CN203536465U - Top emission type LED bracket and top emission type LED device - Google Patents
Top emission type LED bracket and top emission type LED device Download PDFInfo
- Publication number
- CN203536465U CN203536465U CN201320434249.4U CN201320434249U CN203536465U CN 203536465 U CN203536465 U CN 203536465U CN 201320434249 U CN201320434249 U CN 201320434249U CN 203536465 U CN203536465 U CN 203536465U
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- China
- Prior art keywords
- reflector
- placement section
- chip placement
- connecting portion
- pin
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- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The utility model relates to a top emission type LED bracket and a top emission type LED device. The top emission type LED bracket comprises a metal bracket and a reflector cup wrapped outside the metal bracket. The metal bracket comprises a metal pin embedded into the cavity of the reflector cup, and a metal base pin exposed to the outside of the reflector cup. The metal pin is provided with a chip placement part. A space is reserved between the chip placement part and the internal bottom of the cavity of the reflector cup. The top emission type LED device comprises the above top emission type LED bracket, an LED chip and epoxy resin. According to the technical scheme of the utility model, the top emission type LED bracket and the top emission type LED device are prevented from attaching to each other due to the arrangement of the space between the metal pin and the bottom of the cavity of the reflector cup. In this way, the water vapor is prevented from infiltrating onto the metal pin through the bottom of the reflector cup, so that the LED chip on the metal pin is free from being influenced by the water vapor. Therefore, the waterproof effect is better and the service life of the top emission type LED device provided with the top emission type LED bracket is prolonged.
Description
Technical field
The utility model relates to LED technology field, relates in particular to a kind of top light emitting diode support and top light emitting diode component.
Background technology
Light-emitting diode (LED) light source has advantages of high efficiency, long-life, does not contain the harmful substances such as Hg.Along with the fast development of LED technology, the performances such as the brightness of LED, life-span have all obtained great lifting, make the application of LED more and more extensive, from outdoor lightings such as street lamps to room lightings such as decorative lamps, all use one after another or are replaced with LED as light source.
Refer to Fig. 1, at present, traditional top light emitting diode (Top Light Emitting Diode, TOPLED) supporting structure is plastic packaging band lead-in wire chip carrier model (Plastic Leaded Chip Carrier, PLCC), comprise: metallic support 1, and the reflector 2 that wraps up this metallic support 1.Wherein, metallic support 1 forms by embedding the metal pins in reflector 2 and the metal pin being exposed at outside reflector 2 outward, and metal pins is used for carrying LED chip, and metal pin is used for as stent electrode.This metal pins in the cavity of reflector 2, be plane and with the bottom surface laminating of reflector, it runs through the outer wall of this reflector 2, and at the outer wall of reflector 2, is nearly 90 bendings of spending with metal pin and is connected.Because this metal pins is fitted with the bottom surface of reflector in reflector, steam easily penetrates into by the bottom surface of reflector the device inside of manufacturing based on this TOPLED support, makes the water resistance of the device based on this TOPLED support poor, and reliability is low.
Utility model content
The purpose of this utility model is to overcome shortcoming of the prior art with not enough, and a kind of water resistance is good, reliability is high top light emitting diode support and top light emitting diode component are provided.
The utility model is achieved through the following technical solutions: a kind of top light emitting diode support, it comprises the reflector of metallic support and this metallic support of parcel, this metallic support comprises the metal pins in this reflector cavity of embedding and is exposed at the metal pin outside this reflector, this metal pins comprises chip placement section, between the bottom in this chip placement section and reflector cavity, has a spacing.
Further, this metal pins is bent into chip placement section and the connecting portion of level, this chip placement section is positioned at the cavity of this reflector and has difference in height with the top of this metal pin, this connecting portion is connected with the top of this chip placement section and metal pin respectively, and this connecting portion is partly or entirely positioned at reflector cavity, and the upper surface of this connecting portion and this reflector inwall formation groove.
