CN105870159B - A kind of organic LED display panel, display device and production method - Google Patents
A kind of organic LED display panel, display device and production method Download PDFInfo
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- CN105870159B CN105870159B CN201610397832.0A CN201610397832A CN105870159B CN 105870159 B CN105870159 B CN 105870159B CN 201610397832 A CN201610397832 A CN 201610397832A CN 105870159 B CN105870159 B CN 105870159B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
A kind of organic LED display panel of present invention offer, display device and production method, the organic LED display panel include：Organic light-emitting diode display substrate and encapsulated layer for encapsulating the organic light-emitting diode display substrate, the organic light-emitting diode display substrate includes anode, organic luminous layer and cathode, and the encapsulated layer is capable of providing the channel of conducting cathode and the EVSS supply ports in external printed circuit board.In follow-up assembling flow path, the EVSS supply ports on printed circuit board can be electrically connected by the channel that encapsulated layer provides with cathode, to transmit EVSS electric currents.COF then no longer needs to transmit EVSS electric currents, and also there is no need to which EVSS transmission lines are arranged on COF, EVDD transmission lines are only arranged can be applied to narrow frame product so as to reduce the size of COF.
Description
Technical field
The present invention relates to display technology field more particularly to a kind of organic LED display panel, display device and
Production method.
Background technology
Referring to FIG. 1, Fig. 1 is the structural schematic diagram of Organic Light Emitting Diode in the prior art (OLED) display device,
The OLED display includes：OLED display panel, chip on film (COF) 31 and printed circuit board (PCB) 32, the OLED are aobvious
Show that panel includes：Underlay substrate 11, thin film transistor (TFT) (TFT) layer 12, anode 13, organic luminous layer 14, cathode 15 and encapsulated layer
16。
The OLED display panel EVDD (power supply) and EVSS () power supply be all to be conducted to COF31, so by PCB32
It is conducted afterwards to OLED display panel by COF31.That is, needed on COF setting be used for transmission EVDD and EVSS for fax
Defeated line, above-mentioned electrical transfer line occupy the big quantity space on COF, this undoubtedly increases the width of COF, so that it is difficult to
Product applied to narrow frame.
Invention content
In view of this, a kind of organic LED display panel of present invention offer, display device and production method, are used for
Solve to need to be arranged simultaneously on the COF in existing OLED display EVDD and EVSS electrical transfer lines, electrical transfer line compared with
It is more, cause COF sizes big, it is difficult to the problem of being applied to narrow frame product.
In order to solve the above technical problems, the present invention provides a kind of organic LED display panel, including organic light emission
Diode display base plate and encapsulated layer for encapsulating the organic light-emitting diode display substrate, the organic light-emitting diodes
Pipe display base plate includes anode, organic luminous layer and cathode, and the encapsulated layer is capable of providing conducting cathode and external printed circuit
The channel of EVSS supply ports on plate.
Preferably, the encapsulated layer includes：Encapsulate glue-line and Metal Packaging layer, the side of the Metal Packaging layer with it is described
Cathode is electrically connected, and the other side can be electrically connected with the EVSS supply ports on the printed circuit board.
Preferably, the organic LED display panel further includes：First conductive pattern, first conductive pattern
Through the encapsulation glue-line, side and the cathode contacts, the other side are contacted with the Metal Packaging layer, the Metal Packaging layer
It is electrically connected by first conductive pattern with the cathode.
Preferably, first conductive pattern is at least two.
Preferably, the Metal Packaging layer is in direct contact with the cathode, and the encapsulation glue-line is only around organic hair
The display area of optical diode display base plate is arranged.
Preferably, the Metal Packaging layer is metallic plate.
Preferably, the encapsulated layer is thin-film encapsulation layer, and the thin-film encapsulation layer includes at least one be alternately superposed
Layer inorganic thin film layer and at least one layer of organic thin film layer offer the mistake for penetrating through the thin-film encapsulation layer in the thin-film encapsulation layer
Hole；The display panel further includes：Second conductive pattern, second conductive pattern are partially filled in the via, and one
Side is electrically connected by the via with the cathode, and the other side can be electrically connected with the EVSS supply ports in external printed circuit board
It connects.
