CN205319189U - Improve LED lead frame of firm degree of packaging structure - Google Patents
Improve LED lead frame of firm degree of packaging structure Download PDFInfo
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- CN205319189U CN205319189U CN201521061213.1U CN201521061213U CN205319189U CN 205319189 U CN205319189 U CN 205319189U CN 201521061213 U CN201521061213 U CN 201521061213U CN 205319189 U CN205319189 U CN 205319189U
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Abstract
The utility model discloses an improve LED lead frame of firm degree of packaging structure, include at least one the lead frame unit on the lead frame sheet material, each lead frame unit includes first pin group and second pin group, and first pin group sets up with the front end of second pin including at least one microscler second pin, the front end of first pin including at least one microscler first pin, second pin group in opposite directions. The front end of first pin group and the protruding cup structure of front end component of second pin group, protruding cup structure is protruding towards the positive orientation of lead frame sheet material, and the surface and/or the internal surface of the bottom of cup of protruding glass of structure are equipped with sunken first dot matrix. Implement the technical scheme of the utility model, LED lamp body and packaging structure can be more firmly attached to on the LED lead frames, furtherly, and the capillary groove of LED lead frame has improved LED's waterproof performance.
Description
Technical field
This utility model relates to IC-components field, especially relates to a kind of LED lead frame improving encapsulating structure firmness.
Background technology
Lead frame is as the chip carrier of integrated circuit, it it is a kind of electrical connection realizing chip internal circuits exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), forming the structural member of electric loop, it serves the function served as bridge connected with outer lead. LED lead frame is then the electrical connection realizing LED lamp bead internal circuit exit with outer lead.
For having the LED lead frame of convex cup structure, convex cup structure is the region of encapsulation LED illuminator, and LED lamp and encapsulating structure to be rigidly attached on lead frame. But the surface of lead frame is usually flat smooth, it is unfavorable for attachment.
It addition, the water resistance of LED is poor, the packaged lead-in wire in LED stretches out outside encapsulating structure, if LED meets water accidentally, water is then likely to enter in encapsulating structure along lead-in wire, affects the performance of LED.
Utility model content
Firm not for drawbacks described above LED lamp of the prior art and encapsulating structure attachment on the lead frames, the technical problems to be solved in the utility model is in that, how to make LED lamp and encapsulating structure be more firmly attached on lead frame.
This utility model solves its technical problem and be the technical scheme is that a kind of LED lead frame improving encapsulating structure firmness of structure, including at least one the lead frame unit on lead frame plate, each lead frame unit includes the first pin set and the second pin set, first pin set includes the first pin that at least one is elongated, second pin set includes the front end of the second pin that at least one is elongated, the front end of the first pin and the second pin and is oppositely arranged. First pin is intervally arranged along the width of himself, and the second pin is intervally arranged along the width of himself. The front end of the front end of the first pin set and the second pin set constitutes convex cup structure, and convex cup structure is protruding towards the frontal of lead frame plate, and outer surface at the bottom of the cup of convex cup structure and/or inner surface are provided with the first dot matrix of depression.
Preferably, the forward part of the first pin set is raised to front bending, constitute a part for convex cup, and the forward part of the second pin set is raised to front bending, constitute another part of convex cup.
Preferably, rectangular at the bottom of the cup of convex cup structure, the first dot matrix is also rectangular.
Preferably, the outer surface of the sidewall of convex cup structure and/or inner surface are provided with the second dot matrix of depression.
Preferably, the first pin and the second pin one_to_one corresponding are oppositely arranged.
Preferably, the first pin set includes three the first pins, and the second pin set includes three the second pins.
Preferably, the front end of the first pin is oppositely arranged with the front end one_to_one corresponding of the second pin.
Preferably, pin is provided with first and admittedly expects hole, first admittedly material hole be located at the bottom of the cup of convex cup structure and arrange along the edge at the bottom of cup.
Preferably, pin is provided with second and admittedly expects hole, and second expects that hole is located on the sidewall of convex cup structure admittedly.
Further, the water resistance for drawbacks described above LED of the prior art is poor, and the technical problems to be solved in the utility model is in that, how to improve the water resistance of LED.
This utility model solves this technical problem the technical scheme is that above-mentioned the provided LED lead frame improving encapsulating structure firmness and also has following characteristics.
