CN205316056U - LED lamp pearl with waterproof function - Google Patents
LED lamp pearl with waterproof function Download PDFInfo
- Publication number
- CN205316056U CN205316056U CN201521062348.XU CN201521062348U CN205316056U CN 205316056 U CN205316056 U CN 205316056U CN 201521062348 U CN201521062348 U CN 201521062348U CN 205316056 U CN205316056 U CN 205316056U
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- Prior art keywords
- pin
- tank
- led lamp
- lamp bead
- pit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model discloses a LED lamp pearl with waterproof function, including encapsulation cup, LED chip and pin, the encapsulation cup has upper surface, lateral wall and lower surface, and the upper surface of encapsulation cup is equipped with the pit of undercut, and the pin is established in the encapsulation cup including the first pin and the second pin that set up in opposite directions, pin, pit downwardly extending to the front of first pin group and second pin group. The LED chip is established and is connected in the bottom of pit and with the pin electricity, and it has the encapsulation to glue to fill in the pit. The pin is equipped with first capillary groove, and first capillary groove sets up along the both sides edge of pin. Implement the technical scheme of the utility model, the first capillary groove of the pin of LED lamp pearl can obstruct inside water gets into the encapsulation cup effectively, has strengthened the waterproof performance of LED lamp pearl.
Description
Technical field
The utility model relates to integrated circuit (IC)-components field, especially relates to a kind of LED lamp bead with water-proof function.
Background technology
The pin of LED lamp bead, for realizing the electrical connection of LED lamp bead internal electrical road leading-out end and outer lead, serves and the function served as bridge that outer lead connects.
But the water resistance of LED lamp bead is poor usually, it is external that the packaged pin in LED lamp bead stretches out encapsulation cup, if LED lamp bead meets water accidentally, water then may enter in encapsulation structure along lead-in wire, affect the performance of LED, cause the luminous problem such as abnormal of LED chip.
Moreover, the encapsulation cup body of LED lamp bead is combined with pin. But the surface of lead frame normally flat smooth, packaged material is not easy to be attached on pin, so the combination of encapsulation cup body and pin is firm not. Encapsulation cup body is separated with pin, and the destruction of still LED lamp bead structure, also can not affect the water resistance of LED lamp bead, make moisture easily enter LED lamp bead inside.
Practical novel content
Firm not for the water resistance difference of above-mentioned defect LED lamp bead of the prior art and the combination of encapsulation cup body and pin, the technical problems to be solved in the utility model is, how to improve the water resistance of LED lamp bead, and how to improve the bonding strength of encapsulation cup body and pin. The utility model solves this technical problem the technical scheme adopted: provide a kind of LED lamp bead with water-proof function, comprise encapsulation cup body, LED chip and pin, encapsulation cup body has upper surface, sidewall and lower surface, the upper surface of encapsulation cup body is provided with the pit of concave downward, pin comprises the first pin arranged in opposite directions and the 2nd pin, pin is located in encapsulation cup body, and pit extends downward the first pin set and the front of the 2nd pin set. LED chip is located at the bottom of pit and is electrically connected with pin, is filled with packaging plastic in pit. Pin is provided with the first anti-tank, and the first anti-tank is arranged along the both sides of the edge of pin.
Preferably, the first anti-tank is curved and the opening of arc towards the front end of pin.
Preferably, in opposite directions, and the first anti-tank on the first pin and the first anti-tank on the 2nd pin surround the bottom of pit to the arc opening of the arc opening of the anti-tank of first on the first pin and the first anti-tank on the 2nd pin.
Preferably, the material encapsulating cup body is filled in the first anti-tank.
Preferably, pin is provided with the 2nd anti-tank, and the 2nd waterproof slot is in the outside of the bottom of pit and is parallel to the width of pin.
Preferably, at least part of edge of pin is step-like.
Preferably, pin is provided with the anti-tank in edge, and the anti-tank in edge arranges along the edge of pin and is located on the short step at edge.
Preferably, the first pin and/or the 2nd pin are provided with solid material hole, admittedly material hole is located at the outside of the bottom of pit, the material of encapsulation cup body is filled in solid material hole.
Preferably, admittedly material hole is ladder hole.
Preferably, along admittedly expecting that the peritreme in hole is provided with the anti-tank in solid material hole, admittedly the anti-tank in material hole is located on the short step in solid material hole.
Implement the technical solution of the utility model, at least there is following useful effect: it is inner that the anti-tank of the first of the pin of LED lamp bead can hinder water to enter encapsulation cup body effectively, enhances the water resistance of LED lamp bead.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail, in accompanying drawing:
Fig. 1-2 is the schematic perspective view of the LED lamp bead with water-proof function in a preferred embodiment of the present utility model.
Fig. 3 is the schematic top plan view of the LED lamp bead in Fig. 1.
Fig. 4 is the cross-sectional schematic of A-A position in Fig. 3.
Fig. 5 is the cross-sectional schematic of B-B position in Fig. 3.
Fig. 6-7 is the schematic perspective view of the pin in the LED lamp bead in Fig. 1.
Fig. 8 is the schematic top plan view of the pin in Fig. 6.
Fig. 9 be the pin in Fig. 6 look up use figure.
Figure 10 is the cross-sectional schematic of C-C position in Fig. 8.
Figure 11 is the cross-sectional schematic of D-D position in Fig. 8.
Figure 12 is the schematic top plan view of the LED lamp bead with water-proof function in another preferred embodiment of the present utility model.
Figure 13 is the cross-sectional schematic of E-E position in Figure 12.
Figure 14 is the cross-sectional schematic of F-F position in Figure 12.
Figure 15-16 is the schematic perspective view of the pin in the LED lamp bead in Figure 12.
Figure 17 is the schematic top plan view of the pin in Figure 15.
Figure 18 is the elevational schematic view of the pin in Figure 15.
Figure 19 is the cross-sectional schematic of G-G position in Figure 17.
Figure 20 is the cross-sectional schematic of H-H position in Figure 17.
Wherein, 1. the first pin, 2. the 2nd pin, 3. encapsulate cup body, 31. packaging plastics, 4.LED chip, 61. first anti-tanks, 62. the 2nd anti-tanks, and the 63. anti-tanks in edge, 5. expect hole admittedly, and 64. expect the anti-tank in hole admittedly.
Embodiment
In order to technology feature of the present utility model, object and effect are had understanding clearly, now compare accompanying drawing and embodiment of the present utility model is described in detail. In the description of the LED lamp bead with water-proof function of the present utility model, it will be appreciated that, "front", "rear", " on ", D score, " front ", the term such as " back side " be only the technical solution of the utility model for convenience of description, instead of the device referred to or element must have specific orientation, therefore can not be interpreted as restriction of the present utility model.
As shown in Fig. 1-2 0, a kind of LED lamp bead with water-proof function in a preferred implementation of the present utility model, comprise encapsulation cup body 3, LED chip 4 and pin, encapsulation cup body 3 has upper surface, sidewall and lower surface, the upper surface of encapsulation cup body 3 is provided with the pit of concave downward, and encapsulation cup body 3 defines the essential shape of LED lamp bead.Pin comprises the first pin 1 and the 2nd pin 2 that arrange in opposite directions, and pin is located in encapsulation cup body 3, and pit extends downward the first pin 1 group and the front of the 2nd pin 2 groups, the LED chip 4 that pin encapsulates in cup body 3 for being electrically connected and external circuit. LED chip 4 is located at the bottom of pit and is electrically connected with pin, is filled with packaging plastic 31 in pit, and LED chip 4 is for being converted into luminous energy, luminescence electric energy.