Preferably, the encapsulated layer includes encapsulation glue-line and cover-plate glass, is offered described in perforation on the cover-plate glass
The via of glass-encapsulated layer；The display panel further includes：Third conductive pattern, the third conductive pattern are partially filled in
In the via, side is electrically connected by the via with the cathode, the other side can in external printed circuit board
EVSS supply ports are electrically connected.
The present invention also provides a kind of organic LED display devices, including above-mentioned organic light-emitting diode display face
Plate, the display device further include：Printed circuit board, the EVSS supply ports on the printed circuit board pass through the encapsulated layer
The channel of offer is electrically connected with the cathode on the organic LED display panel.
Preferably, the organic LED display device further includes：One end of chip on film COF, the COF and institute
State the EVDD supply ports connection on printed circuit board, the non-display area of the other end and the organic LED display panel
The cabling in domain connects.
The present invention also provides a kind of production methods of organic LED display panel, including：
Organic light-emitting diode display substrate is formed, the organic light-emitting diode display substrate includes anode, You Jifa
Photosphere and cathode；
Form the encapsulated layer for encapsulating the organic light-emitting diode display substrate, wherein the encapsulated layer can carry
For the channel of conducting cathode and the EVSS supply ports in external printed circuit board.
Preferably, the encapsulated layer includes encapsulation glue-line and Metal Packaging layer；
Before the step of encapsulated layer formed for encapsulating the organic light-emitting diode display substrate, further include：
The first conductive pattern is formed on the cathode；
The step of encapsulated layer of the formation for encapsulating the organic light-emitting diode display substrate includes：
The coating encapsulation glue-line on the cathode for being formed with first conductive pattern；
It is pressed to a metallic plate as Metal Packaging layer on the encapsulation glue-line using process for pressing, the gold after pressing
Belong to plate to contact with the conductive pattern.
Preferably, the encapsulated layer includes encapsulation glue-line and Metal Packaging layer；The formation is for encapsulating organic hair
The step of encapsulated layer of optical diode display base plate includes：
In the display area surrounding coating encapsulation glue-line of the organic light-emitting diode display substrate；
Be pressed together on the encapsulation glue-line as Metal Packaging layer using a metallic plate, after pressing the metallic plate directly with
The cathode contacts.
The above-mentioned technical proposal of the present invention has the beneficial effect that：
Since encapsulated layer is capable of providing the channel of conducting cathode and the EVSS supply ports in external printed circuit board, thus
In follow-up assembling flow path, the EVSS supply ports on printed circuit board can be electrically connected by above-mentioned conductive channel with cathode
It connects, to transmit EVSS electric currents.That is, COF no longer needs to transmit EVSS electric currents, setting EVSS is also no longer needed on COF
Transmission line, EVDD transmission lines are only arranged can be applied to narrow frame product so as to reduce the size of COF.
On the other hand, due to only transmitting EVDD on COF, the power supply of EVDD is also improved, the risk that COF is burnt is reduced.
Another aspect is also no longer needed for the shorting bar of design EVSS inside organic LED display panel
(short-circuited node), intersection short circuit caused by script shorting bar and display bad line will no longer occur, and improve organic hair
The yield of optical diode display panel.
Description of the drawings
Fig. 1 is the structural schematic diagram of organic LED display device in the prior art；
Fig. 2 is the structural schematic diagram of the organic LED display panel of the embodiment of the present invention one；
Fig. 3 is the structural schematic diagram of the organic LED display panel of the embodiment of the present invention two；
Fig. 4 is the structural schematic diagram of the organic LED display panel of the embodiment of the present invention three；
Fig. 5 is the structural schematic diagram of the organic LED display panel of the embodiment of the present invention four；
Fig. 6 is the structural schematic diagram of the organic LED display device of the embodiment of the present invention five；
Fig. 7 is the structural schematic diagram of the organic LED display device of the embodiment of the present invention six.
