CN208400872U - A kind of light emitting diode - Google Patents
A kind of light emitting diode Download PDFInfo
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- CN208400872U CN208400872U CN201721832863.0U CN201721832863U CN208400872U CN 208400872 U CN208400872 U CN 208400872U CN 201721832863 U CN201721832863 U CN 201721832863U CN 208400872 U CN208400872 U CN 208400872U
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- colloid
- emitting diode
- lead foot
- supporting plate
- light emitting
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Abstract
The utility model discloses a kind of light emitting diodes, including lead frame, bottom surface lead foot, light-emitting diode chip for backlight unit, the first colloid, the second colloid, lead frame includes shell and supporting plate, the perforation of shell top and bottom, through-hole is formed, supporting plate is set to through-hole lower part, and is closed and connects with peripheric surface, the bottom surface lead foot mounting hole of supporting plate up and down is provided on supporting plate, chip mounting portion is arranged in splint upper surface；Bottom surface lead foot is fixed on the bottom surface lead foot mounting hole, and light-emitting diode chip for backlight unit is fixed on chip mounting portion, and light-emitting diode chip for backlight unit and bottom surface lead foot are electrically connected；First colloid is encapsulated in the space that splint upper surface and shell are constituted；Second colloid encapsulates the first colloid dress.The light emitting diode of the utility model, packaging technology is simple, and packaging cost is low, and is able to satisfy various package requirements.
Description
Technical field
The utility model relates to electronic component field more particularly to a kind of method for manufacturing light-emitting and light-emitting diodes
Pipe.
Background technique
LED (Light Emitling Diode, light emitting diode) encapsulation is to carry chip using bracket (lead frame), is made
The electrical connection of inside and outside is carried out with elargol or metal contact wires, outside carries out protection and optical lens application using colloid.
Encapsulation can protect LED and increase photoelectric properties, be necessary to LED.
Currently, most of LED semiconductor devices is using the encapsulation of pin plug-in type and surface stuck encapsulation.Pin insertion
Formula encapsulation process are as follows: chip is fixed on metallic support using crystal-bonding adhesive, and uses metal wire connection electrode, realizes electric breathing exercise
It after capable of connecting, is insert molded in die cavity, injects liquid-state epoxy resin；After epoxy resin cure, LED is demoulded from die cavity at
Type.Surface stuck encapsulation process are as follows: chip is fixed on pcb board using crystal-bonding adhesive, and uses metal wire connection electrode, it is real
After existing electric function connection, using Molding Shooting Technique, by LED from die cavity stripping forming.
Above two packaging method has the following deficiencies:
The production cost of pin plug-in type encapsulation is smaller, and different finished appearance and difference can be produced by different demands user
Light emitting angle, but whole finished-product volume is larger, and is not easy to the automated production of user；The finished product of surface stuck encapsulation
Small volume, but finished appearance and light emitting angle/photoelectricity effect are more single, and production cost is higher.
Utility model content
Existing LED encapsulation there are aiming at the problem that, the utility model embodiment provides a kind of light emitting diode.
A kind of light emitting diode provided by the embodiment of the utility model, including lead frame, bottom surface lead foot, light-emitting diodes tube core
Piece, the first colloid, the second colloid,
Lead frame includes shell and supporting plate, the perforation of shell top and bottom, forms through-hole, and supporting plate is set to through-hole lower part, and with
Peripheric surface closure connects, and the bottom surface lead foot mounting hole of supporting plate up and down is provided on supporting plate, and splint upper surface is arranged chip and pacifies
Dress portion；Bottom surface lead foot is fixed on the bottom surface lead foot mounting hole, and light-emitting diode chip for backlight unit is fixed on chip mounting portion, light-emitting diodes
Tube chip and bottom surface lead foot are electrically connected；First colloid is encapsulated in the space that splint upper surface and shell are constituted；Second colloid
Encapsulate the first colloid.
Preferably, lead frame be emission type lead frame, four peripheral wall camber of splint upper surface and shell, splint upper surface,
The arc of four peripheral wall of shell constitutes reflector, and light-emitting diode chip for backlight unit installation position is in splint upper surface center.
Preferably, the first colloid and the second colloid are epoxy resin or first colloid and the second colloid is silicon tree
Rouge.First colloid and the second colloid can be solid-state glue, be also possible to liquid glue.
Preferably, shell one side forms side opening, and supporting plate is equipped with side lead foot mounting hole, side in side opening
Side lead foot is set in lead foot mounting hole, and side lead foot connects bottom surface lead foot.
The utility model has the beneficial effects that:
A kind of light emitting diode provided by the embodiment of the utility model, using emission type material as lead frame, support chip and
Electrical connection, outside carry out protection and optical concentration using epoxy resin or silicone resin.The bottom side of lead frame has lead foot, can
Compatible top light emitting and lateral emitting use.The packaging method simple process and low cost, can satisfy various light emitting diodes
Package requirements.The light emitting diode have it is small in size, strong applicability the features such as and advantage.
Detailed description of the invention
Fig. 1 is a kind of flow diagram of the packaging method of light emitting diode of embodiment；
Fig. 2 is two light emitting diode front schematic view of embodiment；
Fig. 3 is two three-dimensional LED schematic diagram of embodiment
Fig. 4 is light emitting diode bottom surface lead foot scheme of installation in embodiment；
Fig. 5 is LED sides lead foot scheme of installation in embodiment.
1, lead frame；2, shell；3, supporting plate；4, bottom surface lead foot；5, light-emitting diode chip for backlight unit；6, plain conductor；7, first
Colloid；8, the second colloid；9, pcb board；10, side lead foot.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the utility model, it should be noted that
Under the premise of not colliding, it can be formed in any combination between various embodiments described below or between each technical characteristic new
Embodiment.
Embodiment 1:
As shown in Figure 1, the utility model implements a kind of encapsulation method of the light emitting diode provided, comprising the following steps:
Lead frame is arranged in S110: lead frame includes shell and supporting plate, and the perforation of shell top and bottom forms through-hole, supporting plate setting
It in the lower part of through-hole, and is closed and connects with peripheric surface, the bottom surface lead foot mounting hole of supporting plate up and down, supporting plate are provided on supporting plate
Chip mounting portion is arranged in upper surface；
Lead frame is set as emission type lead frame, is set as four peripheral wall camber of splint upper surface and shell, table on supporting plate
The arc of four peripheral wall of face-piece body constitutes reflector, and chip mounting portion is set to splint upper surface center.The lead frame of this structure can
Launched with being emitted onto the light of camber line, can be more by the light of colloid, enhance the performance of light emitting diode.
Bottom surface lead foot is arranged in S120: bottom surface lead foot is fixed on bottom surface lead foot mounting hole；
Light-emitting diode chip for backlight unit is arranged in S130: light-emitting diode chip for backlight unit being fixed on chip mounting portion, and by light-emitting diodes
Tube chip and bottom surface lead foot are electrically connected；
Light-emitting diode chip for backlight unit can be connected with bottom surface lead foot by plain conductor, can also be had by other and well be led
The material of electrical property connects.
The encapsulation of the first colloid of S140: light emitting diode is carried out with colloid in the space that splint upper surface and shell are formed
The encapsulation of first time colloid；
The encapsulation of the second colloid of S150: secondary colloid encapsulation is carried out on the colloid after the encapsulation of first time colloid.
Colloid is epoxy resin, is also possible to silicone resin.The encapsulation of first time colloid and second of colloid encapsulation use same
Kind colloid forms the interface of different medium in intersection, has better optical property after can encapsulating to avoid colloid twice.
That is the encapsulation of first time colloid and second of colloid encapsulates while using epoxy resin, or uses silicone resin simultaneously.The glue used
Body can be solid-state glue.Especially, it using light emitting diode simple process provided by the embodiment of the utility model, does not need passing through
It crosses other injection moldings or formed in mould step, simple process overcomes moreover, liquid glue also can be used in colloid
Existing encapsulation technology can only use the limitation of solid gum.
As an improvement implementation method, further comprise the steps of: S160 setting side lead foot: shell side be arranged side
Face opening is arranged side lead foot mounting hole in supporting plate corresponding side surface opening, side lead foot is arranged in the lead foot mounting hole of side,
Side lead foot connects bottom surface lead foot.
By the way that side lead foot is arranged, the light emitting diode of encapsulation is adapted to more application scenarios.It can adapt to push up
The luminous application scenarios in face, are also adapted to the application scenarios of lateral emitting.
Embodiment 2:
As shown in Figure 2,3, the utility model embodiment also provides a kind of light emitting diode, including lead frame 1, bottom surface lead foot
4, light-emitting diode chip for backlight unit 5, the first colloid 7, the second colloid 8,
Lead frame 1 includes shell 2 and supporting plate 3, and the perforation of 2 top and bottom of shell forms through-hole, and supporting plate 3 is set to through-hole lower part,
And be closed and connect with peripheric surface, the bottom surface lead foot mounting hole of supporting plate 3 up and down, the setting of 3 upper surface of supporting plate are provided on supporting plate 3
Chip mounting portion；Bottom surface lead foot 4 is fixed on bottom surface lead foot mounting hole, and light-emitting diode chip for backlight unit 5 is fixed on chip mounting portion, shines
Diode chip for backlight unit 5 and bottom surface lead foot 4 are electrically connected；In the space that first colloid 7 is encapsulated in 3 upper surface of supporting plate and shell 2 is constituted；
Second colloid 8 encapsulates the first colloid 7.
Light-emitting diode chip for backlight unit 5 can be connected with bottom surface lead foot 4 by plain conductor 6, can also be by other with good
The material of good electric conductivity connects.