The one side towards pit opening of pin is front, and contrary one side is the back side. One end that pin is located in encapsulation cup body 3 is front end, and the other end is rear end. Pin just facing to the opening of pit, namely towards upper.
Encapsulation cup body 3 can be in rectangular parallelepiped, has four sidewalls. Preferably, the pit of encapsulation cup body 3 upper surface is cup-shaped, and namely the openings of sizes of pit reduces from top to bottom gradually, and namely the sidewall of pit is not orthogonal to the upper surface of encapsulation cup body 3, to reflect the light sent by LED chip 4 to the direction of pit opening. The opening of pit can be rectangular, but this is not limited by the utility model, and the opening of pit can also rounded, oval, Polygons or other shape. Encapsulation cup body 3 can be plastics, forms encapsulation cup body 3 by being injection-moulded on the pin framework of just one-step forming, but it will be appreciated that encapsulation cup body 3 can also be other material as required, this is prior art, is not repeating at this.
Packaging plastic 31 is transparent solid, it is preferable to epoxy resin. Packaging plastic 31 is for the protection of the circuit in LED chip 4 and pit, and hinders moisture to enter; And lens or diffusion lens function can be played according to the material character of packaging plastic 31 and the shape of formation thereof, the angle of divergence of control light. The outside surface of the shape that packaging plastic 31 is formed can be parallel with the upper surface of encapsulation cup body 3, but will be understood that, this is not limited by the utility model, the such as upper surface of the shape that packaging plastic 31 is formed can also be sphere, the upper surface protruding encapsulation cup body 3, when the sphere that the upper surface shape of packaging plastic 31 is plane or projection, the irradiating angle of LED lamp bead is bigger; Such as the upper surface of the shape that packaging plastic 31 is formed can also be pointed again, then the light that LED lamp bead sends is comparatively concentrated.
Pin is provided with the first anti-tank 61, and this first anti-tank 61 is arranged along the both sides of the edge of pin, and the first anti-tank 61 is inner for hindering water to enter encapsulation cup body 3. Specifically, the first anti-tank 61 can the curved and opening of arc towards the front end of pin. The arc opening of the arc opening of the anti-tank 61 of first on the first pin 1 and the first anti-tank 61 on the 2nd pin 2 is in opposite directions, and the anti-tank of first on the first pin 1 61 surrounds the bottom of pit with the first anti-tank 61 on the 2nd pin 2, namely it is that the anti-tank of first on the first pin 1 61 forms the ring of encirclement with the first anti-tank 61 on the 2nd pin 2, surrounds the bottom of pit. The anti-tank of on the first pin 1 first 61 and the first anti-tank 61 on the 2nd pin 2 formed shape preferably with the mating shapes of pit bottom. In addition, the material of encapsulation cup body 3 can be filled in the first anti-tank 61 the first pin 1 first anti-tank 61 of anti-tank 61 the 2nd pin 2 first, to improve enhancing water resistance further. First anti-tank 61 can be located at front and/or the back side of pin, but the front of pin is provided preferably with the first anti-tank 61, because LED chip 4 is the front being located at pin, so the water resistance in pin front is especially important.
Pin can be provided with the 2nd anti-anti-tank 62 of tank the 62, two and be positioned at the outside of bottom of pit and be parallel to the width of pin, and the 2nd anti-tank 62 is also inner for hindering water to enter encapsulation cup body 3. Specifically, the two ends the first pin 1 and the 2nd pin 2 being all provided with the 2nd anti-anti-tank 62 of tank the 62, two extend to the both sides of the edge of pin; The quantity of the anti-tank 62 of the 2nd on each pin does not limit, and it can be spaced one or more 2nd anti-tank 62 along pin length direction. 2nd anti-tank 62 and the first anti-tank 61 are equivalent to twice defence line, hinder entering of water. In addition, the material of encapsulation cup body 3 can be filled in the 2nd anti-tank 62, to strengthen water resistance further. 2nd anti-tank 62 can be located at front and/or the back side of pin, but the front of pin is provided preferably with the 2nd anti-tank 62, because LED chip 4 is the front being located at pin, so the water resistance in pin front is especially important. In the present embodiment, the first anti-tank 61 is located at the outside of the bottom of pit, and the 2nd anti-tank 62 is located at the outside of the ring of encirclement of the first anti-tank 61.
