CN205016527U - Cover brilliant camera case chip - Google Patents
Cover brilliant camera case chip Download PDFInfo
- Publication number
- CN205016527U CN205016527U CN201520749760.2U CN201520749760U CN205016527U CN 205016527 U CN205016527 U CN 205016527U CN 201520749760 U CN201520749760 U CN 201520749760U CN 205016527 U CN205016527 U CN 205016527U
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- pad
- conductive projection
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- camera
- chip
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Abstract
The utility model provides a cover brilliant camera case chip, involves camera packaging structure technical field. It is big that there is the production degree of difficulty in the current camera chip package structure of solution, and technique with high costs is not enough, the structure including: first base plate, second base plate, camera nude film and infra -red filter, first base plate is double -side circuit board, and its tow sides are equipped with first pad respectively, are equipped with first conductive projection on the positive first pad, be equipped with on the first base plate with the identical chip hole of camera nude film shape, the camera nude film is the flip -chip structure, and the embedding is in in the chip hole of first base plate, it is openly felt the light zone periphery and is equipped with the fourth pad for feeling light zone in the middle part, is equipped with the fourth conductive projection on the fourth pad. Adopt circuit board and glue film encapsulation, between circuit board and the circuit board, all adopt between circuit board and the camera nude film and electrically conduct bump connection, packaging technology is simple, and the cost of manufacture is hanged down, the production efficiency height.
Description
Technical field
The utility model relates to camera encapsulating structure technical field.
Background technology
Camera chip (camerasensor) is now widely used a kind of chip.The common packaged type of camera nude film (baredie) has CSP(ChipScalePackage to refer to chip size packages, and its package dimension is substantially identical with chip core size), TSV(represents silicon perforation ThroughSivia), Neopac etc.Existing common packaged type is common exists production difficulty greatly, the technical deficiency that cost is high.
Summary of the invention
In sum, the purpose of this utility model is that solving existing camera chip encapsulating structure exists production difficulty greatly, the technical deficiency that cost is high, and proposes to cover brilliant camera case chip.
Proposed technical deficiency by solving the utility model, the technical scheme of employing is: cover brilliant camera encapsulating structure, it is characterized in that described structure includes: first substrate, second substrate, camera nude film and infrared fileter;
Described first substrate is double-sided PCB, and its tow sides are respectively equipped with the first pad, and first pad in front is provided with the first conductive projection, and first substrate is provided with the chip hole matched with described camera nude film shape;
Described camera nude film is flip-chip structure, is embedded in the chip hole of described first substrate, and its positive Middle face is photosensitive area, is arranged with the 4th pad outside photosensitive area, and the 4th pad is provided with the 4th conductive projection;
Described second substrate is circuit board, at least be provided with second pad corresponding with described first substrate front first pad at its reverse side, second pad is provided with the second conductive projection, second substrate is provided with the form corresponding with described camera nude film photosensitive area, second substrate reverse side is also provided with three pad corresponding with the 4th pad on described camera nude film, and the 3rd pad is provided with the 3rd conductive projection; Fit bonding by the second glue-line between second substrate reverse side with first substrate front, the second conductive projection is electrically connected with the first conductive projection, and the 3rd conductive projection is electrically connected with the 4th conductive projection;
Described infrared filtering chip size is greater than described window dimension, and infrared fileter is located at second substrate front and described form correspondence position, and second substrate front is fitted bonding with between infrared fileter by the first glue-line.
Be provided with the 3rd glue-line at first substrate and camera nude film reverse side, the 3rd glue-line is provided with the pad hole corresponding with first substrate reverse side first pad.
The first described conductive projection, the second conductive projection, the 3rd conductive projection and the 4th conductive projection are by copper facing bottom, nickel plating intermediate layer and zinc-plated skin composition, or be made up of copper facing bottom, nickel plating intermediate layer and gold-plated skin, or be made up of copper facing bottom and gold-plated skin, or be made up of copper facing bottom and zinc-plated skin.
The first described conductive projection, the second conductive projection, the 3rd conductive projection and the 4th conductive projection are be placed in the gold goal in each respective pad, or plating layer gold.
The beneficial effects of the utility model are: the utility model adopts circuit board and glue-line encapsulation, and all adopt conductive projection to be connected between circuit board with circuit board, between circuit board with camera nude film, packaging technology is simple, and cost of manufacture is low, and production efficiency is high.
Accompanying drawing explanation
Fig. 1 is perspective view of the present utility model;
Fig. 2 is cross section structure schematic diagram of the present utility model;
Fig. 3 is decomposition texture schematic diagram one of the present utility model;
Fig. 4 is decomposition texture schematic diagram two of the present utility model.
Embodiment
Below in conjunction with accompanying drawing and the preferred specific embodiment of the utility model, structure of the present utility model is further described.
Shown in Fig. 4, the utility model includes: first substrate 1, second substrate 2, camera nude film 3 and infrared fileter 4.
Described first substrate 1 is double-sided PCB, double-edged circuit is by plated-through hole conducting, its tow sides are respectively equipped with the first pad 11, and first pad 11 in front is provided with the first conductive projection 12, and first substrate 1 is provided with the chip hole 13 matched with described camera nude film shape.
Described camera nude film 3 is flip-chip structure, and be embedded in the chip hole 13 of described first substrate 1, its positive Middle face is photosensitive area 31, is arranged with the 4th pad the 32, four pad 32 and is provided with the 4th conductive projection 33 outside photosensitive area 31.