Lead frame 1 is emission type lead frame, 2 four peripheral wall camber of 3 upper surface of supporting plate and shell, 3 upper surface of supporting plate, shell
The arc of 2 four peripheral wall of body constitutes reflector, and 5 installation position of light-emitting diode chip for backlight unit is in 3 upper surface center of supporting plate.This structure
Lead frame 1 can be emitted onto the light of camber line and launch, can be more by the light of colloid, enhance light emitting diode
Performance.
First colloid 7 and the second colloid 8 are epoxy resin or the first colloid 7 and the second colloid 8 is silicone resin.First
Colloid 7 and the second colloid 8 use a kind of colloid simultaneously, can form interface to avoid two colloid intersections, have better
Optical property.First colloid 7 and the second colloid 8 can be solid-state glue, be also possible to liquid glue.
As a kind of preferred embodiment of the present embodiment, 2 one side of shell forms side opening, and supporting plate 3 is open in side
Place is equipped with side lead foot mounting hole, and side lead foot 10 is arranged in the lead foot mounting hole of side, and side lead foot 10 connects bottom surface lead foot 4.
As shown in Figure 4, Figure 5, the light emitting diode equipped with side lead foot 10, is adapted to more application scenarios.
In Fig. 4, light emitting diode is installed on pcb board 9 by bottom surface lead foot 4, adapts to the application scenarios of top light emitting.
Light emitting diode is installed on pcb board 9 by side lead foot 10 in Fig. 5, adapts to the application scenarios of lateral emitting.
It the encapsulation method of light emitting diode provided by the embodiment of the utility model a kind of and is encapsulated using the packaging method
Light emitting diode, using emission type material as lead frame 1, support chip and electrical connection, outside use epoxy resin or silicone resin
Carry out protection and optical concentration.The bottom side of lead frame 1 has lead foot, and compatible top light emitting and lateral emitting use.The envelope
It is simple to fill method and process, it is at low cost, it can satisfy the package requirements of various light emitting diodes.The light emitting diode has volume
It is small, strong applicability the features such as and advantage.
Above embodiment is only preferred embodiments of the present invention, cannot be protected with this to limit the utility model
Range, the variation of any unsubstantiality that those skilled in the art is done on the basis of the utility model and replacement belong to
In the utility model range claimed.
Claims (5)
1. a kind of light emitting diode, which is characterized in that including lead frame, bottom surface lead foot, light-emitting diode chip for backlight unit, the first colloid,
Second colloid,
The lead frame includes shell and supporting plate, and the shell top and bottom perforation forms through-hole, the supporting plate is set under through-hole
Portion, and be closed and connect with peripheric surface, is provided with the bottom surface lead foot mounting hole of supporting plate up and down on the supporting plate, on the supporting plate
Chip mounting portion is arranged in surface；The bottom surface lead foot is fixed on the bottom surface lead foot mounting hole, and the light-emitting diode chip for backlight unit is solid
It is scheduled on chip mounting portion, the light-emitting diode chip for backlight unit and bottom surface lead foot are electrically connected；First colloid is encapsulated on supporting plate
In the space that surface and shell are constituted；Second colloid encapsulates the first colloid.
2. light emitting diode as described in claim 1, which is characterized in that the lead frame is emission type lead frame, the support
Four peripheral wall camber of plate upper surface and shell, the arc composition reflector of the splint upper surface, four peripheral wall of shell are described to shine
Diode chip for backlight unit installation position is in splint upper surface center.
3. light emitting diode as described in claim 1, which is characterized in that first colloid and the second colloid are asphalt mixtures modified by epoxy resin
Rouge or first colloid and the second colloid are silicone resin.
4. light emitting diode as described in claim 1, which is characterized in that the colloid is liquid glue or solid-state glue.
5. the light emitting diode as described in Claims 1-4 is any, which is characterized in that the shell one side forms side and opens
Mouthful, the supporting plate is equipped with side lead foot mounting hole in the side opening, and side is arranged in the side lead foot mounting hole
Lead foot, the side lead foot connect bottom surface lead foot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721832863.0U CN208400872U (en) | 2017-12-25 | 2017-12-25 | A kind of light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721832863.0U CN208400872U (en) | 2017-12-25 | 2017-12-25 | A kind of light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208400872U true CN208400872U (en) | 2019-01-18 |
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ID=65065779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721832863.0U Active CN208400872U (en) | 2017-12-25 | 2017-12-25 | A kind of light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208400872U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108134001A (en) * | 2017-12-25 | 2018-06-08 | 河源市富宇光电科技有限公司 | A kind of packaging method and light emitting diode of light emitting diode pole |
-
2017
- 2017-12-25 CN CN201721832863.0U patent/CN208400872U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108134001A (en) * | 2017-12-25 | 2018-06-08 | 河源市富宇光电科技有限公司 | A kind of packaging method and light emitting diode of light emitting diode pole |
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