CN109933227A - FPC structure and terminal - Google Patents
FPC structure and terminal Download PDFInfo
- Publication number
- CN109933227A CN109933227A CN201711347549.8A CN201711347549A CN109933227A CN 109933227 A CN109933227 A CN 109933227A CN 201711347549 A CN201711347549 A CN 201711347549A CN 109933227 A CN109933227 A CN 109933227A
- Authority
- CN
- China
- Prior art keywords
- pad
- electrode
- substrate
- hole
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 94
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 7
- 239000002952 polymeric resin Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 10
- 230000006698 induction Effects 0.000 description 9
- 230000005611 electricity Effects 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The invention proposes a kind of FPC structure, it to be used for terminal, comprising: substrate offers through-hole on substrate；The side of substrate is arranged in first electrode；First pad, is electrically connected with first electrode, and is located at the same side of substrate with first electrode；The other side of substrate is arranged in second electrode；Second pad, the same side of substrate is located at the first pad, and second electrode is electrically connected by through-hole with the second pad.FPC structure proposed by the present invention, by the same side that the first pad and the second pad are arranged in substrate, the first pad, the second pad is facilitated to connect with the external world, simultaneously when manufacturing, directly the first pad and the second pad can be arranged in predeterminated position, integrated wiring board and the first pad and the second pad are electrically connected again, the connection of the first pad, the second pad and wiring board is effectively avoided deviation occur.
Description
Technical field
The invention belongs to terminal device technical fields, in particular to a kind of FPC structure and a kind of terminal.
Background technique
The GFF such as current phone, plate, wearable device (Class Film Film) structure touch screen design is in two bases
Multiple emission electrodes (TX) and multiple induction electrodes (RX) are respectively set on plate, as shown in Figures 1 to 8, two substrates are respectively
First emission electrode is arranged on first substrate 12a ' in process by first substrate 12a ' and the second substrate 12b ', then will
Induction electrode is arranged on the second substrate 12b ', after carrying out slot treatment to the second substrate 12b ', by the second substrate 12b ' and the
One substrate 12a ' is stacked, and then makes the first pad 16 ' being electrically connected with emission electrode and be electrically connected with induction electrode
Second pad 20 ' is exposed to outside convenient for connection line plate, but in assembling process, due to needing to be bonded two substrates
Assembling, and then the first pad 16 ' is easily caused to shift during being bonded with the second pad 20 ', contraposition deviation is generated, is made
Obtaining integrated wiring board can not accurately be electrically connected with multiple first pads 16 ' and multiple second pads 20 ', influence to add
Working hour is long, influences touch-control effect.
Summary of the invention
The present invention is directed to solve at least one of the technical problems existing in the prior art or related technologies.
For this purpose, the first aspect of the present invention proposes a kind of FPC structure.
The second aspect of the present invention proposes a kind of terminal.
In view of this, the first aspect of the present invention proposes a kind of FPC structure, it to be used for terminal, comprising: substrate, on substrate
Offer through-hole；The side of substrate is arranged in first electrode；First pad, is electrically connected with first electrode, and with first electrode position
In the same side of substrate；The other side of substrate is arranged in second electrode；Second pad is located at the same of substrate with the first pad
Side, second electrode are electrically connected by through-hole with the second pad.
FPC structure proposed by the present invention has a substrate, and the two sides of substrate are arranged in first electrode and second electrode, the
One pad is electrically connected with first electrode and the two is located at the same side of substrate, and the second pad is located at the same of substrate with the first pad
Side.By the way that the first pad and the second pad to be arranged in the same side of substrate, on the one hand connection is more concentrated, save
Terminal inner space avoids substrate two sides from being all connected with wiring board or two sandwich circuit boards of setting and more occupied spaces and causes route multiple
It is miscellaneous；On the other hand the connection of other peripheral hardwares such as the first pad, the second pad and wiring board is facilitated.Specifically, manufacturing
When, it is generally the case that in order to save working hour, wiring board and pad are individually manufactured, and multiple routes in wiring board have
Route in wiring board is directly electrically connected by preset spacing and position in assembling with pad, and at this moment, it is existing
Due to needing first to be bonded the substrate that the first pad is arranged with the substrate of the second pad of setting in technology, and then it had been bonded
Easily there is contraposition deviation in Cheng Zhong, causes the position of the first pad and the second pad that opposite offset occurs, so that pad and route
Plate can not connect well.And in the present invention, since the same side of substrate is arranged in the first pad and the second pad, and then making
During work, the first pad and the second pad can be directly arranged in the side of substrate, wanted according to preset position and spacing etc.