Described second substrate 2 is also be circuit board, second substrate 2 can be the double-sided PCB identical with first substrate 1 as required, also can be single sided board, only be provided with circuit at reverse side, its reverse side circuit is provided with second pad 21 corresponding with described first substrate 1 front first pad 11, second pad 21 is provided with the second conductive projection 22, and second substrate 2 is provided with the form 23 corresponding with described camera nude film photosensitive area 31, and form 23 passes through to arrive on camera nude film photosensitive area 31 for light; Second substrate 2 reverse side is also provided with three pad 24, three pad 24 corresponding with the 4th pad 32 on described camera nude film 3 and is provided with the 3rd conductive projection 25; Fit bonding by the second glue-line 5 between second substrate 2 reverse side with first substrate 1 front, the second glue-line 5 is provided with the through hole corresponding with form 23, second pad 21 and the 3rd pad 24; Second conductive projection 22 is electrically connected with the first conductive projection 12, and the 3rd conductive projection 25 is electrically connected with the 4th conductive projection 33.
Described infrared fileter 4 size is greater than described form 23 size, and infrared fileter 4 is located at second substrate 2 front and described form 23 correspondence position, and second substrate 2 front is fitted bonding with the first glue-line 6 by Back Word type between infrared fileter 4.
In order to strengthen camera nude film 3 package strength, being provided with the 3rd glue-line the 7, three glue-line 7 at first substrate 1 and camera nude film 3 reverse side and being provided with the pad hole 71 corresponding with first substrate 1 reverse side first pad 11.
Described the first conductive projection 12, second conductive projection 22, the 3rd conductive projection 25 and the 4th conductive projection 33 are by copper facing bottom, nickel plating intermediate layer and zinc-plated skin composition, or be made up of copper facing bottom, nickel plating intermediate layer and gold-plated skin, or be made up of copper facing bottom and gold-plated skin, or be made up of copper facing bottom and zinc-plated skin; Or for being placed in the gold goal in each respective pad, or plating layer gold; In the utility model bonding processes, make each conductive projection reach fusing point by high temperature, thus the conductive projection of each correspondence is fused together, form more stable conductivity.
Claims (4)
1. cover a brilliant camera case chip, cover brilliant camera case chip described in it is characterized in that and include: first substrate, second substrate, camera nude film and infrared fileter; Described first substrate is double-sided PCB, and its tow sides are respectively equipped with the first pad, and first pad in front is provided with the first conductive projection, and first substrate is provided with the chip hole matched with described camera nude film shape; Described camera nude film is flip-chip structure, is embedded in the chip hole of described first substrate, and its positive Middle face is photosensitive area, is arranged with the 4th pad outside photosensitive area, and the 4th pad is provided with the 4th conductive projection; Described second substrate is circuit board, at least be provided with second pad corresponding with described first substrate front first pad at its reverse side, second pad is provided with the second conductive projection, second substrate is provided with the form corresponding with described camera nude film photosensitive area, second substrate reverse side is also provided with three pad corresponding with the 4th pad on described camera nude film, and the 3rd pad is provided with the 3rd conductive projection; Fit bonding by the second glue-line between second substrate reverse side with first substrate front, the second conductive projection is electrically connected with the first conductive projection, and the 3rd conductive projection is electrically connected with the 4th conductive projection; Described infrared filtering chip size is greater than described window dimension, and infrared fileter is located at second substrate front and described form correspondence position, and second substrate front is fitted bonding with between infrared fileter by the first glue-line.
2. one according to claim 1 covers brilliant camera case chip, it is characterized in that: be provided with the 3rd glue-line at first substrate and camera nude film reverse side, the 3rd glue-line is provided with the pad hole corresponding with first substrate reverse side first pad.
3. one according to claim 1 covers brilliant camera case chip, it is characterized in that: the first described conductive projection, the second conductive projection, the 3rd conductive projection and the 4th conductive projection are by copper facing bottom, nickel plating intermediate layer and zinc-plated skin composition, or be made up of copper facing bottom, nickel plating intermediate layer and gold-plated skin, or be made up of copper facing bottom and gold-plated skin, or be made up of copper facing bottom and zinc-plated skin.
4. one according to claim 1 covers brilliant camera case chip, it is characterized in that: the first described conductive projection, the second conductive projection, the 3rd conductive projection and the 4th conductive projection are be placed in the gold goal in each respective pad, or plating layer gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520749760.2U CN205016527U (en) | 2015-09-25 | 2015-09-25 | Cover brilliant camera case chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520749760.2U CN205016527U (en) | 2015-09-25 | 2015-09-25 | Cover brilliant camera case chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205016527U true CN205016527U (en) | 2016-02-03 |
Family
ID=55215115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520749760.2U Expired - Fee Related CN205016527U (en) | 2015-09-25 | 2015-09-25 | Cover brilliant camera case chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205016527U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962927A (en) * | 2018-06-28 | 2018-12-07 | 江西芯创光电有限公司 | The production method of camera case chip |
-
2015
- 2015-09-25 CN CN201520749760.2U patent/CN205016527U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962927A (en) * | 2018-06-28 | 2018-12-07 | 江西芯创光电有限公司 | The production method of camera case chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160203 Termination date: 20200925 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |