CN206022414U - A kind of LED encapsulation structure - Google Patents
A kind of LED encapsulation structure Download PDFInfo
- Publication number
- CN206022414U CN206022414U CN201620569301.0U CN201620569301U CN206022414U CN 206022414 U CN206022414 U CN 206022414U CN 201620569301 U CN201620569301 U CN 201620569301U CN 206022414 U CN206022414 U CN 206022414U
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- Prior art keywords
- flat board
- connecting portion
- led
- pin
- lead
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 23
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 44
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 43
- 230000001012 protector Effects 0.000 claims abstract description 34
- 238000005452 bending Methods 0.000 claims description 34
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 230000008033 biological extinction Effects 0.000 abstract description 6
- 238000005286 illumination Methods 0.000 abstract description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000001149 thermolysis Methods 0.000 description 3
- 239000004568 cement Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 235000015110 jellies Nutrition 0.000 description 1
- 239000008274 jelly Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Led Device Packages (AREA)
Abstract
A kind of LED encapsulation structure, including LED patch supports, LED chip and Chip protector, the LED patch supports include pedestal, first scolding tin pin, second scolding tin pin, the first scolding tin pin includes the first flat board, the second scolding tin pin includes the second flat board, first flat board and the second flat board are located in pedestal and arrange compartmented between the rwo, the LED chip is mounted on the first flat board, first lead and second lead are drawn respectively in the LED chip two ends, first lead is welded in the first flat board, second lead is welded in the second flat board, on second flat board, a protector is set.Internal electrostatic is not only derived by the LED encapsulation structure, and ensure that the original illumination effect of LED chip, it is to avoid extinction phenomenon.
Description
【Technical field】
The utility model is related to LED and LED patch support technical fields, more particularly to a kind of LED encapsulation structure.
【Background technology】
The mobile electronic devices such as smart mobile phone have become an indispensable part in people's life, and these electronic equipments lead to
Often surface arranges.
LED chip is fabricated to the LED lamp bead with actual illumination effect in production process, generally by LED during making
On support, this support is exactly LED patch supports to chip attachment.In the prior art, LED patch supports include pedestal and two
For placing LED chip in individual scolding tin pin, pedestal, the two ends of LED chip connect two scolding tin pin respectively, and two scolding tin pin are external
Power positive cathode.In order to improve the antistatic effect of LED chip, some elements would generally be placed in LED encapsulation structure and is offset
Electrostatic, but in these structures, it will usually as element itself or component lead block a part of light, cause extinction existing
As making the reduction of LED chip light efficiency, light loss serious.
【Utility model content】
In order to overcome prior art problem, the utility model to provide a kind of LED encapsulation structure.
The utility model solves the scheme of technical problem and is to provide a kind of LED encapsulation structure, including LED patch supports, LED
Chip and Chip protector, the LED patch supports include pedestal, the first scolding tin pin, the second scolding tin pin, the first scolding tin pin
Including the first flat board, the second scolding tin pin includes the second flat board, and first flat board and the second flat board are located in pedestal and the rwo
Between compartmented is set, the LED chip is mounted on the first flat board, and the LED chip two ends draw the first lead and the respectively
Two leads, first lead are welded in the first flat board, and second lead is welded in the second flat board, arrange one on second flat board
Protector, arranges a wire guide in the protector, the wire guide is the through hole through the second flat board upper and lower surface, the chip
Protection device is located in protector, and its one end is electrically connected with the second flat board, the other end and draws the 3rd lead, the 3rd lead
Passed through by wire guide, the 3rd lead is from the direction cabling contrary with LED chip light-emitting area and its other end is connected to first
Flat board, the Chip protector are resistance.
Preferably, depth of the height of the Chip protector less than protector.
Preferably, the base interior opens up a groove, and the groove includes the flat board groove of the open slot on top and bottom, institute
State and in flat board groove, be divided into vat and sulculus, first flat board is located in vat, and second flat board is located in sulculus.
Preferably, the open slot opposite sides face is the first inclined-plane and the second inclined-plane for inclining.
Preferably, the first scolding tin pin further includes first connecting portion, the first bending pin and the first rear, described the
One connecting portion two ends connect the first flat board and the first bending pin respectively, and the first rear is extended in the first bending pin end, described
Second scolding tin pin further includes second connecting portion, the second bending pin and the second rear, and the second connecting portion two ends connect respectively
The second flat board and the second bending pin is connect, the second rear, first flat board and the second flat board are extended in the second bending pin end
It is located in groove respectively, first connecting portion and second connecting portion are embedded in pedestal, the first bending pin and the first rear, second
Bending pin and the second rear are located at outside pedestal.