At least part of edge of pin can in step-like. The material of encapsulation cup body 3 fits on stepped edge, and step-like edge contributes to encapsulation structure to be combined more firm with pin. In the present embodiment, the edge of the first pin 1 and the 2nd pin 2 is all step-like, and the ascent direction of the step of pin edge is by the front of pin rearwardly, and this step is two-stage step.
Pin can be provided with the anti-tank 63 in edge, encapsulates in cup body 3 between water pin edge and the material encapsulating cup body 3 for hindering. The anti-tank in edge 63 arranges along the edge of pin and is located on the short step of pin edge, is namely that one-level step being positioned at top that the anti-tank 63 in this edge is located at the back side of pin and is located in two-stage step in the present embodiment. In addition, the material of encapsulation cup body 3 can be filled in the anti-tank 63 in edge, to strengthen water resistance further.
First pin 1 and/or the 2nd pin 2 the 2nd pin 2 first pin 1 the 2nd pin 2 can be provided with solid material hole 5, admittedly material hole 5 is located at the outside of the bottom of pit, admittedly material hole 5 is through hole, the material of encapsulation cup body 3 is filled in solid material hole 5. In the present embodiment, the 2nd pin 2 is longer than the first pin the 1, two pin 2 and is provided with solid material hole 5. Specifically, admittedly the quantity in material hole 5 can be one, admittedly material hole 5 is long shape and is perpendicular to the length direction of the 2nd pin 2. Such as, admittedly but the quantity in material hole 5 is not limited thereto, its quantity can be four, admittedly expect that hole 5 can along being perpendicular to ground, pin length direction lineal layout for four. Admittedly the shape in material hole 5 is also defined as above-mentioned long shape, it is possible to think circle, ellipse, rectangle or irregular shape etc.
Preferably, admittedly material hole 5 is ladder hole, its ladder is preferably two-stage ladder, and the ascent direction of ladder is by the front of pin rearwardly. The material of encapsulation cup body 3 fits on the stepped edge in solid material hole 5, admittedly the step-like edge in material hole 5 contributes to encapsulation structure to be combined more firm with pin.
Along admittedly expecting that the peritreme in hole 5 can be provided with the anti-tank 64 in solid material hole, encapsulate in cup body 3 between water pin edge and the material encapsulating cup body 3 for hindering. Admittedly material hole anti-tank 64 is located on the short step in solid material hole 5, namely it is that this expects that one-level step being positioned at top that the anti-tank in hole 64 is located at the back side of pin and is located in the two-stage step in solid material hole 5 admittedly in the present embodiment.In addition, the material of encapsulation cup body 3 can be filled in the anti-tank 63 in edge, to strengthen water resistance further.
In sum, it is inner that the anti-tank 61 of the first of the pin of LED lamp bead of the present utility model can hinder water to enter encapsulation cup body 3 effectively, enhances the water resistance of LED lamp bead. Further, the 2nd anti-tank 62, the anti-tank in edge 63 and admittedly expect that hole anti-tank 64 further enhancing the water resistance of LED lamp bead. In addition, the material of encapsulation cup body 3 can be filled in the solid material hole 5 of pin of LED lamp bead, enhances the sticking power of encapsulation cup body 3 on pin, enhances the bonding strength of pin with encapsulation cup body 3. And the edge of the pin of LED lamp bead is stepped, admittedly material hole 5 is ladder hole, further enhancing the bonding strength of pin with encapsulation cup body 3.
These are only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various change, combination and change. All within spirit of the present utility model and principle, any amendment of doing, equivalent replacement, improvement etc., all should be included within right of the present utility model.
Claims (10)
1. one kind has the LED lamp bead of water-proof function, comprise encapsulation cup body (3), LED chip (4) and pin, described encapsulation cup body (3) has upper surface, sidewall and lower surface, the upper surface of described encapsulation cup body (3) is provided with the pit of concave downward, it is characterized in that, described pin comprises the first pin (1) arranged in opposite directions and the 2nd pin (2), described pin is located in encapsulation cup body (3), and described pit extends downward the front that described first pin (1) group is organized with the 2nd pin (2);
Described LED chip (4) is located at the bottom of described pit and is electrically connected with described pin, is filled with packaging plastic (31) in described pit;
Described pin is provided with the first anti-tank (61), and described first anti-tank (61) is arranged along the both sides of the edge of described pin.
2. the LED lamp bead with water-proof function according to claim 1, it is characterised in that, described first anti-tank (61) is curved and the opening of arc towards the front end of described pin.
3. the LED lamp bead with water-proof function according to claim 1, it is characterized in that, in opposite directions, and described first anti-tank (61) on described first pin (1) and the described first anti-tank (61) on described 2nd pin (2) surround the bottom of described pit to the arc opening of the arc opening of the described first anti-tank (61) on described first pin (1) and the described first anti-tank (61) on described 2nd pin (2).
4. the LED lamp bead with water-proof function according to claim 1, it is characterised in that, the material of described encapsulation cup body (3) is filled in described first anti-tank (61).
5. the LED lamp bead with water-proof function according to claim 1, it is characterized in that, described pin is provided with the 2nd anti-tank (62), and described 2nd anti-tank (62) is positioned at the outside of the bottom of described pit and is parallel to the width of described pin.
6. the LED lamp bead with water-proof function according to claim 1, it is characterised in that, at least part of edge of described pin is step-like.
7. the LED lamp bead with water-proof function according to claim 6, it is characterized in that, described pin is provided with the anti-tank in edge (63), and the anti-tank in described edge (63) arranges along the edge of described pin and is located on the short step at edge.
8. the LED lamp bead with water-proof function according to claim 1, it is characterized in that, first pin (1) and/or the 2nd pin (2) are provided with solid material hole (5), described admittedly expecting the outside that hole (5) is located at the bottom of described pit, the material of described encapsulation cup body (3) is filled into described expects in hole (5) admittedly.
9. the LED lamp bead with water-proof function according to claim 8, it is characterised in that, described admittedly expect that hole (5) is for ladder hole.
10. the LED lamp bead with water-proof function according to claim 9, it is characterized in that, admittedly expecting that the peritreme in hole (5) is provided with the anti-tank in solid material hole (64) along described, the described material anti-tank in hole (64) admittedly is located on the described short step admittedly expecting hole (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521062348.XU CN205316056U (en) | 2015-12-17 | 2015-12-17 | LED lamp pearl with waterproof function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521062348.XU CN205316056U (en) | 2015-12-17 | 2015-12-17 | LED lamp pearl with waterproof function |
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| Publication Number | Publication Date |
|---|---|
| CN205316056U true CN205316056U (en) | 2016-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521062348.XU Active CN205316056U (en) | 2015-12-17 | 2015-12-17 | LED lamp pearl with waterproof function |
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| CN (1) | CN205316056U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110277478A (en) * | 2019-06-28 | 2019-09-24 | 旭宇光电（深圳）股份有限公司 | LED device and light emitting device |
-
2015
- 2015-12-17 CN CN201521062348.XU patent/CN205316056U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110277478A (en) * | 2019-06-28 | 2019-09-24 | 旭宇光电（深圳）股份有限公司 | LED device and light emitting device |
| WO2020211874A1 (en) * | 2019-06-28 | 2020-10-22 | 旭宇光电（深圳）股份有限公司 | Light-emitting diode device and light-emitting apparatus |
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