As preferred embodiment of the present utility model, this metal pins is bent into the chip placement section of pin portion, connecting portion and level, this chip placement section is higher than this pin portion, this connecting portion is connected with chip placement section with this pin portion respectively, this pin portion is connected with metal pin, and this connecting portion is partly or entirely positioned at reflector cavity, and this connecting portion upper surface and this reflector inwall formation groove.
As another embodiment of the present utility model, this metal pins is bent into the chip placement section of pin portion, connecting portion and level, this chip placement section is higher than this pin portion, this connecting portion is connected with chip placement section with this pin portion respectively, this pin portion is connected with metal pin, this connecting portion partly or entirely in reflector cavity and and the inwall of reflector between there is a gap; The inwall of this connecting portion, reflector and and its two between the bottom of reflector form groove.
Further, the spacing between the bottom in this chip placement section and reflector cavity is 1/10～1/5 of this reflector degree of depth.
The utility model also provides a kind of top light emitting diode component, it comprises a kind of top light emitting diode support, LED chip and epoxy resin, wherein, this top light emitting diode support comprises the reflector of metallic support and this metallic support of parcel, this metallic support comprises the metal pins in this reflector cavity of embedding and is exposed at the metal pin outside this reflector, this metal pins comprises chip placement section, between bottom in this chip placement section and reflector cavity, there is a spacing, this LED chip is arranged on metal pins, this wire connects electrode and this LED support of this LED chip, this epoxy resin filling covers this reflector inner chamber.
With respect to prior art, top light emitting diode support of the present utility model and top light emitting diode component by arranging a spacing to avoid its two laminating with reflector by metal pins in the cavity of reflector, can stop steam to infiltrate metal pins by reflector bottom affects the LED chip being arranged on metal pins, thereby reaches the useful life of the device that better waterproof effect and prolongation comprise this top light emitting diode support.
In order to understand more clearly the utility model, below with reference to accompanying drawing explanation, set forth embodiment of the present utility model.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of traditional top light emitting diode support of the present utility model;
Fig. 2 is the schematic diagram of a kind of top light emitting diode support of the utility model embodiment mono-;
Fig. 3 is the structural representation of a kind of top light emitting diode component of the utility model embodiment mono-;
Fig. 4 is the schematic diagram of a kind of top light emitting diode support of the utility model embodiment bis-;
Fig. 5 is the structural representation of a kind of top light emitting diode support variant embodiment one of the utility model embodiment bis-;
Fig. 6 is the structural representation of a kind of top light emitting diode support variant embodiment two of the utility model embodiment bis-;
Fig. 7 is the structural representation of a kind of top light emitting diode component of the utility model embodiment bis-.
Embodiment
For making object, technical scheme and the advantage of the utility model embodiment clearer, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, the every other embodiment that those of ordinary skills obtain under the prerequisite of not making creative work, belongs to the scope that the utility model is protected.
As shown in Figure 2, the utility model embodiment mono-provides a kind of top light emitting diode support structure 10, and its supporting structure is PLCC type, comprising: metallic support 1, and the reflector 2 that wraps up this metallic support 1.Wherein, metallic support 1 forms by embedding the metal pins 11 in reflector 2 and the metal pin 12 being exposed at outside reflector 2 outward; Metal pins 11 comprises that chip placement section is for carries chips, and metal pin 12 is for as electrode part.Further, this metal pins 11 is higher than the bottom 21 in the cavity of this reflector 2, this chip placement section is unsettled in the cavity of reflector, and the utility model embodiment is 1/10～1/5 of this reflector degree of depth to the spacing h between this chip placement section and the bottom 21 of reflector.
Wherein, metallic support 1 can be made by conductive metallic materials such as metallic copper or metallic aluminium or copper alloy or aluminium alloys.
Wherein, the material of reflector 2 is engineering resin, can adopt polyphtalamide resin (PPA), polymethyl methacrylate (PMMA), polyamide (PA), Merlon (PC), polyformaldehyde (POM), any one in polybutylene terephthalate (PBT) (PBT) and polyphenylene oxide (PPO), silica gel, epoxy resin, preferably polyphtalamide resin (PPA).
