A CN201610931458 A CN 201610931458A CN 106505089 A CN106505089 A CN 106505089A
- Authority
- CN
- China
- Prior art keywords
- touch control
- substrate
- control electrode
- electrode layer
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 238000007789 sealing Methods 0.000 claims abstract description 21
- 239000000565 sealant Substances 0.000 claims description 42
- 239000010409 thin film Substances 0.000 claims description 33
- 229920006280 packaging film Polymers 0.000 claims description 22
- 239000012785 packaging film Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 12
- 239000010408 film Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 230000027455 binding Effects 0.000 claims description 6
- 238000009739 binding Methods 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 19
- 208000034699 Vitreous floaters Diseases 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- -1 polyethylene terephthalate Polymers 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 239000004698 Polyethylene Substances 0.000 description 8
- 230000008859 change Effects 0.000 description 8
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 7
- 239000011112 polyethylene naphthalate Substances 0.000 description 7
- AHZUOPSGLWYCNF-UHFFFAOYSA-N 1,2,3-trichloro-5-(2,3,5-trichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=C(Cl)C(C=2C=C(Cl)C(Cl)=C(Cl)C=2)=C1 AHZUOPSGLWYCNF-UHFFFAOYSA-N 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000011147 inorganic material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- UNPTZXSJGZTGJJ-UHFFFAOYSA-N 1,2,3,5-tetrachloro-4-(3,5-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=C(Cl)C(Cl)=CC=2Cl)Cl)=C1 UNPTZXSJGZTGJJ-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 235000019253 formic acid Nutrition 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 2
- 229940073561 hexamethyldisiloxane Drugs 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 2
- 229910003978 SiClx Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- MGCQZNBCJBRZDT-UHFFFAOYSA-N midodrine hydrochloride Chemical compound [H+].[Cl-].COC1=CC=C(OC)C(C(O)CNC(=O)CN)=C1 MGCQZNBCJBRZDT-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a display device including: the display device comprises a first substrate and a second substrate, wherein the first substrate comprises a display area and a non-display area, an integrated circuit is bound on the non-display area on the first substrate, and the non-display area of the first substrate is also provided with a plurality of connecting bonding pads which are electrically connected to the integrated circuit; a display element located in the display area above the first substrate, the display element and the integrated circuit being located on the same side of the first substrate; the sealing layer is positioned on one side, away from the first substrate, of the display element, and a plurality of through holes are formed in a non-display area of the sealing layer; and the touch control layer group comprises at least one touch control electrode layer positioned on the sealing layer, and the touch control electrode layer is electrically connected with the connecting pad through the through hole of the sealing layer. The display device provided by the invention can reduce the cost.
Description
Technical field
A kind of the present invention relates to display technology field, more particularly to display device.
Background technology
With the development of human-computer interaction technology, touch technology is increasingly used on various display.Capacitive character is touched
, as which is wear-resistant, life-span length, when user uses, maintenance cost is low, and can support gesture identification and multi-point touch for control technology
Advantage and be widely used.
Detection mode of the capacitive character touch technology according to the electric capacity between different objects, can be divided into self-capacitance touch-control skill
Art and mutual capacitance type touch control technology.Self-capacitance touch technology detects defeated according to the capacitance variations between input object and electrode
Enter object presence on the touchscreen, position and motion.Mutual capacitance type touch control technology is then according between electrode caused by input object
Capacitance variations detecting input object presence on the touchscreen, position and motion.
In the prior art, OLED (Organic Light-Emitting Diode, the organic light emission of integrated touch-control thin film
Diode) display floater, generally connected by two flexible PCBs respectively the array base palte and touch-control thin film of display floater with
Realize respectively showing and touch controllable function.In prior art, the concrete structure of display floater may refer to Fig. 1 and Fig. 2.
Fig. 1 illustrates a kind of display floater of the prior art.Display floater 100A from bottom to top includes array base palte successively
110th, OLED element 120, packaging film 130, second substrate 140 and touch-control thin film 150.First flexible PCB 161 is located at battle array
110 upper surface of row substrate, the second flexible PCB 162 are located at 140 upper surface of second substrate.Thin film on array base palte 110 is brilliant
Body Gutron is crossed with the drive circuit of the binding of the first flexible PCB 161 driving, and then is realized showing and driven.Touch-control thin film 150
Driven by the drive circuit bound with the second flexible PCB 162, and then realize that touch-control drives.Display floater 100A's
In processing procedure, after needing first the second flexible PCB 162 is bound with second substrate 140, could will be formed with touch-control thin film 150
Second substrate is fitted with display base plate (including array base palte 110, OLED element 120, packaging film 130), and attaching process is complicated,
Yield and efficiency are low.
Fig. 2 illustrates a kind of display floater of the prior art.Display floater 100B from bottom to top includes array base palte successively
110th, OLED element 120, packaging film 130, touch-control thin film 150 and second substrate 140.First flexible PCB 161 is located at battle array
110 upper surface of row substrate, the second flexible PCB 162 are located at 140 lower surface of second substrate.First flexible PCB 161 is used for
Realize showing and drive.Second flexible PCB 162 is used for realizing that touch-control drives.In display floater 100B, the first flexible circuit
Spacing between plate 161 and the second flexible PCB 162 is larger, and easy formation mechanism is interfered.
For the embodiment of two prior art display floaters shown in Fig. 1 and Fig. 2, due to needing two flexible PCBs
Realize respectively showing and drive and touch-control driving, its cost of manufacture is higher, and processing technology is complex.
Content of the invention
Defect in order to overcome above-mentioned prior art to exist of the invention, there is provided a kind of display device, its can reach minimizing
Cost of manufacture and the effect of technique.
According to an aspect of the present invention, there is provided a kind of display device, including：First substrate, comprising viewing area and non-aobvious
Show area, the non-display area binding on the first substrate has integrated circuit, and the non-display area of the first substrate is also
Multiple connection pads are provided with, the integrated circuit is electrically connected to；Display element, described aobvious on the first substrate
Show in area, the display element is located at the homonymy of the first substrate with the integrated circuit；Sealant, shows unit positioned at described
Part is provided with multiple vias away from the side of the first substrate, the non-display area of the sealant；And touch control layer group, including
At least touch control electrode layer being located on the sealant, the touch control electrode layer by the via of the sealant with described
Connection pad electrical connection.
Compared with prior art, the present invention is connected to touch control layer group on first substrate by the via on sealant and is connected
Pad, to be tied on integrated circuit using same printed circuit board (PCB) on the first substrate, passes through a printed circuit with this
Plate is realized showing that driving and touch-control drive simultaneously, and then reduces the cost of manufacture of display device, and simplifies the processing procedure of display device
Technique.
Description of the drawings
Its example embodiment is described in detail by referring to accompanying drawing, above and other feature and advantage of the present invention will become
Become apparent from.
Fig. 1 shows a kind of sectional view of the display floater of prior art.
Fig. 2 shows the sectional view of the display floater of another kind of prior art.
Fig. 3 shows the sectional view of display device according to an embodiment of the invention.
Fig. 4 shows the top view of display device in Fig. 3.
Fig. 5 shows the sectional view of the display device according to further embodiment of this invention.
Fig. 6 shows the sectional view of display device according to another embodiment of the present invention.
Fig. 7 shows the sectional view of display device according to yet another embodiment of the invention.
Fig. 8 shows the top view of display device in Fig. 7.
Fig. 9 shows the sectional view of display device according to yet another embodiment of the invention.
Specific embodiment
Example embodiment is described more fully with referring now to accompanying drawing.However, example embodiment can be with multiple shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；Conversely, thesing embodiments are provided so that the present invention will
Fully and completely, and by the design of example embodiment those skilled in the art is comprehensively conveyed to.In figure, identical is attached
Icon note represents same or similar structure, thus will omit repetition thereof.
Described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner
In.In the following description, there is provided many details are fully understood to embodiments of the present invention so as to be given.However,
One of ordinary skill in the art would recognize that, without specific detail in one or more, or adopt other methods, constituent element, material
Material etc., it is also possible to put into practice technical scheme.In some cases, be not shown in detail or describe known features, material or
Person's operation is fuzzy of the invention to avoid.
The accompanying drawing of the present invention is only used for illustrating relative position relation, and in accompanying drawing, the size of element does not represent actual size
Proportionate relationship.
Big in order to solve processing procedure cost in prior art, the problem of complex manufacturing technology, the present invention provide a kind of display
Part, including：First substrate, comprising viewing area and non-display area, the non-display area binding on the first substrate has integrated circuit, the
The non-display area of one substrate is additionally provided with multiple connection pads, is electrically connected to the integrated circuit；Display element, positioned at first base
In viewing area on plate, the display element is located at the homonymy of first substrate with integrated circuit；Sealant, carries on the back positioned at display element
From the side of first substrate, the non-display area of the sealant is provided with multiple vias；And touch control layer group, including positioned at described close
An at least touch control electrode layer on sealing, the touch control electrode layer are electrically connected with pad is connected by the via of sealant.
Multiple embodiments that the present invention is provided are described below in conjunction with the accompanying drawings.
Referring first to Fig. 3, Fig. 3 shows the sectional view of display device according to an embodiment of the invention 200.Display device
200 include first substrate 210, display element 220, sealant and touch control layer group.
Specifically, first substrate 210 includes viewing area A1 and non-display area A2.Viewing area A1 is used for being shown, non-
Viewing area A2 is used for arranging circuit trace.Non-display area A2 bindings on first substrate 210 have integrated circuit.In the present embodiment
In, first substrate 210 binds integrated circuit by printed circuit board (PCB) 260.Printed circuit board (PCB) 260 is located on first substrate 210
The upper surface of non-display area A2.The non-display area A2 of first substrate 210 is additionally provided with multiple connection pads 250 (due to being section
Figure, therefore only illustrates 1 connection pad 250, and its actual quantity is multiple).Connection pad 250 is by 260 electricity of printed circuit board (PCB)
It is connected to integrated circuit.Further, first substrate 210 is array base palte.Array base palte 210 includes flexible substrate and is located at soft
Thin film transistor (TFT) on property substrate.The thin film transistor (TFT) being located in flexible substrate is connected to printed circuit board (PCB) 260 and by integrated electricity
Road is driving.Alternatively, flexible substrate can be by such as PI (Polyimide, polyimides) thin film, PET (Polyethylene
Glycol terephthalate, polyethylene terephthalate) thin film, PE (Polyethylene, polyethylene) thin film,
PEN (Polyethylene naphthalate two formic acid glycol ester, PEN)
The thin polymer film of thin film etc. is made.
