WO2019149081A1 - Led light source, led module, backlight module and electronic device - Google Patents

Led light source, led module, backlight module and electronic device Download PDF

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Publication number
WO2019149081A1
WO2019149081A1 PCT/CN2019/072188 CN2019072188W WO2019149081A1 WO 2019149081 A1 WO2019149081 A1 WO 2019149081A1 CN 2019072188 W CN2019072188 W CN 2019072188W WO 2019149081 A1 WO2019149081 A1 WO 2019149081A1
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WO
WIPO (PCT)
Prior art keywords
bent
pole piece
welded
bracket
accommodating
Prior art date
Application number
PCT/CN2019/072188
Other languages
French (fr)
Chinese (zh)
Inventor
欧阳志斌
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019149081A1 publication Critical patent/WO2019149081A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present application relates to the field of lighting technologies, and in particular, to an LED light source, an LED module, a backlight module, and an electronic device.
  • the application provides an LED light source
  • the LED light source includes an illuminant, a bracket and a pole piece
  • the bracket is provided with a light emitting surface
  • the illuminant is encapsulated in the bracket, and the light emitted by the illuminant is emitted from the light emitting surface
  • the pole piece includes the first a pole piece and a second pole piece
  • the first pole piece includes a first body portion and a first welding portion
  • the second pole piece includes a second body portion and a second welding portion
  • the first body portion and the second body portion are packaged on the bracket
  • the first soldering portion extends from the first body portion toward the light exiting surface, and is bent and protruded at an end away from the light emitting surface to form a first protruding portion
  • the second soldering portion is The second main body portion is disposed to extend away from the light emitting surface, and is bent and protruded at an end away from the light emitting surface to form
  • the application also provides an LED module, the LED module comprises a circuit board and an LED light source, the circuit board is provided with a pad, the LED light source is electrically connected to the pad; the LED light source comprises an illuminant, a bracket and a pole piece, and the bracket a light-emitting surface is disposed, the light-emitting body is encapsulated in the bracket, and light emitted by the light-emitting body is emitted from the light-emitting surface; the pole piece includes a first pole piece and a second pole piece, and the first pole piece includes a first body portion and a first welding portion The second pole piece includes a second body portion and a second soldering portion.
  • the first body portion and the second body portion are encapsulated in the bracket and electrically connected to the illuminator, and the first soldering portion is away from the first body portion
  • the light-emitting surface extends and is bent at an end away from the light-emitting surface to form a first protrusion.
  • the second solder portion extends from the second body portion toward the light-emitting surface, and is bent at an end away from the light-emitting surface.
  • the second protruding portion is formed, and the first protruding portion and the second protruding portion are oppositely disposed to increase the welding area of the first welded portion and the second welded portion with the pad, respectively.
  • the present application further provides a backlight module, which comprises a diffusion plate, a light guide plate, a circuit board and an LED light source.
  • a backlight module which comprises a diffusion plate, a light guide plate, a circuit board and an LED light source.
  • the light guide plate and the diffusion plate are stacked, and the LED light source is electrically connected to the circuit board, and the light emitting surface of the LED light source is provided.
  • the LED light source comprises an illuminant, a bracket and a pole piece, the bracket is provided with a light-emitting surface, the illuminant is encapsulated in the bracket, and the light emitted by the illuminant is emitted from the light-emitting surface;
  • the pole piece includes the first a pole piece and a second pole piece, the first pole piece includes a first body portion and a first welding portion, the second pole piece includes a second body portion and a second welding portion, the first body portion and the second body portion are packaged on the bracket
  • the first soldering portion extends from the first body portion toward the light exiting surface, and is bent and protruded at an end away from the light emitting surface to form a first protruding portion
  • the second soldering portion is The second main body portion is disposed to extend away from the light emitting surface, and is bent and protrude
  • the present application also provides an electronic device including a display module, a diffusion plate, a light guide plate, a circuit board, and an LED light source.
  • the display module, the diffusion plate, and the light guide plate are sequentially stacked, and the LED light source and the circuit board are electrically connected.
  • the light-emitting surface of the LED light source is aligned with the light-incident surface of the light guide plate;
  • the LED light source comprises an illuminant, a bracket and a pole piece, the bracket is provided with a light-emitting surface, the illuminant is encapsulated in the bracket, and the light emitted by the illuminant is emitted from the light-emitting surface Shooting;
  • the pole piece includes a first pole piece and a second pole piece, the first pole piece includes a first body portion and a first welding portion, the second pole piece includes a second body portion and a second welding portion, the first body portion and The second body portion is encapsulated in the bracket and electrically connected to the illuminator.
  • the first soldering portion extends from the first body portion toward the light exiting surface, and is bent at an end away from the light emitting surface to form a first protruding portion.
  • a second soldering portion extending from the second body portion toward the light exiting surface, and bending and protruding at an end away from the light emitting surface to form a second protruding portion, wherein the first protruding portion and the second protruding portion are oppositely disposed To increase the first weld And a second portion welded portions of the circuit board welding area.
  • the lamp bead of the LED light source of the present application reduces the size of the lamp bead without reducing the stability of the soldering ground.
  • FIG. 1 is a schematic exploded view of an electronic device of the present application
  • FIG. 2 is a schematic cross-sectional view showing a stack of a display module and a backlight module of the present application
  • FIG. 3 is a schematic exploded view of a backlight module of the present application.
  • FIG. 5 is a schematic perspective structural view of an embodiment of an LED light source of the present application.
  • Figure 6 is a schematic exploded view of the pole piece and the bracket of Figure 5.
  • the electronic device provided by the embodiment of the present application includes an electronic device such as a smart phone, a tablet computer, a smart wearable device, a digital audio and video player, an electronic reader, a handheld game machine, and an in-vehicle electronic device.
  • an electronic device such as a smart phone, a tablet computer, a smart wearable device, a digital audio and video player, an electronic reader, a handheld game machine, and an in-vehicle electronic device.
  • first and second in this application are used for descriptive purposes only, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • the meaning of "a plurality” is at least two, such as two, three, etc., unless specifically defined otherwise. All directional indications (such as up, down, left, right, front, back, ...) in the embodiments of the present application are only used to explain the relative positional relationship between components in a certain posture (as shown in the drawing).
  • references to "an embodiment” herein mean that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the present application.
  • the appearances of the phrases in various places in the specification are not necessarily referring to the same embodiments, and are not exclusive or alternative embodiments that are mutually exclusive. Those skilled in the art will understand and implicitly understand that the embodiments described herein can be combined with other embodiments.
  • FIG. 1 is a schematic exploded view of an electronic device according to the present application.
  • the electronic device in this embodiment may include a display module 10, a backlight module 20, a middle frame 30, and a rear case 40.
  • the display module 10, the backlight module 20, the middle frame 30 and the rear case 40 are sequentially stacked, and a receiving space is formed between the middle frame 30 and the rear case 40.
  • the receiving space is for accommodating electronic components of the electronic device, such as a camera module. , battery, motherboard, microphone and speakers, etc.
  • the display module 10 is configured to display information received by the electronic device to the user, and the backlight module 20 is configured to provide illumination for the display module 10.
  • FIG. 2 is a schematic cross-sectional view showing a stack of the display module 10 and the backlight module 20 of the present application
  • FIG. 3 is a schematic exploded view of the backlight module 20 of the present application.
  • the backlight module 20 may include components such as an upper brightness enhancement sheet 21, a lower brightness enhancement sheet 22, a diffusion plate 23, a light guide plate 24, a light reflection sheet 25, and an LED module 50.
  • the display module 10, the upper brightness enhancement sheet 21, the lower brightness enhancement sheet 22, the diffusion plate 23, the light guide plate 24, and the light reflection sheet 25 are sequentially stacked, and the light exit surface 501 of the LED module 50 is aligned with the light incident surface 241 of the light guide plate 24. .
  • the light emitted by the LED module 50 travels farther through the conduction of the light guide plate 24, the diffuser plate 23 scatters the light evenly, and the reflective sheet 25 reflects the leaked light to the diffuser plate 23, and the upper brightness enhancement sheet 21 and the lower portion
  • the light-increasing sheet 22 turns the optical path of the light transmitted through the diffusing plate 23 perpendicular to the display module 10 to enhance the display brightness of the display module 10.
  • the display module 10 includes a display area and a non-display area.
  • the non-display area is generally used to set the LED module 50 of the backlight module, and the display area is used to display information received by the electronic device to the user.
  • the display module 10 needs to find a way to shorten the size of the non-display area, and the size of the LED module 50 is a key factor.
  • the external dimensions of the display module 10 are constant, the smaller the volume of the LED module 50 in the direction perpendicular to the light exit surface 501, the smaller the size of the non-display area, and correspondingly, the display area. The size is larger.
  • FIG. 4 is a schematic perspective view of the LED module 50 of the present application.
  • the LED module 50 can include an LED light source 51 and a circuit board 52.
  • the circuit board 52 is provided with a pad (not shown).
  • the LED light source 51 is soldered on the pad to electrically connect the LED light source 51 and the circuit board 52. .