A kind of top light emitting diode support structure that the present embodiment provides, by by chip placement section in the cavity of reflector unsettled setting to avoid and reflector bottom laminating, can stop steam to infiltrate metal pins by reflector bottom affects the LED chip being arranged on metal pins, thereby reaches the useful life of the device that better waterproof effect and prolongation comprise this top light emitting diode support.
As shown in Figure 3, the present embodiment also provides a kind of top light emitting diode component 20, comprises top light emitting diode support 10, is arranged on LED chip 3 on the metal pins of this top light emitting diode support 10, connects LED chip electrode and the wire 4 of top light emitting diode support 10 and the packing colloid 5 of the whole reflector inner chamber of filling.
Wherein, this top light emitting diode support structure 10 comprises: metallic support 1, and the reflector 2 that wraps up this metallic support 1.Wherein, metallic support 1 forms by embedding the metal pins 11 in reflector 2 and the metal pin 12 being exposed at outside reflector 2 outward; Metal pins 11 comprises that chip placement section is for carries chips, and metal pin 12 is for as electrode part.Further, this metal pins 11 is higher than the bottom 21 in the cavity of this reflector 2, this chip placement section is unsettled in the cavity of reflector, and the utility model embodiment is 1/10～1/5 of this reflector degree of depth to the spacing h between this chip placement section and the bottom 21 of reflector.
As can be seen from Figure 3, packing colloid 5 has covered metal pins 11, LED chip 3 and wire 4.When this top light emitting diode component of encapsulation, owing to thering is a difference in height between this metal pins 11 and reflector bottom 21, between metal pins 11 and reflector bottom 21, by epoxy resin, be coated, because the binding ability of epoxy resin and metal pins is fine, can fully wrap up this metal pins and on LED chip, thereby can stop aqueous vapor along reflector bottom, to infiltrate the top light emitting diode component inside being placed on metal pins, strengthened the water resistance of the top light emitting diode component that includes this top light emitting diode support, improved the reliability of top light emitting diode component.
A kind of in ultraviolet light chip, blue chip, green glow chip or red light chips of the LED chip 3 being somebody's turn to do, is preferably gallium nitride base blue light chip.
The wire 4 being somebody's turn to do has good electric conductivity, conventionally by metal material, is made, and the present embodiment adopts gold thread; This packing colloid 5 is epoxy resin or silica gel, is preferably epoxy resin in the present embodiment, but is not limited to the utility model embodiment.
As shown in Figure 4, a kind of top light emitting diode support structure 30 that the present embodiment provides, comprising: metallic support 1, and the reflector 2 that wraps up this metallic support 1.Wherein, metallic support 1 forms by embedding the metal pins 11 in reflector 2 and the metal pin 12 being exposed at outside reflector 2 outward; Metal pins 11 is for carrying top light-emitting diode chip for backlight unit, and metal pin 12 is for as electrode part.These metal pins 11 bendings form three parts, are respectively the chip placement section 116 of pin portion 112, connecting portion 114 and the level of level.Between this chip placement section 116 and this pin portion 112, have a difference in height, and this chip placement section 116 is higher than this pin portion 112, the utility model embodiment is to this height extent unrestricted.This connecting portion 114 connects this chip placement section 116 and pin portions 112, and shape has angle respectively and between this chip placement section 116 and pin portion 112.Between the bottom 21 of the lower surface of this chip placement section 116 and reflector 2, there is a difference in height, the lower surface that is chip placement section 116 will be higher than the bottom of reflector 2, between the two, there is certain spacing h, make to there is certain space between the lower surface of chip placement section 116 and the bottom of reflector, in the present embodiment, this spacing h is 1/10～1/5 of this reflector degree of depth.In the present embodiment, this connecting portion 114 respectively with this chip placement section 116 and pin portion 112 between vertical connection, connecting portion 114 is not engaged with the inwall of reflector in the cavity of reflector 2, but and between the inwall of reflector 2, there is a distance, thereby between the inwall and connecting portion 114 of reflector 2, and a darker groove 6 is formed on the bottom of the reflector between the two.
Further, refer to Fig. 5, as a variant embodiment of the present utility model, this metal pins 11 can bending form two parts, is respectively the chip placement section 116 of connecting portion 114 and level.This chip placement section 116 is positioned at the cup of reflector 2, and is exposed at outward between the metal pin 12 outside reflector 2 and has a difference in height, and this chip placement section 116 is higher than the top of metal pin 12.This connecting portion 114 runs through the sidewall of this reflector 2, and to connect the top of this chip placement section 116 and metal pin 12, and shape has angle respectively and between this chip placement section 116 and metal pin 12.And these connecting portion 114 parts are positioned at the cup of reflector 2, and between the inwall of reflector 2, form a groove 6.
In addition, refer to Fig. 6, as another variant embodiment of the present utility model, this metal pins 11 can bending form three parts, is respectively the chip placement section 116 of pin portion 112, connecting portion 114 and the level of level.Between this chip placement section 116 and this pin portion 112, have a difference in height, and this chip placement section 116 is higher than this pin portion 112, the utility model embodiment is to this height extent unrestricted.This connecting portion 114 connects this chip placement section 116 and pin portions 112, and shape has angle respectively and between this chip placement section 116 and pin portion 112.This chip placement section 116 is positioned at the cup of this reflector, and the sidewall of this reflector 2 is run through in this connecting portion 114 and pin portion 112, the part of this connecting portion 114 in the cup of this reflector 2 and and the inwall of reflector 2 between form a groove 6.
A kind of top light emitting diode support structure that the present embodiment provides, because the lower surface of chip placement section 116 will be higher than the bottom of reflector 2, between the two, there is certain spacing h, make to there is certain space between the lower surface of chip placement section 116 and the bottom of reflector, be that chip placement section 116 is unsettled in reflector 2, so epoxy resin can wrap up chip placement section 116 from surrounding while adopting this support encapsulation top light emitting diode; Simultaneously; because the chip placement section binding ability of epoxy resin and metal material is fine; so can fully wrap up protection this metal pins and on LED chip; thereby can stop aqueous vapor along reflector bottom, to infiltrate the top light emitting diode component inside being placed on metal pins; strengthen the water resistance of the top light emitting diode component that includes this top light emitting diode support, improved the reliability of top light emitting diode component.Further, by chip placement section and metal pins plane, there is a difference in height, form ramp structure, steam is had to good barrier effect, can stop well steam to penetrate in reflector along metal pin, also strengthen the water resistance of top light emitting diode support.Further, upper surface at the inwall of reflector and the connecting portion of metal pins forms a groove structure, at wrapper, contain this top light emitting diode support structure top light emitting diode component time, in groove, fill the packing colloid as epoxy resin etc., due to the metal pins in cup and packing colloid excellent bonding performance, therefore can allow metal pins be combined better with packing colloid, to stop aqueous vapor, along metallic support 1, infiltrate the top light emitting diode component inside being placed on chip placement section 116, strengthened the water resistance of the top light emitting diode component that includes this top light emitting diode support, improved the reliability of top light emitting diode component.
As shown in Figure 7, the present embodiment also provides a kind of top light emitting diode component 40, it comprises top light emitting diode support 30, be arranged at least one LED chip 3 on the chip placement section 116 of this top light emitting diode support, connects LED chip electrode and the wire 4 of top light emitting diode support 30 and the packing colloid 5 of the whole reflector inner chamber of covering.