Preferably, the two ends of the pedestal are offered respectively through the first hole of pedestal and the second hole, first connecting portion
It is located in first hole and the second hole respectively with second connecting portion, the side protrusion first of the first connecting portion is convex
The second salient angle is protruded at angle, the side of the second connecting portion, first salient angle and the second salient angle respectively with the first hole and the
Two hole inwalls are brought into close contact.
Preferably, the first connecting portion further includes that the first arc body, first salient angle are located at the first arc body
Side, the second connecting portion further includes the second arc body, and second salient angle is located at the side of the second arc body, institute
The first arc body and the second arc body are stated in 90 ° of arc shapes, is had between the edge of first arc body and the first hole inwall
There is the gap of 1mm-2mm, there is between the edge of second arc body and the second hole inwall the gap of 1mm-2mm.
Preferably, described first bending pin L-shaped, one end which is connected with first connecting portion perpendicular to the first flat board,
First rear perpendicular to the first bending pin place face and is attached at pedestal outer surface；The second bending pin is L-shaped, its
The one end being connected with second connecting portion bends pin place face and attaching perpendicular to the second flat board, second rear perpendicular to second
In pedestal outer surface.
Preferably, one layer of reflectance coating is respectively provided with first inclined-plane and the second inclined-plane.
Compared with prior art, the utility model LED encapsulation structure is by arranging a Chip protector and by its one end
The first flat board that the second flat board of the second scolding tin pin, the other end are electrically connected at the first scolding tin pin is electrically connected at, makes the electrostatic can
To be balanced out by the Chip protector.By the 3rd lead by Chip protector from lower with LED chip light-emitting area phase
Anti- direction cabling, it is ensured that the original illumination effect of LED chip, it is to avoid extinction phenomenon.
By the height of the Chip protector to be set smaller than the depth of protector, it is to avoid Chip protector hides
A part of light of gear LED chip.
【Description of the drawings】
Fig. 1 is the dimensional structure diagram of the utility model first embodiment LED patch support.
Fig. 2 is the configuration schematic diagram of the utility model first embodiment LED patch support.
Fig. 3 is the overlooking the structure diagram of the utility model first embodiment LED patch support.
Fig. 4 is the top view of the first scolding tin pin of the utility model first embodiment LED patch support.
Fig. 5 is the top view of the second scolding tin pin of the utility model first embodiment LED patch support.
Fig. 6 is the cross section structure diagram of the utility model second embodiment LED encapsulation structure.
Fig. 7 is the vertical view of the second scolding tin pin of LED patch supports in the utility model second embodiment LED encapsulation structure
Figure.
【Specific embodiment】
In order that the purpose of this utility model, technical scheme and advantage become more apparent, below in conjunction with accompanying drawing and enforcement
Example, is further elaborated to the utility model.It should be appreciated that specific embodiment described herein is only in order to solving
The utility model is released, is not used to limit the utility model.
Fig. 1 is referred to, the utility model first embodiment LED patch support 1 includes pedestal 15, the first scolding tin pin 17 and
Two scolding tin pin 19, the first scolding tin pin 17 and the second scolding tin pin 19 are located at the lower left and lower right of pedestal 15 respectively (in institute
Have in embodiment, upper and lower, left and right, the position determiner such as inside and outside are only limitted to the relative position in given view, rather than definitely position
Put), and a part for the first scolding tin pin 17 and the second scolding tin pin 19, in pedestal 15, another part is located at outside pedestal 15.
The pedestal 15 includes the first pedestal 151 and the second pedestal 153, first pedestal 151 is folded be located on the second pedestal 153 and this two
Person's one is connected.The material of the pedestal 15 is plastic cement, and the first scolding tin pin 17 and the second scolding tin pin 19 are metal.
Fig. 2 is referred to, first pedestal 151 is hollow cavity, in which, accommodates LED chip 13 and phosphor powder layer 11,
Phosphor powder layer 11 is arranged in LED chip 13.Filling jelly in second pedestal 153.
Fig. 2 and Fig. 3 is seen also, in first pedestal 151, groove 152 is opened up, the groove 152 is by two parts group
Into the two parts are respectively the open slot 1522 on top and the flat board groove 1521 of bottom, and the flat board groove 1521 is used for accommodating LED
Chip 13, arranges a compartmented 15212 in the flat board groove 1521, the compartmented 15212 is plastic cement, and flat board groove 1521 is divided into by which
Vat 15211 and sulculus 15213, are separated by compartmented 15212 or so between the vat 152111 and sulculus 15213, described
Open slot 1522 is used for accommodating phosphor powder layer 11, and 1522 opposite sides face of open slot is inclined plane, and which is respectively the first inclined-plane
15221 and second inclined-plane 15222, the shape of the phosphor powder layer 11 is approximately the same with open slot 1522, and LED chip 13 is covered by which
Cover in the flat board groove 1521 of the first pedestal 151.
The lower left and lower right of first pedestal 151 is respectively provided with the first hole 154 and second through pedestal 15
It is inside and outside that hole 156, first hole 154 and the second hole 156 connect the first pedestal 151, first hole 154 with
The vat 15211 is communicated, and the second hole 156 is communicated with the sulculus 15213.
Further referring to Fig. 4, the first scolding tin pin 17 include integrally formed first flat board 171, first connecting portion 173,
First bending pin 175 and the first rear 177, the size of first flat board 171 are equal with vat 15211, first connection
173 two ends of portion connect the first flat board 171 and the first bending pin 175 respectively, and the first rear is extended in 175 end of the first bending pin
177, the first connecting portion 173 includes the first arc body 1731 of integrally connected and the first salient angle 1732, and the rwo body phase
Even, first arc body 1731 is in approximate 90 ° of arc shapes, and it is curved that its arc two ends respectively connected the first flat board 171 and first
Folding pin 175, first salient angle 1732 protrude from the outside of 1731 interlude of the first arc body.In the first connecting portion 173
It is embedded in the first hole 154, and does not contact between the edge of the first arc body 1731 and 154 inwall of the first hole, with 1mm-
The gap of 2mm, arranges gap herein and plays thermolysis, and first salient angle 1732 is brought into close contact with 156 inwall of the first hole.
The first bending pin 175 is L-shaped, one end which is connected with first connecting portion 173 perpendicular to the first flat board 171, described the
One rear 177 perpendicular to the first bending 175 place face of pin and is attached at pedestal 15.In the present embodiment, the width of the first flat board 171
Width of the degree more than 173 coupled end of first connecting portion.
Further referring to Fig. 5, the second scolding tin pin 19 includes the second flat board 191, the bending pin of second connecting portion 193, second
195 and second rear 197, the size of second flat board 191 is equal with sulculus 15213,193 two ends of the second connecting portion point
Do not connect the second flat board 191 and the second bending pin 195, the second rear 197 is extended in 195 end of the second bending pin, and this second
Connecting portion 193 includes the second arc body 1931 of integrally connected and the second salient angle 1732, and the rwo one is connected, described second
Arc body 1931 is in approximate 90 ° of arc shapes, and its arc two ends respectively connected the second flat board 191 and the second bending pin 195, described
Second salient angle 1932 protrudes from the outside of 1931 interlude of the first arc body.The second connecting portion 193 is embedded in the second hole
In 156, and the edge of the second arc body 1931 is not contacted with 156 inwall of the second hole, and the gap with 1mm-2mm sets herein
Put gap and play thermolysis, second salient angle 1932 is brought into close contact with 156 inwall of the second hole.The second bending pin
195 is L-shaped, one end which is connected with second connecting portion 196 perpendicular to the second flat board 191, second rear 197 perpendicular to
Second bends 195 place face of pin and is attached at pedestal 15.In the present embodiment, the width of the second flat board 191 is more than the second connection
The width at 193 coupled end of portion.
In the present embodiment, the first salient angle 1732 protrudes from the outside of 1731 interlude of the first arc body, the second salient angle
1932 outsides for protruding from 1931 interlude of the second arc body, used as a kind of deformation, first salient angle 1732 can protrude from the
The either side of one arc body 1731, second salient angle 1932 can protrude from the either side of the second arc body 1931, if this
One salient angle 1732 and 1932 salient angle of the second salient angle are brought into close contact with the first hole 154 and 156 inwall of the second hole.This first
Salient angle 1732 and the second salient angle 193 play fixation, and which makes first connecting portion 173 and second connecting portion 193 and pedestal respectively
15 connection more consolidates, is difficult to loosen.