Specific implementation mode
To solve on the COF in existing OLED display to need that EVDD and EVSS electrical transfer lines are arranged simultaneously, supply
Electric transmission line is more, causes COF sizes big, it is difficult to which the problem of being applied to narrow frame product, the embodiment of the present invention, which provides one kind, to be had
Machine LED display panel, including organic light-emitting diode display substrate and for encapsulating the Organic Light Emitting Diode
The encapsulated layer of display base plate, the organic light-emitting diode display substrate include anode, organic luminous layer and cathode, wherein institute
State the channel that encapsulated layer is capable of providing conducting cathode and the EVSS supply ports in external printed circuit board.
Since encapsulated layer is capable of providing the channel of conducting cathode and the EVSS supply ports in external printed circuit board, thus
In follow-up assembling flow path, the EVSS supply ports on printed circuit board can be electrically connected by above-mentioned conductive channel with cathode
It connects, to transmit EVSS electric currents.That is, COF no longer needs to transmit EVSS electric currents, setting EVSS is also no longer needed on COF
Transmission line, EVDD transmission lines are only arranged can be applied to narrow frame product so as to reduce the size of COF.
On the other hand, due to only transmitting EVDD on COF, the power supply of EVDD is also improved, the risk that COF is burnt is reduced.
Another aspect is also no longer needed for the shorting bar of design EVSS inside organic LED display panel
(short-circuited node), intersection short circuit caused by script shorting bar and display bad line will no longer occur, and improve organic hair
The yield of optical diode display panel.
Encapsulated layer in organic LED display panel can substantially be divided into：Two type of glass-encapsulated and thin-film package
Type.Wherein, glass-encapsulated is that cover-plate glass is carried out pairing by packaging plastic and organic light-emitting diode display substrate.Film seals
Dress is a kind of novel encapsulated mode, and cover board no longer uses glass material, but is replaced with film.Film can be metal material,
Can also be other thin-film materials (such as the inorganic thin film layer and organic thin film layer being alternately superposed).Thin-film package has thickness
Spend thin, the advantages that being easily bent.
Below for different types of encapsulated layer, detailed description of embodiments of the present invention.
It is the embodiment using metallic film encapsulation below.
The encapsulated layer includes：Encapsulate glue-line and Metal Packaging layer, side and the cathode electricity of the Metal Packaging layer
Connection, the other side can be electrically connected with the EVSS supply ports on the printed circuit board.
In the embodiment of the present invention, Metal Packaging layer is that cathode and the EVSS supply ports in external printed circuit board is connected
Channel.
Since Metal Packaging layer is electrically connected with cathode, in the follow-up assembling flow path of organic LED display panel,
Metal Packaging layer can be electrically connected with the EVSS supply ports on PCB, cathode and EVSS supply ports is connected, so that
EVSS electric currents can be conducted by Metal Packaging layer to cathode.That is, can no longer need via COF transmission EVSS electricity
It flows, also there is no need to which EVSS transmission lines are arranged on COF, EVDD transmission lines are only arranged to be made so as to reduce the size of COF
It can be applied to narrow frame product.
The connection type of Metal Packaging layer and cathode can be a variety of, below illustrate citing.
Referring to FIG. 2, Fig. 2 is the structural schematic diagram of the organic LED display panel of the embodiment of the present invention one, institute
Stating organic LED display panel includes：Organic light-emitting diode display substrate and for encapsulating the organic light-emitting diodes
The encapsulation glue-line 27 and Metal Packaging layer 28 of pipe display base plate, the organic light-emitting diode display substrate includes underlay substrate
21, TFT layer 22, anode 23, organic luminous layer 24 and cathode 25.
The organic LED display panel further includes：First conductive pattern 26, first conductive pattern 26 pass through
The encapsulation glue-line 27 is worn, side is contacted with the cathode 25, and the other side is contacted with the Metal Packaging layer 28, i.e., the described metal
Encapsulated layer 28 and the cathode 25 are electrically connected by first conductive pattern 26.
In the embodiment of the present invention, cathode 25 and Metal Packaging layer 28 are electrically connected by the first conductive pattern 26, realization side
Formula is simple.
In order to reduce conduction impedance, it is preferable that the number of first conductive pattern 26 is at least two.Certainly, first
The number of conductive pattern 26 may be one, as long as suitably increasing the width of the first conductive pattern 26, can also reach reduction
The purpose of conduction impedance.