  • the number of LED light sources 51 is plural, and the LED light sources 51 may be arranged in a row on the circuit board 52.
  • the LED light sources 51 may also be arranged in a plurality of rows on the circuit board 52, and are surrounded by a triangle, a quadrangle, and a circle on the circuit board 52. Or an opposite sex or the like, in which the light-emitting surface 501 of the LED light source 51 and the light guide plate 24 are aligned perpendicular to either side of the diffusion plate 23 (see the figure).
  • the circuit board 52 can be a rigid PCB board, the hard PCB board is well cooled, and the LED light source 51 is soldered stably and firmly.
  • the circuit board 52 can also be a flexible FPC board having a small thickness that can reduce the size of the LED light source 51 in a direction parallel to its light exit surface 501.
  • FIG. 5 is a schematic perspective structural view of an embodiment of the LED light source 51 of the present application.
  • the LED light source 51 can include an illuminator 53, a bracket 54 and a pole piece 55.
  • the bracket 54 is provided with a light-emitting surface 501.
  • the illuminant 53 is enclosed in the bracket 54.
  • the light emitted by the illuminant 53 is emitted from the light-emitting surface 501, and the pole piece 55 is respectively.
  • the illuminator 53 is connected to a pad (not shown) of the circuit board 52 to electrically connect the circuit board 52 to the illuminator 53.
  • the bracket 54 may be a plastic piece, the pole piece 55 may be a metal piece, and the bracket 54 and the pole piece 55 may be integrally molded by integral injection molding, and the bracket 54 and the pole piece 55 may also be separately manufactured and then assembled.
  • FIG. 6 is a schematic exploded view of the pole piece 55 and the bracket 54 of FIG.
  • the pole piece 55 may include a first pole piece 56 and a second pole piece 57, the first pole piece 56 and the second pole piece 57 being spaced apart to insulate each other.
  • the first pole piece 56 may include a first body portion 561 and a first soldering portion 562.
  • the first body portion 561 is encapsulated in the bracket 54 and electrically connected to the illuminant (refer to the illuminant 53 in FIG. 5).
  • the soldering portion 562 extends from the first main body portion 561 toward the distance from the light emitting surface 501, and is bent and protruded at an end away from the light emitting surface 501 to form a first protruding portion 563, the first protruding portion 563 and the first soldering portion 562. It is used for soldering connection with a circuit board (not shown) to increase the soldering area of the first pole piece 56 and the circuit board.
  • the first soldering portion 562 may be bent and protruded parallel to the light emitting surface 501 at one end away from the light emitting surface 501 to form a first protruding portion 563.
  • the first soldering portion 562 may also be bent toward the light emitting surface 501 at an end away from the light emitting surface 501.
  • the first protrusion 563 is formed by folding and folding, which is not limited herein.
  • the shape of the first welded portion 562 may be square, circular, triangular or opposite, which is not limited herein.
  • the second pole piece 57 may include a second body portion 571 and a second soldering portion 572.
  • the second body portion 571 is encapsulated in the bracket 54 and electrically connected to the illuminant (refer to the illuminant 53 in FIG. 5).
  • the soldering portion 572 extends from the second main body portion 571 toward the distance from the light emitting surface 501, and is bent and protruded at an end away from the light emitting surface 501 to form a second protruding portion 573, the second protruding portion 573 and the second soldering portion 572. It is used for soldering connection with the circuit board to increase the soldering area of the second pole piece 57 and the circuit board.
  • the second soldering portion 572 can be bent and protruded parallel to the light exiting surface 501 to form a second protruding portion 573.
  • the second soldering portion 572 can also be bent toward the light emitting surface 501 at an end away from the light emitting surface 501.
  • the second protrusion 573 is formed by folding and forming, which is not limited herein.
  • the shape of the second soldering portion 572 may be square, circular, triangular or opposite, which is not limited herein.
  • the bracket 54 includes a longitudinal direction, a thickness direction, and a width direction, and the longitudinal direction, the thickness direction, and the width direction are perpendicular to each other, and the width direction is perpendicular to the light exit surface 501.
  • the first welded portion 562 and the second welded portion 572 are disposed at opposite ends of the bracket 54 in the longitudinal direction of the bracket 54.
  • the first protruding portion 563 and the second protruding portion 573 are oppositely disposed.
  • the volume of the LED light source in the direction perpendicular to the light-emitting surface 501 is reduced. purpose.
  • the first protruding portion 563 and the second protruding portion 573 are respectively protruded from the first soldering portion 562 and the second soldering portion 572, and the first protruding portion 563 and the second protruding portion 573 are parallel or directed toward the light.
  • the surface of the surface 501 is convexly disposed, and the welding area of the LED light source and the circuit board is increased without increasing the volume of the LED light source in the direction perpendicular to the light-emitting surface 501, thereby ensuring welding of the LED light source and the circuit board. stability.
  • the first pole piece 56 further includes a first bent portion 564 that is bent along one side of the first welded portion 562.
  • the first bent portion 564 and the first protruding portion 563 may be disposed at the opposite side of the first welded portion 562.
  • the first bent portion 564 abuts on the bracket 54 , and the first bent portion 564 is used to increase the contact area between the first pole piece 56 and the bracket 54 , thereby improving the stability of the connection between the first pole piece 56 and the bracket 54 .
  • the first bent portion 564 is bent in the thickness direction of the bracket 54.
  • the first bent portion 564 may be disposed on the same side of the first welded portion 562 as the first protruding portion 563, which is not limited herein.
  • the second pole piece 57 further includes a second bent portion 574 which is bent along one side of the second welded portion 572, and the second bent portion 574 and the second protruding portion 573 may be disposed at the opposite side of the second welded portion 572 On both sides, the second bent portion 574 abuts on the bracket 54 , and the second bent portion 574 is used to increase the contact area between the second pole piece 57 and the bracket 54 , thereby improving the stability of the connection between the second pole piece 57 and the bracket 54 . Further, the second bent portion 574 is bent in the thickness direction of the bracket 54. The second bent portion 574 may be disposed on the same side of the second welded portion 572 as the second protruding portion 573, which is not limited herein.
  • the bracket 54 includes a receiving portion 541 and a sealing portion 542.
  • the illuminating body is housed in the accommodating portion 541.
  • the sealing portion 542 is connected to the accommodating portion 541 to seal the accommodating portion 541.
  • the end surface of the accommodating portion 541 away from the sealing portion 542 is a light emitting surface 501.
  • the first body portion 561 and the second body portion 571 may be embedded in the sealing portion 542 and parallel to the light exit surface 501 to be laminated with the illuminant.
  • the first body portion 561 and the second body portion 571 may be embedded in the accommodating portion 541 and parallel to the light-emitting surface 501 to be laminated with the illuminant.
  • the first soldering portion 562 and the second soldering portion 572 abut against the sealing portion 542 toward the surface of the circuit board, respectively.
  • the sealing portion 542 is provided with a first accommodating groove 543 and a second accommodating groove 544.
  • the first accommodating groove 543 and the second accommodating groove 544 are disposed at opposite ends of the sealing portion 542 in the longitudinal direction.
  • a soldering portion 562 extends from the first body portion 561 along the bottom wall of the first receiving groove 543, and the first protruding portion 563 is received in the first receiving groove 543 to reduce the thickness of the LED light source in the bracket 54.
  • the second soldering portion 572 extends from the second body portion 571 along the bottom wall of the second receiving groove 544, and the second protruding portion 573 is received in the second receiving groove 544 to reduce the LED light source in the bracket 54. Volume in the thickness direction.
  • the shape of the first accommodating groove 543 may be L-shaped, that is, the first accommodating groove 543 further extends in the thickness direction of the bracket 54 , and the first bending portion 564 is received in the first accommodating groove. Within 543, thereby reducing the volume of the bracket 54 in the length direction.
  • the shape of the second accommodating groove 544 may be L-shaped, that is, the second accommodating groove 544 is further extended in the thickness direction of the bracket 54 , and the second bent portion 574 is received in the second accommodating groove 544 , thereby The volume of the bracket 54 in the length direction is reduced.
  • the one end of the first welded portion 562 and the second welded portion 572 away from the light-emitting surface 501 does not exceed the sealing portion 542 . That is, the end surface of the sealing portion 542 away from the one end of the light-emitting surface 501 may be flush with the end surface corresponding to the first soldering portion 562 and the second soldering portion 572, and the end surface of the sealing portion 542 away from the end of the light-emitting surface 501 may also exceed the first soldering portion 562.
  • a heat dissipating groove 545 is provided at one end of the sealing portion 542 facing away from the accommodating portion 541 to increase the heat dissipating area of the illuminating body.
  • the heat sink 545 can serve as a glue injection port, and the protruding portion of the glue injection port is received in the heat dissipation groove 545, so that the size of the bracket 54 in the direction of the vertical light exit surface 501. Reduced.

Abstract

An LED light source (51), an LED module (50), a backlight module (20), and an electronic device. The LED light source (51) comprises a light emitting body (53), a bracket (54) and pole pieces (55). The bracket (54) is provided with a light emitting surface (501), the light emitting body (53) is encapsulated within the bracket (54), and light emitted from the light emitting body (53) is emitted from the light emitting surface (501). The pole pieces (55) comprise a first pole piece (56) and a second pole piece (57), the first pole piece (56) comprising a first body part (561) and a first welding part (562), and the second pole piece (57) comprising a second body part (571) and a second welding part (572). The first body part (561) and the second body part (571) are encapsulated within the bracket (54) and are electrically connected to the light emitting body (53). The first welding part (562) extends from the first body part (561) in the direction away from the light emitting surface (501), and a first protrusion (563) is formed by bending and protruding from the end of the first welding part (562) away from the light emitting surface (501), and the second welding part (572) extends from the second body part (571) in the direction away from the light emitting surface (501), and a second protrusion (573) is formed by bending and protruding from the end of the second welding part (572) away from the light emitting surface (501), and the first protrusion (563) and the second protrusion (573) are opposite to each other. As a result, the LED light source (51) has its lamp beads reduced in size without lowering its welding stability.

Description

LED光源、LED模组、背光模组及电子装置LED light source, LED module, backlight module and electronic device 【技术领域】[Technical Field]
本申请涉及照明技术领域,特别是涉及一种LED光源、LED模组、背光模组及一种电子装置。The present application relates to the field of lighting technologies, and in particular, to an LED light source, an LED module, a backlight module, and an electronic device.
【背景技术】【Background technique】
目前电子装置通常会配备显示模组,显示模组用于显示信息给用户观看。在显示模组尺寸一定的前提下,显示模组的显示区域进一步扩大是目前工程师面临的难题。Currently, electronic devices are usually equipped with a display module, and the display module is used to display information for viewing by the user. Under the premise of a certain size of the display module, further expansion of the display area of the display module is a problem faced by engineers at present.
【发明内容】[Summary of the Invention]
本申请提供了一种LED光源,该LED光源包括发光体、支架和极片,支架设置有出光面,发光体封装于支架内,且发光体发出的光线从出光面射出;极片包括第一极片和第二极片,第一极片包括第一主体部和第一焊接部,第二极片包括第二主体部和第二焊接部,第一主体部和第二主体部封装于支架内,并与发光体电性连接,第一焊接部从第一主体部上朝向远离出光面延伸设置,并在远离出光面的一端弯折凸出形成第一凸出部,第二焊接部从第二主体部上朝向远离出光面延伸设置,并在远离出光面的一端弯折凸出形成第二凸出部,第一凸出部和第二凸出部相对设置,以增加第一焊接部和第二焊接部分别与电路板的焊接面积。The application provides an LED light source, the LED light source includes an illuminant, a bracket and a pole piece, the bracket is provided with a light emitting surface, the illuminant is encapsulated in the bracket, and the light emitted by the illuminant is emitted from the light emitting surface; the pole piece includes the first a pole piece and a second pole piece, the first pole piece includes a first body portion and a first welding portion, the second pole piece includes a second body portion and a second welding portion, the first body portion and the second body portion are packaged on the bracket Internally, and electrically connected to the illuminator, the first soldering portion extends from the first body portion toward the light exiting surface, and is bent and protruded at an end away from the light emitting surface to form a first protruding portion, and the second soldering portion is The second main body portion is disposed to extend away from the light emitting surface, and is bent and protruded at an end away from the light emitting surface to form a second protruding portion. The first protruding portion and the second protruding portion are oppositely disposed to increase the first welded portion. And the welding area of the second soldering portion and the circuit board, respectively.
本申请还提供了一种LED模组,该LED模组包括电路板和LED光源,电路板设置有焊盘,LED光源与焊盘电性连接;LED光源包括发光体、支架和极片,支架设置有出光面,发光体封装于支架内,且发光体发出的光线从出光面射出;极片包括第一极片和第二极片,第一极片包括第一主体部和第一焊接部,第二极片包括第二主体部和第二焊接部,第一主体部和第二主体部封装于支架内,并与发光体电性连接,第一焊接部从第一主体部上朝向远离出光面延伸设置,并在远离出光面的一端弯折凸出形成第一凸出部,第二焊接部从第二主体部上朝向远离出光面延伸设置,并在远离出光面的一端弯折凸出形成第二凸出部,第一凸出部和第二凸出部相对设置,以增加第一焊接部和第二焊接部分别与焊盘的焊接面积。The application also provides an LED module, the LED module comprises a circuit board and an LED light source, the circuit board is provided with a pad, the LED light source is electrically connected to the pad; the LED light source comprises an illuminant, a bracket and a pole piece, and the bracket a light-emitting surface is disposed, the light-emitting body is encapsulated in the bracket, and light emitted by the light-emitting body is emitted from the light-emitting surface; the pole piece includes a first pole piece and a second pole piece, and the first pole piece includes a first body portion and a first welding portion The second pole piece includes a second body portion and a second soldering portion. The first body portion and the second body portion are encapsulated in the bracket and electrically connected to the illuminator, and the first soldering portion is away from the first body portion The light-emitting surface extends and is bent at an end away from the light-emitting surface to form a first protrusion. The second solder portion extends from the second body portion toward the light-emitting surface, and is bent at an end away from the light-emitting surface. The second protruding portion is formed, and the first protruding portion and the second protruding portion are oppositely disposed to increase the welding area of the first welded portion and the second welded portion with the pad, respectively.
本申请还提供了一种背光模组,该背光模组包括扩散板、导光板、电路板和LED光源,导光板与扩散板层叠设置,LED光源与电路板电性连接,LED光源的出光面与导光板的进光面对齐;LED光源包括发光体、支架和极片,支架设置有出光面,发光体封装于支架内,且发光体发出的光线从出光面射出;极片包括第一极片和第二极片,第一极片包括第一主体部和第一焊接部,第二极片包括第二主体部和第二焊接部,第一主体部和第二主体部封装于支架内,并与发光体电性连接,第一焊接部从第一主体部上朝向远离出光面延伸设置,并在远离出光面的一端弯折凸出形成第一凸出部,第二焊接部从第二主体部上朝向远离出光面延伸设置,并在远离出光面的一端弯折凸出形成第二凸出部,第一凸出部和第二凸出部相对设置,以增加第一焊接部和第二焊接部分别与电路板的焊接面积。The present application further provides a backlight module, which comprises a diffusion plate, a light guide plate, a circuit board and an LED light source. The light guide plate and the diffusion plate are stacked, and the LED light source is electrically connected to the circuit board, and the light emitting surface of the LED light source is provided. Aligning with the light-incident surface of the light guide plate; the LED light source comprises an illuminant, a bracket and a pole piece, the bracket is provided with a light-emitting surface, the illuminant is encapsulated in the bracket, and the light emitted by the illuminant is emitted from the light-emitting surface; the pole piece includes the first a pole piece and a second pole piece, the first pole piece includes a first body portion and a first welding portion, the second pole piece includes a second body portion and a second welding portion, the first body portion and the second body portion are packaged on the bracket Internally, and electrically connected to the illuminator, the first soldering portion extends from the first body portion toward the light exiting surface, and is bent and protruded at an end away from the light emitting surface to form a first protruding portion, and the second soldering portion is The second main body portion is disposed to extend away from the light emitting surface, and is bent and protruded at an end away from the light emitting surface to form a second protruding portion. The first protruding portion and the second protruding portion are oppositely disposed to increase the first welded portion. And the second welded part and the electric respectively Welding area of the plate.
本申请还提供了一种电子装置,该电子装置包括显示模组、扩散板、导光板、电路板和LED光源,显示模组、扩散板和导光板依次层叠设置,LED光源与电路板电性连接,LED光源的出光面与导光板的进光面对齐;LED光源包括发光体、支架和极片,支架设置有出光面,发光体封装于支架内,且发光体发出的光线从出光面射出;极片包括第一极片和第二极片,第一极片包括第一主体部和第一焊接部,第二极片包括第二主体部和第二焊接部,第一主体部和第二主体部封装于支架内,并与发光体电性连接,第一焊接部从第一主体部上朝向远离出光面延伸设置,并在远离出光面的一端弯折凸出形成第一凸出部,第二焊接部从第二主体部上朝向远离出光面延伸设置,并在远离出光面的一端弯折凸出形成第二凸出部,第一凸出部和第二凸出部相对设置,以增加第一焊接部和第二焊接部分别与电路板的焊接面积。The present application also provides an electronic device including a display module, a diffusion plate, a light guide plate, a circuit board, and an LED light source. The display module, the diffusion plate, and the light guide plate are sequentially stacked, and the LED light source and the circuit board are electrically connected. The light-emitting surface of the LED light source is aligned with the light-incident surface of the light guide plate; the LED light source comprises an illuminant, a bracket and a pole piece, the bracket is provided with a light-emitting surface, the illuminant is encapsulated in the bracket, and the light emitted by the illuminant is emitted from the light-emitting surface Shooting; the pole piece includes a first pole piece and a second pole piece, the first pole piece includes a first body portion and a first welding portion, the second pole piece includes a second body portion and a second welding portion, the first body portion and The second body portion is encapsulated in the bracket and electrically connected to the illuminator. The first soldering portion extends from the first body portion toward the light exiting surface, and is bent at an end away from the light emitting surface to form a first protruding portion. a second soldering portion extending from the second body portion toward the light exiting surface, and bending and protruding at an end away from the light emitting surface to form a second protruding portion, wherein the first protruding portion and the second protruding portion are oppositely disposed To increase the first weld And a second portion welded portions of the circuit board welding area.
本申请的LED光源的灯珠在不降低其焊接地稳定性的前提下,缩小了灯珠的尺寸。The lamp bead of the LED light source of the present application reduces the size of the lamp bead without reducing the stability of the soldering ground.
【附图说明】[Description of the Drawings]
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下, 还可以根据这些附图获得其它的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application. Other drawings may also be obtained from those of ordinary skill in the art in view of the drawings.
图1是本申请一种电子装置的分解结构示意图;1 is a schematic exploded view of an electronic device of the present application;
图2是本申请显示模组和背光模组层叠的截面示意图;2 is a schematic cross-sectional view showing a stack of a display module and a backlight module of the present application;
图3是本申请背光模组的分解结构示意图;3 is a schematic exploded view of a backlight module of the present application;
图4是本申请LED模组的立体结构示意图;4 is a schematic perspective view of the LED module of the present application;
图5是本申请LED光源一实施例的立体结构示意图;5 is a schematic perspective structural view of an embodiment of an LED light source of the present application;
图6是图5中极片和支架的分解结构示意图。Figure 6 is a schematic exploded view of the pole piece and the bracket of Figure 5.
【具体实施方式】【Detailed ways】
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。可以理解的是,此处所描述的具体实施例仅用于解释本申请,而非对本申请的限定。另外还需要说明的是,为了便于描述,附图中仅示出了与本申请相关的部分而非全部结构。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described in the following with reference to the accompanying drawings in the embodiments. It is understood that the specific embodiments described herein are merely illustrative of the application and are not intended to be limiting. In addition, it should be noted that, for the convenience of description, only some but not all of the structures related to the present application are shown in the drawings. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present application without departing from the inventive scope are the scope of the present application.
本申请实施例所提供的电子装置,包括智能手机、平板电脑、智能穿戴设备、数字音视频播放器、电子阅读器、手持游戏机和车载电子设备等电子设备。The electronic device provided by the embodiment of the present application includes an electronic device such as a smart phone, a tablet computer, a smart wearable device, a digital audio and video player, an electronic reader, a handheld game machine, and an in-vehicle electronic device.
本申请中的术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。本申请的描述中,“多个”的含义是至少两个,例如两个,三个等,除非另有明确具体的限定。本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。此外,术语“包括”和“具有”以及它们任何变形,意图在于覆盖不排他的包含。例如包含了一系列步骤或部件的过程、方法、系统、产品或设备,没有限定于已列出的步骤或部件,而是可选地还包括没有列出的步骤或部件,或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或部件。The terms "first" and "second" in this application are used for descriptive purposes only, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include at least one of the features, either explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless specifically defined otherwise. All directional indications (such as up, down, left, right, front, back, ...) in the embodiments of the present application are only used to explain the relative positional relationship between components in a certain posture (as shown in the drawing). , the movement situation, etc., if the specific posture changes, the directional indication also changes accordingly. Furthermore, the terms "comprises" and "comprising" and "comprising" are intended to cover a non-exclusive inclusion. For example, a process, method, system, product, or device that comprises a series of steps or components is not limited to the listed steps or components, but optionally includes steps or components not listed, or alternatively Other steps or components inherent to these processes, methods, products or devices are included.
在本文中提及“实施例”意味着,结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语 并不一定均是指相同的实施例,也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是,本文所描述的实施例可以与其它实施例相结合。References to "an embodiment" herein mean that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the present application. The appearances of the phrases in various places in the specification are not necessarily referring to the same embodiments, and are not exclusive or alternative embodiments that are mutually exclusive. Those skilled in the art will understand and implicitly understand that the embodiments described herein can be combined with other embodiments.
请参阅图1,图1是本申请一种电子装置的分解结构示意图。Please refer to FIG. 1. FIG. 1 is a schematic exploded view of an electronic device according to the present application.
本实施例中的电子装置可以包括显示模组10、背光模组20、中框30和后壳40。The electronic device in this embodiment may include a display module 10, a backlight module 20, a middle frame 30, and a rear case 40.
显示模组10、背光模组20、中框30和后壳40依次层叠设置,中框30和后壳40之间形成收容空间,收容空间用于收容电子装置的电子元器件,例如摄像头模组、电池、主板、麦克风和扬声器等等。显示模组10用于将电子装置接收的信息显示给用户,背光模组20用于为显示模组10提供光照。The display module 10, the backlight module 20, the middle frame 30 and the rear case 40 are sequentially stacked, and a receiving space is formed between the middle frame 30 and the rear case 40. The receiving space is for accommodating electronic components of the electronic device, such as a camera module. , battery, motherboard, microphone and speakers, etc. The display module 10 is configured to display information received by the electronic device to the user, and the backlight module 20 is configured to provide illumination for the display module 10.
请参阅图2和图3,图2是本申请显示模组10和背光模组20层叠的截面示意图,图3是本申请背光模组20的分解结构示意图。2 and FIG. 3, FIG. 2 is a schematic cross-sectional view showing a stack of the display module 10 and the backlight module 20 of the present application, and FIG. 3 is a schematic exploded view of the backlight module 20 of the present application.
背光模组20可以包括上增光片21、下增光片22、扩散板23、导光板24、反光片25和LED模组50等零件。其中,显示模组10、上增光片21、下增光片22、扩散板23、导光板24和反光片25依次层叠设置,LED模组50的出光面501与导光板24的进光面241对齐。The backlight module 20 may include components such as an upper brightness enhancement sheet 21, a lower brightness enhancement sheet 22, a diffusion plate 23, a light guide plate 24, a light reflection sheet 25, and an LED module 50. The display module 10, the upper brightness enhancement sheet 21, the lower brightness enhancement sheet 22, the diffusion plate 23, the light guide plate 24, and the light reflection sheet 25 are sequentially stacked, and the light exit surface 501 of the LED module 50 is aligned with the light incident surface 241 of the light guide plate 24. .
LED模组50发出的光经过导光板24的传导作用而传播的更远,扩散板23将光打散变均匀,反光片25将漏掉的光反射至扩散板23,上增光片21、下增光片22将经过扩散板23传出的光的光路变成垂直于显示模组10,以增强显示模组10的显示亮度。The light emitted by the LED module 50 travels farther through the conduction of the light guide plate 24, the diffuser plate 23 scatters the light evenly, and the reflective sheet 25 reflects the leaked light to the diffuser plate 23, and the upper brightness enhancement sheet 21 and the lower portion The light-increasing sheet 22 turns the optical path of the light transmitted through the diffusing plate 23 perpendicular to the display module 10 to enhance the display brightness of the display module 10.
显示模组10包括显示区域和非显示区域,非显示区域通常用于设置背光模组的LED模组50等,显示区域用于将电子装置接收的信息显示给用户。显示模组10在同等外形尺寸下,要实现更大的显示区域,则需要想办法缩短非显示区域的尺寸,而LED模组50的尺寸大小是一个关键因素。具体地,在显示模组10的外形尺寸一定的前提下,LED模组50的在垂直于其出光面501方向上的体积越小,则非显示区域的尺寸就越小,相应地,显示区域的尺寸就越大。The display module 10 includes a display area and a non-display area. The non-display area is generally used to set the LED module 50 of the backlight module, and the display area is used to display information received by the electronic device to the user. In order to achieve a larger display area under the same external dimensions, the display module 10 needs to find a way to shorten the size of the non-display area, and the size of the LED module 50 is a key factor. Specifically, under the premise that the external dimensions of the display module 10 are constant, the smaller the volume of the LED module 50 in the direction perpendicular to the light exit surface 501, the smaller the size of the non-display area, and correspondingly, the display area. The size is larger.
请参阅图4,图4是本申请LED模组50的立体结构示意图。Please refer to FIG. 4. FIG. 4 is a schematic perspective view of the LED module 50 of the present application.
LED模组50可以包括LED光源51和电路板52,电路板52上设置有焊盘(图上未显示),LED光源51焊接在焊盘上,以使LED光源51和电路板52电性连接。The LED module 50 can include an LED light source 51 and a circuit board 52. The circuit board 52 is provided with a pad (not shown). The LED light source 51 is soldered on the pad to electrically connect the LED light source 51 and the circuit board 52. .
LED光源51的数量为多个,LED光源51可以在电路板52上排成一列,LED光源51也可以在电路板52上排成多列,在电路板52上围成三角形、四边形、圆形或者异性等等,其中LED光源51的出光面501与导光板24垂直于扩散板23(请参阅图)的任一侧面对齐。The number of LED light sources 51 is plural, and the LED light sources 51 may be arranged in a row on the circuit board 52. The LED light sources 51 may also be arranged in a plurality of rows on the circuit board 52, and are surrounded by a triangle, a quadrangle, and a circle on the circuit board 52. Or an opposite sex or the like, in which the light-emitting surface 501 of the LED light source 51 and the light guide plate 24 are aligned perpendicular to either side of the diffusion plate 23 (see the figure).
电路板52可以是硬质PCB板,硬质PCB板散热好,且LED光源51焊接的稳定牢固。电路板52也可以是柔性FPC板,柔性FPC板厚度小,可以减小LED光源51在平行于其出光面501方向上的尺寸。The circuit board 52 can be a rigid PCB board, the hard PCB board is well cooled, and the LED light source 51 is soldered stably and firmly. The circuit board 52 can also be a flexible FPC board having a small thickness that can reduce the size of the LED light source 51 in a direction parallel to its light exit surface 501.
请参阅图5,图5是本申请LED光源51一实施例的立体结构示意图。Please refer to FIG. 5. FIG. 5 is a schematic perspective structural view of an embodiment of the LED light source 51 of the present application.
LED光源51可以包括发光体53、支架54和极片55,支架54设置有出光面501,发光体53封装于支架54内,发光体53发出的光线从出光面501射出,极片55分别与发光体53和电路板52的焊盘(图上未显示)连接,以使电路板52与发光体53电性连接。The LED light source 51 can include an illuminator 53, a bracket 54 and a pole piece 55. The bracket 54 is provided with a light-emitting surface 501. The illuminant 53 is enclosed in the bracket 54. The light emitted by the illuminant 53 is emitted from the light-emitting surface 501, and the pole piece 55 is respectively The illuminator 53 is connected to a pad (not shown) of the circuit board 52 to electrically connect the circuit board 52 to the illuminator 53.
支架54可以为塑胶件,极片55可以为金属件,支架54与极片55可以通过一体注塑的方式制成为一体注塑结构,支架54与极片55也可以分开制作,然后装配在一起。The bracket 54 may be a plastic piece, the pole piece 55 may be a metal piece, and the bracket 54 and the pole piece 55 may be integrally molded by integral injection molding, and the bracket 54 and the pole piece 55 may also be separately manufactured and then assembled.
请同时参阅图6,图6是图5中极片55和支架54的分解结构示意图。极片55可以包括第一极片56和第二极片57,第一极片56和第二极片57间隔设置以使彼此相互绝缘。Please refer to FIG. 6 at the same time. FIG. 6 is a schematic exploded view of the pole piece 55 and the bracket 54 of FIG. The pole piece 55 may include a first pole piece 56 and a second pole piece 57, the first pole piece 56 and the second pole piece 57 being spaced apart to insulate each other.
第一极片56可以包括第一主体部561和第一焊接部562,第一主体部561封装于支架54内,并与发光体(请参阅图5中发光体53)电性连接,第一焊接部562从第一主体部561上朝向远离出光面501延伸设置,并在远离出光面501的一端弯折凸出形成第一凸出部563,第一凸出部563和第一焊接部562用于与电路板(图上未显示)焊接连接,以增加第一极片56与电路板的焊接面积。第一焊接部562可以在远离出光面501的一端平行于出光面501弯折凸出形成第一凸出部563,第一焊接部562也可以在远离出光面501的一端朝向于出光面501弯折凸出形成第一凸出部563,在此不做限定。The first pole piece 56 may include a first body portion 561 and a first soldering portion 562. The first body portion 561 is encapsulated in the bracket 54 and electrically connected to the illuminant (refer to the illuminant 53 in FIG. 5). The soldering portion 562 extends from the first main body portion 561 toward the distance from the light emitting surface 501, and is bent and protruded at an end away from the light emitting surface 501 to form a first protruding portion 563, the first protruding portion 563 and the first soldering portion 562. It is used for soldering connection with a circuit board (not shown) to increase the soldering area of the first pole piece 56 and the circuit board. The first soldering portion 562 may be bent and protruded parallel to the light emitting surface 501 at one end away from the light emitting surface 501 to form a first protruding portion 563. The first soldering portion 562 may also be bent toward the light emitting surface 501 at an end away from the light emitting surface 501. The first protrusion 563 is formed by folding and folding, which is not limited herein.
第一焊接部562的形状可以是方形、圆形、三角形或者异性,在此不做限定。The shape of the first welded portion 562 may be square, circular, triangular or opposite, which is not limited herein.
第二极片57可以包括第二主体部571和第二焊接部572,第二主体部571封装于支架54内,并与发光体(请参阅图5中发光体53)电性连接,第二焊接 部572从第二主体部571上朝向远离出光面501延伸设置,并在远离出光面501的一端弯折凸出形成第二凸出部573,第二凸出部573和第二焊接部572用于与电路板焊接连接,以增加第二极片57与电路板的焊接面积。第二焊接部572可以在远离出光面501的一端平行于出光面501弯折凸出形成第二凸出部573,第二焊接部572也可以在远离出光面501的一端朝向于出光面501弯折凸出形成第二凸出部573,在此不做限定。The second pole piece 57 may include a second body portion 571 and a second soldering portion 572. The second body portion 571 is encapsulated in the bracket 54 and electrically connected to the illuminant (refer to the illuminant 53 in FIG. 5). The soldering portion 572 extends from the second main body portion 571 toward the distance from the light emitting surface 501, and is bent and protruded at an end away from the light emitting surface 501 to form a second protruding portion 573, the second protruding portion 573 and the second soldering portion 572. It is used for soldering connection with the circuit board to increase the soldering area of the second pole piece 57 and the circuit board. The second soldering portion 572 can be bent and protruded parallel to the light exiting surface 501 to form a second protruding portion 573. The second soldering portion 572 can also be bent toward the light emitting surface 501 at an end away from the light emitting surface 501. The second protrusion 573 is formed by folding and forming, which is not limited herein.
第二焊接部572的形状可以是方形、圆形、三角形或者异性,在此不做限定。The shape of the second soldering portion 572 may be square, circular, triangular or opposite, which is not limited herein.
支架54包括长度方向、厚度方向和宽度方向,长度方向、厚度方向和宽度方向彼此相互垂直,宽度方向垂直于出光面501。第一焊接部562和第二焊接部572在支架54的长度方向上设置在支架54的相对两端。第一凸出部563和第二凸出部573相对设置。The bracket 54 includes a longitudinal direction, a thickness direction, and a width direction, and the longitudinal direction, the thickness direction, and the width direction are perpendicular to each other, and the width direction is perpendicular to the light exit surface 501. The first welded portion 562 and the second welded portion 572 are disposed at opposite ends of the bracket 54 in the longitudinal direction of the bracket 54. The first protruding portion 563 and the second protruding portion 573 are oppositely disposed.
在本实施例中,通过减小第一焊接部562和第二焊接部572在垂直于出光面501的方向上的尺寸,来达到LED光源的在垂直于出光面501方向上的体积减小的目的。但是为了不影响LED光源与电路板的焊接稳定性。本申请在第一焊接部562和第二焊接部572上分别凸出设置第一凸出部563和第二凸出部573,第一凸出部563和第二凸出部573平行或者朝向出光面501的方向上凸出设置,在不增加LED光源在垂直于出光面501方向上的体积的前提下,增大了LED光源与电路板的焊接面积,从而保证了LED光源与电路板的焊接稳定性。In the present embodiment, by reducing the size of the first soldering portion 562 and the second soldering portion 572 in a direction perpendicular to the light-emitting surface 501, the volume of the LED light source in the direction perpendicular to the light-emitting surface 501 is reduced. purpose. However, in order not to affect the welding stability of the LED light source and the circuit board. The first protruding portion 563 and the second protruding portion 573 are respectively protruded from the first soldering portion 562 and the second soldering portion 572, and the first protruding portion 563 and the second protruding portion 573 are parallel or directed toward the light. The surface of the surface 501 is convexly disposed, and the welding area of the LED light source and the circuit board is increased without increasing the volume of the LED light source in the direction perpendicular to the light-emitting surface 501, thereby ensuring welding of the LED light source and the circuit board. stability.
第一极片56进一步包括沿第一焊接部562的一侧折弯设置的第一折弯部564,第一折弯部564和第一凸出部563可以设置在第一焊接部562的相对两侧,第一折弯部564贴靠在支架54上,第一折弯部564用于增加第一极片56与支架54的接触面积,进而提高第一极片56与支架54连接的稳定性,进一步地,第一折弯部564向支架54厚度方向折弯。第一折弯部564也可以和第一凸出部563设置在第一焊接部562的同一侧,在此不做限定。The first pole piece 56 further includes a first bent portion 564 that is bent along one side of the first welded portion 562. The first bent portion 564 and the first protruding portion 563 may be disposed at the opposite side of the first welded portion 562. On both sides, the first bent portion 564 abuts on the bracket 54 , and the first bent portion 564 is used to increase the contact area between the first pole piece 56 and the bracket 54 , thereby improving the stability of the connection between the first pole piece 56 and the bracket 54 . Further, the first bent portion 564 is bent in the thickness direction of the bracket 54. The first bent portion 564 may be disposed on the same side of the first welded portion 562 as the first protruding portion 563, which is not limited herein.
第二极片57进一步包括沿第二焊接部572的一侧折弯设置的第二折弯部574,第二折弯部574和第二凸出部573可以设置在第二焊接部572的相对两侧,第二折弯部574贴靠在支架54上,第二折弯部574用于增加第二极片57与支架54的接触面积,进而提高第二极片57与支架54连接的稳定性,进一步地,第二折弯部574向支架54厚度方向折弯。第二折弯部574也可以和第二凸出部 573设置在第二焊接部572的同一侧,在此不做限定。The second pole piece 57 further includes a second bent portion 574 which is bent along one side of the second welded portion 572, and the second bent portion 574 and the second protruding portion 573 may be disposed at the opposite side of the second welded portion 572 On both sides, the second bent portion 574 abuts on the bracket 54 , and the second bent portion 574 is used to increase the contact area between the second pole piece 57 and the bracket 54 , thereby improving the stability of the connection between the second pole piece 57 and the bracket 54 . Further, the second bent portion 574 is bent in the thickness direction of the bracket 54. The second bent portion 574 may be disposed on the same side of the second welded portion 572 as the second protruding portion 573, which is not limited herein.
支架54包括收容部541和密封部542,发光体容置于收容部541中,密封部542与收容部541连接以密封收容部541,收容部541远离密封部542的端面为出光面501。The bracket 54 includes a receiving portion 541 and a sealing portion 542. The illuminating body is housed in the accommodating portion 541. The sealing portion 542 is connected to the accommodating portion 541 to seal the accommodating portion 541. The end surface of the accommodating portion 541 away from the sealing portion 542 is a light emitting surface 501.
第一主体部561和第二主体部571可以嵌设于密封部542内且与出光面501平行,以与发光体层叠设置。第一主体部561和第二主体部571也可以嵌设于收容部541内且与出光面501平行,以与发光体层叠设置。第一焊接部562和第二焊接部572分别贴靠密封部542朝向电路板的表面。The first body portion 561 and the second body portion 571 may be embedded in the sealing portion 542 and parallel to the light exit surface 501 to be laminated with the illuminant. The first body portion 561 and the second body portion 571 may be embedded in the accommodating portion 541 and parallel to the light-emitting surface 501 to be laminated with the illuminant. The first soldering portion 562 and the second soldering portion 572 abut against the sealing portion 542 toward the surface of the circuit board, respectively.
进一步地,密封部542设置有第一容置槽543和第二容置槽544,第一容置槽543和第二容置槽544设置在密封部542的长度方向上的相对两端,第一焊接部562从第一主体部561上沿第一容置槽543的底壁延伸设置,且第一凸出部563容置在第一容置槽543内,以降低LED光源在支架54厚度方向上的体积。第二焊接部572从第二主体部571上沿第二容置槽544的底壁延伸设置,且第二凸出部573容置在第二容置槽544内,以降低LED光源在支架54厚度方向上的体积。Further, the sealing portion 542 is provided with a first accommodating groove 543 and a second accommodating groove 544. The first accommodating groove 543 and the second accommodating groove 544 are disposed at opposite ends of the sealing portion 542 in the longitudinal direction. A soldering portion 562 extends from the first body portion 561 along the bottom wall of the first receiving groove 543, and the first protruding portion 563 is received in the first receiving groove 543 to reduce the thickness of the LED light source in the bracket 54. The volume in the direction. The second soldering portion 572 extends from the second body portion 571 along the bottom wall of the second receiving groove 544, and the second protruding portion 573 is received in the second receiving groove 544 to reduce the LED light source in the bracket 54. Volume in the thickness direction.
可选地,第一容置槽543的形状可以为L型,即第一容置槽543在支架54的厚度方向上进一步延伸设置,进而第一折弯部564容置在第一容置槽543内,从而降低支架54在长度方向上的体积。第二容置槽544的形状可以为L型,即第二容置槽544在支架54的厚度方向上进一步延伸设置,进而第二折弯部574容置在第二容置槽544内,从而降低支架54在长度方向上的体积。Optionally, the shape of the first accommodating groove 543 may be L-shaped, that is, the first accommodating groove 543 further extends in the thickness direction of the bracket 54 , and the first bending portion 564 is received in the first accommodating groove. Within 543, thereby reducing the volume of the bracket 54 in the length direction. The shape of the second accommodating groove 544 may be L-shaped, that is, the second accommodating groove 544 is further extended in the thickness direction of the bracket 54 , and the second bent portion 574 is received in the second accommodating groove 544 , thereby The volume of the bracket 54 in the length direction is reduced.
具体地,第一焊接部562和第二焊接部572远离出光面501的一端不超出密封部542。即密封部542远离出光面501的一端的端面可以与第一焊接部562和第二焊接部572对应的端面齐平,密封部542远离出光面501的一端的端面也可以超出第一焊接部562和第二焊接部572对应的端面。Specifically, the one end of the first welded portion 562 and the second welded portion 572 away from the light-emitting surface 501 does not exceed the sealing portion 542 . That is, the end surface of the sealing portion 542 away from the one end of the light-emitting surface 501 may be flush with the end surface corresponding to the first soldering portion 562 and the second soldering portion 572, and the end surface of the sealing portion 542 away from the end of the light-emitting surface 501 may also exceed the first soldering portion 562. An end surface corresponding to the second welded portion 572.
密封部542背离收容部541的一端设置有散热槽545,以增大发光体的散热面积。此外,当支架54为塑胶件时,散热槽545处可以作为注胶口,进而将注胶口的凸出部分容置在散热槽545内,从而支架54在垂直出光面501的方向上的尺寸减小。A heat dissipating groove 545 is provided at one end of the sealing portion 542 facing away from the accommodating portion 541 to increase the heat dissipating area of the illuminating body. In addition, when the bracket 54 is a plastic member, the heat sink 545 can serve as a glue injection port, and the protruding portion of the glue injection port is received in the heat dissipation groove 545, so that the size of the bracket 54 in the direction of the vertical light exit surface 501. Reduced.
以上所述仅为本申请的实施方式,并非因此限制本申请的专利范围,凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换,或直接或间接 运用在其它相关的技术领域,均同理包括在本申请的专利保护范围内。The above description is only the embodiment of the present application, and thus does not limit the scope of the patent application, and the equivalent structure or equivalent process transformation made by using the specification and the drawings of the present application, or directly or indirectly applied to other related technologies. The fields are all included in the scope of patent protection of this application.

Claims (20)

  1. 一种LED光源,其特征在于,包括:发光体、支架和极片,所述支架设置有出光面,所述发光体封装于所述支架内,且所述发光体发出的光线从所述出光面射出;An LED light source, comprising: an illuminant, a bracket and a pole piece, the bracket is provided with a light emitting surface, the illuminant is encapsulated in the bracket, and light emitted by the illuminator is emitted from the light Shot out
    所述极片包括第一极片和第二极片,所述第一极片包括第一主体部和第一焊接部,所述第二极片包括第二主体部和第二焊接部,所述第一主体部和所述第二主体部封装于所述支架内,并与所述发光体电性连接,所述第一焊接部从所述第一主体部上朝向远离所述出光面延伸设置,并在远离所述出光面的一端弯折凸出形成第一凸出部,所述第二焊接部从所述第二主体部上朝向远离所述出光面延伸设置,并在远离所述出光面的一端弯折凸出形成第二凸出部,所述第一凸出部和所述第二凸出部相对设置,以增加所述第一焊接部和所述第二焊接部分别与电路板的焊接面积。The pole piece includes a first pole piece and a second pole piece, the first pole piece includes a first body portion and a first welded portion, and the second pole piece includes a second body portion and a second welded portion, The first body portion and the second body portion are encapsulated in the bracket and electrically connected to the illuminator, and the first soldering portion extends from the first body portion toward the light exiting surface Arranging and bending at an end away from the light-emitting surface to form a first protrusion, the second soldering portion extending from the second body portion away from the light-emitting surface, and away from the One end of the light-emitting surface is bent and protrudes to form a second protruding portion, and the first protruding portion and the second protruding portion are oppositely disposed to increase the first welded portion and the second welded portion respectively The soldering area of the board.
  2. 根据权利要求1所述的LED光源,其特征在于,The LED light source of claim 1 wherein
    所述第一主体部和所述第二主体部分别与所述发光体层叠设置,且相互隔开。The first body portion and the second body portion are respectively laminated with the illuminants and spaced apart from each other.
  3. 根据权利要求1所述的LED光源,其特征在于,The LED light source of claim 1 wherein
    所述支架包括收容部和密封部,所述发光体容置于所述收容部中,所述密封部与所述收容部连接以密封所述收容部,所述收容部远离所述密封部的端面为所述出光面,所述第一主体部和所述第二主体部嵌设于所述收容部内且与所述出光面平行,所述第一焊接部和所述第二焊接部分别贴靠所述密封部的表面。The bracket includes a receiving portion and a sealing portion, wherein the illuminating body is received in the accommodating portion, and the sealing portion is connected to the accommodating portion to seal the accommodating portion, wherein the accommodating portion is away from the sealing portion The first main body portion and the second main body portion are embedded in the accommodating portion and parallel to the illuminating surface, and the first welded portion and the second welded portion are respectively attached Relying on the surface of the seal.
  4. 根据权利要求3所述的LED光源,其特征在于,The LED light source of claim 3, wherein
    所述密封部设置有第一容置槽和第二容置槽,所述第一容置槽和所述第二容置槽设置在所述密封部的相对两端,所述第一焊接部从所述第一主体部上沿所述第一容置槽的底壁延伸设置,所述第一凸出部容置在所述第一容置槽内,所述第二焊接部从所述第二主体部上沿所述第二容置槽的底壁延伸设置,所述第二凸出部容置在所述第二容置槽内。The sealing portion is provided with a first accommodating groove and a second accommodating groove, and the first accommodating groove and the second accommodating groove are disposed at opposite ends of the sealing portion, the first welded portion Extending from the first body portion along the bottom wall of the first accommodating groove, the first protruding portion is received in the first accommodating groove, and the second welded portion is from the The second body portion extends along a bottom wall of the second receiving groove, and the second protruding portion is received in the second receiving groove.
  5. 根据权利要求4所述的LED光源,其特征在于,The LED light source of claim 4, wherein
    所述第一极片进一步包括沿所述第一焊接部的一侧折弯设置的第一折弯部,所述第一折弯部和所述第一凸出部设置在所述第一焊接部的相对两侧,所述第二极片进一步包括沿所述第二焊接部的一侧折弯设置的第二折弯部,所述 第二折弯部和所述第二凸出部设置在所述第二焊接部的相对两侧,所述第一折弯部和所述第二折弯部贴靠在所述密封部上。The first pole piece further includes a first bent portion that is bent along one side of the first welded portion, the first bent portion and the first protruding portion being disposed at the first welding The second pole piece further includes a second bent portion disposed along one side of the second welded portion, and the second bent portion and the second protruding portion are disposed on opposite sides of the portion The first bent portion and the second bent portion abut against the sealing portion on opposite sides of the second welded portion.
  6. 根据权利要求5所述的LED光源,其特征在于,The LED light source of claim 5, wherein
    所述第一折弯部进一步沿所述焊接部的厚度方向折弯设置,所述第一容置槽的形状为L型,所述第一折弯部容置在所述第一容置槽内,所述第二折弯部进一步沿所述焊接部的厚度方向折弯设置,所述第二容置槽的形状为L型,所述第二折弯部容置在所述第二容置槽内。The first bent portion is further bent in a thickness direction of the welded portion, the shape of the first receiving groove is L-shaped, and the first bent portion is received in the first receiving groove The second bent portion is further bent along a thickness direction of the welded portion, the second receiving groove has an L shape, and the second bent portion is received in the second portion Set in the slot.
  7. 根据权利要求3所述的LED光源,其特征在于,The LED light source of claim 3, wherein
    所述密封部的背离所述出光面的一端设置有散热槽。A heat dissipating groove is disposed at one end of the sealing portion facing away from the light emitting surface.
  8. 一种LED模组,其特征在于,包括:电路板和LED光源,所述电路板设置有焊盘,所述LED光源与所述焊盘电性连接;An LED module, comprising: a circuit board and an LED light source, wherein the circuit board is provided with a pad, and the LED light source is electrically connected to the pad;
    所述LED光源包括发光体、支架和极片,所述支架设置有出光面,所述发光体封装于所述支架内,且所述发光体发出的光线从所述出光面射出;The LED light source includes an illuminant, a bracket and a pole piece, the bracket is provided with a light emitting surface, the illuminant is encapsulated in the bracket, and light emitted by the illuminating body is emitted from the light emitting surface;
    所述极片包括第一极片和第二极片,所述第一极片包括第一主体部和第一焊接部,所述第二极片包括第二主体部和第二焊接部,所述第一主体部和所述第二主体部封装于所述支架内,并与所述发光体电性连接,所述第一焊接部从所述第一主体部上朝向远离所述出光面延伸设置,并在远离所述出光面的一端弯折凸出形成第一凸出部,所述第二焊接部从所述第二主体部上朝向远离所述出光面延伸设置,并在远离所述出光面的一端弯折凸出形成第二凸出部,所述第一凸出部和所述第二凸出部相对设置,以增加所述第一焊接部和所述第二焊接部分别与所述焊盘的焊接面积。The pole piece includes a first pole piece and a second pole piece, the first pole piece includes a first body portion and a first welded portion, and the second pole piece includes a second body portion and a second welded portion, The first body portion and the second body portion are encapsulated in the bracket and electrically connected to the illuminator, and the first soldering portion extends from the first body portion toward the light exiting surface Arranging and bending at an end away from the light-emitting surface to form a first protrusion, the second soldering portion extending from the second body portion away from the light-emitting surface, and away from the One end of the light-emitting surface is bent and protrudes to form a second protruding portion, and the first protruding portion and the second protruding portion are oppositely disposed to increase the first welded portion and the second welded portion respectively The soldering area of the pad.
  9. 根据权利要求8述的LED模组,其特征在于,The LED module of claim 8 wherein:
    所述支架包括收容部和密封部,所述发光体容置于所述收容部中,所述密封部与所述收容部连接以密封所述收容部,所述收容部远离所述密封部的端面为所述出光面,所述第一主体部和所述第二主体部嵌设于所述收容部内且与所述出光面平行,所述第一焊接部和所述第二焊接部分别贴靠所述密封部的表面。The bracket includes a receiving portion and a sealing portion, wherein the illuminating body is received in the accommodating portion, and the sealing portion is connected to the accommodating portion to seal the accommodating portion, wherein the accommodating portion is away from the sealing portion The first main body portion and the second main body portion are embedded in the accommodating portion and parallel to the illuminating surface, and the first welded portion and the second welded portion are respectively attached Relying on the surface of the seal.
  10. 根据权利要求9所述的LED模组,其特征在于,The LED module according to claim 9, wherein
    所述密封部设置有第一容置槽和第二容置槽,所述第一容置槽和所述第二容置槽设置在所述密封部的相对两端,所述第一焊接部从所述第一主体部上沿所述第一容置槽的底壁延伸设置,所述第一凸出部容置在所述第一容置槽内,所述第二焊接部从所述第二主体部上沿所述第二容置槽的底壁延伸设置,所述 第二凸出部容置在所述第二容置槽内。The sealing portion is provided with a first accommodating groove and a second accommodating groove, and the first accommodating groove and the second accommodating groove are disposed at opposite ends of the sealing portion, the first welded portion Extending from the first body portion along the bottom wall of the first accommodating groove, the first protruding portion is received in the first accommodating groove, and the second welded portion is from the The second body portion extends along a bottom wall of the second receiving groove, and the second protruding portion is received in the second receiving groove.
  11. 根据权利要求10所述的LED模组,其特征在于,The LED module of claim 10, wherein
    所述第一极片进一步包括沿所述第一焊接部的一侧折弯设置的第一折弯部,所述第一折弯部和所述第一凸出部设置在所述第一焊接部的相对两侧,所述第二极片进一步包括沿所述第二焊接部的一侧折弯设置的第二折弯部,所述第二折弯部和所述第二凸出部设置在所述第二焊接部的相对两侧,所述第一折弯部和所述第二折弯部贴靠在所述密封部上。The first pole piece further includes a first bent portion that is bent along one side of the first welded portion, the first bent portion and the first protruding portion being disposed at the first welding The second pole piece further includes a second bent portion disposed along one side of the second welded portion, and the second bent portion and the second protruding portion are disposed on opposite sides of the portion The first bent portion and the second bent portion abut against the sealing portion on opposite sides of the second welded portion.
  12. 根据权利要求11所述的LED模组,其特征在于,The LED module of claim 11 wherein:
    所述第一折弯部进一步沿所述焊接部的厚度方向折弯设置,所述第一容置槽的形状为L型,所述第一折弯部容置在所述第一容置槽内,所述第二折弯部进一步沿所述焊接部的厚度方向折弯设置,所述第二容置槽的形状为L型,所述第二折弯部容置在所述第二容置槽内。The first bent portion is further bent in a thickness direction of the welded portion, the shape of the first receiving groove is L-shaped, and the first bent portion is received in the first receiving groove The second bent portion is further bent along a thickness direction of the welded portion, the second receiving groove has an L shape, and the second bent portion is received in the second portion Set in the slot.
  13. 一种背光模组,其特征在于,包括:扩散板、导光板、电路板和LED光源,所述导光板与所述扩散板层叠设置,所述LED光源与所述电路板电性连接,所述LED光源的出光面与所述导光板的进光面对齐;A backlight module, comprising: a diffusion plate, a light guide plate, a circuit board, and an LED light source, wherein the light guide plate and the diffusion plate are stacked, and the LED light source is electrically connected to the circuit board. The light emitting surface of the LED light source is aligned with the light incident surface of the light guide plate;
    所述LED光源包括发光体、支架和极片,所述支架设置有所述出光面,所述发光体封装于所述支架内,且所述发光体发出的光线从所述出光面射出;The LED light source includes an illuminator, a bracket and a pole piece, the bracket is provided with the illuminating surface, the illuminant is encapsulated in the bracket, and light emitted by the illuminating body is emitted from the illuminating surface;
    所述极片包括第一极片和第二极片,所述第一极片包括第一主体部和第一焊接部,所述第二极片包括第二主体部和第二焊接部,所述第一主体部和所述第二主体部封装于所述支架内,并与所述发光体电性连接,所述第一焊接部从所述第一主体部上朝向远离所述出光面延伸设置,并在远离所述出光面的一端弯折凸出形成第一凸出部,所述第二焊接部从所述第二主体部上朝向远离所述出光面延伸设置,并在远离所述出光面的一端弯折凸出形成第二凸出部,所述第一凸出部和所述第二凸出部相对设置,以增加所述第一焊接部和所述第二焊接部分别与所述电路板的焊接面积。The pole piece includes a first pole piece and a second pole piece, the first pole piece includes a first body portion and a first welded portion, and the second pole piece includes a second body portion and a second welded portion, The first body portion and the second body portion are encapsulated in the bracket and electrically connected to the illuminator, and the first soldering portion extends from the first body portion toward the light exiting surface Arranging and bending at an end away from the light-emitting surface to form a first protrusion, the second soldering portion extending from the second body portion away from the light-emitting surface, and away from the One end of the light-emitting surface is bent and protrudes to form a second protruding portion, and the first protruding portion and the second protruding portion are oppositely disposed to increase the first welded portion and the second welded portion respectively The soldering area of the board.
  14. 根据权利要求13述的背光模组,其特征在于,A backlight module according to claim 13, wherein
    所述支架包括收容部和密封部,所述发光体容置于所述收容部中,所述密封部与所述收容部连接以密封所述收容部,所述收容部远离所述密封部的端面为所述出光面,所述第一主体部和所述第二主体部嵌设于所述收容部内且与所述出光面平行,所述第一焊接部和所述第二焊接部分别贴靠所述密封部的表面。The bracket includes a receiving portion and a sealing portion, wherein the illuminating body is received in the accommodating portion, and the sealing portion is connected to the accommodating portion to seal the accommodating portion, wherein the accommodating portion is away from the sealing portion The first main body portion and the second main body portion are embedded in the accommodating portion and parallel to the illuminating surface, and the first welded portion and the second welded portion are respectively attached Relying on the surface of the seal.
  15. 根据权利要求14所述的背光模组,其特征在于,The backlight module of claim 14, wherein
    所述密封部设置有第一容置槽和第二容置槽,所述第一容置槽和所述第二容置槽设置在所述密封部的相对两端,所述第一焊接部从所述第一主体部上沿所述第一容置槽的底壁延伸设置,所述第一凸出部容置在所述第一容置槽内,所述第二焊接部从所述第二主体部上沿所述第二容置槽的底壁延伸设置,所述第二凸出部容置在所述第二容置槽内。The sealing portion is provided with a first accommodating groove and a second accommodating groove, and the first accommodating groove and the second accommodating groove are disposed at opposite ends of the sealing portion, the first welded portion Extending from the first body portion along the bottom wall of the first accommodating groove, the first protruding portion is received in the first accommodating groove, and the second welded portion is from the The second body portion extends along a bottom wall of the second receiving groove, and the second protruding portion is received in the second receiving groove.
  16. 根据权利要求15所述的背光模组,其特征在于,The backlight module according to claim 15, wherein
    所述第一极片进一步包括沿所述第一焊接部的一侧折弯设置的第一折弯部,所述第一折弯部和所述第一凸出部设置在所述第一焊接部的相对两侧,所述第二极片进一步包括沿所述第二焊接部的一侧折弯设置的第二折弯部,所述第二折弯部和所述第二凸出部设置在所述第二焊接部的相对两侧,所述第一折弯部和所述第二折弯部贴靠在所述密封部上。The first pole piece further includes a first bent portion that is bent along one side of the first welded portion, the first bent portion and the first protruding portion being disposed at the first welding The second pole piece further includes a second bent portion disposed along one side of the second welded portion, and the second bent portion and the second protruding portion are disposed on opposite sides of the portion The first bent portion and the second bent portion abut against the sealing portion on opposite sides of the second welded portion.
  17. 根据权利要求16所述的背光模组,其特征在于,The backlight module of claim 16, wherein
    所述第一折弯部进一步沿所述焊接部的厚度方向折弯设置,所述第一容置槽的形状为L型,所述第一折弯部容置在所述第一容置槽内,所述第二折弯部进一步沿所述焊接部的厚度方向折弯设置,所述第二容置槽的形状为L型,所述第二折弯部容置在所述第二容置槽内。The first bent portion is further bent in a thickness direction of the welded portion, the shape of the first receiving groove is L-shaped, and the first bent portion is received in the first receiving groove The second bent portion is further bent along a thickness direction of the welded portion, the second receiving groove has an L shape, and the second bent portion is received in the second portion Set in the slot.
  18. 一种电子装置,其特征在于,包括:显示模组、扩散板、导光板、电路板和LED光源,所述显示模组、所述扩散板和所述导光板依次层叠设置,所述LED光源与所述电路板电性连接,所述LED光源的出光面与所述导光板的进光面对齐;An electronic device, comprising: a display module, a diffusion plate, a light guide plate, a circuit board, and an LED light source, wherein the display module, the diffusion plate and the light guide plate are sequentially stacked, the LED light source Electrically connecting with the circuit board, the light emitting surface of the LED light source is aligned with the light incident surface of the light guide plate;
    所述LED光源包括发光体、支架和极片,所述支架设置有所述出光面,所述发光体封装于所述支架内,且所述发光体发出的光线从所述出光面射出;The LED light source includes an illuminator, a bracket and a pole piece, the bracket is provided with the illuminating surface, the illuminant is encapsulated in the bracket, and light emitted by the illuminating body is emitted from the illuminating surface;
    所述极片包括第一极片和第二极片,所述第一极片包括第一主体部和第一焊接部,所述第二极片包括第二主体部和第二焊接部,所述第一主体部和所述第二主体部封装于所述支架内,并与所述发光体电性连接,所述第一焊接部从所述第一主体部上朝向远离所述出光面延伸设置,并在远离所述出光面的一端弯折凸出形成第一凸出部,所述第二焊接部从所述第二主体部上朝向远离所述出光面延伸设置,并在远离所述出光面的一端弯折凸出形成第二凸出部,所述第一凸出部和所述第二凸出部相对设置,以增加所述第一焊接部和所述第二焊接部分别与电路板的焊接面积。The pole piece includes a first pole piece and a second pole piece, the first pole piece includes a first body portion and a first welded portion, and the second pole piece includes a second body portion and a second welded portion, The first body portion and the second body portion are encapsulated in the bracket and electrically connected to the illuminator, and the first soldering portion extends from the first body portion toward the light exiting surface Arranging and bending at an end away from the light-emitting surface to form a first protrusion, the second soldering portion extending from the second body portion away from the light-emitting surface, and away from the One end of the light-emitting surface is bent and protrudes to form a second protruding portion, and the first protruding portion and the second protruding portion are oppositely disposed to increase the first welded portion and the second welded portion respectively The soldering area of the board.
  19. 根据权利要求18所述的LED光源,其特征在于,The LED light source of claim 18, wherein
    所述第一主体部和所述第二主体部分别与所述发光体层叠设置,且相互隔开。The first body portion and the second body portion are respectively laminated with the illuminants and spaced apart from each other.
  20. 根据权利要求18所述的LED光源,其特征在于,The LED light source of claim 18, wherein
    所述支架包括收容部和密封部,所述发光体容置于所述收容部中,所述密封部与所述收容部连接以密封所述收容部,所述收容部远离所述密封部的端面为所述出光面,所述第一主体部和所述第二主体部嵌设于所述收容部内且与所述出光面平行,所述第一焊接部和所述第二焊接部分别贴靠所述密封部的表面。The bracket includes a receiving portion and a sealing portion, wherein the illuminating body is received in the accommodating portion, and the sealing portion is connected to the accommodating portion to seal the accommodating portion, wherein the accommodating portion is away from the sealing portion The first main body portion and the second main body portion are embedded in the accommodating portion and parallel to the illuminating surface, and the first welded portion and the second welded portion are respectively attached Relying on the surface of the seal.
PCT/CN2019/072188 2018-02-01 2019-01-17 Led light source, led module, backlight module and electronic device WO2019149081A1 (en)

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CN207796762U (en) * 2018-02-01 2018-08-31 广东欧珀移动通信有限公司 A kind of LED light source, LED module, backlight module and a kind of electronic device

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