It asks that the first pad and the setting of the second pad is in place, and then in electrical interconnection plate, can directly dock on wiring board
Route, eliminate contraposition deviation brought by adhesive substrates, it is ensured that pad is accurately connect with wiring board.In addition, due to exempting
It the process of adhesive substrates and eliminates and repeatedly docks the process for finding pad accurately using multiple wiring boards, greatly improve production
Efficiency saves working hour, is electrically connected simultaneously with the first pad and the second pad using integrated wiring board, facilitates behaviour
Make.In addition, enabling second electrode to be electrically connected by through-hole with the second pad by opening up through-hole on substrate, guaranteeing
While first pad and the second pad are located at substrate the same side, guarantee connection and save terminal inner space, avoid the
Two electrodes are curved to the other side around substrate edge and are electrically connected and more occupied spaces with the second pad.Furthermore, it is necessary to explanation
It is that the FPC structure in the present invention may be directly applied in touch sensing and/or fingerprint sensor, when it is applied to above-mentioned biography
When in sensor, first electrode is any of emission electrode and induction electrode, and second electrode is receiving electrode and driving electrodes
In another.
In addition, the FPC structure in above-described embodiment provided by the invention can also have following additional technical feature:
In the above-mentioned technical solutions, it is preferable that first electrode is any of receiving electrode and driving electrodes, the second electricity
Another extremely in receiving electrode and driving electrodes.
In the technical scheme, first electrode and second electrode are receiving electrode and driving electrodes, and then the FPC structure
Have the function of accommodating capacitor, the variation of the capacitance between first electrode and second electrode between first electrode and second electrode
Wiring board directly can be transferred to by the first pad and the second pad and be transferred to the controller connecting with wiring board, into
And the PFC structure can be directly used for touch sensing also and can be directly used for fingerprint tactility apparatus, facilitates and turns the touching effect of human body
It is changed to capacitor and then judges touch points position or carry out identification fingerprint.
In any of the above-described technical solution, it is preferable that second electrode is protruded into through-hole and is electrically connected with the second pad.
In the technical scheme, when second electrode is arranged, directly second electrode can be extended to inside through-hole, by second
Electrode is directly contacted with pad, and then second electrode and pad are electrically connected, easy to process, can also be set on the second electrode
Protrusion is set, protrusion is integrated with second electrode, and protrusion protrudes into through-hole to be in contact with the second pad, so that the second electricity
Pole is electrically connected with the realization of the second pad.It is electrically connected by protruding into second electrode in through-hole with the second pad, on the one hand, convenient to add
Tooling is matched, save working hour, on the other hand improve terminal space utilization rate, avoid second electrode around substrate edge curve to
The other side is electrically connected and more occupied spaces with the second pad.
In any of the above-described technical solution, it is preferable that conductive part is set in through-hole, and conductive part one end is electrically connected with second electrode
It connects, the other end of conductive part is electrically connected with the second pad.
In the technical scheme, by filling conductive part in through-hole, conductive part one end is in contact with the second pad, makes to lead
Electric portion is electrically connected with the second pad, and the other end of conductive part is in contact with second electrode, is electrically connected conductive part with second electrode,
On the one hand it eliminates and projective structure is set and increases second electrode difficulty of processing on the second electrode, so that second electrode need to only adopt
The other side of substrate is set with existing plating etch process, on the other hand saves working hour, facilitates processing, need to will only lead
Electric portion is plugged in through-hole and is in contact with second electrode, convenient for assembly.Wherein it is preferred to the outer peripheral surface of conductive part with
The inner peripheral surface of through-hole fits closely, and conductive part is effectively prevent to fall off in through-hole or shake and lead to second electrode and the second pad
Contact not tight problem, it is ensured that second electrode is remained with the second pad and well contacted.
In any of the above-described technical solution, it is preferable that the upper surface of the first pad and the second pad is located at same level
On.