Display element 220 is located in the viewing area A1 on first substrate 210.Display element 220 is located at integrated circuit
The homonymy of first substrate 210.In other words, display element 220 is located at first with the printed circuit board (PCB) 260 for being used for binding integrated circuit
The homonymy of substrate 210.Display element 220 is optionally OLED element.Film crystal of the OLED element 220 by array base palte 210
Pipe is driving.OLED element 220 alternatively includes anode electrode, hole injection layer, hole transmission layer, luminescent layer, electric transmission
Layer, electron injecting layer and cathode electrode.In OLED element 220, one or more layers of above-mentioned stepped construction can be omitted, or,
Other layers can also be increased.OLED element 220 can be that top lights or bottom light emitting-type.
Sealant is located at display element 220 away from the side of first substrate 210.The non-display area A2 of sealant is provided with many
Individual via.In the present embodiment, sealant includes packaging film 230, between display element 220 and touch control layer group.Such as Fig. 3
Shown, packaging film 230 extends to non-display area A2 from viewing area A1.The non-display area A2 of packaging film 230 is provided with multiple
First via 231 (due to being sectional view, therefore only illustrating 1 the first via 231, its actual quantity is multiple).Specifically,
Packaging film 230 can include barrier layer and base film.Barrier layer is located between base film and display element 220.Base material
Substrate in the making technologies such as thin film is sputtered as barrier layer, evaporation, deposition.Alternatively, base film by such as PI, PET,
The flexible polymeric materials such as PE, PEN are made.Alternatively, barrier layer is barrier.In certain embodiments, barrier layer by
Inorganic material layer and organic material layer are alternately stacked to be formed.Alternatively, inorganic material layer is made up of the one kind in following material：Nitrogen
SiClx；Silicon oxide；Silicon oxynitride；Or aluminium oxide.Inorganic material layer invades display element in order to be mainly used in stop water oxygen
220.Organic material layer is made up of organosilicon series material or flexible polymeric materials.Organosilicon series material includes four ethoxies
Base silicon, hexamethyl disiloxane, hexamethyldisiloxane, octamethylcy-clotetrasiloxane, silicon oxide carbide and carbonitride of silicium etc..Flexible
Polymeric material includes PI, PET, PE, PEN etc..Organic material layer is used for improving the flatness of base film, reduces machinery damage
Wound.
Touch control layer group includes at least touch control electrode layer 241 on sealant.Touch control electrode layer 241 is by sealing
The via of layer is electrically connected with pad 250 is connected.In the present embodiment, touch control electrode layer 241 is located on dress thin film 230, and is touched
Control electrode layer 241 is electrically connected by the first via 231 and connection pad 250.Specifically, touch control layer group is included positioned at thinner package
A touch control electrode layer 241 in viewing area A1 on film 230 and the multiple conducting pads 242 positioned at non-display area A2.Touch-control
Electrode layer 241 includes multiple touch control electrodes.Each touch control electrode electrical connection conducting pad 242, turns on pad 242 by sealant
Via (the first via in the present embodiment, that is, on packaging film 230 231) be connected pad 250 and electrically connect.Further
Ground, turns on metal (metal for example includes silver, copper, aluminum) or metal that pad 242 can pass through via (such as the first via 231) place
Slurry (metal pulp is for example comprising silver paste, copper slurry, aluminium paste) is connected to first substrate 210.
With further reference to Fig. 4, Fig. 4 shows the top view of display device in Fig. 3.Specifically, the display shown in Fig. 4
Part adopts self-tolerant touch technology.In the diagram, touch control electrode layer 241 is located in the viewing area A1 of first substrate 210, conducting weldering
Disk 242 is located in the non-display area A2 of first substrate 210.Alternatively, conducting pad 242 and touch control electrode layer 241 are in same system
Formed in journey processing step.Multiple touch control electrodes of touch control electrode layer 241 are arranged in a matrix, and each touch control electrode passes through touch-control lead
It is connected to conducting pad 242.Display device shown in Fig. 4 by measure the capacitance variations between input object and touch control electrode with
Determine the position that touch-control occurs.
As can be seen here, touch control layer group is connected to the first base by the via on sealant by the embodiment shown in Fig. 3 and Fig. 4
Connect pad 250 on plate 210, to be tied on integrated circuit using same printed circuit board (PCB) 260 on first substrate 210,
Realize simultaneously showing that driving and touch-control drive by a printed circuit board (PCB) 260 with this, and then reduce being fabricated to for display device
This, and simplify the making technology of display device.