First conductive pattern 26 can be set to the non-display area of organic light-emitting diode display substrate, can also
It is set to the display area of organic light-emitting diode display substrate.
Referring to FIG. 3, Fig. 3 is the structural schematic diagram of the organic LED display panel of the embodiment of the present invention two, institute
Stating organic LED display panel includes：Organic light-emitting diode display substrate and for encapsulating the organic light emission two
The encapsulation glue-line 27 and Metal Packaging layer 28 of pole pipe display base plate, the organic light-emitting diode display substrate includes underlay substrate
21, TFT layer 22, anode 23, organic luminous layer 24 and cathode 25.
Wherein, the Metal Packaging layer 28 is in direct contact with the cathode 25, between Metal Packaging layer 28 and cathode 25 not
Encapsulation glue-line 27 is set again, and the encapsulation glue-line 27 is set only around the display area of the organic light-emitting diode display substrate
It sets.
In the embodiment of the present invention, Metal Packaging layer 28 is set on cathode 25, is in direct contact with cathode 25, without
The conductive pattern for Metal Packaging layer 28 and cathode 25 to be connected is made again, is reduced the production cost.
In above-described embodiment, it is preferable that the Metal Packaging layer 28 is a metallic plate, when being packaged, directly by institute
Metallic plate is stated to press on the organic light-emitting diode display substrate for being coated with encapsulation glue-line.
It is right in the embodiment that Metal Packaging layer 28 and cathode 25 are in direct contact when Metal Packaging layer 28 is metallic plate
The flatness requirement of metal sheet surface is higher so that metallic plate can realize the purpose of large area conducting with cathode with close contact.
Certainly, in some other embodiment of the present invention, the Metal Packaging layer 28 can be by depositing or sputtering
Etc. the metallic film that is formed of modes.
It is the embodiment using other thin-film packages below.
Referring to FIG. 4, Fig. 4 is the structural schematic diagram of the organic LED display panel of the embodiment of the present invention three, institute
Stating organic LED display panel includes：Organic light-emitting diode display substrate and for encapsulating the organic light emission two
The thin-film encapsulation layer 29 of pole pipe display base plate, the thin-film encapsulation layer include at least one layer of inorganic thin film layer being alternately superposed
With at least one layer of organic thin film layer, embodiment shown in Fig. 4 includes that thin-film encapsulation layer includes three layers, in the side far from cathode 25
Upwards, first time inorganic thin film layer, organic thin film layer and second layer inorganic thin film layer are followed successively by.The Organic Light Emitting Diode is aobvious
Show that substrate includes underlay substrate 21, TFT layer 22, anode 23, organic luminous layer 24 and cathode 25.
The via 291 for penetrating through the thin-film encapsulation layer is offered in the thin-film encapsulation layer 29；The display panel also wraps
It includes：Second conductive pattern 210, second conductive pattern 210 are partially filled in the via 291, and side passes through described
Via 291 is electrically connected with the cathode 25, and the other side can be electrically connected with the EVSS supply ports in external printed circuit board.
The number of the via 291 can be one, or it is multiple, to reduce conduction impedance.
In the embodiment of the present invention, the via in the thin-film encapsulation layer is to provide in conducting cathode and external printed circuit board
EVSS supply ports channel.
Since the second conductive pattern 210 is electrically connected with the cathode 25, in the follow-up of organic LED display panel
In assembling flow path, the second conductive pattern 210 can be electrically connected with the EVSS supply ports on PCB, cathode and EVSS is connected
Supply port, so that EVSS electric currents can be conducted by the second conductive pattern 210 to cathode.That is, can be no longer
It needs to transmit EVSS electric currents via COF, also there is no need to which EVSS transmission lines are arranged on COF, EVDD transmission lines is only set, from
And the size of COF can be reduced, narrow frame product can be applied to.
It is the embodiment using other glass-encapsulateds below.
Referring to FIG. 5, Fig. 5 is the structural schematic diagram of the organic LED display panel of the embodiment of the present invention four, institute
Stating organic LED display panel includes：Organic light-emitting diode display substrate and for encapsulating the organic light emission two
The encapsulation glue-line 27 and cover-plate glass 211 of pole pipe display base plate, the organic light-emitting diode display substrate includes underlay substrate
21, TFT layer 22, anode 23, organic luminous layer 24 and cathode 25.
