CN217114432U - Circuit structure of five-color LED lamp - Google Patents
Circuit structure of five-color LED lamp Download PDFInfo
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- CN217114432U CN217114432U CN202220624401.4U CN202220624401U CN217114432U CN 217114432 U CN217114432 U CN 217114432U CN 202220624401 U CN202220624401 U CN 202220624401U CN 217114432 U CN217114432 U CN 217114432U
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Abstract
The utility model provides a circuit structure of a five-color LED lamp, which comprises a substrate, a chip, a current-conducting plate and a plate electrode; the electrode plate is arranged on the first side of the substrate; the conductive plate is arranged on the second side of the substrate; wherein the conductive plate is electrically connected to the electrode plate; the first side of the substrate is arranged opposite to the second side of the substrate; the chip is arranged on the surface of the conductive plate and is electrically connected with the electrode plate through the conductive plate; wherein the chip corresponds to at least two of the conductive plates and at least two of the electrode plates. Through will the current conducting plate with the plate electrode set up respectively in the both sides of base plate, and will the chip is located on the current conducting plate, realize through the current conducting plate with the plate electrode is connected with the power to simplify the internal line of LED lamp and reduce the whole size of LED lamp.
Description
Technical Field
The utility model relates to a LED lamp technical field especially relates to a circuit structure of five-color LED lamp.
Background
The LED lamp is a lighting lamp widely used in the market all over the world at present, has the advantages of small volume, high brightness, low power consumption, less heat generation, long service life, environmental protection and the like, has rich and colorful color types, and is deeply loved by consumers.
The LED lamp can emit light with different colors by internally arranging chips with several colors. LED lamps on the market are generally capable of emitting light in two or three colors; if more than three kinds of light are emitted, the wiring structure inside the LED lamp is very complicated, and the overall structure of the LED lamp is correspondingly increased, which is not beneficial to actual production and application.
Therefore, the wiring structure of the existing LED lamp needs to be further improved.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention has been made to provide a circuit structure of a five-color LED lamp that overcomes or at least partially solves the above problems.
In order to solve the problem, the utility model discloses a circuit structure of five-color LED lamp, include: a substrate, a chip and an electrical plate; wherein the substrate is provided with a through hole;
the electric plate comprises an electrode plate and an electric conduction plate; the electrode plate is arranged on the first side of the substrate, the conductive plate is arranged on the second side of the substrate, and the first side of the substrate and the second side of the substrate are oppositely arranged, so that the electrode plate and the conductive plate are connected through the through hole;
the chip is arranged on the surface of the conductive plate and is electrically connected with the electrode plate through the conductive plate; wherein the chip corresponds to at least two of the conductive plates and at least two of the electrode plates.
Optionally, a conductive medium; the conductive medium is arranged in the through hole and is respectively connected with the electrode plate and the conductive plate.
Optionally, the electrode plates include a first pair of electrode plates, a second pair of electrode plates, a third pair of electrode plates, a fourth pair of electrode plates, and a fifth pair of electrode plates; the conductive plates comprise a first pair of conductive plates, a second pair of conductive plates, a third pair of conductive plates, a fourth pair of conductive plates and a fifth pair of conductive plates; the chips comprise a first chip, a second chip, a third chip, a fourth chip and a fifth chip;
wherein the first chip is electrically connected to the first pair of electrode plates through the first pair of conductive plates; the second chip is electrically connected with the second pair of electrode plates through the second pair of conductive plates; the third chip is electrically connected with the third pair of electrode plates through the third pair of conductive plates; the fourth chip is electrically connected with the fourth pair of electrode plates through the fourth pair of conductive plates; the fifth chip is electrically connected to the fifth pair of electrode plates through the fifth pair of conductive plates.
Optionally, the first pair of electrode plates, the second pair of electrode plates, the third pair of electrode plates, the fourth pair of electrode plates, and the fifth pair of electrode plates are sequentially disposed on a first side of the substrate along a first direction, respectively; the first pair of conductive plates is arranged at the upper part of the substrate, the fifth pair of conductive plates is arranged at the lower part of the substrate, and the second pair of electrode plates, the third pair of electrode plates and the fourth pair of electrode plates are respectively arranged at the middle part of the substrate;
wherein the first pair of electrode plates are connected to the first pair of conductive plates through a conductive medium; the second pair of electrode plates are connected with the second pair of conductive plates through conductive media; the third pair of electrode plates is connected with the third pair of conductive plates through a conductive medium; the fourth pair of electrode plates is connected with the fourth pair of conductive plates through a conductive medium; the fifth pair of electrode plates is connected with the fifth pair of conductive plates through a conductive medium.