Fig. 5 shows the sectional view of the display device according to further embodiment of this invention.Display device 300 shown in Fig. 5
It is also adopted by self-tolerant touch technology.In other words, the top view of display device 300 is similar with Fig. 4.Similar with Fig. 3, display device
300 include first substrate 310, display element 320, sealant and touch control layer group from the bottom to top successively.
From unlike Fig. 3, sealant includes packaging film 330 and glue-line 370.Glue-line 370 is further sealed and is protected
Packaging film 330 and display device 300.Packaging film 330 is located between display element 320 and touch control layer group.Glue-line 370 is at least
It is located in the non-display area A2 between first substrate 210 and touch control layer group.Glue-line 370 be provided with multiple second vias 371 (due to
It is sectional view, therefore 1 the second via 371 is only shown, its actual quantity is multiple), touch control electrode layer 341 passes through the second via
371 electrically connect with pad 350 is connected, and then are connected to the printed circuit board (PCB) 360 of 310 upper surface of first substrate.Specifically, with
Touch control electrode layer 341 can pass through the metal at the second via 371 with the conducting pad 342 of layer (metal for example includes silver, copper, aluminum)
Or metal pulp (metal pulp is for example comprising silver paste, copper slurry, aluminium paste) is connected to connection pad 350, and touch control electrode layer 341 is connected
To first substrate 310.
Fig. 6 shows the sectional view of display device according to another embodiment of the present invention.Display device 400 shown in Fig. 6
It is also adopted by self-tolerant touch technology.In other words, the top view of display device 400 is similar with Fig. 4.Display device 400 is from the bottom to top
Include successively first substrate 410, display element 420, sealant (in the present embodiment, sealant include packaging film 430), second
Substrate 480 and touch control layer group.The touch control electrode layer 441 at least described in one of touch control layer group is arranged on second substrate 480 away from first
The side of substrate 410.In due to the present embodiment, display device 400 adopts self-tolerant touch technology, and therefore, touch control layer group is only wrapped
Include one layer of touch control electrode layer 441 and with the touch control electrode layer 441 with layer conducting pad 442.
The non-display area A2 of second substrate 480 is provided with multiple 3rd vias 481 and (due to being sectional view, therefore only illustrates 1
Individual 3rd via 481, its actual quantity are multiple).3rd via 481 (in the present embodiment, that is, is encapsulated with the via of sealant
431) first via of thin film 430 connects.In some change case, the 3rd via 481 also can with glue-line (such as Fig. 5-370) on
Second via (such as Fig. 5-371) connects.So, the conducting pad 442 of touch control electrode layer 441 can pass through 481 He of the 3rd via
The via of sealant is electrically connected to the connection pad 450 on first substrate 410, and then is connected to 410 upper surface of first substrate
Printed circuit board (PCB) 460.Alternatively, second substrate 480 can be by such as PI (Polyimide, polyimides) thin film, PET
(Polyethylene glycol terephthalate, polyethylene terephthalate) thin film, PE (Polyethylene,
Polyethylene) thin film, PEN (Polyethylene naphthalate two formic acid glycol ester, poly- naphthalene two
Formic acid glycol ester) thin polymer film of thin film etc. makes.
Fig. 7 shows the sectional view of display device 500 according to yet another embodiment of the invention.Display device 500 and display
Device 200 is similar to, including first substrate 510, display element 520, sealant and touch control layer group.Different from display device 200
It is that display device 500 adopts mutual capacitance type touch technology.Touch control layer group includes the first touch control electrode layer 541, second touch control electrode layer
542 and the multiple conducting pads 540 positioned at non-display area A2.In the present embodiment, encapsulation of the pad 540 by sealant is turned on
The first via 531 on thin film 530 is electrically connected to the connection pad 550 on first substrate 510, and then is electrically connected to printed circuit
Plate 560.In some change case, sealant also includes glue-line, turns on pad 540 by the second via on the glue-line of sealant
The connection pad 550 being electrically connected on first substrate 510.In other change case, display device 200 is also included positioned at sealing
Second substrate between layer and touch control layer group, turns on pad 540 by the mistake on the 3rd via and sealant on second substrate
Hole is electrically connected to the connection pad 550 on first substrate 510.
Display device 500 is described further combined with Fig. 8.Fig. 8 shows the top view of display device 500 in Fig. 7.In Fig. 8
In, the first touch control electrode layer 541 and second touch control electrode layer 542 are located in the viewing area A1 of first substrate 410.First touch-control electricity
Pole layer 541 includes multiple first touch control electrodes for extending in a first direction.Second touch control electrode layer 542 includes prolonging in a second direction
The second touch control electrode that stretches.Each first touch control electrode and each second touch control electrode mutually insulated.
The conducting pad (such as Fig. 7-540) being located in the non-display area A2 of first substrate 510 includes connection the first touch-control electricity
Second conducting pad 544 of the first conducting pad 543 and connection second touch control electrode layer 542 of pole layer 541.Alternatively, each
One touch control electrode and second touch control electrode are respectively connecting to the first conducting pad 543 and two conducting pads 544 by touch-control lead.