Outer surface and/or the inner surface of the sidewall of convex cup structure are provided with capillary groove, capillary groove includes the first capillary groove being located in the first pin set and the second capillary groove being located in the second pin set, first capillary groove is not parallel to the length direction of the first pin, and the second capillary groove is not parallel to the length direction of the second pin.
Implementing the technical solution of the utility model, at least have following beneficial effect: LED lamp and encapsulating structure can be more firmly attached in LED lead frame, further, the capillary groove of LED lead frame improves the water resistance of LED.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail, in accompanying drawing:
Fig. 1 is the schematic top plan view of a lead frame unit of the LED lead frame improving encapsulating structure firmness in a preferred implementation of the present utility model.
Fig. 2 is the cross-sectional schematic of A-A position in Fig. 1.
Fig. 3 is the close-up schematic view at P position in Fig. 2.
Fig. 4 is the schematic top plan view of a lead frame unit of the LED lead frame improving encapsulating structure firmness in another preferred implementation of the present utility model.
Fig. 5 is the cross-sectional schematic of B-B position in Fig. 3.
Fig. 6 is the close-up schematic view at Q position in Fig. 5.
Fig. 7 is the schematic top plan view of the LED lead frame improving encapsulating structure firmness in a preferred implementation of the present utility model.
Wherein, 1. the first pin set, 100. first pin, 2. the second pin set, 200. second pins, 31. first dot matrix, 32. second dot matrix, 41. first expect hole admittedly, and 42. second expect hole admittedly, 51. first capillary grooves, 52. second capillary grooves.
Detailed description of the invention
In order to technical characteristic of the present utility model, purpose and effect are more clearly understood from, now comparison accompanying drawing describes detailed description of the invention of the present utility model in detail. In the description of LED lead frame of the present utility model, it will be appreciated that, "front", "rear", " on ", the term such as D score be for only for ease of description this utility model, rather than the instruction device of indication or element must have specific orientation, therefore it is not intended that to restriction of the present utility model.
As shown in Fig. 1,2,3,7, the LED lead frame improving encapsulating structure firmness in one preferred implementation of this utility model, including forming at least one the lead frame unit on lead frame plate, each lead frame unit includes the first pin set and the second pin set, first pin set includes the first pin that at least one is elongated, second pin set includes the front end of the second pin that at least one is elongated, the front end of the first pin and the second pin and is oppositely arranged.Wherein, Fig. 1,2 show a lead frame unit in the LED lead frame shown in Fig. 7.
First pin is intervally arranged along the width of himself, namely is intervally arranged along the width defence line of lead frame unit; Second pin is intervally arranged along the width of himself, namely is intervally arranged along the width defence line of lead frame unit. First pin can be parallel to each other, and the second pin can also be parallel to each other. Wherein, the first pin and the second pin are referred to as pin.
The front end of the front end of the first pin set and the second pin set constitutes convex cup structure, and convex cup structure is protruding towards the frontal of lead frame plate, and outer surface at the bottom of the cup of convex cup structure and/or inner surface are provided with the first dot matrix of depression. Wherein, the forward direction of the first pin set namely the forward direction of the first pin, the forward direction of the second pin set namely the forward direction of the second pin. Specifically, the forward part of the first pin set bends raised, to constitute a convex cup structure part to the frontal of lead frame plate, the forward part of the second pin set bends raised, to constitute convex cup structure another part to the frontal of lead frame plate, thus constituting complete convex cup structure.
The quantity of the first pin and the second pin does not limit, and further, the first pin and the second pin can be that one_to_one corresponding is oppositely arranged, namely the quantity of the first pin is identical with the quantity of the second pin. Additionally, the passable pin number of lead frame unit can be six, then the first pin set can include three the first pins, and the second pin set can include three the second pins. And the first pin and the second pin can be parallel to each other.
Preferably, the spacing being smaller than rear end of the front end of adjacent two the first pins, the spacing being smaller than rear end of the front end of adjacent two the second pins, the spacing between the rear end being smaller than adjacent two the first pins between the first pin set with the second pin set less than the spacing between the rear end of adjacent two the second pins. Namely the spacing being smaller than both rear ends constituting part at the bottom of convex cup structure cup of adjacent two pins. Owing to convex cup structure is the region of encapsulation LED illuminator, so so can make to be of compact construction at the bottom of the cup of convex cup structure and to have bigger surface area available, be conducive to the encapsulation of LED illuminator.
