CN211352527U - Intelligent lighting integrated substrate - Google Patents
Intelligent lighting integrated substrate Download PDFInfo
- Publication number
- CN211352527U CN211352527U CN202020206023.9U CN202020206023U CN211352527U CN 211352527 U CN211352527 U CN 211352527U CN 202020206023 U CN202020206023 U CN 202020206023U CN 211352527 U CN211352527 U CN 211352527U
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- CN
- China
- Prior art keywords
- circuit board
- elevated
- led light
- wireless communication
- leg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims abstract description 47
- 238000004891 communication Methods 0.000 claims abstract description 42
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000005286 illumination Methods 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 5
- 239000004411 aluminium Substances 0.000 abstract 5
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Abstract
The utility model relates to an intelligence illumination integrated substrate contains aluminium base board, LED light source, the little card of wireless communication is provided with the overhead leg, the overhead leg sets up in the circuit board below, the bottom welding of overhead leg is at aluminium base board upper surface, makes form the air gap between circuit board lower surface and the aluminium base board, and this air gap has formed the thermal-insulated medium between aluminium base board and the little card of wireless communication, avoids aluminium base board to the heat-conduction of the little card of wireless communication.
Description
Technical Field
The utility model relates to an intelligence illumination field especially relates to an intelligence illumination integrated substrate.
Background
With the development of the internet of things technology, LED lighting products gradually develop towards the directions of intelligent lighting and internet of things lighting. The wireless communication small card is integrated in the LED lamp, so that the LED lamp can realize wireless control or intelligent automatic adjustment of the LED lamp through wireless communication. Through the interconnection and intercommunication of the light control of the lighting product and the sensor of the Internet of things, or the connection of the LED lamp and the gateway, or the connection of the LED lamp and the mobile phone terminal, the LED lamp can become a part of the Internet of things, interaction of lighting and the environment and the demand of people in the environment can be realized, and meanwhile, the saving of lighting power consumption can be realized. The advantages make intelligent lighting a necessary trend for LED lighting. However, since the LED lamp for intelligent lighting is usually installed in an embedded manner, in order to obtain better wireless communication signal strength, a wireless communication small card is usually required to be integrated in an area where a light emitting surface of the LED lamp is located. Because the LED light source can emit a large amount of heat in the working process, the temperature of a substrate for welding the LED light source is increased. The performance of the wireless communication small card is greatly reduced due to the increase of the temperature, and how to realize the heat insulation of the wireless communication small card and the LED light source substrate becomes an important problem.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is desirable to provide a smart lighting integrated substrate capable of achieving thermal isolation of a wireless communication small card. In order to solve the technical problem, the technical scheme of the utility model is that: an intelligent lighting integrated substrate comprises an aluminum substrate, an LED light source and a wireless communication small card, wherein the LED light source is welded on the upper surface of the aluminum substrate, the wireless communication small card is provided with an elevated leg, a circuit board and a communication module, the elevated leg is a metal conductor, the communication module is arranged on the upper surface of the circuit board, the elevated leg is arranged below the circuit board, the length of the elevated leg is larger than the thickness of the circuit board, the bottom of the elevated leg is welded on the upper surface of the aluminum substrate, so that an air gap is formed between the lower surface of the circuit board and the aluminum substrate, and the air gap forms a heat insulation medium between the aluminum substrate and the wireless communication small card, thereby avoiding the heat conduction from the aluminum substrate to the wireless communication small card.
The wireless communication small card is arranged in the middle area of the aluminum substrate, and the LED light sources are arranged and distributed around the wireless communication small card.
The elevated leg is arranged at the left end and the right end of the circuit board, and a plurality of elevated legs are arranged at the left side and the right side of the circuit board.
The height of the elevated welding leg is larger than the thickness of the LED light source.
The top of the elevated leg extends beyond the upper surface of the circuit board.
The area of the circuit board is larger than that of the communication module, and the area of the circuit board is larger than that of the single LED light source.