Corresponding, the connection pad (such as Fig. 7-550) on first substrate 510 includes the first connection being connected with the first conducting pad 543
Pad and the second connection pad being connected with the second conducting pad 544.First conducting pad 543 and first connects pad first
Projection on substrate 510 is overlapped.The projection on the first substrate 510 of second conducting pad 544 and the second connection pad is overlapped.Figure
Display device shown in 8 passes through to measure the capacitance variations of the first touch control electrode and second touch control electrode overlapping region to determine touch-control
The position of generation.
Fig. 9 shows the sectional view of display device according to yet another embodiment of the invention.Display device 600 adopts mutual capacitance type
Touch technology.In other words, the top view of display device 600 is similar with Fig. 8.The structure of display device 600 and display device in Fig. 9
500 are similar to, including first substrate 610, display element 620, sealant and touch control layer group.
From unlike display device 600, display device 600 also includes sealing coat 670.In the present embodiment, sealing coat
670 be flexible base board, any one in inorganic insulation layer.Sealing coat 670 is located at the first touch control electrode layer 641 and the second touch-control
Between electrode layer 642.(due to being sectional view, therefore only the non-display area A2 of sealing coat 670 is provided with multiple 4th vias 671
1 the 4th via 671 is shown, its actual quantity is multiple).The via of the 4th via 671 and sealant is (in the present embodiment,
That is 631) the first via of packaging film 630 connects.In some change case, the 4th via 671 also can with glue-line (as Fig. 5-
370) the second via (such as Fig. 5-371) on connects.
In the present embodiment, the first conducting pad 643 and the first touch control electrode layer of the first touch control electrode layer 641 of connection
641 same layers；Second conducting 641 same layer of pad 644 and the first touch control electrode layer of connection second touch control electrode layer 642.In other words,
First conducting pad 643 is located between packaging film 630 and sealing coat 670；Second conducting pad 644 be located at sealing coat 670 it
On.
Specifically, the first conducting pad 643 passes through via (in the present embodiment, i.e. the first via of packaging film 630
631) electrical connection first connects pad 651.Second conducting pad 644 is by via (in the present embodiment, i.e. packaging film 630
The first via 631) and the 4th via 671 electrical connection second connect pad 652.So, the first touch control electrode layer 641 and second
Touch control electrode layer 642 is connected to the printed circuit board (PCB) 660 of 610 upper surface of first substrate.
In a change case of the present embodiment, the first touch control electrode layer 641 is integrated in sealant.Second touch control electrode
Layer 642 is located at sealing coat 670 away from the side of sealant.Specifically, sealant includes packaging film 630, packaging film 630
As it was previously stated, base film, organic material layer and inorganic material layer can be included.First touch control electrode layer 641 can be base material
Arbitrary side surface of thin film, between organic material layer and inorganic material layer or be located between packaging film 630 and display element,
To be integrated in sealant.
In a change case of the present embodiment, sealing coat 670 is optical thin film, and second touch control electrode layer 642 is integrated in
In optical thin film 670.Optical thin film 670 includes one or more in line polarisation piece, 1/4 phase retardation film and 1/2 phase retardation film
Optical element.Second touch control electrode layer 642 is may be located in optical thin film between two optical elements or positioned at optical thin film
670 arbitrary side surface, to be integrated in optical thin film 670.
Each accompanying drawing above-mentioned is only the display device for schematically showing present invention offer.For the sake of clarity, simplify
Component shape, number of elements clipped element in above-mentioned each figure, those skilled in the art can enter according to the actual requirements
Row change, these changes all within the scope of the present invention, will not be described here.
Compared with prior art, the present invention is connected to touch control layer group on first substrate by the via on sealant and is connected
Pad, to be tied on integrated circuit using same printed circuit board (PCB) on the first substrate, passes through a printed circuit with this
Plate is realized showing that driving and touch-control drive simultaneously, and then reduces the cost of manufacture of display device, and simplifies the processing procedure of display device
Technique.
The illustrative embodiments of the present invention are more than particularly shown and described.It should be understood that the invention is not restricted to institute
Disclosed embodiment, on the contrary, it is intended to cover comprising various modifications within the scope of the appended claims and equivalent put
Change.
Claims (17)
1. a kind of display device, it is characterised in that include：
First substrate, comprising viewing area and non-display area, the non-display area binding on the first substrate has integrated circuit,
The non-display area of the first substrate is additionally provided with multiple connection pads, is electrically connected to the integrated circuit；
Display element, in the viewing area on the first substrate, the display element and the integrated circuit position
Homonymy in the first substrate；
Sealant, positioned at the display element away from the side of the first substrate, the non-display area of the sealant is provided with
Multiple vias；And
Touch control layer group, including at least touch control electrode layer on the sealant, the touch control electrode layer is by described
The via of sealant is electrically connected with the connection pad.