The via 2111 for penetrating through the encapsulated layer is offered on the cover-plate glass 211；The display panel further includes：The
Three conductive patterns 212, the third conductive pattern 212 are partially filled in the via 2111, and side passes through the via
2111 are electrically connected with the cathode 25, and the other side can be electrically connected with the EVSS supply ports in external printed circuit board.
In the embodiment of the present invention, the via 2111 on the cover-plate glass 211 is to provide conducting cathode 25 to print with external
The channel of EVSS supply ports on circuit board.
Since third conductive pattern 212 is electrically connected with the cathode 25, in the follow-up of organic LED display panel
In assembling flow path, third conductive pattern 212 can be electrically connected with the EVSS supply ports on PCB, cathode and EVSS is connected
Supply port, so that EVSS electric currents can be conducted by third conductive pattern 212 to cathode.That is, can be no longer
It needs to transmit EVSS electric currents via COF, also there is no need to which EVSS transmission lines are arranged on COF, EVDD transmission lines is only set, from
And the size of COF can be reduced, narrow frame product can be applied to.
The present invention also provides a kind of organic LED display devices, including organic hair described in any of the above-described embodiment
Optical diode display panel, the display device further include：Printed circuit board, the EVSS supply ports on the printed circuit board
The channel provided by the encapsulated layer is electrically connected with the cathode on the organic LED display panel.
The organic LED display device further includes：Chip on film COF, one end of the COF and the printing
EVDD supply ports connection on circuit board, the other end are walked with the non-display area of the organic LED display panel
Line connects.
That is, EVSS electric currents can by the channel transfer that encapsulated layer provides to cathode, on COF there is no need to
EVSS transmission lines are set again, and EVDD transmission lines are only arranged can be applied to narrow side so as to reduce the size of COF
Frame product.
Referring to FIG. 6, Fig. 6 is the structural schematic diagram of the organic LED display device of the embodiment of the present invention five, institute
Stating organic LED display device includes：Organic LED display panel, PCB42 and COF41, wherein described
Organic LED display panel includes：Organic light-emitting diode display substrate and for encapsulating the Organic Light Emitting Diode
The encapsulation glue-line 27 and Metal Packaging layer 28 of display base plate.The organic light-emitting diode display substrate include underlay substrate 21,
TFT layer 22, anode 23, organic luminous layer 24 and cathode 25.The organic LED display panel further includes：First is conductive
Figure 26, first conductive pattern 26 run through the encapsulation glue-line 27, side is contacted with the cathode 25, the other side with it is described
Metal Packaging layer 28 contacts, i.e., the described Metal Packaging layer 28 and the cathode 25 are electrically connected by first conductive pattern 26.
In addition, the Metal Packaging layer 28 is connect by conducting resinl with the EVSS supply ports on PCB so that cathode 25 with it is described
EVSS supply ports conducting on PCB.
Referring to FIG. 7, Fig. 7 is the structural schematic diagram of the organic LED display device of the embodiment of the present invention six, institute
Stating organic LED display device includes：Organic LED display panel, PCB42 and COF41, wherein described
Organic LED display panel includes：Organic light-emitting diode display substrate and for encapsulating the organic light-emitting diodes
The encapsulation glue-line 27 and Metal Packaging layer 28 of pipe display base plate, the organic light-emitting diode display substrate includes underlay substrate
21, TFT layer 22, anode 23, organic luminous layer 24 and cathode 25.Wherein, the Metal Packaging layer 28 and the cathode 25 are direct
Contact, no longer setting encapsulates glue-line 27 between Metal Packaging layer 28 and cathode 25, and the encapsulation glue-line 27 is only around described organic
The display area of diode displaying substrate is arranged.In addition, the Metal Packaging layer 28 is also by conducting resinl and PCB
EVSS supply ports connect, so that cathode 25 is connected with the EVSS supply ports on the PCB.
In above-described embodiment, Metal Packaging layer is connect with EVSS supply ports, EVSS and GND () be connected, thus, metal
Encapsulated layer is electrically connected with GND, and Metal Packaging layer is electrically GND to be improved so Metal Packaging layer has the function of electromagnetic shielding
EMI (electromagnetic shielding) characteristic of organic LED display panel.Metal Packaging layer is electrically GND, Organic Light Emitting Diode
When display panel encounters electrostatic, can electrostatic be passed into GND by Metal Packaging layer in time, it is aobvious to improve Organic Light Emitting Diode
Show ESD (Electro-static Driven Comb) characteristic of panel.
In above-described embodiment, when carrying out the design of printed circuit board, the bonding (connection) of PCB is showed into out bulk
Copper is leaked, which is electrically the net attributes of EVSS.In the assembling flow path after module bonding, by PCB's
Exposed PAD is stained with conducting resinl, and then conducting resinl is adhered to above Metal Packaging layer again, realizes on Metal Packaging layer and PCB
EVSS supply ports electrical connection purpose.Since the faces bonding of PCB are without electronic component, it is possible to increase leakage copper face product,
And increase the area of conducting resinl, to improve conduction impedance.
The present invention also provides a kind of production methods of organic LED display panel, including：
Step S101：Organic light-emitting diode display substrate is formed, the organic light-emitting diode display substrate includes sun
Pole, organic luminous layer and cathode；
Step S102：Form the encapsulated layer for encapsulating the organic light-emitting diode display substrate, wherein the encapsulation
Layer is capable of providing the channel of conducting cathode and the EVSS supply ports in external printed circuit board.
In one embodiment of this invention, the encapsulated layer includes encapsulation glue-line and Metal Packaging layer；
Before the step of encapsulated layer formed for encapsulating the organic light-emitting diode display substrate, further include：
The first conductive pattern is formed on the cathode；
The step of encapsulated layer of the formation for encapsulating the organic light-emitting diode display substrate includes：
The coating encapsulation glue-line on the cathode for being formed with first conductive pattern；
It is pressed to a metallic plate as Metal Packaging layer on the encapsulation glue-line using process for pressing, the gold after pressing
Belong to plate to contact with the conductive pattern.
In another embodiment of the invention, the encapsulated layer includes encapsulation glue-line and Metal Packaging layer；The formation is used
Include in the step of encapsulating the encapsulated layer of the organic light-emitting diode display substrate：
In the display area surrounding coating encapsulation glue-line of the organic light-emitting diode display substrate；
Be pressed together on the encapsulation glue-line as Metal Packaging layer using a metallic plate, after pressing the metallic plate directly with
The cathode contacts.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (4)
1. a kind of organic LED display device, including：Display panel, printed circuit board and chip on film, the printing
Ground supply port and power supply power supply port are provided on circuit board；
The display panel includes display base plate and encapsulated layer；The display base plate includes anode, organic luminous layer and cathode,
It is characterized in that,
The anode is connect by the chip on film with the power supply power supply port, and the cathode passes through the encapsulated layer and institute
State ground supply port connection；The encapsulated layer is capable of providing the channel of conducting cathode and described ground supply port；The flip is thin
Film is capable of providing the channel of conducting anode and the power supply power supply port；
The cathode is connect by the encapsulated layer with described ground supply port, specifically：The encapsulated layer includes：Encapsulate glue-line
It is electrically connected with the cathode with the side of Metal Packaging layer, the Metal Packaging layer, the other side can be with described ground supply port
Electrical connection, the Metal Packaging layer are in direct contact with the cathode, and the encapsulation glue-line is only around the Organic Light Emitting Diode
The display area of display base plate is arranged；
Or
The cathode is connect by the encapsulated layer with described ground supply port, specifically：The encapsulated layer is thin-film encapsulation layer,
The thin-film encapsulation layer includes at least one layer of inorganic thin film layer and at least one layer of organic thin film layer that alternating is superposed, described thin
The via for penetrating through the thin-film encapsulation layer is offered on film encapsulated layer；The display panel further includes：Second conductive pattern, it is described
Second conductive pattern is partially filled in the via, and side is electrically connected by the via with the cathode, other side energy
It is enough to be electrically connected with described ground supply port；
Or
The cathode is connect by the encapsulated layer with described ground supply port, specifically：The encapsulated layer includes encapsulation glue-line
And cover-plate glass, the via for penetrating through the cover-plate glass is offered on the cover-plate glass；The display panel further includes：Third
Conductive pattern, the third conductive pattern are partially filled in the via, and side passes through the via and cathode electricity
Connection, the other side can be electrically connected with described ground supply port.