The height of the air gap is greater than the thickness of the LED light source.
The LED light source is characterized in that a circuit layer is arranged on the upper surface of the aluminum substrate, and the LED light source and the bottoms of the elevated welding feet are welded on the circuit layer.
The circuit board is provided with a through hole, the upper part of the elevated soldering pin is inserted into the through hole of the circuit board, metal wiring is arranged on the upper surface of the circuit board and in the through hole of the circuit board, and the top of the elevated soldering pin is electrically communicated with the metal wiring on the upper surface of the circuit board.
The diameter of the elevated leg is less than the width of the LED light source.
Compared with the prior art, the utility model discloses following beneficial effect has: the small wireless communication card is arranged on the aluminum substrate in an overhead mode through the elevated welding feet, so that an air gap is formed between the small wireless communication card and the aluminum substrate, a heat insulation medium between the aluminum substrate and the small wireless communication card is formed in the air gap, heat emitted by the LED light source on the aluminum substrate is prevented from conducting heat to the small wireless communication card, and performance and reliability of the small wireless communication card are guaranteed.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic view of an intelligent illumination integrated substrate according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view a-a of fig. 1.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the objects of the present invention, the following detailed description of the embodiments, structures, features and effects according to the present invention will be made with reference to the accompanying drawings and preferred embodiments.
Example one
Referring to fig. 1 to 2, an intelligent lighting integrated substrate includes an aluminum substrate 1, an LED light source 2, and a wireless communication small card 3, where the LED light source 2 is welded on an upper surface of the aluminum substrate 1, the wireless communication small card 3 is provided with an elevated solder leg 33, a circuit board 32, and a communication module 31, the elevated solder leg 33 is a metal conductor, the communication module 31 is disposed on an upper surface of the circuit board 32, the elevated solder leg 33 is disposed below the circuit board 32, a length of the elevated solder leg 33 is greater than a thickness of the circuit board 32, and a bottom of the elevated solder leg 33 is welded on the upper surface of the aluminum substrate 1, so that an air gap 4 is formed between a lower surface of the circuit board 32 and the aluminum substrate 1, and the air gap 4 forms a heat insulation medium between the aluminum substrate 1 and the wireless communication small card 3, thereby avoiding heat conduction from the aluminum substrate 1 to the wireless communication small.
The wireless communication small cards 3 are arranged in the middle area of the aluminum substrate 1, and the number of the LED light sources 2 is 8, and the LED light sources are distributed around the wireless communication small cards 3.
The elevated leg 33 is disposed at the left and right ends of the circuit board 32, and 3 elevated legs 33 are disposed at the left and right sides of the circuit board 32.
The height of the elevated leg 33 is greater than the thickness of the LED light source 2.
The top of the elevated leg 33 extends above the top surface of the circuit board 32.
The area of the circuit board 32 is larger than that of the communication module 31, and the area of the circuit board 32 is larger than that of the single LED light source 2.
The height of the air gap is greater than the thickness of the LED light source 2.
The upper surface of the aluminum substrate 1 is provided with a circuit layer, and the bottoms of the LED light source 2 and the overhead solder leg 33 are welded on the circuit layer.
The circuit board 32 is provided with a through hole, the upper part of the elevated solder leg 33 is inserted into the through hole of the circuit board 32, metal wires are arranged on the upper surface of the circuit board 32 and in the through hole of the circuit board 32, and the top of the elevated solder leg 33 is electrically communicated with the metal wires on the upper surface of the circuit board 32.
The diameter of the elevated leg 33 is less than the width of the LED light source 2.
Example two
The novel aluminum base plate is characterized in that a through hole is formed in the circuit board 32, metal wiring lines are arranged on the upper surface of the circuit board 32, in the through hole of the circuit board 32 and on the lower surface of the circuit board 32, a wiring terminal is further welded on the lower surface of the circuit board 32, a wire outlet is formed in the position, corresponding to the wireless communication small card 3, of the aluminum base plate 1, a wire is installed on the wiring terminal, and the wire penetrates out of the wire outlet.
The rest is the same as the first embodiment.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention has been disclosed by the preferred embodiment, it is not limited to the present invention, and any person skilled in the art can make modifications or changes equivalent to the equivalent embodiments by utilizing the above disclosed technical contents without departing from the technical scope of the present invention, but all the modifications, changes and changes of the technical spirit of the present invention made to the above embodiments are also within the scope of the technical solution of the present invention.
Claims (10)
1. The intelligent lighting integrated substrate is characterized in that the LED light source is welded on the upper surface of the aluminum substrate, the wireless communication small card is provided with an elevated leg, a circuit board and a communication module, the elevated leg is a metal conductor, the communication module is arranged on the upper surface of the circuit board, the elevated leg is arranged below the circuit board, the length of the elevated leg is greater than the thickness of the circuit board, the bottom of the elevated leg is welded on the upper surface of the aluminum substrate, so that an air gap is formed between the lower surface of the circuit board and the aluminum substrate, and the air gap forms a heat insulation medium between the aluminum substrate and the wireless communication small card, thereby avoiding heat conduction from the aluminum substrate to the wireless communication small card.
2. The integrated substrate of claim 1, wherein the wireless communication small card is disposed in a middle region of the aluminum substrate, and the plurality of LED light sources are disposed and distributed around the wireless communication small card.
3. An intelligent lighting integrated substrate according to claim 1, wherein the elevated solder tails are disposed at left and right ends of the circuit board, and a plurality of elevated solder tails are disposed at both left and right sides of the circuit board.
4. The intelligent lighting integrated substrate of claim 1, wherein the height of the elevated solder feet is greater than the thickness of the LED light source.
5. The intelligent lighting integrated substrate of claim 1, wherein the top of the elevated solder tail extends beyond the top surface of the circuit board.
6. The intelligent lighting integrated substrate of claim 1, wherein the area of the circuit board is larger than the area of the communication module, and the area of the circuit board is larger than the area of a single LED light source.
7. A smart lighting integrated substrate as recited in claim 1, wherein the height of said air gap is greater than the thickness of said LED light source.
8. The intelligent lighting integrated substrate as claimed in claim 1, wherein a circuit layer is disposed on the upper surface of the aluminum substrate, and the LED light sources and the bottoms of the raised solder feet are all soldered on the circuit layer.
9. The intelligent illumination integrated substrate of claim 1, wherein the circuit board is provided with a through hole, the upper portion of the elevated solder leg is inserted into the through hole of the circuit board, the upper surface of the circuit board and the through hole of the circuit board are both provided with metal traces, and the top of the elevated solder leg is electrically connected to the metal trace on the upper surface of the circuit board.
10. A smart lighting integrated substrate as recited in claim 1, wherein said elevated solder feet have a diameter less than a width of said LED light sources.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020206023.9U CN211352527U (en) | 2020-02-25 | 2020-02-25 | Intelligent lighting integrated substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020206023.9U CN211352527U (en) | 2020-02-25 | 2020-02-25 | Intelligent lighting integrated substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211352527U true CN211352527U (en) | 2020-08-25 |
Family
ID=72093291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020206023.9U Active CN211352527U (en) | 2020-02-25 | 2020-02-25 | Intelligent lighting integrated substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211352527U (en) |
-
2020
- 2020-02-25 CN CN202020206023.9U patent/CN211352527U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An intelligent lighting integrated substrate Effective date of registration: 20220402 Granted publication date: 20200825 Pledgee: Xiamen SME Financing Guarantee Co.,Ltd. Pledgor: XIAMEN LED BOARD ELECTRON-TECH CO.,LTD. Registration number: Y2022980003863 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20200825 Pledgee: Xiamen SME Financing Guarantee Co.,Ltd. Pledgor: XIAMEN LED BOARD ELECTRON-TECH CO.,LTD. Registration number: Y2022980003863 |