Wherein, this top light emitting diode support 30 comprises metallic support 1, and the reflector 2 that wraps up this metallic support 1.Wherein, metallic support 1 forms by embedding the metal pins 11 in reflector 2 and the metal pin 12 being exposed at outside reflector 2 outward; Metal pins 11 is for carrying top light-emitting diode chip for backlight unit, and metal pin 12 is for as electrode part.Metal pins 11 is for carrying top light-emitting diode chip for backlight unit, and metal pin 12 is for as electrode part.These metal pins 11 bendings form three parts, are respectively the chip placement section 116 of pin portion 112, connecting portion 114 and the level of level.Between this chip placement section 116 and this pin portion 112, have a difference in height, and this chip placement section 116 is higher than this pin portion 112, the utility model embodiment is to this height extent unrestricted.This connecting portion 114 connects this chip placement section 116 and pin portions 112, and shape has angle respectively and between this chip placement section 116 and pin portion 112.Between the bottom 21 of the lower surface of this chip placement section 116 and reflector 2, there is a difference in height, the lower surface that is chip placement section 116 will be higher than the bottom of reflector 2, between the two, there is certain spacing h, make to there is certain space between the lower surface of chip placement section 116 and the bottom of reflector, in the present embodiment, this spacing h is 1/10～1/5 of this reflector degree of depth.In the present embodiment, this connecting portion 114 respectively with this chip placement section 116 and pin portion 112 between vertical connection, connecting portion 114 is not engaged with the inwall of reflector in the cavity of reflector 2, but and between the inwall of reflector 2, there is a distance, thereby between the inwall and connecting portion 114 of reflector 2, and a darker groove 6 is formed on the bottom of the reflector between the two.
When wrapper contains the top light emitting diode component based on this top light emitting diode support structure, because the lower surface of chip placement section 116 will be higher than the bottom of reflector 2, between the two, there is certain spacing h, make to there is certain space between the lower surface of chip placement section 116 and the bottom of reflector, be that chip placement section 116 is unsettled in reflector 2, so epoxy resin can wrap up chip placement section 116 from surrounding while adopting this support encapsulation top light emitting diode; Simultaneously; because the chip placement section binding ability of epoxy resin and metal material is fine; so can fully wrap up protection this metal pins and on LED chip; thereby can stop aqueous vapor along reflector bottom, to infiltrate the top light emitting diode component inside being placed on metal pins; strengthen the water resistance of the top light emitting diode component that includes this top light emitting diode support, improved the reliability of top light emitting diode component.Further, by chip placement section and metal pins plane, there is a difference in height, form ramp structure, steam is had to good barrier effect, can stop well steam to penetrate in reflector along metal pin, also strengthen the water resistance of top light emitting diode support.And, upper surface at the inwall of reflector and the connecting portion of metal pins forms a groove structure, at wrapper, contain this top light emitting diode support structure top light emitting diode component time, in groove, fill the packing colloid as epoxy resin etc., groove can make the chip placement section 116 of metal pins 11 can fill more fully and be coated by packed colloid around, due to the metal pins in cup and packing colloid excellent bonding performance, therefore can allow metal pins be combined better with packing colloid, to stop aqueous vapor, along metallic support 1, infiltrate the top light emitting diode component inside being placed on chip placement section 116, strengthened the water resistance of the top light emitting diode component that includes this top light emitting diode support, improved the reliability of top light emitting diode component.
The utility model is not limited to above-mentioned execution mode, if various changes of the present utility model or distortion are not departed to spirit and scope of the present utility model, within if these changes and distortion belong to claim of the present utility model and equivalent technologies scope, the utility model is also intended to comprise these changes and distortion.
Claims (10)
1. a top light emitting diode support, it is characterized in that: the reflector that comprises metallic support and this metallic support of parcel, this metallic support comprises the metal pins in this reflector cavity of embedding and is exposed at the metal pin outside this reflector, this metal pins comprises chip placement section, between the bottom in this chip placement section and reflector cavity, has a spacing.
2. a kind of top light emitting diode support according to claim 1, it is characterized in that: this metal pins is bent into chip placement section and the connecting portion of level, this chip placement section is positioned at the cavity of this reflector and has difference in height with the top of this metal pin, this connecting portion is connected with the top of this chip placement section and metal pin respectively, and this connecting portion is partly or entirely positioned at reflector cavity, and the upper surface of this connecting portion and this reflector inwall formation groove.
3. a kind of top light emitting diode support according to claim 1, it is characterized in that: this metal pins is bent into the chip placement section of pin portion, connecting portion and level, this chip placement section is higher than this pin portion, this connecting portion is connected with chip placement section with this pin portion respectively, this pin portion is connected with metal pin, and this connecting portion is partly or entirely positioned at reflector cavity, and this connecting portion upper surface and this reflector inwall formation groove.
4. a kind of top light emitting diode support according to claim 1, it is characterized in that: this metal pins is bent into the chip placement section of pin portion, connecting portion and level, this chip placement section is higher than this pin portion, this connecting portion is connected with chip placement section with this pin portion respectively, this pin portion is connected with metal pin, this connecting portion partly or entirely in reflector cavity and and the inwall of reflector between there is a gap; The inwall of this connecting portion, reflector and and its two between the bottom of reflector form groove.
5. according to a kind of top light emitting diode support described in any one claim in claim 1 to 4, it is characterized in that: the spacing between the bottom in this chip placement section and reflector cavity for this reflector degree of depth 1/10～1/5.
6. a top light emitting diode component, it is characterized in that: comprise a kind of top light emitting diode support, LED chip and epoxy resin, wherein, this top light emitting diode support comprises the reflector of metallic support and this metallic support of parcel, this metallic support comprises the metal pins in this reflector cavity of embedding and is exposed at the metal pin outside this reflector, this metal pins comprises chip placement section, between bottom in this chip placement section and reflector cavity, there is a spacing, this LED chip is arranged on metal pins, the electrode of this LED chip is connected by wire with this LED support, this epoxy resin filling covers this reflector inner chamber.
7. a kind of top light emitting diode component according to claim 6, it is characterized in that: this metal pins is bent into chip placement section and the connecting portion of level, this chip placement section is positioned at the cavity of this reflector and has difference in height with the top of this metal pin, this connecting portion is connected with the top of this chip placement section and metal pin respectively, and this connecting portion is partly or entirely positioned at reflector cavity, and the upper surface of this connecting portion and this reflector inwall formation groove.
8. a kind of top light emitting diode component according to claim 6, it is characterized in that: this metal pins is bent into the chip placement section of pin portion, connecting portion and level, this chip placement section is higher than this pin portion, this connecting portion is connected with chip placement section with this pin portion respectively, this pin portion is connected with metal pin, and this connecting portion is partly or entirely positioned at reflector cavity, and the upper surface of this connecting portion and this reflector inwall formation groove.
9. a kind of top light emitting diode component according to claim 6, it is characterized in that: this metal pins is bent into the chip placement section of pin portion, connecting portion and level, this chip placement section is higher than this pin portion, this connecting portion is connected with chip placement section with this pin portion respectively, this pin portion is connected with metal pin, this connecting portion partly or entirely in reflector cavity and and the inwall of reflector between there is a gap; The inwall of this connecting portion, reflector and and its two between the bottom of reflector form groove.
10. according to a kind of top light emitting diode component described in arbitrary claim in claim 6 to 9, it is characterized in that: the spacing between the bottom in this chip placement section and reflector cavity for this reflector degree of depth 1/10～1/5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320434249.4U CN203536465U (en) | 2013-07-19 | 2013-07-19 | Top emission type LED bracket and top emission type LED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320434249.4U CN203536465U (en) | 2013-07-19 | 2013-07-19 | Top emission type LED bracket and top emission type LED device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203536465U true CN203536465U (en) | 2014-04-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320434249.4U Expired - Lifetime CN203536465U (en) | 2013-07-19 | 2013-07-19 | Top emission type LED bracket and top emission type LED device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203536465U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108447961A (en) * | 2018-04-17 | 2018-08-24 | 深圳成光兴光电技术股份有限公司 | A kind of paster type light emitting type and electronic equipment |
-
2013
- 2013-07-19 CN CN201320434249.4U patent/CN203536465U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108447961A (en) * | 2018-04-17 | 2018-08-24 | 深圳成光兴光电技术股份有限公司 | A kind of paster type light emitting type and electronic equipment |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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Granted publication date: 20140409 |
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| CX01 | Expiry of patent term |