In the technical scheme, the first pad and the second pad are not only located at the same side of substrate, while the first pad
Upper surface and the upper surface of the second pad are located in same level, further facilitate the first pad and the second pad and line
The connection of the external components such as road plate, especially in connection line plate, whole wiring board need to only keep horizontality to be sequentially connected
First pad and the second pad, not only facilitate connection, while ensuring to connect between the first pad and the second pad and wiring board
The accuracy connect, when the upper surface of the first pad and the second pad being avoided to be not on horizontal plane, the route that is electrically connected with the two
Plate needs that bending occurs and deviation occurs, causes wiring board that can not while accurately connect the first pad and the second pad, needs
Bending is adjusted again, influences to process duration.
In any of the above-described technical solution, it is preferable that the number of first electrode be it is multiple, the number of second electrode is more
It is a, the number of through-hole be it is multiple, second electrode is identical as the number of through-hole and corresponds.
In the technical scheme, the number of first electrode is multiple, and the number of second electrode is also multiple, while first welds
The number of disk and the number of the second pad be also it is multiple, the number of first electrode is identical as the number of the first pad and one is a pair of
It answers, the number of second electrode is identical as the number of the second pad and corresponds.In addition, the number of through-hole is also more on substrate
A, and the number of second electrode is identical and one-to-one correspondence, second pad are arranged a through hole, preferably for the number of through-hole
Ground, second pad cover one end of a through-hole or the surrounding of a through-hole are arranged in.
In any of the above-described technical solution, it is preferable that substrate is pet layer or cyclic olefin polymer resin layer or PI layers.
In the technical scheme, substrate can be pet layer, can also be cyclic olefin polymer resin layer, can also be PI layers, can root
According to needing to select suitable material setting substrate, wherein pet layer, cyclic olefin polymer resin layer and PI layers are transparence, and
With certain flexibility, it is easy to implement flexible screen terminal.
In any of the above-described technical solution, it is preferable that through-hole is round hole or regular polygon hole.
In the technical scheme, through-hole is round hole or regular polygon hole, on the one hand facilitates processing, another aspect round hole
Or polygonal hole is smaller to the structure destructive power of substrate, while opening up through-hole, improves the structural strength of substrate as far as possible.
In any of the above-described technical solution, it is preferable that the diameter of through-hole or its circumscribed circle diameter range are 50 μm to 300 μ
m。
In the technical scheme, the diameter range of the diameter of through-hole or its circumscribed circle is 50 μm to 300 μm, is on the one hand avoided
The diameter of through-hole or its circumscribed circle diameter are too small, lead to through-hole processing difficulties less than 50 μm, and second electrode is difficult logical by this
Hole is electrically connected with the second pad, on the other hand avoids the diameter of through-hole or its circumscribed circle diameter excessive, the shadow greater than 300 μm
Ring the intensity of substrate.
Second aspect of the present invention proposes a kind of terminal, comprising: such as the FPC structure of any one of above-mentioned technical proposal.
Terminal provided by the invention because including the FPC structure such as any one of above-mentioned technical proposal, and then has above-mentioned
The beneficial effect of the FPC structure of one technical solution, does not do repeat one by one herein.
Third aspect present invention proposes a kind of display component, is used for terminal, comprising: touch sensing and/or fingerprint pass
Sensor includes the FPC structure such as any one of above-mentioned technical proposal in touch sensing, includes such as above-mentioned skill in fingerprint sensor
The FPC structure of any one of art scheme.
In the technical scheme, when FPC structure is applied to touch sensing, the first electrode in FPC structure is touch-control
Any of emission electrode and the induction electrode of touch sensing of sensor, second electrode are the reception electricity of touch sensing
Another in the driving electrodes of pole and touch sensing.When FPC structure is applied to fingerprint sensor, in FPC structure the
One electrode is any of emission electrode and induction electrode of fingerprint sensor of fingerprint sensor, and second electrode is fingerprint biography
Another in the receiving electrode of sensor and the driving electrodes of fingerprint sensor.
Additional aspect and advantage of the invention will become obviously in following description section, or practice through the invention
Recognize.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
The overlooking structure diagram after the first pad is arranged during showing processing FPC in the related technology in Fig. 1；
Fig. 2 shows the broken section structural schematic diagrams after the first pad of setting during processing FPC in the related technology；
The overlooking structure diagram after the second pad is arranged during showing processing FPC in the related technology in Fig. 3；
The broken section structural schematic diagram after the second pad is arranged during showing processing FPC in the related technology in Fig. 4；
The plan structure that Fig. 5 shows during processing FPC in the related technology after substrate fluting where second electrode is shown
It is intended to；
Fig. 6 shows the broken section knot processed during FPC after substrate fluting where second electrode in the related technology
Structure schematic diagram；
Fig. 7 show in the related technology processing FPC during first substrate and the second substrate combination after plan structure
Schematic diagram；
Fig. 8 show in the related technology processing FPC during first substrate and the second substrate combination after broken section
Structural schematic diagram；
After the first pad and the second pad is arranged in the process in the processing FPC that Fig. 9 shows one embodiment of the present of invention
Overlooking structure diagram；
After the first pad and the second pad is arranged in the process in the processing FPC that Figure 10 shows one embodiment of the present of invention
Broken section structural schematic diagram；
The processing FPC that Figure 11 shows one embodiment of the present of invention opens up the plan structure signal after through-hole in the process
Figure；
The broken section structure that Figure 12 shows after opening up through-hole during the processing FPC of one embodiment of the present of invention is shown
It is intended to；
Figure 13 is shown during the processing FPC of one embodiment of the present of invention after second electrode and the electrical connection of the second pad
Overlooking structure diagram；
Figure 14 is shown during the processing FPC of one embodiment of the present of invention after second electrode and the electrical connection of the second pad
Broken section structural schematic diagram.
Wherein, corresponding relationship of the Fig. 1 into Fig. 8 between appended drawing reference and component names are as follows:
12a ' first substrate, 12b ' the second substrate, 16 ' first pads, 20 ' second pads；
Corresponding relationship of the Fig. 9 into Figure 14 between appended drawing reference and component names are as follows:
12 substrates, 122 through-holes, 14 first electrodes, 16 first pads, 18 second electrodes, 20 second pads.
Specific embodiment
To better understand the objects, features and advantages of the present invention, with reference to the accompanying drawing and specific real
Applying mode, the present invention is further described in detail.It should be noted that in the absence of conflict, the implementation of the application
Feature in example and embodiment can be combined with each other.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, still, the present invention may be used also
To be implemented using other than the one described here other modes, therefore, protection scope of the present invention is not by described below
Specific embodiment limitation.
The FPC structure described according to some embodiments of the invention and terminal are described referring to Fig. 9 to Figure 14.
As shown in Fig. 9 to Figure 14, the embodiment of first aspect present invention proposes a kind of FPC structure, is used for terminal, packet
Include: substrate 12 offers through-hole 122 on substrate 12；The side of substrate 12 is arranged in first electrode 14；First pad 16, with
One electrode 14 is electrically connected, and is located at the same side of substrate 12 with first electrode 14；The another of substrate 12 is arranged in second electrode 18
Side；Second pad 20, the same side of substrate 12 is located at the first pad 16, and second electrode 18 passes through through-hole 122 and the second pad
20 electrical connections.
FPC structure proposed by the present invention has a substrate 12, and first electrode 14 and second electrode 18 are arranged in substrate 12
Two sides, the first pad 16 is electrically connected with first electrode 14 and the two is located at the same side of substrate 12, the second pad 20 and first
Pad 16 is located at the same side of substrate 12.By the way that the first pad 16 and the second pad 20 to be arranged in the same side of substrate 12, one
Aspect concentrates connection more, saves terminal inner space, and 12 two sides of substrate is avoided to be all connected with wiring board or setting two
Sandwich circuit board and more occupied spaces and lead to complex circuit；On the other hand the first pad 16, the second pad 20 and route are facilitated
The connection of other peripheral hardwares such as plate.Specifically, when manufacturing, it is generally the case that in order to save working hour, wiring board and pad are equal
It is individually manufactured, multiple routes in wiring board have preset spacing and position, directly will be in wiring board in assembling
Route is electrically connected with pad, and at this moment, in the prior art due to need first to be arranged the substrate 12 of the first pad 16 with
The substrate 12 that the second pad 20 is arranged is bonded, and then during fitting, contraposition deviation easily occurs, leads to the first pad
16 and second the position of pad 20 opposite offset occurs so that pad can not be connect well with wiring board.And in the present invention, by
The same side of substrate 12 is set in the first pad 16 and the second pad 20, and then in the production process, it can be directly by the first weldering
The side of substrate 12 is arranged in disk 16 and the second pad 20, requires according to preset position and spacing etc. by the first pad 16 and the
Two pads 20 are arranged in place, and then in electrical interconnection plate, can directly dock the route on wiring board, eliminate patch
Close contraposition deviation brought by substrate 12, it is ensured that pad is accurately connect with wiring board.In addition, due to eliminating adhesive substrates 12
It process and eliminates and repeatedly dock the process for finding pad accurately using multiple wiring boards, greatly improve production efficiency, saving work
When, it is electrically connected simultaneously with the first pad 16 and the second pad 20 using integrated wiring board, facilitates operation.In addition,
By opening up through-hole 122 on the substrate 12, second electrode 18 is electrically connected by through-hole 122 with the second pad 20,
While guaranteeing that the first pad 16 and the second pad 20 are located at 12 the same side of substrate, guarantees connection and save terminal inner sky
Between, it avoids second electrode 18 from curving around 12 edge of substrate to the other side and is electrically connected and more occupied spaces with the second pad 20.
In addition, it should be noted that, the FPC structure in the present invention may be directly applied in touch sensing and/or fingerprint sensor, when
When it is applied in the sensor, first electrode 14 is any of emission electrode and induction electrode, and second electrode 18 is
Another in receiving electrode and driving electrodes.
In one embodiment of the invention, it is preferable that first electrode 14 is any in receiving electrode and driving electrodes
A, second electrode 18 is another in receiving electrode and driving electrodes.
In this embodiment, first electrode 14 and second electrode 18 are receiving electrode and driving electrodes, and then the FPC structure
First electrode 14 and second electrode 18 between have the function of accommodate capacitor, the electricity between first electrode 14 and second electrode 18
The variation of capacity directly can be transferred to wiring board and be transferred to by the first pad 16 and the second pad 20 to be connected with wiring board
The controller connect, in turn, the PFC structure can be directly used for touch sensing also and can be directly used for fingerprint tactility apparatus, facilitate people
The touching effect of body is converted to capacitor and then judges touch points position or carry out identification fingerprint.
In one embodiment of the invention, it is preferable that as shown in Figure 13 and Figure 14, second electrode 18 protrudes into through-hole 122
In be electrically connected with the second pad 20.
In this embodiment, when second electrode 18 is arranged, directly second electrode 18 can be extended to inside through-hole 122,
Second electrode 18 is directly contacted with pad, and then second electrode 18 is electrically connected with pad, it is easy to process, it can also be
On two electrodes 18 be arranged protrusion, protrusion be integrated with second electrode 18, protrude protrude into through-hole 122 with the second pad 20
It is in contact, so that second electrode 18 is electrically connected with the realization of the second pad 20.By by second electrode 18 protrude into through-hole 122 with
Second pad 20 electrical connection, on the one hand, facilitate process and assemble, save working hour, on the other hand improve the space utilization rate of terminal, keep away
Exempt from second electrode 18 to curve to the other side and be electrically connected and more occupied spaces with the second pad 20 around 12 edge of substrate.
In one embodiment of the invention, it is preferable that conductive part, conductive part one end and the second electricity are set in through-hole 122
Pole 18 is electrically connected, and the other end of conductive part is electrically connected with the second pad 20.
In this embodiment, by filling conductive part in through-hole 122, conductive part one end is in contact with the second pad 20,
It is electrically connected conductive part with the second pad 20, the other end of conductive part is in contact with second electrode 18, makes conductive part and the second electricity
Pole 18 is electrically connected, and on the one hand eliminates and projective structure is arranged and increases by 18 difficulty of processing of second electrode in second electrode 18, make
The other side that substrate 12 need to be arranged in second electrode 18 using existing plating etch process is obtained, work is on the other hand saved
When, facilitate processing, only conductive part need to be plugged in through-hole 122 and be in contact with second electrode 18, it is convenient for assembly.Its
In, it is preferable that the outer peripheral surface of conductive part and the inner peripheral surface of through-hole 122 fit closely, and conductive part is effectively prevent to take off in through-hole 122
It falls or shakes and second electrode 18 is caused to contact not tight problem with the second pad 20, it is ensured that second electrode 18 and the second pad 20
Remain good contact.
In one embodiment of the invention, it is preferable that as shown in figure 14, the upper table of the first pad 16 and the second pad 20
Face is located in same level.
In this embodiment, the first pad 16 and the second pad 20 are not only located at the same side of substrate 12, while the first weldering
The upper surface of disk 16 and the upper surface of the second pad 20 are located in same level, further facilitate the first pad 16 and
The connection of the external components such as two pads 20 and wiring board, especially in connection line plate, whole wiring board need to only keep horizontal
State is sequentially connected the first pad 16 and the second pad 20, not only facilitates connection, while ensuring the first pad 16 and second
The accuracy connected between pad 20 and wiring board avoids the first pad 16 and the upper surface of the second pad 20 from being not at horizontal plane
When upper, and the wiring board of the two electrical connection needs that bending occurs and deviation occurs, causes wiring board that can not while accurately connect
First pad 16 and the second pad 20, need to bend again and are adjusted, and influence to process duration.
In one embodiment of the invention, it is preferable that as shown in figure 13, the number of first electrode 14 be it is multiple, second
The number of electrode 18 be it is multiple, the number of through-hole 122 be it is multiple, second electrode 18 is identical with the number of through-hole 122 and an a pair
It answers.
In this embodiment, the number of first electrode 14 is multiple, the number of second electrode 18 be also it is multiple, while first
The number of pad 16 and the number of the second pad 20 be also it is multiple, the number of first electrode 14 is identical as the number of the first pad 16
And correspond, the number of second electrode 18 is identical as the number of the second pad 20 and corresponds.In addition, through-hole on substrate 12
122 number be also it is multiple, the number of through-hole 122 it is identical as the number of second electrode 18 and correspond, second pad
20 are arranged at a through-hole 122, it is preferable that second pad 20 covers one end of a through-hole 122 or is arranged one
The surrounding of a through-hole 122.
In one embodiment of the invention, it is preferable that substrate 12 is pet layer or cyclic olefin polymer resin layer or PI
Layer.
In this embodiment, substrate 12 can be pet layer, can also be cyclic olefin polymer resin layer, can also be PI layers, can root
According to needing to select suitable material setting substrate 12, wherein pet layer, cyclic olefin polymer resin layer and PI layers are transparence,
And there is certain flexibility, it is easy to implement flexible screen terminal.
In one embodiment of the invention, it is preferable that through-hole 122 is round hole or regular polygon hole.
In this embodiment, through-hole 122 is round hole or regular polygon hole, on the one hand facilitates processing, on the other hand round
Hole or polygonal hole are smaller to the structure destructive power of substrate 12, while opening up through-hole 122, improve substrate 12 as far as possible
Structural strength.
In one embodiment of the invention, it is preferable that the diameter of through-hole 122 or its circumscribed circle diameter range be 50 μm extremely
300μm。
In this embodiment, the diameter range of the diameter of through-hole 122 or its circumscribed circle is 50 μm to 300 μm, is on the one hand kept away
Diameter or its circumscribed circle diameter for exempting from through-hole 122 are too small, lead to 122 processing difficulties of through-hole less than 50 μm, second electrode 18 is very
Hardly possible is electrically connected by the through-hole 122 with the second pad 20, and the diameter or its circumscribed circle diameter of through-hole 122 are on the other hand avoided
It is excessive, the intensity of substrate 12 is influenced greater than 300 μm.
Second aspect of the present invention embodiment proposes a kind of terminal, comprising: as the FPC of any one of above-described embodiment is tied
Structure.
Terminal provided by the invention because including the FPC structure such as any one of above-described embodiment, and then has any of the above-described
The beneficial effect of the FPC structure of embodiment, does not do repeat one by one herein.
Third aspect present invention embodiment proposes a kind of display component, be used for terminal, comprising: touch sensing and/or
Fingerprint sensor includes the FPC structure such as any one of above-described embodiment in touch sensing, includes as above in fingerprint sensor
State the FPC structure of any one of embodiment.
In this embodiment, when FPC structure is applied to touch sensing, the first electrode 14 in FPC structure is touch-control
Any of emission electrode and the induction electrode of touch sensing of sensor, second electrode 18 are the reception of touch sensing
Another in the driving electrodes of electrode and touch sensing.When FPC structure is applied to fingerprint sensor, in FPC structure
First electrode 14 is any of emission electrode and induction electrode of fingerprint sensor of fingerprint sensor, and second electrode 18 is
Another in the receiving electrode of fingerprint sensor and the driving electrodes of fingerprint sensor.
In the present invention, term " multiple " then refers to two or more, unless otherwise restricted clearly.Term " peace
Dress ", " connected ", " connection ", the terms such as " fixation " shall be understood in a broad sense, can also be with for example, " connection " may be a fixed connection
It is to be detachably connected, or be integrally connected；" connected " can be directly connected, can also be indirectly connected through an intermediary.It is right
For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one reality of the invention
It applies in example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or reality
Example.Moreover, description particular features, structures, materials, or characteristics can in any one or more of the embodiments or examples with
Suitable mode combines.The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for ability
For the technical staff in domain, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made
Any modification, equivalent substitution, improvement and etc. should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of FPC structure is used for terminal characterized by comprising
Substrate offers through-hole on the substrate；
The side of the substrate is arranged in first electrode；
First pad is electrically connected with the first electrode, and is located at the same side of the substrate with the first electrode；
The other side of the substrate is arranged in second electrode；
Second pad, the same side of the substrate is located at first pad, and the second electrode passes through the through-hole and institute
State the electrical connection of the second pad.
2. FPC structure according to claim 1, which is characterized in that
The first electrode is any of receiving electrode and driving electrodes, and the second electrode is the receiving electrode and institute
State another in driving electrodes.
3. FPC structure according to claim 1, which is characterized in that
The second electrode is protruded into the through-hole and is electrically connected with second pad.
4. FPC structure according to claim 1, which is characterized in that
Conductive part is set in the through-hole, described conductive part one end is electrically connected with the second electrode, the conductive part it is another
End is electrically connected with second pad.
5. FPC structure according to claim 1, which is characterized in that
The upper surface of first pad and second pad is located in same level.
6. FPC structure according to any one of claim 1 to 5, which is characterized in that
The number of the first electrode be it is multiple, the number of the second electrode be it is multiple, the number of the through-hole is multiple, institute
It is identical as the number of the through-hole and correspond to state second electrode.
7. FPC structure according to any one of claim 1 to 5, which is characterized in that
The substrate is pet layer or cyclic olefin polymer resin layer or PI layers.
8. FPC structure according to any one of claim 1 to 5, which is characterized in that
The through-hole is round hole or regular polygon hole.
9. according to right want 8 described in FPC structure, which is characterized in that
The diameter of the through-hole or its circumscribed circle diameter range are 50 μm to 300 μm.
10. a kind of terminal characterized by comprising
FPC structure as claimed in any one of claims 1-9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711347549.8A CN109933227A (en) | 2017-12-15 | 2017-12-15 | FPC structure and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711347549.8A CN109933227A (en) | 2017-12-15 | 2017-12-15 | FPC structure and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109933227A true CN109933227A (en) | 2019-06-25 |
Family
ID=66979561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711347549.8A Pending CN109933227A (en) | 2017-12-15 | 2017-12-15 | FPC structure and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109933227A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101341030B1 (en) * | 2012-08-29 | 2013-12-13 | 엘지디스플레이 주식회사 | Organic emitting display device and method for manufacturing the same |
| US20140062916A1 (en) * | 2012-08-28 | 2014-03-06 | Lg Display Co., Ltd. | Touch panel and method of manufacturing the same and display device using the same |
| TW201447718A (en) * | 2013-04-15 | 2014-12-16 | Fujifilm Corp | Method for producing conductive sheet for touch panel, conductive sheet for touch panel |
| CN104238806A (en) * | 2013-06-20 | 2014-12-24 | 启耀光电股份有限公司 | Touch display panel and touch display device |