2. organic LED display device according to claim 1, which is characterized in that the Metal Packaging layer is gold
Belong to plate.
3. a kind of production method of organic LED display panel, which is characterized in that including：
Organic light-emitting diode display substrate is formed, the organic light-emitting diode display substrate includes anode, organic luminous layer
And cathode；The anode is connect by chip on film with the power supply power supply port in external printed circuit board；
Form the encapsulated layer for encapsulating the organic light-emitting diode display substrate, wherein the cathode passes through the encapsulation
Layer is connect with the ground supply port in the external printed circuit board；The encapsulated layer is capable of providing conducting cathode and the printing
The channel of ground supply port on circuit board；
The encapsulated layer includes：Encapsulation glue-line and Metal Packaging layer, the side of the Metal Packaging layer are electrically connected with the cathode,
The other side can be electrically connected with the ground supply port on the printed circuit board, and the Metal Packaging layer directly connects with the cathode
It touches, the encapsulation glue-line is arranged only around the display area of the organic light-emitting diode display substrate；
Or
The encapsulated layer is thin-film encapsulation layer, and the thin-film encapsulation layer includes at least one layer of inorganic thin film layer being alternately superposed
With at least one layer of organic thin film layer, the via for penetrating through the thin-film encapsulation layer is offered in the thin-film encapsulation layer；The display
Panel further includes：Second conductive pattern, second conductive pattern are partially filled in the via, and side passes through the mistake
Hole is electrically connected with the cathode, and the other side can be electrically connected with the ground supply port in external printed circuit board；
Or
The encapsulated layer includes encapsulation glue-line and cover-plate glass, and the mistake for penetrating through the cover-plate glass is offered on the cover-plate glass
Hole；The display panel further includes：Third conductive pattern, the third conductive pattern are partially filled in the via, and one
Side is electrically connected by the via with the cathode, and the other side can be electrically connected with the ground supply port in external printed circuit board
It connects.
4. the production method of organic LED display panel according to claim 3, which is characterized in that the encapsulation
Layer includes encapsulation glue-line and Metal Packaging layer；Encapsulated layer of the formation for encapsulating the organic light-emitting diode display substrate
The step of include：
In the display area surrounding coating encapsulation glue-line of the organic light-emitting diode display substrate；
Be pressed together on the encapsulation glue-line as Metal Packaging layer using a metallic plate, after pressing the metallic plate directly with it is described
Cathode contacts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610397832.0A CN105870159B (en) | 2016-06-07 | 2016-06-07 | A kind of organic LED display panel, display device and production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610397832.0A CN105870159B (en) | 2016-06-07 | 2016-06-07 | A kind of organic LED display panel, display device and production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105870159A CN105870159A (en) | 2016-08-17 |
| CN105870159B true CN105870159B (en) | 2018-07-17 |
Family
ID=56677240
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| CN108206196A (en) | 2016-12-16 | 2018-06-26 | 京东方科技集团股份有限公司 | A kind of organic electroluminescence display device and method of manufacturing same |
| CN107302016B (en) * | 2017-08-08 | 2020-01-10 | 京东方科技集团股份有限公司 | Organic light-emitting diode display panel and manufacturing method thereof |
| CN109599498B (en) * | 2017-09-30 | 2020-11-17 | 云谷（固安）科技有限公司 | Display panel and evaporation mask |
| CN108231859A (en) * | 2018-01-26 | 2018-06-29 | 京东方科技集团股份有限公司 | Oled substrate and preparation method thereof, display device |
| JP7183427B2 (en) | 2018-12-29 | 2022-12-05 | 華為技術有限公司 | Display module and display device |
| CN110853572A (en) | 2019-11-27 | 2020-02-28 | 深圳市华星光电半导体显示技术有限公司 | Display panel and display device |
| CN110854300A (en) * | 2019-11-27 | 2020-02-28 | 京东方科技集团股份有限公司 | Display device, display panel and manufacturing method thereof |
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