Optionally, the first chip is disposed on one of the first pair of electrode plates, and the first chip is electrically connected to the other of the first pair of electrode plates through a wire; the second chip is arranged on one electrode plate in the second pair of electrode plates and is electrically connected with the other electrode plate in the second pair of electrode plates through a lead; the third chip is respectively arranged on two electrode plates in the third pair of electrode plates; the fourth chip is respectively arranged on two electrode plates in the fourth pair of electrode plates; the fifth chip is respectively arranged on two electrode plates in the fifth pair of electrode plates.
Optionally, the first chip, the second chip, the third chip and the fourth chip surround the fifth chip.
Optionally, the electrode plate, the conductive plate and/or the conductive medium is gold, silver or copper.
Optionally, the electrode plate and the conductive plate are respectively provided with at least one through hole.
Optionally, the substrate is provided with a heat dissipation plate; the heat dissipation plate is arranged on the first side of the substrate and located between the electrode plates.
The utility model discloses a following advantage: a substrate, a chip and an electrical plate; wherein the substrate is provided with a through hole; the electric plate comprises an electrode plate and an electric conduction plate; the electrode plate is arranged on the first side of the substrate, the conductive plate is arranged on the second side of the substrate, and the first side of the substrate and the second side of the substrate are oppositely arranged, so that the electrode plate and the conductive plate are connected through the through hole; the chip is arranged on the surface of the conductive plate and is electrically connected with the electrode plate through the conductive plate; wherein the chip corresponds to at least two of the conductive plates and at least two of the electrode plates. Through will the current conducting plate with the plate electrode set up respectively in the both sides of base plate, and will the chip is located on the current conducting plate, realize through the current conducting plate with the plate electrode is connected with the power to simplify the internal line of LED lamp and reduce the whole size of LED lamp.
Drawings
Fig. 1 is a schematic structural diagram of a circuit structure of a five-color LED lamp according to the present invention;
fig. 2 is another schematic structural diagram of a circuit structure of a five-color LED lamp according to the present invention.
Description of the drawings: 1. the chip comprises a substrate, 2, chips, 21, a first chip, 22, a second chip, 23, a third chip, 24, a fourth chip, 25, a fifth chip, 3, a conductive plate, 4, an electrode plate, 5, a through hole, 6 and a heat dissipation plate.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.
One of the core ideas of the utility model is that a substrate 1, a chip 2, a current-conducting plate 3 and an electrode plate 4; the electrode plate 4 is arranged on the first side of the substrate 1; the conductive plate 3 is arranged on the second side of the substrate 1; wherein the conductive plate 3 is electrically connected to the electrode plate 4; the first side of the substrate 1 is opposite to the second side of the substrate 1; the chip 2 is arranged on the surface of the conductive plate 3, and the chip 2 is electrically connected with the electrode plate 4 through the conductive plate 3; wherein, the chip 2 corresponds to at least two conductive plates 3 and at least two electrode plates 4; when the LED lamp is powered on, the chip 2 is electrically connected with a power supply through the electrode plate 4 and the conductive plate 3. Through with the current conducting plate 3 with the plate electrode 4 set up respectively in the both sides of base plate 1, and will chip 2 is located on the current conducting plate 3, realize through current conducting plate 3 with plate electrode 4 is connected with the power to simplify the internal line of LED lamp and reduce the whole size of LED lamp.
Referring to fig. 1-2, the schematic structural diagrams of the circuit structure of a five-color LED lamp of the present invention are shown, which may specifically include:
the chip comprises a substrate 1, a chip 2, a conductive plate 3 and an electrode plate 4;
the electrode plate 4 is arranged on the first side of the substrate 1;
the conductive plate 3 is arranged on the second side of the substrate 1; wherein the conductive plate 3 is electrically connected to the electrode plate 4; the first side of the substrate 1 is opposite to the second side of the substrate 1;
the chip 2 is arranged on the surface of the conductive plate 3, and the chip 2 is electrically connected with the electrode plate 4 through the conductive plate 3; wherein, the chip 2 corresponds to at least two conductive plates 3 and at least two electrode plates 4;
when the LED lamp is powered on, the chip 2 is electrically connected with a power supply through the electrode plate 4 and the conductive plate 3.
In the embodiment of the present application, the substrate 1, the chip 2, the conductive plate 3, and the electrode plate 4; the electrode plate 4 is arranged on the first side of the substrate 1; the conductive plate 3 is arranged on the second side of the substrate 1; wherein the conductive plate 3 is electrically connected to the electrode plate 4; the first side of the substrate 1 is opposite to the second side of the substrate 1; the chip 2 is arranged on the surface of the conductive plate 3, and the chip 2 is electrically connected with the electrode plate 4 through the conductive plate 3; wherein, the chip 2 corresponds to at least two conductive plates 3 and at least two electrode plates 4; when the LED lamp is powered on, the chip 2 is electrically connected with a power supply through the electrode plate 4 and the conductive plate 3. Through will current conducting plate 3 with plate electrode 4 set up respectively in the both sides of base plate 1, and will chip 2 is located on the current conducting plate 3, the realization is through current conducting plate 3 with plate electrode 4 is connected with the power to simplify the internal line of LED lamp and reduce the whole size of LED lamp.
Next, the circuit configuration of the five-color LED lamp in the present exemplary embodiment will be further described.
In an embodiment of the present application, the substrate 1 is provided with a through hole 5; the through hole 5 penetrates through the first side of the substrate 1 and the second side of the substrate 1; wherein the through-hole 5 is filled with a conductive medium for connecting the electrode plate 4 and the conductive plate 3.
In one example, one end of the through hole 5 corresponds to the conductive plate 3, and the other end of the through hole 5 corresponds to the electrode plate 4, so that one end of the conductive medium contacts the conductive plate 3 and the other end of the conductive medium contacts the electrode plate 4, thereby connecting the conductive plate 3 and the electrode plate 4.
In an embodiment of the present application, the electrode plates 4 include a first pair of electrode plates 4, a second pair of electrode plates 4, a third pair of electrode plates 4, a fourth pair of electrode plates 4, and a fifth pair of electrode plates 4; the conductive plates 3 include a first pair of conductive plates 3, a second pair of conductive plates 3, a third pair of conductive plates 3, a fourth pair of conductive plates 3, and a fifth pair of conductive plates 3; the chip 2 comprises a first chip 21, a second chip 22, a third chip 23, a fourth chip 24 and a fifth chip 25;
wherein the first chip 21 is electrically connected to the first pair of electrode plates 4 through the first pair of conductive plates 3; the second chip 22 is electrically connected to the second pair of electrode plates 4 through the second pair of conductive plates 3; the third chip 23 is electrically connected to the third pair of electrode plates 4 through the third pair of conductive plates 3; the fourth chip 24 is electrically connected to the fourth pair of electrode plates 4 through the fourth pair of conductive plates 3; the fifth chip 25 is electrically connected to the fifth pair of electrode plates 4 through the fifth pair of conductive plates 3.
In an embodiment of the present application, the first counter electrode plate 4, the second counter electrode plate 4, the third counter electrode plate 4, the fourth counter electrode plate 4, and the fifth counter electrode plate 4 are sequentially disposed on a first side of the substrate 1 along a first direction, respectively; the first pair of conductive plates 3 is disposed on the upper portion of the substrate 1, the fifth pair of conductive plates 3 is disposed on the lower portion of the substrate 1, and the second pair of electrode plates 4, the third pair of electrode plates 4 and the fourth pair of electrode plates 4 are respectively disposed in the middle of the substrate 1;
wherein the first pair of electrode plates 4 are connected to the first pair of conductive plates 3 through a conductive medium; the second pair of electrode plates 4 is connected with the second pair of conductive plates 3 through a conductive medium; the third pair of electrode plates 4 is connected with the third pair of conductive plates 3 through a conductive medium; the fourth pair of electrode plates 4 is connected with the fourth pair of conductive plates 3 through a conductive medium; the fifth pair of electrode plates 4 is connected to the fifth pair of conductive plates 3 through a conductive medium.
The electrode plate 4 on the side surface of the substrate 1 is connected with the conductive plate 3, so that the wiring structure of the chip 2 can be reduced, and the overall size of the LED lamp is reduced.
It should be noted that the first direction is a longitudinal direction.
In a specific implementation, the first chip 21 is disposed on one electrode plate 4 of the first pair of electrode plates 4, and the first chip 21 is electrically connected to the other electrode plate 4 of the first pair of electrode plates 4 through a wire; the second chip 22 is disposed on one electrode plate 4 of the second pair of electrode plates 4, and the second chip 22 is electrically connected to the other electrode plate 4 of the second pair of electrode plates 4 through a wire; the third chip 23 is respectively arranged on two electrode plates 4 of the third pair of electrode plates 4; the fourth chip 24 is respectively disposed on two electrode plates 4 of the fourth pair of electrode plates 4; the fifth chips 25 are respectively disposed on two electrode plates 4 of the fifth pair of electrode plates 4. The electrode plates 4 are arranged, and each chip 2 is connected with the corresponding electrode plate 4, so that the wiring structure of the chip 2 is simplified.
In a specific implementation, the substrate 1 is provided with a heat dissipation plate 6; the heat dissipation plate 6 is disposed on a first side of the substrate 1, and the heat dissipation plate 6 is located between the electrode plates 4.
In an embodiment of the present application, the first chip 21, the second chip 22, the third chip 23 and the fourth chip 24 surround the fifth chip 25.
In an embodiment of the present application, the electrode plate 4, the conductive plate 3 and/or the conductive medium is gold, silver or copper.
In an embodiment of the present application, the electrode plate 4 and the conductive plate 3 are respectively provided with at least one through hole 5.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The circuit structure of the five-color LED lamp provided by the present invention is introduced in detail, and the principle and the implementation of the present invention are explained by applying specific examples, and the descriptions of the above examples are only used to help understand the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the specific implementation and application scope, to sum up, the content of the present specification should not be understood as the limitation of the present invention.
Claims (9)
1. A circuit structure of a five-color LED lamp is characterized by comprising: a substrate, a chip and an electrical plate; wherein the substrate is provided with a through hole;
the electric plate comprises an electrode plate and an electric conduction plate; the electrode plate is arranged on the first side of the substrate, the conductive plate is arranged on the second side of the substrate, and the first side of the substrate and the second side of the substrate are oppositely arranged, so that the electrode plate and the conductive plate are connected through the through hole;
the chip is arranged on the surface of the conductive plate and is electrically connected with the electrode plate through the conductive plate; wherein the chip corresponds to at least two of the conductive plates and at least two of the electrode plates.
2. The circuit structure of claim 1, further comprising a conductive medium; the conductive medium is arranged in the through hole and is respectively connected with the electrode plate and the conductive plate.
3. The circuit structure of claim 2, wherein the electrode plates comprise a first pair of electrode plates, a second pair of electrode plates, a third pair of electrode plates, a fourth pair of electrode plates, and a fifth pair of electrode plates; the conductive plates comprise a first pair of conductive plates, a second pair of conductive plates, a third pair of conductive plates, a fourth pair of conductive plates and a fifth pair of conductive plates; the chips comprise a first chip, a second chip, a third chip, a fourth chip and a fifth chip;
wherein the first chip is electrically connected to the first pair of electrode plates through the first pair of conductive plates; the second chip is electrically connected with the second pair of electrode plates through the second pair of conductive plates; the third chip is electrically connected with the third pair of electrode plates through the third pair of conductive plates; the fourth chip is electrically connected with the fourth pair of electrode plates through the fourth pair of conductive plates; the fifth chip is electrically connected to the fifth pair of electrode plates through the fifth pair of conductive plates.
4. The circuit structure of claim 3, wherein the first pair of electrode plates, the second pair of electrode plates, the third pair of electrode plates, the fourth pair of electrode plates, and the fifth pair of electrode plates are sequentially disposed on a first side of the substrate along a first direction, respectively; the first pair of conductive plates is arranged at the upper part of the substrate, the fifth pair of conductive plates is arranged at the lower part of the substrate, and the second pair of electrode plates, the third pair of electrode plates and the fourth pair of electrode plates are respectively arranged at the middle part of the substrate;
wherein the first pair of electrode plates are connected to the first pair of conductive plates through a conductive medium; the second pair of electrode plates are connected with the second pair of conductive plates through conductive media; the third pair of electrode plates is connected with the third pair of conductive plates through a conductive medium; the fourth pair of electrode plates is connected with the fourth pair of conductive plates through a conductive medium; the fifth pair of electrode plates is connected with the fifth pair of conductive plates through a conductive medium.
5. The circuit structure of claim 4, wherein the first chip is disposed on one of the first pair of electrode plates, and the first chip is electrically connected to the other of the first pair of electrode plates through a wire; the second chip is arranged on one electrode plate in the second pair of electrode plates and is electrically connected with the other electrode plate in the second pair of electrode plates through a lead; the third chip is respectively arranged on two electrode plates in the third pair of electrode plates; the fourth chip is respectively arranged on two electrode plates in the fourth pair of electrode plates; the fifth chip is respectively arranged on two electrode plates in the fifth pair of electrode plates.
6. The circuit structure of claim 5, wherein the first chip, the second chip, the third chip, and the fourth chip surround the fifth chip.
7. The circuit structure of claim 2, wherein the electrode plates, the conductive plates, and/or the conductive media are gold, silver, or copper.
8. The circuit structure of claim 7, wherein said electrode plate and said conductive plate are each provided with at least one of said through holes.
9. The circuit structure according to claim 8, wherein the substrate is provided with a heat dissipation plate; the heat dissipation plate is arranged on the first side of the substrate and located between the electrode plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220624401.4U CN217114432U (en) | 2022-03-21 | 2022-03-21 | Circuit structure of five-color LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220624401.4U CN217114432U (en) | 2022-03-21 | 2022-03-21 | Circuit structure of five-color LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217114432U true CN217114432U (en) | 2022-08-02 |
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ID=82605107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220624401.4U Active CN217114432U (en) | 2022-03-21 | 2022-03-21 | Circuit structure of five-color LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217114432U (en) |
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2022
- 2022-03-21 CN CN202220624401.4U patent/CN217114432U/en active Active
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