2. display device as claimed in claim 1, it is characterised in that the sealant includes：
Packaging film, between the display element and the touch control layer group.
3. display device as claimed in claim 2, it is characterised in that the packaging film extends to described from the viewing area
Non-display area, the non-display area of the packaging film are provided with multiple first vias, and the touch control electrode layer passes through described first
Via and connection pad electrical connection.
4. display device as claimed in claim 2, it is characterised in that the sealant also includes：
Glue-line, is located at least in the non-display area between the first substrate and the touch control layer group, and the glue-line is provided with many
Individual second via, the touch control electrode layer are electrically connected with the connection pad by second via.
5. display device as claimed in claim 1, it is characterised in that also include：
Second substrate, on the sealant.
6. display device as claimed in claim 5, it is characterised in that touch control electrode layer is arranged on described second at least described in
Away from the side of the first substrate, the non-display area of the second substrate is provided with multiple 3rd vias to substrate, described
3rd via is connected with the via.
7. display device as claimed in claim 1, it is characterised in that the touch control layer group has a touch control electrode layer and is located at
Multiple conducting pads of the non-display area, the touch control electrode layer include multiple touch control electrodes, the touch control electrode electrical connection
The conducting pad, the conducting pad are electrically connected with the connection pad by the via of the sealant.
8. display device as claimed in claim 1, it is characterised in that the touch control electrode layer include the first touch control electrode layer and
Second touch control electrode layer, the touch control layer group also include the multiple conducting pads positioned at the non-display area, the conducting pad
Including the first conducting pad for connecting first touch control electrode layer and the second conducting weldering for connecting the second touch control electrode layer
Disk,
The connection pad is included the first connection pad being connected with the described first conducting pad and turns on pad with described second
Second connection pad of connection.
9. display device as claimed in claim 8, it is characterised in that also include：
Sealing coat, between first touch control electrode layer and second touch control electrode layer, the sealing coat described non-display
Area is provided with multiple 4th vias, and the 4th via is connected with the via,
Wherein, the first conducting pad electrically connects the first connection pad, the second conducting pad by the via
The second connection pad is electrically connected by the via and the 4th via.
10. display device as claimed in claim 9, it is characterised in that first touch control electrode layer is integrated in the sealing
In layer, the second touch control electrode layer is located at the sealing coat away from the side of the sealant.
11. display devices as claimed in claim 10, it is characterised in that the sealing coat is optical thin film, and described second touches
Control electrode layer is integrated in the optical thin film.
12. display devices as claimed in claim 11, it is characterised in that the optical thin film includes line polarisation piece, 1/4 phase place
One or more optical elements in difference film and 1/2 phase retardation film.
13. display devices as claimed in claim 9, it is characterised in that first touch control electrode layer is included in the first direction
Multiple first touch control electrodes for extending, the second touch control electrode layer include the second touch control electrode for extending in a second direction.
14. display devices as claimed in claim 9, it is characterised in that the sealing coat is flexible base board, in inorganic insulation layer
Any one.
15. display devices as described in claim 5 or 8, it is characterised in that the conducting pad is connected by metal or metal pulp
It is connected to the first substrate；
The metal includes silver, copper, aluminum, and the metal pulp includes silver paste, copper slurry, aluminium paste.
16. display devices as claimed in claim 1, it is characterised in that the first substrate is array base palte, including flexible liner
Bottom and the thin film transistor (TFT) in the flexible substrate, the thin film transistor (TFT) are driven by the integrated circuit.
17. display devices as claimed in claim 16, it is characterised in that the integrated circuit is bundled in by printed circuit board (PCB)
On the first substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610931458.8A CN106505089B (en) | 2016-10-31 | 2016-10-31 | Display device with a light-shielding layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610931458.8A CN106505089B (en) | 2016-10-31 | 2016-10-31 | Display device with a light-shielding layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106505089A true CN106505089A (en) | 2017-03-15 |