Can being rectangle at the bottom of the cup of convex cup structure, the first dot matrix be also rectangular and at the bottom of cloth brimmer. But it is not limited to rectangle at the bottom of cup, it is also possible to be circular, oval or trapezoidal etc.; And the shape of the first dot matrix is also not limited to rectangle, but it is preferably shape corresponding with cup Bottom Shape. Wherein, the shape of the point of the depression in the first dot matrix is also not limited, it is possible to be rectangle, circular, oval or irregularly shaped etc. First dot matrix is more firmly attached to lead frame for making LED lamp and encapsulating structure. Preferably, first dot matrix is located at the inner surface at the bottom of the cup of convex cup structure, because the contact area of inner surface is bigger at the bottom of LED encapsulation structure and cup, and outer surface at the bottom of cup there is provision of LED lamp, so the first dot matrix is located at the inner surface at the bottom of the cup of convex cup structure and can effectively strengthen encapsulating material adhesive force in LED lead frame, can not interfere with again the setting of LED lamp. When encapsulating LED illuminator, encapsulating material can be filled in the first dot matrix of depression, enhances encapsulating material adhesive force on the lead frames, so that LED lamp and encapsulating structure are more firmly attached in LED lead frame.
Preferably, the outer surface of the sidewall of convex cup structure and/or inner surface are provided with the second dot matrix of depression. Wherein, the shape of the point of the depression in the second dot matrix is also not limited, it is possible to be rectangle, circular, oval or irregularly shaped etc. Second dot matrix is more firmly attached to lead frame for making LED lamp and encapsulating structure. When encapsulating LED illuminator, encapsulating material can be filled in the second dot matrix of depression, enhances encapsulating material adhesive force on the lead frames, so that LED lamp and encapsulating structure are more firmly attached in LED lead frame.
Further, above-mentioned the provided LED lead frame improving encapsulating structure firmness can also have following characteristics.
Be provided with first at the bottom of the cup of convex cup structure and admittedly expect hole, first admittedly material hole be located at the bottom of the cup of convex cup structure and arrange along the edge at the bottom of cup. First admittedly to expect that the quantity in hole is not limited fixed, as long as the cup feather edge along convex cup structure is arranged, for instance its quantity can be four, four first admittedly expect the rectangular distribution in hole and be respectively provided at glass at the bottom of four corners on. First expects that the shape in hole is also not limited admittedly, it is possible to for circular, oval, rectangle or irregularly shaped etc. When encapsulating LED illuminator, encapsulating material can be filled into first and admittedly expect in hole, enhances encapsulating material adhesive force on the lead frames, so that LED lamp and encapsulating structure are more firmly attached in LED lead frame.
Preferably, the sidewall of convex cup structure is provided with second and admittedly expects hole, and second expects that the quantity in hole is not limited admittedly determines, it is possible to be respectively equipped with one second on each first pin and each second pin admittedly to expect hole. Second expects that the shape in hole is also not limited admittedly, it is possible to for oval, circular, rectangle or irregularly shaped etc. When encapsulating LED illuminator, encapsulating material can be filled into second and admittedly expect in hole, enhances encapsulating material adhesive force on the lead frames, so that LED lamp and encapsulating structure are more firmly attached in LED lead frame.
Yet further, as Figure 4-Figure 6, above-mentioned the provided LED lead frame improving encapsulating structure firmness can also have following characteristics to utility model.
Outer surface and/or the inner surface of the sidewall of convex cup structure are provided with capillary groove, capillary groove includes the first capillary groove being located in the first pin set and the second capillary groove being located in the second pin set, first capillary groove is not parallel to the length direction of the first pin, and the second capillary groove is not parallel to the length direction of the second pin. Preferably, inner surface and the outer surface of the sidewall of convex cup structure are designed with capillary groove, and the first capillary groove is perpendicular to the length direction of the first pin, and the second capillary groove is perpendicular to the length direction of the second pin. When packaged LED meets water accidentally, capillary groove is used for hindering water to penetrate in encapsulating structure along pin.