| US20150075959A1 (en) * | 2013-09-17 | 2015-03-19 | Wintek Corporation | Touch panel |
| CN204595807U (en) * | 2015-04-30 | 2015-08-26 | 深圳欧菲光科技股份有限公司 | Touch-screen and display device |
| US20160004353A1 (en) * | 2014-07-07 | 2016-01-07 | Lg Innotek Co., Ltd. | Touch window |
| CN106033765A (en) * | 2015-03-17 | 2016-10-19 | 上海和辉光电有限公司 | Organic light emitting diode touch control display panel |
| CN106505089A (en) * | 2016-10-31 | 2017-03-15 | 上海天马微电子有限公司 | Display device |
| US20170277341A1 (en) * | 2016-03-23 | 2017-09-28 | Samsung Display Co., Ltd. | Method and apparatus for multi-sensing |
| US20170303395A1 (en) * | 2014-09-22 | 2017-10-19 | Fujikura Ltd. | Printed wiring board |
-
2017
- 2017-12-15 CN CN201711347549.8A patent/CN109933227A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140062916A1 (en) * | 2012-08-28 | 2014-03-06 | Lg Display Co., Ltd. | Touch panel and method of manufacturing the same and display device using the same |
| KR101341030B1 (en) * | 2012-08-29 | 2013-12-13 | 엘지디스플레이 주식회사 | Organic emitting display device and method for manufacturing the same |
| TW201447718A (en) * | 2013-04-15 | 2014-12-16 | Fujifilm Corp | Method for producing conductive sheet for touch panel, conductive sheet for touch panel |
| CN104238806A (en) * | 2013-06-20 | 2014-12-24 | 启耀光电股份有限公司 | Touch display panel and touch display device |
| US20150075959A1 (en) * | 2013-09-17 | 2015-03-19 | Wintek Corporation | Touch panel |
| US20160004353A1 (en) * | 2014-07-07 | 2016-01-07 | Lg Innotek Co., Ltd. | Touch window |
| US20170303395A1 (en) * | 2014-09-22 | 2017-10-19 | Fujikura Ltd. | Printed wiring board |
| CN106033765A (en) * | 2015-03-17 | 2016-10-19 | 上海和辉光电有限公司 | Organic light emitting diode touch control display panel |
| CN204595807U (en) * | 2015-04-30 | 2015-08-26 | 深圳欧菲光科技股份有限公司 | Touch-screen and display device |
| US20170277341A1 (en) * | 2016-03-23 | 2017-09-28 | Samsung Display Co., Ltd. | Method and apparatus for multi-sensing |
| CN106505089A (en) * | 2016-10-31 | 2017-03-15 | 上海天马微电子有限公司 | Display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208172458U (en) | display device and flexible circuit board | |
| CN207410590U (en) | Circuit connection structure and terminal | |
| CN111083879B (en) | Connection method of electronic element and circuit board, circuit board assembly and electronic equipment | |
| EA201291424A1 (en) | HOUSEHOLD APPARATUS AND INPUT SENSORY DEVICE FOR HOUSEHOLD APPLIANCES | |
| EP2567600A1 (en) | Circuit board for display and display module with display and circuit board | |
| CN210119787U (en) | Flexible circuit board, ultrasonic fingerprint module and electronic equipment | |
| CN106409578A (en) | Button device using piezoelectric element | |
| JPWO2002029770A1 (en) | Display module | |
| CN106371615A (en) | Tactile feedback module and button | |
| US10541359B2 (en) | Simple-assembly sensing device | |
| CN109933227A (en) | FPC structure and terminal | |
| CN105704907A (en) | Flexible circuit board for reducing impedance of piezoresonator | |
| CN109494294A (en) | Piezoelectric device and electronic equipment | |
| CN214256810U (en) | Piezoelectric ceramic waterproof structure, piezoelectric ceramic device and electronic equipment | |
| CN205488235U (en) | Structure is drawn forth to piezoelectric membrane electrode | |
| CN207182322U (en) | Ultrasonic sensor and electronic installation | |
| CN211376665U (en) | Non-contact human sleep physiological parameter detection sensor transduction unit | |
| CN208079490U (en) | A kind of electronic component safeguard structure and the mobile terminal with the structure | |
| JP2009289923A (en) | Substrate connection structure, and electronic appliance | |
| CN205139946U (en) | Fingerprint detection module and electronic equipment | |
| JP2012028320A (en) | Electronic device and touch button connection structure therefor | |
| CN207557967U (en) | Display module and electronic device | |
| CN206388732U (en) | A kind of piezoelectric ceramic wafer welding connecting elements | |
| WO2014194860A1 (en) | Switch system and electronic device using same | |
| CN107768318B (en) | Packaging structure and packaging method of chip of Internet of things |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210415 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Applicant after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: 330013 oufeiguang science and Technology Park, HUANGJIAHU Road, Nanchang Economic and Technological Development Zone, Jiangxi Province Applicant before: Nanchang OFilm Tech. Co.,Ltd. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190625 |