| CN106505089B CN106505089B (en) | 2019-11-05 |
Family
ID=58319696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610931458.8A Active CN106505089B (en) | 2016-10-31 | 2016-10-31 | Display device with a light-shielding layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106505089B (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973496A (en) * | 2017-05-09 | 2017-07-21 | 上海天马微电子有限公司 | Flexible circuit board and display device |
| CN107275379A (en) * | 2017-07-28 | 2017-10-20 | 武汉华星光电半导体显示技术有限公司 | Touch oled display panel and display device |
| CN107807753A (en) * | 2017-10-31 | 2018-03-16 | 武汉华星光电技术有限公司 | Touch oled display panel and display device |
| CN108091676A (en) * | 2017-12-14 | 2018-05-29 | 合肥鑫晟光电科技有限公司 | A kind of touch display substrate, its production method and touch control display apparatus |
| CN108803923A (en) * | 2017-05-03 | 2018-11-13 | 瑞鼎科技股份有限公司 | Capacitance type touch-control panel |
| CN109119445A (en) * | 2018-08-27 | 2019-01-01 | 京东方科技集团股份有限公司 | A kind of display base plate and preparation method thereof, display panel and display device |
| CN109144320A (en) * | 2018-08-23 | 2019-01-04 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
| CN109828691A (en) * | 2019-02-01 | 2019-05-31 | 华为技术有限公司 | Touch screen and electronic equipment for narrow frame electronic equipment |
| CN109842977A (en) * | 2017-11-28 | 2019-06-04 | 乐金显示有限公司 | OLED lighting device |
| CN109933227A (en) * | 2017-12-15 | 2019-06-25 | 南昌欧菲光科技有限公司 | FPC structure and terminal |
| CN110262702A (en) * | 2019-07-30 | 2019-09-20 | 昆山国显光电有限公司 | A kind of display panel and display device |
| CN110377184A (en) * | 2019-07-30 | 2019-10-25 | 昆山国显光电有限公司 | A kind of display panel and display device |
| CN110518050A (en) * | 2019-08-30 | 2019-11-29 | 昆山国显光电有限公司 | Display panel and preparation method thereof and display device |
| CN111128022A (en) * | 2019-12-24 | 2020-05-08 | 云谷（固安）科技有限公司 | Display panel, preparation method thereof and display device |
| CN111583812A (en) * | 2020-05-26 | 2020-08-25 | 京东方科技集团股份有限公司 | Connection substrate, preparation method, spliced screen and display device |
| CN112103297A (en) * | 2019-06-18 | 2020-12-18 | 群创光电股份有限公司 | Electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202331403U (en) * | 2011-10-27 | 2012-07-11 | 傲达科技（香港）有限公司 | Liquid crystal induction screen |
| CN103681735A (en) * | 2012-09-18 | 2014-03-26 | 乐金显示有限公司 | Organic light emitting display |
| CN104714710A (en) * | 2015-03-27 | 2015-06-17 | 深圳市深越光电技术有限公司 | GX-cell capacitive touch screen module and manufacturing method thereof |
| US20160247871A1 (en) * | 2000-08-10 | 2016-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Area sensor and display apparatus provided with an area sensor |
-
2016
- 2016-10-31 CN CN201610931458.8A patent/CN106505089B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160247871A1 (en) * | 2000-08-10 | 2016-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Area sensor and display apparatus provided with an area sensor |
| CN202331403U (en) * | 2011-10-27 | 2012-07-11 | 傲达科技（香港）有限公司 | Liquid crystal induction screen |
| CN103681735A (en) * | 2012-09-18 | 2014-03-26 | 乐金显示有限公司 | Organic light emitting display |
| CN104714710A (en) * | 2015-03-27 | 2015-06-17 | 深圳市深越光电技术有限公司 | GX-cell capacitive touch screen module and manufacturing method thereof |
Cited By (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108803923A (en) * | 2017-05-03 | 2018-11-13 | 瑞鼎科技股份有限公司 | Capacitance type touch-control panel |
| CN106973496A (en) * | 2017-05-09 | 2017-07-21 | 上海天马微电子有限公司 | Flexible circuit board and display device |
| CN106973496B (en) * | 2017-05-09 | 2019-06-11 | 上海天马微电子有限公司 | Flexible circuit board and display device |
| CN107275379A (en) * | 2017-07-28 | 2017-10-20 | 武汉华星光电半导体显示技术有限公司 | Touch oled display panel and display device |
| US10516014B2 (en) | 2017-07-28 | 2019-12-24 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Touch OLED display panel and display apparatus |
| WO2019019235A1 (en) * | 2017-07-28 | 2019-01-31 | 武汉华星光电半导体显示技术有限公司 | Oled touch display panel, and display device |
| CN107807753A (en) * | 2017-10-31 | 2018-03-16 | 武汉华星光电技术有限公司 | Touch oled display panel and display device |
| WO2019085169A1 (en) * | 2017-10-31 | 2019-05-09 | 武汉华星光电技术有限公司 | Touch oled display panel and display device |
| CN109842977A (en) * | 2017-11-28 | 2019-06-04 | 乐金显示有限公司 | OLED lighting device |
| CN109842977B (en) * | 2017-11-28 | 2021-04-16 | 乐金显示有限公司 | OLED lighting device |
| CN108091676A (en) * | 2017-12-14 | 2018-05-29 | 合肥鑫晟光电科技有限公司 | A kind of touch display substrate, its production method and touch control display apparatus |
| CN109933227A (en) * | 2017-12-15 | 2019-06-25 | 南昌欧菲光科技有限公司 | FPC structure and terminal |
| CN109144320A (en) * | 2018-08-23 | 2019-01-04 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
| CN109144320B (en) * | 2018-08-23 | 2021-12-03 | 武汉天马微电子有限公司 | Display panel and display device |