In sum, the LED lead frame of raising encapsulating structure firmness provided by the utility model can make LED lamp and encapsulating structure can be more firmly attached in LED lead frame, further, the capillary groove of LED lead frame improves the water resistance of LED.
The foregoing is only preferred embodiment of the present utility model, be not limited to this utility model, for a person skilled in the art, this utility model can have various change, combination and change. All within spirit of the present utility model and principle, any amendment of making, equivalent replacement, improvement etc., should be included within right of the present utility model.
Claims (10)
1. the LED lead frame improving encapsulating structure firmness, including at least one the lead frame unit on lead frame plate, each described lead frame unit includes the first pin set (1) and the second pin set (2), it is characterized in that, described first pin set (1) includes the first pin (100) that at least one is elongated, described second pin set (2) includes the front end of the second pin (200) that at least one is elongated, the front end of described first pin (200) and described second pin (200) and is oppositely arranged;
Described first pin (100) is intervally arranged along the width of himself, and described second pin (200) is intervally arranged along the width of himself;
The front end of the front end of the first pin set (1) and the second pin set (2) constitutes convex cup structure, described convex cup structure is protruding towards the frontal of described lead frame plate, and the outer surface at the bottom of cup of described convex cup structure and/or inner surface are provided with first dot matrix (3) of depression.
2. the LED lead frame of raising encapsulating structure firmness according to claim 1, it is characterized in that, the forward part of described first pin set (1) is raised to front bending, constitute a part for described convex cup, and the forward part of described second pin set (2) is raised to front bending, constitute another part of described convex cup.
3. the LED lead frame of raising encapsulating structure firmness according to claim 1, it is characterised in that rectangular at the bottom of the cup of described convex cup structure, described first dot matrix (31) is also rectangular.
4. the LED lead frame of raising encapsulating structure firmness according to claim 1, it is characterised in that the outer surface of the sidewall of described convex cup structure and/or inner surface are provided with second dot matrix (32) of depression.
5. the LED lead frame of raising encapsulating structure firmness according to claim 1, it is characterised in that described first pin (100) and described second pin (200) one_to_one corresponding are oppositely arranged.
6. the LED lead frame of raising encapsulating structure firmness according to claim 1, it is characterized in that, described first pin set (1) includes three described first pins (100), and described second pin set (2) includes three described second pins (200).
7. the LED lead frame of raising encapsulating structure firmness according to claim 6, it is characterised in that described first pin (100) is parallel to each other, it is shown that the second pin (200) is parallel to each other.
8. the LED lead frame of raising encapsulating structure firmness according to claim 1, it is characterized in that, described pin is provided with first and admittedly expects hole (41), and described first expects that hole (41) is located at the bottom of the cup of described convex cup structure and arranges along the edge at the bottom of described cup admittedly.
9. the LED lead frame of raising encapsulating structure firmness according to claim 1, it is characterised in that described pin is provided with second and admittedly expects hole (42), described second expects that hole (42) is located on the sidewall of described convex cup structure admittedly.
10. the LED lead frame of raising encapsulating structure firmness according to claim 1, it is characterized in that, the outer surface of the sidewall of described convex cup structure and/or inner surface are provided with capillary groove (5), described capillary groove (5) includes the first capillary groove (51) of being located on described first pin set (1) and is located at the second capillary groove (52) on described second pin set (2), described first capillary groove (51) is not parallel to the length direction of described first pin (100), described second capillary groove (51) is not parallel to the length direction of described second pin (200).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521061213.1U CN205319189U (en) | 2015-12-17 | 2015-12-17 | Improve LED lead frame of firm degree of packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521061213.1U CN205319189U (en) | 2015-12-17 | 2015-12-17 | Improve LED lead frame of firm degree of packaging structure |
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| Publication Number | Publication Date |
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| CN205319189U true CN205319189U (en) | 2016-06-15 |
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| CN201521061213.1U Active CN205319189U (en) | 2015-12-17 | 2015-12-17 | Improve LED lead frame of firm degree of packaging structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116153898A (en) * | 2023-04-23 | 2023-05-23 | 宁波中车时代传感技术有限公司 | Lead frame structure for packaging and sensor packaging structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116153898A (en) * | 2023-04-23 | 2023-05-23 | 宁波中车时代传感技术有限公司 | Lead frame structure for packaging and sensor packaging structure |
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