CN105870159A - Organic light-emitting diode display panel, display device and manufacturing method - Google Patents
Organic light-emitting diode display panel, display device and manufacturing method Download PDFInfo
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- CN105870159A CN105870159A CN201610397832.0A CN201610397832A CN105870159A CN 105870159 A CN105870159 A CN 105870159A CN 201610397832 A CN201610397832 A CN 201610397832A CN 105870159 A CN105870159 A CN 105870159A
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- emitting diode
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention provides an organic light-emitting diode display panel, a display device and a manufacturing method. The organic light-emitting diode display panel comprises an organic light-emitting diode substrate and an encapsulating layer for encapsulating the organic light-emitting diode display substrate, wherein the organic light-emitting diode display substrate comprises a positive electrode, an organic light-emitting layer and a negative electrode; the encapsulating layer can be used for providing a channel capable of communicating the negative electrode with an EVSS power supplying port on an external printed circuit board. In a subsequent assembly flow, the EVSS power supplying port on the printed circuit board can be electrically connected with the negative electrode through the channel provided by the encapsulating layer in order to transmit EVSS current. EVSS current is not required to be transmitted by a COF (Chip on Film), the COF does not need to be provided with an EVSS transmission line, and only an EVDD transmission line is provided, so that the size of the COF can be reduced, and the organic light-emitting diode display panel can be applied to narrow-border products.
Description
Technical field
The present invention relates to Display Technique field, particularly relate to a kind of organic LED display panel, display
Device and manufacture method.
Background technology
Refer to Fig. 1, Fig. 1 is Organic Light Emitting Diode of the prior art (OLED) display device
Structural representation, this OLED display includes: OLED display panel, chip on film (COF) 31
With printed circuit board (PCB) (PCB) 32, described OLED display panel includes: underlay substrate 11, thin film are brilliant
Body pipe (TFT) layer 12, anode 13, organic luminous layer 14, negative electrode 15 and encapsulated layer 16.
The EVDD (power supply) of described OLED display panel and EVSS () power supply be all to pass through PCB32
Conduction, to COF31, is then conducted to OLED display panel by COF31.It is to say, need on COF
Being provided for transmitting the electrical transfer line of EVDD and EVSS, above-mentioned electrical transfer line occupies COF
On big quantity space, this adds the width of COF undoubtedly, so that it is dfficult to apply to narrow frame
Product.
Summary of the invention
In view of this, the present invention provides a kind of organic LED display panel, display device and making side
Method, needs to arrange EVDD and EVSS on the COF solving in existing OLED display simultaneously
Electrical transfer line, electrical transfer line is more, causes COF size big, it is difficult to be applied to narrow edge frame product
Problem.
For solving above-mentioned technical problem, the present invention provides a kind of organic LED display panel, includes
Machine diode displaying substrate and for encapsulating the encapsulated layer of described organic light-emitting diode display substrate,
Described organic light-emitting diode display substrate includes anode, organic luminous layer and negative electrode, and described encapsulated layer can
The passage of conducting negative electrode and the EVSS supply port in external printed circuit board is provided.
Preferably, described encapsulated layer includes: encapsulation glue-line and Metal Packaging layer, the one of described Metal Packaging layer
Side electrically connects with described negative electrode, and opposite side can be electrically connected with the EVSS supply port on described printed circuit board (PCB)
Connect.
Preferably, described organic LED display panel also includes: the first conductive pattern, described first
Conductive pattern runs through described encapsulation glue-line, side and described cathode contacts, opposite side and described Metal Packaging layer
Contact, described Metal Packaging layer and described negative electrode are electrically connected by described first conductive pattern.
Preferably, described first conductive pattern is at least two.
Preferably, described Metal Packaging layer directly contacts with described negative electrode, and described encapsulation glue-line is only around described
The viewing area of organic light-emitting diode display substrate is arranged.
Preferably, described Metal Packaging layer is metallic plate.
Preferably, described encapsulated layer is thin-film encapsulation layer, and described thin-film encapsulation layer includes what alternately superposition was arranged
At least one of which inorganic thin film layer and at least one of which organic thin film layer, described thin-film encapsulation layer offers through institute
State the via of thin-film encapsulation layer；Described display floater also includes: the second conductive pattern, described second conductive pattern
Being partially filled in described via of shape, side is electrically connected with described negative electrode by described via, opposite side energy
Enough electrically connect with the EVSS supply port in external printed circuit board.
Preferably, described encapsulated layer includes encapsulating glue-line and cover-plate glass, described cover-plate glass offers and passes through
The via of logical described glass-encapsulated layer；Described display floater also includes: the 3rd conductive pattern, and the described 3rd leads
Being partially filled in described via of electrograph shape, side is electrically connected with described negative electrode by described via, another
Side can electrically connect with the EVSS supply port in external printed circuit board.
The present invention also provides for a kind of organic LED display device, shows including above-mentioned Organic Light Emitting Diode
Showing that panel, described display device also include: printed circuit board (PCB), the EVSS on described printed circuit board (PCB) powers
The passage that port is provided by described encapsulated layer and the negative electrode electricity on described organic LED display panel
Connect.
Preferably, described organic LED display device also includes: chip on film COF, described COF
One end be connected with the EVDD supply port on described printed circuit board (PCB), the other end and described organic light emission
The cabling of the non-display area of diode display panel connects.
The present invention also provides for the manufacture method of a kind of organic LED display panel, including:
Formed organic light-emitting diode display substrate, described organic light-emitting diode display substrate include anode,
Organic luminous layer and negative electrode；
Form the encapsulated layer for encapsulating described organic light-emitting diode display substrate, wherein, described encapsulated layer
The passage of conducting negative electrode and the EVSS supply port in external printed circuit board can be provided.
Preferably, described encapsulated layer includes encapsulating glue-line and Metal Packaging layer；
Described formation is before the step of the encapsulated layer encapsulating described organic light-emitting diode display substrate, also
Including: form the first conductive pattern on the cathode；
The step of the described formation encapsulated layer for encapsulating described organic light-emitting diode display substrate includes:
Coating encapsulation glue-line on the negative electrode being formed with described first conductive pattern；
Process for pressing is used to press on described encapsulation glue-line using a metallic plate as Metal Packaging layer, after pressing
Described metallic plate contacts with described conductive pattern.
Preferably, described encapsulated layer includes encapsulating glue-line and Metal Packaging layer；Described formation is used for encapsulating described
The step of the encapsulated layer of organic light-emitting diode display substrate includes:
Viewing area surrounding coating encapsulation glue-line at described organic light-emitting diode display substrate；
A metallic plate is used to be combined on described encapsulation glue-line as Metal Packaging lamination, described metallic plate after pressing
Directly with described cathode contacts.
Having the beneficial effect that of the technique scheme of the present invention:
Owing to encapsulated layer can provide conducting negative electrode and the EVSS supply port in external printed circuit board
Passage, thus in follow-up assembling flow path, can be by the EVSS supply port on printed circuit board (PCB) by upper
State conductive channel to electrically connect with negative electrode, to transmit EVSS electric current.It is to say, COF is no longer necessary to pass
Defeated EVSS electric current, COF is also no longer needed for arrange EVSS transmission line, only arranges EVDD transmission
Line, thus the size of COF can be reduced so that it is narrow edge frame product can be applied to.
On the other hand, owing to only transmitting EVDD on COF, also improve the power supply of EVDD, reduce
The risk that COF burns.
Another aspect, is also no longer needed for inside organic LED display panel designing EVSS's
Shorting bar (short-circuited node), shorting bar causes originally intersection short circuit and display bad line will not
Occur again, improve the yield of organic LED display panel.
Accompanying drawing explanation
Fig. 1 is the structural representation of organic LED display device of the prior art；
Fig. 2 is the structural representation of the organic LED display panel of the embodiment of the present invention one；
Fig. 3 is the structural representation of the organic LED display panel of the embodiment of the present invention two；
Fig. 4 is the structural representation of the organic LED display panel of the embodiment of the present invention three；
Fig. 5 is the structural representation of the organic LED display panel of the embodiment of the present invention four；
Fig. 6 is the structural representation of the organic LED display device of the embodiment of the present invention five；
Fig. 7 is the structural representation of the organic LED display device of the embodiment of the present invention six.
Detailed description of the invention
For solving to need to arrange EVDD and EVSS on the COF in existing OLED display simultaneously
Electrical transfer line, electrical transfer line is more, causes COF size big, it is difficult to be applied to narrow edge frame product
Problem, the embodiment of the present invention provides a kind of organic LED display panel, including Organic Light Emitting Diode
Display base plate and for encapsulating the encapsulated layer of described organic light-emitting diode display substrate, described organic light emission
Diode display base plate includes anode, organic luminous layer and negative electrode, and wherein, described encapsulated layer can provide and lead
The passage of the EVSS supply port on logical negative electrode and external printed circuit board.
Owing to encapsulated layer can provide conducting negative electrode and the EVSS supply port in external printed circuit board
Passage, thus in follow-up assembling flow path, can be by the EVSS supply port on printed circuit board (PCB) by upper
State conductive channel to electrically connect with negative electrode, to transmit EVSS electric current.It is to say, COF is no longer necessary to pass
Defeated EVSS electric current, COF is also no longer needed for arrange EVSS transmission line, only arranges EVDD transmission
Line, thus the size of COF can be reduced so that it is narrow edge frame product can be applied to.
On the other hand, owing to only transmitting EVDD on COF, also improve the power supply of EVDD, reduce
The risk that COF burns.
Another aspect, is also no longer needed for inside organic LED display panel designing EVSS's
Shorting bar (short-circuited node), shorting bar causes originally intersection short circuit and display bad line will not
Occur again, improve the yield of organic LED display panel.
Encapsulated layer in organic LED display panel substantially can be divided into: glass-encapsulated and thin-film package
Two types.Wherein, glass-encapsulated is by packaging plastic and organic light-emitting diode display base by cover-plate glass
Plate carries out involutory.Thin-film package is a kind of novel encapsulated mode, and cover plate no longer uses glass material, but uses
Thin film replaces.Thin film can be metal material, it is also possible to be that other thin-film materials (such as replace superposition to arrange
Inorganic thin film layer and organic thin film layer).Thin-film package has the advantages such as thickness is thin, be easily bent.
Below for different types of encapsulated layer, embodiments of the present invention are described in detail.
The following is the embodiment using metallic film encapsulation.
Described encapsulated layer includes: encapsulation glue-line and Metal Packaging layer, the side of described Metal Packaging layer is with described
Negative electrode electrically connects, and opposite side can electrically connect with the EVSS supply port on described printed circuit board (PCB).
In the embodiment of the present invention, Metal Packaging layer is that conducting negative electrode supplies with the EVSS in external printed circuit board
The passage of electricity port.
Owing to Metal Packaging layer electrically connects with negative electrode, at the follow-up assembling stream of organic LED display panel
Cheng Zhong, can electrically connect Metal Packaging layer with the EVSS supply port on PCB, with turn on negative electrode with
EVSS supply port, so that EVSS electric current can be conducted to negative electrode by Metal Packaging layer.The most just
It is to say, can be no longer necessary to transmit EVSS electric current via COF, COF also avoid the need for arrange EVSS
Transmission line, only arranges EVDD transmission line, thus can reduce the size of COF so that it is can apply
In narrow edge frame product.
Metal Packaging layer and the connected mode of negative electrode can be multiple, citing illustrated below.
The structure that refer to the organic LED display panel that Fig. 2, Fig. 2 are the embodiment of the present invention one is shown
Being intended to, described organic LED display panel includes: organic light-emitting diode display substrate and be used for sealing
Fill encapsulation glue-line 27 and the Metal Packaging layer 28 of described organic light-emitting diode display substrate, described organic
Optical diode display base plate includes underlay substrate 21, TFT layer 22, anode 23, organic luminous layer 24 and
Negative electrode 25.
Described organic LED display panel also includes: the first conductive pattern 26, described first conduction
Figure 26 runs through described encapsulation glue-line 27, and side contacts with described negative electrode 25, opposite side and described metal
Encapsulated layer 28 contacts, and the most described Metal Packaging layer 28 and described negative electrode 25 are by described first conductive pattern
26 electrical connections.
In the embodiment of the present invention, by the first conductive pattern 26, negative electrode 25 and Metal Packaging layer 28 are electrically connected
Connect, it is achieved mode is simple.
In order to reduce conduction impedance, it is preferable that the number of described first conductive pattern 26 is at least two.
Certainly, the number of the first conductive pattern 26 can also be one, as long as suitably increasing by the first conductive pattern 26
Width, it is also possible to arrive reduce conduction impedance purpose.
Described first conductive pattern 26 can be arranged at the non-display area of organic light-emitting diode display substrate,
The viewing area of organic light-emitting diode display substrate can also be arranged at.
The structure that refer to the organic LED display panel that Fig. 3, Fig. 3 are the embodiment of the present invention two is shown
Being intended to, described organic LED display panel includes: organic light-emitting diode display substrate and being used for
Encapsulate encapsulation glue-line 27 and the Metal Packaging layer 28 of described organic light-emitting diode display substrate, described organic
Diode displaying substrate includes underlay substrate 21, TFT layer 22, anode 23, organic luminous layer 24
With negative electrode 25.
Wherein, described Metal Packaging layer 28 directly contacts with described negative electrode 25, Metal Packaging layer 28 and the moon
No longer arranging encapsulation glue-line 27 between pole 25, described encapsulation glue-line 27 is only around described organic light-emitting diodes
The viewing area of pipe display base plate is arranged.
In the embodiment of the present invention, Metal Packaging layer 28 is arranged on negative electrode 25, directly connects with negative electrode 25
Touch, thus without making for turning on Metal Packaging layer 28 and the conductive pattern of negative electrode 25 again, reduce system
Make cost.
In above-described embodiment, it is preferable that described Metal Packaging layer 28 is a metallic plate, when being packaged,
Directly press to described metallic plate be coated with on the organic light-emitting diode display substrate of encapsulation glue-line.
When Metal Packaging layer 28 is metallic plate, in the reality that Metal Packaging layer 28 directly contacts with negative electrode 25
Execute in example, higher to the flatness requirement of metal sheet surface so that metallic plate and negative electrode can with close contact,
Realize the purpose of large area conducting.
Certainly, in some other embodiment of the present invention, described Metal Packaging layer 28 can be by heavy
The metallic film that the modes such as long-pending or sputtering are formed.
The following is the embodiment using other thin-film package.
The structure that refer to the organic LED display panel that Fig. 4, Fig. 4 are the embodiment of the present invention three is shown
Being intended to, described organic LED display panel includes: organic light-emitting diode display substrate and being used for
Encapsulating the thin-film encapsulation layer 29 of described organic light-emitting diode display substrate, described thin-film encapsulation layer includes handing over
At least one of which inorganic thin film layer arranged for superposition and at least one of which organic thin film layer, the embodiment shown in Fig. 4
Include that thin-film encapsulation layer includes three layers, on the direction away from negative electrode 25, be followed successively by inorganic the thinnest
Film layer, organic thin film layer and second layer inorganic thin film layer.Described organic light-emitting diode display substrate includes lining
Substrate 21, TFT layer 22, anode 23, organic luminous layer 24 and negative electrode 25.
The via 291 of through described thin-film encapsulation layer is offered in described thin-film encapsulation layer 29；Described display
Panel also includes: the second conductive pattern 210, described second conductive pattern 210 be partially filled in described mistake
In hole 291, side is electrically connected with described negative electrode 25 by described via 291, and opposite side can be with outside
EVSS supply port electrical connection on printed circuit board (PCB).
The number of described via 291 can be one, it is also possible to for multiple, to reduce conduction impedance.
In the embodiment of the present invention, the via in described thin-film encapsulation layer is for providing conducting negative electrode and outside printing electricity
The passage of the EVSS supply port on the plate of road.
Owing to the second conductive pattern 210 electrically connects with described negative electrode 25, in organic light-emitting diode display face
In the follow-up assembling flow path of plate, can be by the second conductive pattern 210 and the EVSS supply port on PCB
Electrical connection, to turn on negative electrode and EVSS supply port, so that EVSS electric current can be led by second
Electrograph shape 210 is conducted to negative electrode.It is to say, can be no longer necessary to transmit EVSS electric current via COF,
Also avoid the need for arranging EVSS transmission line on COF, EVDD transmission line is only set, thus can drop
The size of low COF so that it is narrow edge frame product can be applied to.
The following is the embodiment using other glass-encapsulated.
The structure that refer to the organic LED display panel that Fig. 5, Fig. 5 are the embodiment of the present invention four is shown
Being intended to, described organic LED display panel includes: organic light-emitting diode display substrate and being used for
Encapsulate encapsulation glue-line 27 and the cover-plate glass 211 of described organic light-emitting diode display substrate, described organic
Diode displaying substrate includes underlay substrate 21, TFT layer 22, anode 23, organic luminous layer 24
With negative electrode 25.
The via 2111 of through described encapsulated layer is offered on described cover-plate glass 211；Described display floater
Also include: the 3rd conductive pattern 212, described 3rd conductive pattern 212 be partially filled in described via 2111
In, side is electrically connected with described negative electrode 25 by described via 2111, and opposite side can be with outside printing electricity
EVSS supply port electrical connection on the plate of road.
In the embodiment of the present invention, the via 2111 on described cover-plate glass 211 for provide conducting negative electrode 25 with
The passage of the EVSS supply port in external printed circuit board.
Owing to the 3rd conductive pattern 212 electrically connects with described negative electrode 25, in organic light-emitting diode display face
In the follow-up assembling flow path of plate, can be by the 3rd conductive pattern 212 and the EVSS supply port on PCB
Electrical connection, to turn on negative electrode and EVSS supply port, so that EVSS electric current can be led by the 3rd
Electrograph shape 212 is conducted to negative electrode.It is to say, can be no longer necessary to transmit EVSS electric current via COF,
Also avoid the need for arranging EVSS transmission line on COF, EVDD transmission line is only set, thus can drop
The size of low COF so that it is narrow edge frame product can be applied to.
The present invention also provides for a kind of organic LED display device, including described in any of the above-described embodiment
Organic LED display panel, described display device also includes: printed circuit board (PCB), described printed circuit
The passage that EVSS supply port on plate is provided by described encapsulated layer shows with described Organic Light Emitting Diode
Show the negative electrode electrical connection on panel.
Described organic LED display device also includes: chip on film COF, one end of described COF
It is connected with the EVDD supply port on described printed circuit board (PCB), the other end and described Organic Light Emitting Diode
The cabling of the non-display area of display floater connects.
It is to say, the channel transfer that EVSS electric current can be provided by encapsulated layer is to negative electrode, thus COF
On avoid the need for arranging EVSS transmission line again, EVDD transmission line is only set, thus COF can be reduced
Size so that it is narrow edge frame product can be applied to.
The structure that refer to the organic LED display device that Fig. 6, Fig. 6 are the embodiment of the present invention five is shown
Being intended to, described organic LED display device includes: organic LED display panel, PCB42
And COF41, wherein, described organic LED display panel includes: Organic Light Emitting Diode shows
Show substrate and for encapsulating encapsulation glue-line 27 and the Metal Packaging layer of described organic light-emitting diode display substrate
28.Described organic light-emitting diode display substrate includes underlay substrate 21, TFT layer 22, anode 23, has
Machine luminescent layer 24 and negative electrode 25.Described organic LED display panel also includes: the first conductive pattern
26, described first conductive pattern 26 runs through described encapsulation glue-line 27, and side contacts with described negative electrode 25,
Opposite side contacts with described Metal Packaging layer 28, and the most described Metal Packaging layer 28 and described negative electrode 25 pass through
Described first conductive pattern 26 electrically connects.It addition, described Metal Packaging layer 28 is by conducting resinl and PCB
On EVSS supply port connect so that negative electrode 25 is led with the EVSS supply port on described PCB
Logical.
The structure that refer to the organic LED display device that Fig. 7, Fig. 7 are the embodiment of the present invention six is shown
Being intended to, described organic LED display device includes: organic LED display panel, PCB42
And COF41, wherein, described organic LED display panel includes: Organic Light Emitting Diode shows
Show substrate and for encapsulating encapsulation glue-line 27 and the Metal Packaging of described organic light-emitting diode display substrate
Layer 28, described organic light-emitting diode display substrate include underlay substrate 21, TFT layer 22, anode 23,
Organic luminous layer 24 and negative electrode 25.Wherein, described Metal Packaging layer 28 directly contacts with described negative electrode 25,
Between Metal Packaging layer 28 and negative electrode 25 no longer arrange encapsulation glue-line 27, described encapsulation glue-line 27 only around
The viewing area of described organic light-emitting diode display substrate is arranged.It addition, described Metal Packaging layer 28 is also
It is connected with the EVSS supply port on PCB by conducting resinl, so that on negative electrode 25 and described PCB
EVSS supply port conducting.
In above-described embodiment, Metal Packaging layer is connected with EVSS supply port, EVSS Yu GND ()
It is connected, thus, Metal Packaging layer electrically connects with GND, and Metal Packaging layer is electrically GND, so metal
Encapsulated layer has the effect of electromagnetic shielding, improves the EMI (electromagnetic screen of organic LED display panel
Cover) characteristic.Metal Packaging layer is electrically GND, when organic LED display panel runs into electrostatic,
In time electrostatic can be passed to GND by Metal Packaging layer, improve organic LED display panel
ESD (Electro-static Driven Comb) characteristic.
In above-described embodiment, when carrying out the design of printed circuit board (PCB), by the bonding (connection) of PCB
Showing out bulk leakage copper, this exposed copper is the net attribute of EVSS electrically.At module bonding
In assembling flow path afterwards, the exposed PAD of PCB is stained with conducting resinl, the most again conducting resinl is adhered to
Above Metal Packaging layer, it is achieved that the mesh that Metal Packaging layer electrically connects with the EVSS supply port on PCB
's.Owing to the bonding face of PCB is without electronic component, it is possible to increase leakage copper face and amass, and increase is led
The area of electricity glue, improves conduction impedance.
The present invention also provides for the manufacture method of a kind of organic LED display panel, including:
Step S101: form organic light-emitting diode display substrate, described organic light-emitting diode display base
Plate includes anode, organic luminous layer and negative electrode；
Step S102: formation is for encapsulating the encapsulated layer of described organic light-emitting diode display substrate, wherein,
Described encapsulated layer can provide the passage of conducting negative electrode and the EVSS supply port in external printed circuit board.
In one embodiment of this invention, described encapsulated layer includes encapsulating glue-line and Metal Packaging layer；
Described formation is before the step of the encapsulated layer encapsulating described organic light-emitting diode display substrate, also
Including: form the first conductive pattern on the cathode；
The step of the described formation encapsulated layer for encapsulating described organic light-emitting diode display substrate includes:
Coating encapsulation glue-line on the negative electrode being formed with described first conductive pattern；
Process for pressing is used to press on described encapsulation glue-line using a metallic plate as Metal Packaging layer, after pressing
Described metallic plate contacts with described conductive pattern.
In another embodiment of the invention, described encapsulated layer includes encapsulating glue-line and Metal Packaging layer；Described
The step forming the encapsulated layer for encapsulating described organic light-emitting diode display substrate includes:
Viewing area surrounding coating encapsulation glue-line at described organic light-emitting diode display substrate；
A metallic plate is used to be combined on described encapsulation glue-line as Metal Packaging lamination, described metallic plate after pressing
Directly with described cathode contacts.
The above is the preferred embodiment of the present invention, it is noted that for the common skill of the art
For art personnel, on the premise of without departing from principle of the present invention, it is also possible to make some improvements and modifications,
These improvements and modifications also should be regarded as protection scope of the present invention.
Claims (13)
1. an organic LED display panel, including organic light-emitting diode display substrate and use
In the encapsulated layer of the described organic light-emitting diode display substrate of encapsulation, described organic light-emitting diode display substrate
Including anode, organic luminous layer and negative electrode, it is characterised in that described encapsulated layer can provide conducting negative electrode with
The passage of the EVSS supply port in external printed circuit board.
Organic LED display panel the most according to claim 1, it is characterised in that described
Encapsulated layer includes: encapsulation glue-line and Metal Packaging layer, the side of described Metal Packaging layer is electrically connected with described negative electrode
Connecing, opposite side can electrically connect with the EVSS supply port on described printed circuit board (PCB).
Organic LED display panel the most according to claim 2, it is characterised in that also wrap
Including: the first conductive pattern, described first conductive pattern runs through described encapsulation glue-line, and side connects with described negative electrode
Touching, opposite side contacts with described Metal Packaging layer, and described Metal Packaging layer and described negative electrode are by described first
Conductive pattern electrically connects.
Organic LED display panel the most according to claim 3, it is characterised in that described
First conductive pattern is at least two.
Organic LED display panel the most according to claim 2, it is characterised in that described
Metal Packaging layer directly contacts with described negative electrode, and described encapsulation glue-line shows only around described Organic Light Emitting Diode
Show that the viewing area of substrate is arranged.
6. according to the organic LED display panel described in any one of claim 2-5, it is characterised in that
Described Metal Packaging layer is metallic plate.
Organic LED display panel the most according to claim 1, it is characterised in that described
Encapsulated layer is thin-film encapsulation layer, and described thin-film encapsulation layer includes at least one of which inorganic thin film that alternately superposition is arranged
Layer and at least one of which organic thin film layer, described thin-film encapsulation layer offers the mistake of through described thin-film encapsulation layer
Hole；Described display floater also includes: the second conductive pattern, described second conductive pattern be partially filled in institute
Stating in via, side is electrically connected with described negative electrode by described via, and opposite side can be with outside printed circuit
EVSS supply port electrical connection on plate.
Organic LED display panel the most according to claim 1, it is characterised in that described
Encapsulated layer includes encapsulating glue-line and cover-plate glass, and described cover-plate glass offers through described glass-encapsulated layer
Via；Described display floater also includes: the 3rd conductive pattern, being partially filled with of described 3rd conductive pattern
In described via, side is electrically connected with described negative electrode by described via, and opposite side can print with outside
EVSS supply port electrical connection on circuit board.
9. an organic LED display device, it is characterised in that include as claim 1-8 is arbitrary
Organic LED display panel described in Xiang, described display device also includes: printed circuit board (PCB), described
The passage that EVSS supply port on printed circuit board (PCB) is provided by described encapsulated layer and described organic light emission
Negative electrode electrical connection on diode display panel.
Organic LED display device the most according to claim 9, it is characterised in that also wrap
Include: chip on film COF, one end of described COF and the EVDD supply port on described printed circuit board (PCB)
Connecting, the other end is connected with the cabling of the non-display area of described organic LED display panel.
The manufacture method of 11. 1 kinds of organic LED display panels, it is characterised in that including:
Formed organic light-emitting diode display substrate, described organic light-emitting diode display substrate include anode,
Organic luminous layer and negative electrode；
Form the encapsulated layer for encapsulating described organic light-emitting diode display substrate, wherein, described encapsulated layer
The passage of conducting negative electrode and the EVSS supply port in external printed circuit board can be provided.
The manufacture method of 12. organic LED display panels according to claim 11, it is special
Levying and be, described encapsulated layer includes encapsulating glue-line and Metal Packaging layer；
Described formation is before the step of the encapsulated layer encapsulating described organic light-emitting diode display substrate, also
Including: form the first conductive pattern on the cathode；
The step of the described formation encapsulated layer for encapsulating described organic light-emitting diode display substrate includes:
Coating encapsulation glue-line on the negative electrode being formed with described first conductive pattern；
Process for pressing is used to press on described encapsulation glue-line using a metallic plate as Metal Packaging layer, after pressing
Described metallic plate contacts with described conductive pattern.
The manufacture method of 13. organic LED display panels according to claim 11, it is special
Levying and be, described encapsulated layer includes encapsulating glue-line and Metal Packaging layer；Described formation is used for encapsulating described organic
The step of the encapsulated layer of diode displaying substrate includes:
Viewing area surrounding coating encapsulation glue-line at described organic light-emitting diode display substrate；
A metallic plate is used to be combined on described encapsulation glue-line as Metal Packaging lamination, described metallic plate after pressing
Directly with described cathode contacts.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107302016A (en) * | 2017-08-08 | 2017-10-27 | 京东方科技集团股份有限公司 | A kind of organic LED display panel and preparation method thereof |
| WO2018107788A1 (en) * | 2016-12-16 | 2018-06-21 | 京东方科技集团股份有限公司 | Display apparatus and electrical connection structure with via hole |
| CN108231859A (en) * | 2018-01-26 | 2018-06-29 | 京东方科技集团股份有限公司 | Oled substrate and preparation method thereof, display device |
| CN109599498A (en) * | 2017-09-30 | 2019-04-09 | 云谷（固安）科技有限公司 | Display panel and vapor deposition mask plate |
| CN110853572A (en) * | 2019-11-27 | 2020-02-28 | 深圳市华星光电半导体显示技术有限公司 | Display panel and display device |
| CN110854300A (en) * | 2019-11-27 | 2020-02-28 | 京东方科技集团股份有限公司 | Display device, display panel and manufacturing method thereof |
| US11450690B2 (en) | 2018-12-29 | 2022-09-20 | Huawei Technologies Co., Ltd. | Display module and display device |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1668145A (en) * | 2005-04-28 | 2005-09-14 | 友达光电股份有限公司 | Organic electroluminescent display and packaging method thereof |
| CN201590206U (en) * | 2009-11-12 | 2010-09-22 | 厦门日亚光电科技有限公司 | Ultrathin LED module |
| CN102347453A (en) * | 2010-07-28 | 2012-02-08 | 三星移动显示器株式会社 | Display device and organic light emitting diode display device |
| CN202818673U (en) * | 2012-08-13 | 2013-03-20 | 昆山维信诺显示技术有限公司 | Organic light-emitting diode (OLED) lighting device |
| CN103081156A (en) * | 2010-08-05 | 2013-05-01 | 皇家飞利浦电子股份有限公司 | Organic electroluminescent device |
| CN103325317A (en) * | 2013-05-15 | 2013-09-25 | 京东方科技集团股份有限公司 | Display panel and display device thereof |
| CN103594654A (en) * | 2012-08-15 | 2014-02-19 | 力志国际光电股份有限公司 | Organic light-emitting diode planar lighting device |
| CN104022139A (en) * | 2014-05-30 | 2014-09-03 | 京东方科技集团股份有限公司 | Organic electroluminescence displaying panel and device |
| CN104659271A (en) * | 2015-03-17 | 2015-05-27 | 京东方科技集团股份有限公司 | Packaging structure and packing method of organic light-emitting diode as well as display device |
| CN104718637A (en) * | 2012-08-17 | 2015-06-17 | 荷兰应用自然科学研究组织Tno | Electro-optic component and method of manufacturing these |
| CN204884440U (en) * | 2015-08-27 | 2015-12-16 | 京东方科技集团股份有限公司 | Flexible display panel and flexible display device |
-
2016
- 2016-06-07 CN CN201610397832.0A patent/CN105870159B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1668145A (en) * | 2005-04-28 | 2005-09-14 | 友达光电股份有限公司 | Organic electroluminescent display and packaging method thereof |
| CN201590206U (en) * | 2009-11-12 | 2010-09-22 | 厦门日亚光电科技有限公司 | Ultrathin LED module |
| CN102347453A (en) * | 2010-07-28 | 2012-02-08 | 三星移动显示器株式会社 | Display device and organic light emitting diode display device |
| CN103081156A (en) * | 2010-08-05 | 2013-05-01 | 皇家飞利浦电子股份有限公司 | Organic electroluminescent device |
| CN202818673U (en) * | 2012-08-13 | 2013-03-20 | 昆山维信诺显示技术有限公司 | Organic light-emitting diode (OLED) lighting device |
| CN103594654A (en) * | 2012-08-15 | 2014-02-19 | 力志国际光电股份有限公司 | Organic light-emitting diode planar lighting device |
| CN104718637A (en) * | 2012-08-17 | 2015-06-17 | 荷兰应用自然科学研究组织Tno | Electro-optic component and method of manufacturing these |
| CN103325317A (en) * | 2013-05-15 | 2013-09-25 | 京东方科技集团股份有限公司 | Display panel and display device thereof |
| CN104022139A (en) * | 2014-05-30 | 2014-09-03 | 京东方科技集团股份有限公司 | Organic electroluminescence displaying panel and device |
| CN104659271A (en) * | 2015-03-17 | 2015-05-27 | 京东方科技集团股份有限公司 | Packaging structure and packing method of organic light-emitting diode as well as display device |
| CN204884440U (en) * | 2015-08-27 | 2015-12-16 | 京东方科技集团股份有限公司 | Flexible display panel and flexible display device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018107788A1 (en) * | 2016-12-16 | 2018-06-21 | 京东方科技集团股份有限公司 | Display apparatus and electrical connection structure with via hole |
| US10790347B2 (en) | 2016-12-16 | 2020-09-29 | Boe Technology Group Co., Ltd. | Display device and via-hole electrical connection structure |
| CN107302016A (en) * | 2017-08-08 | 2017-10-27 | 京东方科技集团股份有限公司 | A kind of organic LED display panel and preparation method thereof |
| CN107302016B (en) * | 2017-08-08 | 2020-01-10 | 京东方科技集团股份有限公司 | Organic light-emitting diode display panel and manufacturing method thereof |
| CN109599498A (en) * | 2017-09-30 | 2019-04-09 | 云谷（固安）科技有限公司 | Display panel and vapor deposition mask plate |
| CN108231859A (en) * | 2018-01-26 | 2018-06-29 | 京东方科技集团股份有限公司 | Oled substrate and preparation method thereof, display device |
| US11450690B2 (en) | 2018-12-29 | 2022-09-20 | Huawei Technologies Co., Ltd. | Display module and display device |
| CN110853572A (en) * | 2019-11-27 | 2020-02-28 | 深圳市华星光电半导体显示技术有限公司 | Display panel and display device |
| CN110854300A (en) * | 2019-11-27 | 2020-02-28 | 京东方科技集团股份有限公司 | Display device, display panel and manufacturing method thereof |
| US11430930B2 (en) | 2019-11-27 | 2022-08-30 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and display device with dual substrates |
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