| CN109119445A (en) * | 2018-08-27 | 2019-01-01 | 京东方科技集团股份有限公司 | A kind of display base plate and preparation method thereof, display panel and display device |
| US11367758B2 (en) | 2018-08-27 | 2022-06-21 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate and method for manufacturing the same, display panel and display device |
| CN109119445B (en) * | 2018-08-27 | 2021-09-14 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof, display panel and display device |
| US11550417B2 (en) | 2019-02-01 | 2023-01-10 | Huawei Technologies Co., Ltd. | Touchscreen for narrow-frame electronic device, and electronic device |
| CN109828691B (en) * | 2019-02-01 | 2023-06-20 | 华为技术有限公司 | Touch screen for narrow-frame electronic equipment and electronic equipment |
| EP3896557A4 (en) * | 2019-02-01 | 2022-02-23 | Huawei Technologies Co., Ltd. | Touch screen for narrow-bezel electronic apparatus, and electronic apparatus |
| CN109828691A (en) * | 2019-02-01 | 2019-05-31 | 华为技术有限公司 | Touch screen and electronic equipment for narrow frame electronic equipment |
| CN112103297A (en) * | 2019-06-18 | 2020-12-18 | 群创光电股份有限公司 | Electronic device |
| CN110262702B (en) * | 2019-07-30 | 2022-05-10 | 昆山国显光电有限公司 | Display panel and display device |
| US11747934B2 (en) | 2019-07-30 | 2023-09-05 | Kunshan Go-Visionox Opto-Electronics Co., Ltd | Display panel and display device |
| CN110262702A (en) * | 2019-07-30 | 2019-09-20 | 昆山国显光电有限公司 | A kind of display panel and display device |
| CN110377184B (en) * | 2019-07-30 | 2022-04-12 | 昆山国显光电有限公司 | Display panel and display device |
| CN110377184A (en) * | 2019-07-30 | 2019-10-25 | 昆山国显光电有限公司 | A kind of display panel and display device |
| CN110518050A (en) * | 2019-08-30 | 2019-11-29 | 昆山国显光电有限公司 | Display panel and preparation method thereof and display device |
| EP4009310A4 (en) * | 2019-12-24 | 2022-10-19 | Yungu (Gu'an) Technology Co., Ltd. | Display panel and preparing method therefor, and display apparatus |
| WO2021129093A1 (en) * | 2019-12-24 | 2021-07-01 | 云谷（固安）科技有限公司 | Display panel and preparing method therefor, and display apparatus |
| JP2022545490A (en) * | 2019-12-24 | 2022-10-27 | 云谷（固安）科技有限公司 | Display panel, manufacturing method thereof, and display device |
| CN111128022A (en) * | 2019-12-24 | 2020-05-08 | 云谷（固安）科技有限公司 | Display panel, preparation method thereof and display device |
| JP7292499B2 (en) | 2019-12-24 | 2023-06-16 | 云谷（固安）科技有限公司 | Display panel, manufacturing method thereof, and display device |
| CN111128022B (en) * | 2019-12-24 | 2021-04-23 | 云谷（固安）科技有限公司 | Display panel, preparation method thereof and display device |
| US11825681B2 (en) | 2019-12-24 | 2023-11-21 | Yungu (Gu'an) Technology Co., Ltd. | Display panel and display device |
| CN111583812A (en) * | 2020-05-26 | 2020-08-25 | 京东方科技集团股份有限公司 | Connection substrate, preparation method, spliced screen and display device |
| CN111583812B (en) * | 2020-05-26 | 2023-09-22 | 京东方科技集团股份有限公司 | Connection substrate, preparation method, spliced screen and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106505089B (en) | 2019-11-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106505089A (en) | Display device with a light-shielding layer | |
| CN107527932B (en) | Display apparatus | |
| CN105390526B (en) | It is integrated with the flexible oganic light-emitting display device of In-cell touch panel | |
| CN206332028U (en) | Flexible display panel and flexible display device | |
| CN206774549U (en) | Touch display panel and touch display device | |
| CN106033765B (en) | Organic Light Emitting Diode touch-control display panel | |
| US8906717B2 (en) | Organic light emitting diode display device having built-in touch panel and method of manufacturing the same | |
| CN103855188B (en) | There is OLED display and the manufacture method thereof of touch sensor | |
| CN104679369A (en) | Flexible display device including touch sensor | |
| CN107025014A (en) | Touch panel and the display device including the touch panel | |
| CN106775173A (en) | Touch display panel and touch display device | |
| CN108123062A (en) | Organic light-emitting display device | |
| CN105047609B (en) | Organic LED array substrate and preparation method thereof, touch control display apparatus | |
| CN206058160U (en) | touch sensor, flexible touch display panel and flexible touch display device | |
| CN107885383A (en) | Display module | |
| CN106648207A (en) | Display device | |
| CN115360228A (en) | Display device | |
| CN106229332A (en) | Display panel, manufacturing method thereof and flexible display device | |
| CN208903231U (en) | Electrode connecting structure, electronic device, image display device and touch screen panel | |
| CN107037922B (en) | Display device and method for manufacturing the same | |
| CN105745607A (en) | Display apparatus using semiconductor light emitting device | |
| TWI541693B (en) | Structure of touch control device | |
| KR20210050235A (en) | Flexible display device | |
| CN107632743B (en) | Touch OLED display panel and display device | |
| CN106406627A (en) | Flexible touch display panel and touch display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |