CN108231859A - Oled substrate and preparation method thereof, display device - Google Patents
Oled substrate and preparation method thereof, display device Download PDFInfo
- Publication number
- CN108231859A CN108231859A CN201810079079.XA CN201810079079A CN108231859A CN 108231859 A CN108231859 A CN 108231859A CN 201810079079 A CN201810079079 A CN 201810079079A CN 108231859 A CN108231859 A CN 108231859A
- Authority
- CN
- China
- Prior art keywords
- layer
- oled
- cathode
- substrate
- oled device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention provides a kind of oled substrate and preparation method thereof, display device, belongs to display technology field.The preparation method of the oled substrate of the present invention, includes the following steps:Pixel confining layer is formed in substrate, and a kind of receiving portion of the OLED device of color is formed in the pixel confining layer;In the receiving portion formed in above-mentioned steps, formed along luminescent layer, cathode layer, the encapsulated layer set gradually away from the substrate direction;According to above-mentioned steps, the receiving portion of the OLED device of remaining color is formed one by one in the pixel confining layer;And after a kind of every receiving portion of the OLED device of color of formation, in the receiving portion formed, sequentially form the luminescent layer, cathode layer, encapsulated layer of the OLED device of this kind of color.
Description
Technical field
The invention belongs to display technology fields, and in particular to a kind of oled substrate and preparation method thereof, display device.
Background technology
In the prior art, OLED (Organic Light Emitting Diodes;Organic Light-Emitting Diode) substrate
Preparation flow is as follows:First, development, etching processing are exposed to the substrate of oled substrate, to be formed simultaneously red sub-pixel
Area, green sub-pixels area, blue subpixels area;Then, vapor deposition treatment is carried out to three sub-pixel areas respectively, so that red sub- picture
Plain area is deposited with emitting red light layer material, and green subpixel areas is deposited with green emitting layer material, the deposit of blue subpixels area
There is blue-light-emitting layer material, to form oled substrate.
But inventor has found the preparation method of above-mentioned oled substrate that there are the following problems:Due to red sub-pixel area,
Green sub-pixels area, blue subpixels area are simultaneously formed on oled substrate, therefore are carried out respectively to three sub-pixel areas
During vapor deposition treatment, if the distance between three sub-pixel areas are smaller, a kind of emitting layer material deposit of color is easily lead to
To the sub-pixel area of another color, so as to cause colour mixture;If the distance between three sub-pixel areas are larger, can reduce logical
Cross the resolution ratio that above-mentioned preparation method prepares the oled substrate of gained.
Invention content
The present invention is directed at least solve one of technical problem in the prior art, provide one kind can prevent it is each
The preparation method of the oled substrate of colour mixture occurs for the luminescent layer of OLED device.
Technical solution is a kind of preparation method of oled substrate used by solving present invention problem, including walking as follows
Suddenly:Pixel confining layer is formed in substrate, and a kind of receiving portion of the OLED device of color is formed in the pixel confining layer;
In the receiving portion formed in above-mentioned steps, formed along luminescent layer, the moon set gradually away from the substrate direction
Pole layer, encapsulated layer;
According to above-mentioned steps, the receiving portion of the OLED device of remaining color is formed one by one in the pixel confining layer;With
And after a kind of every receiving portion of the OLED device of color of formation, in the receiving portion formed, sequentially form this kind of color
OLED device luminescent layer, cathode layer, encapsulated layer.
Preferably, it further includes:
Via is formed in the encapsulated layer of the OLED device of a variety of colors;
Connection electrode is formed on the encapsulated layer for completing above-mentioned steps;Wherein, each cathode layer passes through described
Connection electrode links together.
Preferably, it is described in the receiving portion formed, it is formed and shone along what is set gradually away from the substrate direction
The step of layer, cathode layer, encapsulated layer, specifically includes:
Have in the pixel confining layer of described accommodation section what is formed, sequentially form luminous material layer, cathode material layer, envelope
Package material layer;
The luminous material layer, cathode material in addition to corresponding with described accommodation section position is removed by chemical mechanical grinding
The bed of material, encapsulating material layer, to form the luminescent layer being located in described accommodation section, cathode layer, encapsulated layer.
Preferably, the luminous material layer, the cathode material layer have been sequentially formed at the appearance by evaporation process
It receives in the pixel confining layer in portion;
The encapsulating material layer is formed in the cathode material layer by way of plasma enhanced chemical vapor deposition
On.
Preferably, the preparation method of the oled substrate further includes:
In described accommodation section, the protective layer between the cathode layer and the encapsulated layer is formed.
Preferably, the material of the protective layer includes:Tin indium oxide or indium zinc oxide.
Preferably, it is described the step of pixel confining layer is formed in substrate before, it further includes:
On the substrate, the anode layer of each OLED device is formed by patterning processes.
Preferably, the material of the encapsulated layer includes:The oxide of silicon, the nitride of silicon, the nitrogen oxides of silicon, epoxy
It is one or more in polymer, acrylate polymer.
Technical solution is a kind of oled substrate used by solving present invention problem, including:
Substrate;
Pixel confining layer is provided with receiving portion in the pixel confining layer;
Along away from the substrate direction, and the luminescent layer of the OLED device set gradually in described accommodation section, cathode layer,
Encapsulated layer, and the cathode layer of each OLED device, encapsulated layer are independently arranged, and are mutually disconnected.
Technical solution is a kind of display device used by solving present invention problem, including above-mentioned oled substrate.
The present invention has the advantages that:
It is that a kind of color is first formed in pixel confining layer due to the preparation method of oled substrate provided by the present invention
The receiving portion of OLED device, and the luminescent layer, cathode layer, encapsulated layer of the OLED device of this kind of color be sequentially formed at above-mentioned
After receiving portion, then prepared using same method the OLED device of other colors receiving portion and, form a kind of color every
OLED device receiving portion after, in the receiving portion formed, sequentially form the OLED device of this kind of color luminescent layer,
Cathode layer, encapsulated layer;It, will shape on the light-emitting layer that is, often formed after a kind of luminescent layer of the OLED device of color
Luminescent layer is protected into cathode layer, encapsulated layer namely by cathode layer and encapsulated layer, in this way since, can be effectively
It prevents from, in the luminescent layer for forming a certain color, polluting the luminescent layer of other colors formed;Further, in this base
On plinth, the distance between two adjacent receiving portions of OLED device can also be largely reduced, so as to improve oled substrate
Resolution ratio so that by the oled substrate prepare gained display device display effect more preferably.
Description of the drawings
Fig. 1 is the flow chart of the preparation method of the oled substrate of the embodiment of the present invention 1;
Fig. 2 is the flow chart of the preparation method of the oled substrate of the embodiment of the present invention 2;
Fig. 3 is the schematic diagram of the oled substrate of the embodiment of the present invention 3;
Fig. 4 is the schematic diagram of the oled substrate of the embodiment of the present invention 3;
Wherein reference numeral is:1st, substrate;2nd, pixel confining layer;3rd, luminescent layer;31st, red light emitting layer;32nd, green emitting
Layer;33rd, blue light-emitting layer;4th, cathode layer;41st, the first cathode layer;42nd, the second cathode layer;43rd, third cathode layer;5th, encapsulated layer;
51st, the first encapsulated layer;52nd, the second encapsulated layer;53rd, third encapsulated layer;6th, protective layer;7th, connection electrode;8th, receiving portion;9th, mistake
Hole.
Specific embodiment
For those skilled in the art is made to more fully understand technical scheme of the present invention, below in conjunction with the accompanying drawings and specific embodiment party
Formula is described in further detail the present invention.
In an embodiment of the present invention, OLED device in different colors includes:Red OLED device, green OLED devices
It is illustrated for part, Blue OLED device;Wherein, the red light emitting layer of red OLED device, the first cathode layer, the first encapsulation
Layer is correspondingly arranged in the first receiving portion, and red light emitting layer is made of red illuminating material layer, and the first cathode layer is by first the moon
Pole material layer composition, the first encapsulated layer are made of the first encapsulating material layer;The green light emitting layer of green OLED device, the second cathode
Layer, the second encapsulated layer are correspondingly arranged in the second receiving portion, and green light emitting layer is made of green luminescent material layer, the second cathode
Layer is made of the second cathode material layer, and the second encapsulated layer is made of the second encapsulating material layer;The blue-light-emitting of Blue OLED device
Layer, third cathode layer, third encapsulated layer are correspondingly arranged in third receiving portion, and blue light-emitting layer is by blue emitting material layer group
Into third cathode layer is made of third cathode material layer, and third encapsulated layer is made of third encapsulating material layer;Wherein, first is cloudy
Pole material layer, the second cathode material layer, third cathode material layer are only the differences in address, and in fact the material component of three is all
It is identical;Similarly, the first encapsulating material layer, the second encapsulating material layer, third encapsulating material layer material component be also identical
's.
It should be noted that the OLED device in the present invention is not limited to the OLED device of above-mentioned three kinds of colors;This hair
" first ", " second " and the similar word used in bright embodiment is not offered as any sequence, quantity or importance, and
It is used only to distinguish different component parts;The similar word such as " comprising " or "comprising" means the element for occurring before the word
Either object, which is covered, appears in the element of the word presented hereinafter either object and its equivalent and be not excluded for other elements or object
Part.
Embodiment 1:
As shown in Figure 1, the present embodiment provides a kind of preparation method of oled substrate, include the following steps:Shape on the base 1
Pixel confining layers 2, and a kind of receiving portion 8 of the OLED device of color is formed in pixel confining layer 2;In above-mentioned steps institute shape
Into receiving portion 8 in, formed along luminescent layer 3, cathode layer 4, the encapsulated layer 5 set gradually away from 1 direction of substrate;According to above-mentioned step
Suddenly, the receiving portion 8 of the OLED device of remaining color is formed one by one in pixel confining layer 2;And in a kind of every color of formation
After the receiving portion 8 of OLED device, in the receiving portion 8 formed, the luminescent layer of the OLED device of this kind of color is sequentially formed
3rd, cathode layer 4, encapsulated layer 5.
Further, it is further included in the preparation method of the oled substrate in the present embodiment:By the OLED devices of all colours
After luminescent layer 3, cathode layer 4, the encapsulated layer 5 of part are formed in substrate, by etching technics, in the encapsulation of each OLED device
Via 9 is formed in layer 5, and connection electrode 7 is formed on each encapsulated layer 5 after having etched, for by each OLED device
Cathode layer 4 links together, in this way since, convenient 4 on-load voltage of cathode layer for each OLED device, and facilitate wiring.
It is that a kind of face is first formed in pixel confining layer 2 by the preparation method for the oled substrate that the present embodiment is provided
The receiving portion 8 of the OLED device of color, and the luminescent layer 3, cathode layer 4, encapsulated layer 5 of the OLED device of this kind of color are sequentially formed
After above-mentioned receiving portion 8, then using same method prepare other colors OLED device receiving portion 8 and, in every shape
Into after a kind of receiving portion 8 of the OLED device of color, in the receiving portion 8 formed, the OLED of this kind of color is sequentially formed
Luminescent layer 3, cathode layer 4, the encapsulated layer 5 of device;That is, often formed after a kind of luminescent layer 3 of the OLED device of color,
Cathode layer 4, encapsulated layer 5 will be formed on luminescent layer 3 namely luminescent layer 3 is protected by cathode layer 4 and encapsulated layer 5
Shield, in this way since, can be effectively prevented in the luminescent layer 3 for forming a certain color, other colors that pollution has been formed
Luminescent layer 3;Further, on this basis, can also largely reduce two adjacent OLED device receiving portion 8 it
Between distance, so as to improve the resolution ratio of oled substrate, so that preparing the aobvious of the display device of gained by the oled substrate
Show better.
Embodiment 2:
As shown in Fig. 2, the present embodiment provides a kind of preparation method of oled substrate, include the following steps:
Step 1: pixel-driving circuit is formed on the base 1.
Specifically, on the base 1, switching transistor, driving transistor, storage capacitance etc. are included by patterning processes formation
Each layer structure of element, to form pixel-driving circuit.
Step 2: in the substrate 1 for completing above-mentioned steps one, the anode of each OLED device is formed by patterning processes
Layer.
It should be noted that, the driving transistor of the corresponding pixel-driving circuit of the anode layer of each OLED device
Drain electrode connection.Under normal conditions, it needs to form interlayer insulating film on each layer structure of the pixel-driving circuit formed,
And the interlayer insulating film is etched to form via 9, for by the drain electrode of the driving transistor of pixel-driving circuit and OLED devices
The anode connection of part.Wherein, a pixel-driving circuit corresponds to one OLED device of driving.
Step 3: in the substrate 1 for completing above-mentioned steps two, pixel confining layer 2 is formed;And in pixel confining layer 2, shape
Into the first receiving portion of red OLED device.
Specifically, in the substrate 1 for completing above-mentioned steps two, pass through sputtering, PECVD (plasma enhanced chemical vapor
Deposition;Plasma Enhanced Chemical Vapor Deposition) mode, pixel deposition confining layers 2, and to picture
Plain confining layers 2 are exposed, develop, etching processing, to form the first receiving portion of red OLED device.
Step 4: in the first receiving portion formed in step 3, emitting red light is sequentially formed along away from 1 direction of substrate
The 31, first cathode layer 41 of layer, the first encapsulated layer 51.
The step can specifically include:First, having in the pixel confining layer 2 of the first receiving portion in formation, passes through vapor deposition
Technique sequentially forms red illuminating material layer, the first cathode material layer;Then, in the first cathode material layer, pass through PECVD
Mode form the first encapsulating material layer;Finally, by chemical mechanical grinding removal in addition to corresponding with the first receiving portion position
Red illuminating material layer, the first cathode material layer, the first encapsulating material layer, sent out with forming be located in the first receiving portion red
Photosphere 31, the first cathode layer 41, the first encapsulated layer 51.
Wherein, above-mentioned chemical mechanical milling tech specifically includes:Using lapping liquid to the first encapsulating material layer
Corrosion is learned, and utilizes red illuminating material layer of the mechanical polishing process removal in addition to corresponding with the first receiving portion position, first
The part first that corrosion is crossed that is ground in the first receiving portion of cathode material layer, the first encapsulating material layer and removal encapsulates
Material layer.Wherein, lapping liquid includes:Abrasive grains, additive and water;Abrasive grains account for the 0.01%~10% of lapping liquid gross mass,
It is cerium based compound, such as:Cerium oxide;And the grain size of the abrasive grains is 50nm~500nm.In addition, additive accounts for lapping liquid
The 0.01%~5% of gross mass, the additive is by free uracil -6- carboxylic acids, mandelic acid, salicylaldoxime, ascorbic acid, youngster
Tea phenol, 3- methyl catechols, 4- methyl catechols, 4- tert-butyl catechols, 1,4- benzoquinones dioxime, 2- pyridinemethanols,
4- isopropyls tropolone, 2- hydroxyl -2,4,6- cycloheptatriene -1- ketone, 5- amino-uracil -6- carboxylics
One or more being prepared in acid and benzilic acid.
Repeat the above steps three and step 4, on the pixel confining layer 2 of red OLED device is formed with, to pass through exposure
Light, etches the second receiving portion for forming green OLED device at development;Then, in the pixel confining layer 2 for being formed with the second receiving portion
On, green luminescent material layer, the second cathode material layer are sequentially formed by evaporation process;Subsequently, in the second cathode material layer
On, the second encapsulating material layer is formed by way of PECVD;Finally, it is removed and the second receiving portion by chemical mechanical grinding removal
Green luminescent material layer, the second cathode material layer, the second encapsulating material layer other than the correspondence of position are located at the second receiving to be formed
Green light emitting layer 32, the second cathode layer 42, the second encapsulated layer 52 in portion.
Similarly, on the pixel confining layer 2 of red OLED device and green OLED device is already formed with, by exposing,
Development, etching form the third receiving portion of Blue OLED device, and are sequentially formed in third receiving portion by the same method
Blue light-emitting layer 33, third cathode layer 43, third encapsulated layer 53.It should be noted that it is formed in pixel confining layer 2 red
Color OLED device, green OLED device, the sequence of Blue OLED device have no successively, herein also without limiting.
Wherein, the first above-mentioned encapsulated layer 51, the second encapsulated layer 52, third encapsulated layer 53 material include:The oxygen of silicon
It is one or more in compound, the nitride of silicon, the nitrogen oxides of silicon, epoxy polymer, acrylate polymer.
Wherein, the present embodiment is preferred, in the receiving portion of the OLED device of different colours, is also formed with being arranged on cathode
Protective layer 6 between layer 4 and encapsulated layer 5, for preventing from performing etching the encapsulated layer 5 of the OLED device of different colours in postorder
Processing, the step of to form via 9 in, damage cathode layer 4.Wherein, the material of protective layer 6 includes:Tin indium oxide (ITO) or oxygen
Change indium zinc (IZO).
Step 5: via 9 is formed in the encapsulated layer 5 of the OLED device of a variety of colors, and in the envelope for completing above-mentioned steps
It fills and connection electrode 7 is formed on layer 5;Wherein, each cathode layer 4 is linked together by connection electrode 7.
Specifically, by etching technics, while the of the first encapsulated layer 51 in red OLED device, green OLED device
Two encapsulated layers 52, Blue OLED device third encapsulated layer 53 in form via 9, and the first encapsulated layer 51 after having etched,
Connection electrode 7 is formed on second encapsulated layer 52, third encapsulated layer 53, for by the first cathode layer 41, the second cathode layer 42, third
Cathode layer 43 links together, so that red OLED device, green OLED device, Blue OLED device normal luminous.
So far the preparation of oled substrate is completed.
In conclusion after the red light emitting layer 31 of red OLED device is formed, will be formed on red light emitting layer 31
First cathode layer 41, the first encapsulated layer 51,41 and first encapsulated layer 51 of the first cathode layer can be effectively prevented from, and form green
During the green light emitting layer 32 of OLED device, in green light emitting layer 32 accumulation to red light emitting layer 31, so as to pollute red light emitting layer
31 the occurrence of.Similarly, in the blue light-emitting layer 33 for forming Blue OLED device, the first cathode of red OLED device
41 and first encapsulated layer 51 of layer, can prevent in blue light-emitting layer 33 accumulation to red light emitting layer 31, so as to pollute red light emitting layer
31;The second cathode layer 42 and the second encapsulated layer 52 of green OLED device can prevent blue light-emitting layer 33 from polluting green light emitting layer
32;That is, red light emitting layer 31 can be only arranged in the first receiving portion of red OLED device, 32 meetings of green light emitting layer
It is arranged in the second receiving portion of green OLED device, the third that blue light-emitting layer 33 can only be arranged on Blue OLED device accommodates
In portion namely in a kind of receiving portion of the OLED device of color, luminescent layer corresponding with its color only can be provided with, so as to ensure
The luminance purity of the OLED device of a variety of colors, and then improve the display effect of the display device made of the oled substrate.
Embodiment 3:
As shown in figure 3, the present embodiment provides a kind of oled substrate, it can be used embodiment 1 or embodiment 2 provided
The preparation method of oled substrate is prepared.Wherein, which includes:Substrate 1;Pixel confining layer 2, pixel confining layer 2
In be provided with receiving portion 8;Edge deviates from 1 direction of substrate, and luminescent layer 3, the cathode of the OLED device set gradually in receiving portion 8
Layer 4, encapsulated layer 5;Wherein, the cathode layer 4 of each OLED device, encapsulated layer 5 are independently arranged, mutually disconnect, with to hair
Photosphere 3 is protected, so as to prevent, in the luminescent layer 3 for forming a certain color, polluting the hair of other colors formed
Photosphere 3.
Wherein, as shown in figure 4, the present embodiment is preferred, oled substrate further includes:Protective layer 6, is arranged on different colours
The cathode layer 4 of OLED device and encapsulated layer 5 between, for preventing the encapsulated layer 5 in postorder to the OLED device of different colours
Perform etching processing, the step of to form via 9 in, damage cathode layer 4.
It is further preferred that oled substrate further includes:Connection electrode 7 is arranged on the encapsulated layer after etching processing 5
On, for the cathode layer 4 of the OLED device of different colours to be linked together, so that each OLED device normal luminous.
It can thus be seen that the oled substrate that is provided of the present embodiment include the OLED device of different colours luminescent layer 3,
Cathode layer 4, encapsulated layer 5 on the luminescent layer 3 of the OLED device of each color, are disposed with the cathode layer 4 mutually disconnected, envelope
Layer 5 is filled, for being protected to luminescent layer 3, is prevented in the luminescent layer 3 for forming a certain color, pollutes its that formed
The luminescent layer 3 of his color, so that preparing the display effect of the display device of gained by the oled substrate more preferably.
Embodiment 4:
The present embodiment provides a kind of display device with preferable display effect, including the oled substrate in embodiment 3.
Wherein, the display device of the present embodiment can be Electronic Paper, oled panel, mobile phone, tablet computer, television set, show
Show any product or component with display function such as device, laptop, Digital Frame, navigator.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, in the essence for not departing from the present invention
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of preparation method of oled substrate, which is characterized in that including:
Pixel confining layer is formed in substrate, and a kind of receiving of the OLED device of color is formed in the pixel confining layer
Portion;
In the receiving portion formed in above-mentioned steps, formed along set gradually away from the substrate direction luminescent layer, cathode layer,
Encapsulated layer;
According to above-mentioned steps, the receiving portion of the OLED device of remaining color is formed one by one in the pixel confining layer;And
It is often formed after a kind of receiving portion of the OLED device of color, in the receiving portion formed, sequentially forms this kind of color
Luminescent layer, cathode layer, the encapsulated layer of OLED device.
2. the preparation method of oled substrate according to claim 1, which is characterized in that further include:
Via is formed in the encapsulated layer of the OLED device of a variety of colors;
Connection electrode is formed on the encapsulated layer for completing above-mentioned steps;Wherein, each cathode layer passes through the connection
Electrode links together.
3. the preparation method of oled substrate according to claim 1, which is characterized in that described in the receiving portion formed
In, it is formed and is specifically included along the step of luminescent layer, cathode layer, encapsulated layer set gradually away from the substrate direction:
Have in the pixel confining layer of described accommodation section what is formed, sequentially form luminous material layer, cathode material layer, package material
The bed of material;
The luminous material layer, cathode material in addition to corresponding with described accommodation section position is removed by chemical mechanical grinding
Layer, encapsulating material layer, to form the luminescent layer being located in described accommodation section, cathode layer, encapsulated layer.
4. the preparation method of oled substrate according to claim 3, which is characterized in that the luminous material layer, described the moon
Pole material layer is sequentially formed at by evaporation process in the pixel confining layer of described accommodation section;
The encapsulating material layer is formed in by way of plasma enhanced chemical vapor deposition in the cathode material layer.
5. the preparation method of oled substrate according to claim 1, which is characterized in that the preparation method of the oled substrate
It further includes:
In described accommodation section, the protective layer between the cathode layer and the encapsulated layer is formed.
6. the preparation method of oled substrate according to claim 5, which is characterized in that the material of the protective layer includes:
Tin indium oxide or indium zinc oxide.
7. the preparation method of oled substrate according to claim 1, which is characterized in that described that pixel limit is formed in substrate
Before the step of given layer, further include:
On the substrate, the anode layer of each OLED device is formed by patterning processes.
8. the preparation method of oled substrate according to claim 1, which is characterized in that the material of the encapsulated layer includes:
It is one or more in the oxide of silicon, the nitride of silicon, the nitrogen oxides of silicon, epoxy polymer, acrylate polymer.
9. a kind of oled substrate, which is characterized in that including:
Substrate;
Pixel confining layer is provided with receiving portion in the pixel confining layer;
Edge deviates from the substrate direction, and the luminescent layer of the OLED device set gradually in described accommodation section, cathode layer, encapsulation
Layer, and the cathode layer of each OLED device, encapsulated layer are independently arranged, and are mutually disconnected.
10. a kind of display device, which is characterized in that including the oled substrate described in claim 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810079079.XA CN108231859A (en) | 2018-01-26 | 2018-01-26 | Oled substrate and preparation method thereof, display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810079079.XA CN108231859A (en) | 2018-01-26 | 2018-01-26 | Oled substrate and preparation method thereof, display device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108231859A true CN108231859A (en) | 2018-06-29 |
Family
ID=62668773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810079079.XA Pending CN108231859A (en) | 2018-01-26 | 2018-01-26 | Oled substrate and preparation method thereof, display device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108231859A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023178774A1 (en) * | 2022-03-23 | 2023-09-28 | 深圳市华星光电半导体显示技术有限公司 | Manufacturing method for oled display panel, and oled display panel |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104022139A (en) * | 2014-05-30 | 2014-09-03 | 京东方科技集团股份有限公司 | Organic electroluminescence displaying panel and device |
CN105870159A (en) * | 2016-06-07 | 2016-08-17 | 京东方科技集团股份有限公司 | Organic light-emitting diode display panel, display device and manufacturing method |
CN105914220A (en) * | 2015-02-24 | 2016-08-31 | 三星显示有限公司 | Organic light emitting display device |
-
2018
- 2018-01-26 CN CN201810079079.XA patent/CN108231859A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104022139A (en) * | 2014-05-30 | 2014-09-03 | 京东方科技集团股份有限公司 | Organic electroluminescence displaying panel and device |
CN105914220A (en) * | 2015-02-24 | 2016-08-31 | 三星显示有限公司 | Organic light emitting display device |
CN105870159A (en) * | 2016-06-07 | 2016-08-17 | 京东方科技集团股份有限公司 | Organic light-emitting diode display panel, display device and manufacturing method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023178774A1 (en) * | 2022-03-23 | 2023-09-28 | 深圳市华星光电半导体显示技术有限公司 | Manufacturing method for oled display panel, and oled display panel |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103762224B (en) | Organic el display panel | |
CN207116481U (en) | Display base plate, display device | |
US9543368B2 (en) | OLED array substrate having black matrix, manufacturing method and display device thereof | |
CN106935624B (en) | Organic light emitting diode display device | |
CN104009186B (en) | Organic light-emitting display device and manufacture method thereof | |
CN105895655B (en) | Organic light emitting diode display and its manufacture method with high aperture ratio | |
CN100514702C (en) | Organic electroluminescent device and fabrication method thereof | |
CN108051943A (en) | Display panel and its display device | |
CN107808895A (en) | Transparent OLED display and preparation method thereof | |
CN106711179B (en) | AMOLED transparent display and preparation method thereof | |
CN107845667A (en) | A kind of organic electroluminescence display panel, display device and preparation method thereof | |
CN107611280A (en) | Organic Light Emitting Diode substrate and its manufacture method | |
CN100512585C (en) | Dual panel-type organic electroluminescent display device and method for manufacturing the same | |
CN104659066A (en) | Display panel and manufacturing method thereof, as well as display device | |
CN107887526B (en) | Display panel and preparation method thereof, display device | |
CN109244269A (en) | Display panel and its manufacturing method, display device | |
CN109004005A (en) | Display panel and preparation method thereof, display device | |
CN105097830B (en) | A kind of array substrate and preparation method thereof, display panel and display device | |
CN103283306A (en) | Method for forming vapor deposition film, and method for producing display device | |
CN103779381A (en) | Organic light emitting display device and manufacturing method thereof | |
CN112714955B (en) | Display substrate, display panel and preparation method of display substrate | |
CN104576694A (en) | Oled display device and manufacturing method thereof | |
CN103715222A (en) | Organic light emitting diode display and method for manufacturing the same | |
CN110137378A (en) | Display panel and display device | |
CN106910836A (en) | A kind of OLED display device and OLED display |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180629 |
|
RJ01 | Rejection of invention patent application after publication |