First flat board 171 of the first scolding tin pin 17 is located in vat 15211, and first connecting portion 173 is located at the first hole
In hole 154, the first bending pin 175 and the first rear 177 are located at outside pedestal 15；Second flat board of the second scolding tin pin 19
191 are located in sulculus 15213, and second connecting portion 193 is located in the second hole 156, and second bends pin 195 and the first rear 197
It is located at outside pedestal 15, first rear 177 and the second rear 197 are just fitted with the left and right two ends of the second pedestal 153.Institute
The two ends for stating LED chip 13 draw the first lead 131 and the second lead 133 respectively, and the LED chip 13 is mounted on the first flat board
On 171, first lead 131 is welded in the first flat board 171, and it is flat that second lead 133 is welded in second across compartmented 15212
Plate 191.
It is that 1.0mm, height H are 0.6mm that length L of the LED patch supports 1 is 3.8mm, width W, and which is applied to specific
The mobile phone of thickness.As a kind of deformation, set on first inclined-plane 15221 and the second inclined-plane 15222 of the open slot 1522 respectively
One layer of reflectance coating is put, the reflectance coating not only increases the reflecting effect of light source and plays optically focused effect.
Compared with prior art, the utility model first embodiment LED patch support is offered respectively at the two ends of pedestal
Through the first hole of pedestal and the second hole, the first connecting portion side of the first scolding tin pin arranges the first salient angle that protrudes, the
The second connecting portion side of two scolding tin pin arranges the second salient angle that protrudes, and first salient angle and the second salient angle play fixation,
It is brought into close contact with the first hole and the second hole inwall by the first salient angle and the second salient angle respectively, does not make first connecting portion and
Two connecting portions are more consolidated, are difficult to loosen with the connection of pedestal.
There is gap in first arc body and the second arc body between the first hole and the second hole inwall, institute respectively
State the first salient angle and the second salient angle is brought into close contact with the first hole and the second hole inwall respectively, the gap is between 1mm-2mm
Gap, plays thermolysis.
By one layer of reflectance coating is respectively provided with first inclined-plane and the second inclined-plane, make the reflective effect of LED chip
Fruit is more preferably.
Fig. 6 and Fig. 7 is referred to, the structure of LED patch supports 2 in the utility model second embodiment LED encapsulation structure 20
Identical with first embodiment LED patch support 1 with material, the LED patch supports 2 only difference that：Second scolding tin
A protector 292 is set on second flat board 291 of pin 29, a wire guide 2921 is set in the protector 292, the wire guide 2921
It is the through hole through 291 upper and lower surface of the second flat board.
LED chip 23 is mounted on the first flat board 271, and the first lead 231 and second is drawn at 23 two ends of LED chip respectively
Lead 233, first lead 231 are welded in the first flat board 271, and second lead 233 is welded in the second flat board 291, in protection
One Chip protector 24 is set in groove 292, and the Chip protector 24 can offset the element of electrostatic, its one end for resistance etc.
The second flat board 291 is electrically connected with, its other end draws the 3rd lead 241, if now walked the 3rd lead 241 from above
The first flat board 271 that its other end is connected to the first scolding tin pin 27 by line above (i.e. the light-emitting area direction of LED chip 23), can be made
Into extinction phenomenon, make the reduction of 23 light efficiency of LED chip, light loss serious, and in the present embodiment, by the 3rd lead 241 by protection
Wire guide 2921 on groove 292 is passed through, and its other end is connected to the first flat board 271 of the first scolding tin pin 27 from following cabling for which
Below (i.e. contrary with the light-emitting area of LED chip 23 direction), such LED encapsulation structure 20 is not only by internal static guiding
Go out, and ensure that 23 original illumination effect of LED chip, it is to avoid extinction phenomenon.In the present embodiment, the chip protection
Depth of the height of device 24 less than protector 292, it is to avoid Chip protector 24 blocks a part of light of LED chip 23.
Compared with prior art, the utility model LED encapsulation structure is by arranging a Chip protector and by its one end
The first flat board that the second flat board of the second scolding tin pin, the other end are electrically connected at the first scolding tin pin is electrically connected at, makes the electrostatic can
To be balanced out by the Chip protector.By the 3rd lead by Chip protector from lower with LED chip light-emitting area phase
Anti- direction cabling, it is ensured that the original illumination effect of LED chip, it is to avoid extinction phenomenon.
By the height of the Chip protector to be set smaller than the depth of protector, it is to avoid Chip protector hides
A part of light of gear LED chip.
Preferred embodiment of the present utility model is the foregoing is only, not in order to limit the utility model, all at this
Any modification that is made within the principle of utility model, equivalent and improvement etc. all should include protection domain of the present utility model
Within.
Claims (9)
1. a kind of LED encapsulation structure, it is characterised in that：Including LED patch supports, LED chip and Chip protector, described
LED patch supports include pedestal, the first scolding tin pin, the second scolding tin pin, and the first scolding tin pin includes the first flat board, second scolding tin
Pin includes the second flat board, and first flat board and the second flat board are located in pedestal and arrange compartmented, the LED core between the rwo
Piece is mounted on the first flat board, and the LED chip two ends draw the first lead and the second lead respectively, and first lead is welded in
One flat board, second lead are welded in the second flat board, arrange a protector on second flat board, arrange one and lead in the protector
String holes, the wire guide is the through hole through the second flat board upper and lower surface, and the Chip protector is located in protector, one
End is electrically connected with the second flat board, the other end and draws the 3rd lead, and the 3rd lead is passed through by wire guide, the 3rd lead
From the direction cabling contrary with LED chip light-emitting area and its other end is connected to the first flat board, the Chip protector is electricity
Resistance.
2. LED encapsulation structure as claimed in claim 1, it is characterised in that：The height of the Chip protector is less than protection
The depth of groove.
3. LED encapsulation structure as claimed in claim 1, it is characterised in that：The base interior opens up a groove, the groove bag
The open slot on top and the flat board groove of bottom is included, vat and sulculus in the flat board groove, is divided into, first flat board is located at
In vat, second flat board is located in sulculus.
4. LED encapsulation structure as claimed in claim 3, it is characterised in that：The open slot opposite sides face is for inclining
One inclined-plane and the second inclined-plane.
5. LED encapsulation structure as claimed in claim 3, it is characterised in that：The first scolding tin pin further includes the first company
Socket part, the first bending pin and the first rear, the first connecting portion two ends connect the first flat board and the first bending pin respectively, and this
The first rear is extended in one bending pin end, and the second scolding tin pin further includes second connecting portion, the second bending pin and the
Two rears, the second connecting portion two ends connect the second flat board and the second bending pin respectively, and the second bending pin end is extended
Second rear, first flat board and the second flat board are located in groove respectively, and first connecting portion and second connecting portion are embedded in base
Seat, the first bending pin and the first rear, the second bending pin and the second rear are located at outside pedestal.
6. LED encapsulation structure as claimed in claim 5, it is characterised in that：The two ends of the pedestal are offered respectively through base
The first hole of seat and the second hole, first connecting portion and second connecting portion are located in first hole and the second hole respectively,
The first salient angle is protruded in the side of the first connecting portion, and the second salient angle is protruded in the side of the second connecting portion, and described first is convex
Angle and the second salient angle are brought into close contact with the first hole and the second hole inwall respectively.
7. LED encapsulation structure as claimed in claim 6, it is characterised in that：The first connecting portion further includes the first arc
Body, first salient angle are located at the side of the first arc body, and the second connecting portion further includes the second arc body, described
Second salient angle is located at the side of the second arc body, and first arc body and the second arc body are in 90 ° of arc shapes, first arc
There is between the edge of body and the first hole inwall the gap of 1mm-2mm, the edge and the second hole of second arc body
There is between inwall the gap of 1mm-2mm.
8. LED encapsulation structure as claimed in claim 5, it is characterised in that：The first bending pin is L-shaped, and which is with first
One end of connecting portion connection perpendicular to the first bending pin place face and is attached at pedestal perpendicular to the first flat board, first rear
Outer surface；The second bending pin is L-shaped, one end which is connected with second connecting portion perpendicular to the second flat board, described second
Rear perpendicular to the second bending pin place face and is attached at pedestal outer surface.
9. LED encapsulation structure as claimed in claim 4, it is characterised in that：Set on first inclined-plane and the second inclined-plane respectively
Put one layer of reflectance coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620569301.0U CN206022414U (en) | 2016-06-12 | 2016-06-12 | A kind of LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620569301.0U CN206022414U (en) | 2016-06-12 | 2016-06-12 | A kind of LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206022414U true CN206022414U (en) | 2017-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620569301.0U Expired - Fee Related CN206022414U (en) | 2016-06-12 | 2016-06-12 | A kind of LED encapsulation structure |
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| Country | Link |
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| CN (1) | CN206022414U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019149081A1 (en) * | 2018-02-01 | 2019-08-08 | Oppo广东移动通信有限公司 | Led light source, led module, backlight module and electronic device |
-
2016
- 2016-06-12 CN CN201620569301.0U patent/CN206022414U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019149081A1 (en) * | 2018-02-01 | 2019-08-08 | Oppo广东移动通信有限公司 | Led light source, led module, backlight module and electronic device |
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| C14 | Grant of patent or utility model | ||
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Granted publication date: 20170315 |