CN211260719U - Circuit board and lamp with same - Google Patents
Circuit board and lamp with same Download PDFInfo
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- CN211260719U CN211260719U CN201921746556.XU CN201921746556U CN211260719U CN 211260719 U CN211260719 U CN 211260719U CN 201921746556 U CN201921746556 U CN 201921746556U CN 211260719 U CN211260719 U CN 211260719U
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Abstract
The utility model is suitable for a lighting technology field provides a circuit board and have lamps and lanterns of this circuit board, and this circuit board includes: the substrate layer comprises an insulation part and a metal part which are connected in a splicing manner; an insulating layer disposed on the base layer; the circuit layer is arranged on the insulating layer; at least one first component inserted on the insulating portion; the metal part can provide good heat dissipation performance, the circuit board can be guaranteed to have good heat dissipation performance, the insulating part can allow the first component part to penetrate through, therefore, the arrangement height of the first component on the circuit board can be reduced, meanwhile, the first components and the circuit layer can be connected in a more simple and convenient plug-in mode, the structural design and the manufacture of the circuit board can be simplified, and the circuit board is suitable for design of more driving schemes; the lamp with the circuit board is simpler and more convenient in structural design and manufacture, and has good heat dissipation performance and strong applicability.
Description
Technical Field
The utility model relates to the field of lighting technology, in particular to circuit board and lamps and lanterns that have this circuit board.
Background
Currently, inside lighting fixtures, a linear driving scheme and a switching power scheme are mainly used for driving light emitting elements of light emitting diodes. The linear driving scheme mainly uses an aluminum substrate as a circuit carrier plate, in order to meet ripple requirements and a better linear adjustment rate, an electrolytic capacitor is usually used at an output end, and the aluminum substrate greatly limits the use of plug-in components, so that the functions which can be realized by the linear driving scheme are limited, and an additional avoidance design is required in structural design. The circuit board used by the switching power supply is mainly used for electrical connection, and heat dissipation cannot be effectively considered.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a circuit board aims at solving the limited technical problem of current circuit board in structural design and heat dissipation.
The utility model discloses a realize like this, a circuit board, include:
the substrate layer comprises an insulation part and a metal part which are connected in a splicing manner;
an insulating layer disposed on the base layer; and
the circuit layer is arranged on the insulating layer;
at least one first component interposed on the insulating portion; and
and the second component is attached to the circuit layer.
In one embodiment, the area of the insulating portion is less than or equal to one-half of the area of the base layer.
In one embodiment, the insulating portion includes a first insulating region disposed at a center or an edge of the metal portion, the first insulating region being disposed with the first component.
In one embodiment, the insulating portion further includes a second insulating region spaced apart from or connected to the first insulating portion, the second insulating region being disposed at an edge of the metal portion; the circuit board further comprises at least one pin, one end of the pin extends into the second insulation region and is electrically connected to the circuit layer, and the other end of the pin extends out of the second insulation region.
In one embodiment, the circuit board is provided with a positive connection hole and a negative connection hole penetrating through the metal part and the circuit layer, the positive connection hole and the negative connection hole are both adhered with an insulating inner wall, and the insulating inner wall and the insulating part are made of the same material.
In one embodiment, the metal portion is provided with a mark for distinguishing the positive connection hole from the negative connection hole.
In one embodiment, the circuit layer is a copper foil layer, and the metal portion is made of aluminum.
In one embodiment, the insulating portion is a single layer structure or a composite layer structure.
In one embodiment, the first component comprises at least an electrolytic capacitor.
Another object of the present invention is to provide a lamp, which includes the circuit board and the light source assembly disposed on the circuit board.
The utility model provides a beneficial effect of circuit board and lamps and lanterns lies in:
the circuit board comprises a circuit layer, an insulating layer, a substrate layer, a first component and a second component which are sequentially stacked, wherein the substrate layer comprises an insulating part and a metal part which are connected in a splicing manner, the metal part can provide good heat dissipation performance and can ensure that the circuit board can have good heat dissipation performance, and the insulating part can allow the first component part to penetrate through and be inserted into the insulating part, so that the arrangement height of the first component on the circuit board can be reduced, and meanwhile, the connection between the first component and the circuit layer is simplified, so that the structural design and the manufacture of the circuit board are simplified, and the circuit board is suitable for more driving scheme designs; the lamp with the circuit board is simpler and more convenient in structural design and manufacture, and has good heat dissipation performance and strong applicability.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;
fig. 2 is another schematic structural diagram of a circuit board according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a substrate layer side of a circuit board according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a lamp provided in an embodiment of the present invention.
The designations in the figures mean:
100-a circuit board; 1-ink layer; 2-a line layer; 3-an insulating layer; 4-base layer, 41-insulating part, 411-first insulating region, 412-second insulating region, 42-metal part; 5-first component, 51-terminal; 6-pin; 101-positive connection hole, 102-negative connection hole; 7-mark, 71-line filled area, 72-unfilled area;
200-lamp, 9-light source component, 8-driving component.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the patent. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
In order to explain the technical solution of the present invention, the following detailed description is made with reference to the specific drawings and examples.
Referring to fig. 1 and 2, an embodiment of the present invention first provides a circuit board 100, which includes a substrate layer 4, an insulating layer 3, a circuit layer 2, at least one first component 5, and at least one second component (not shown) stacked in sequence, wherein the substrate layer 4 includes an insulating portion 41 and a metal portion 42 connected in a splicing manner, the insulating layer 3 is disposed on the substrate layer 4, the circuit layer 2 is further disposed on the insulating layer 3, and the insulating layer 3 insulates and separates the circuit layer 2 from the metal portion 42 so that a circuit pattern of the circuit layer 2 is not electrically connected to the metal portion 42; the first component 5 is inserted on the insulating part 41, and the second component is attached on the circuit layer 2.
The embodiment of the utility model provides a circuit board 100, its stratum basale 4 includes splicing connection's insulating part 41 and metal part 42, and metal part 42 can provide good heat dispersion, can guarantee that this circuit board 100 can have good heat dispersion, is used for switching power supply's drive mode, can compromise heat dissipation and electrical connection performance; the insulation part 41 can allow the first component 5 to partially penetrate through, so that the setting height of the circuit board 100 can be reduced, and meanwhile, the first component 5 and the circuit layer 2 can be connected in a simpler plug-in mode, so that the structural design and the manufacturing of the circuit board 100 are simplified, and the circuit board is suitable for more driving scheme designs.
Referring to fig. 2, in one embodiment, the first component 5 is disposed on one side of the substrate layer 4, and the terminal 51 of the first component 5 for electrically connecting with the circuit layer 2 extends through the insulating portion 41 and the insulating layer 3 until reaching the circuit layer 2 to form an electrical connection with the circuit layer 2 by soldering or the like. Therefore, the great majority of the height of the first component 5 is hidden, the whole height of the circuit board 100 can be reduced, the position design and the arrangement of other more electronic components are facilitated, and the use of the circuit board 100 in a specific scene is also facilitated.
Specifically, as shown in fig. 2, both terminals 51 of the first component 5 enter the insulating layer 3 from the insulating portion 41 side and continue into the wiring layer 2. In a particular application, its terminals 51 may protrude from the wiring layer 2, as shown in fig. 2, to facilitate soldering.
In addition, because the first component 5 and the circuit layer 2 can be connected by a simpler plug-in mode, some auxiliary structures for electrically connecting the terminal 51 and the circuit layer 2 in the original patch connection mode can be further eliminated. Therefore, the maximum height that the design of the circuit board 100 can be reduced can be larger than the sum of the heights of the circuit layer 2, the insulating layer 3 and the base layer 4. In specific applications, the height reduction can reach 4mm, even 5mm, and the height reduction is obvious.
In a particular embodiment, the first component 5 may comprise an electrolytic capacitor. The electrolytic capacitor has a larger volume compared with other types of electronic components, and the circuit board 100 of the present embodiment can significantly improve the overall design problem of the circuit board 100 caused by the larger height, and is particularly suitable for a linear driving scheme. The specific type of the second component is selected according to the specific function of the circuit board, and is not particularly limited.
The shape of the circuit board 100 may be regular, such as rectangular, circular, oval, etc., or irregular, as shown in fig. 2, which is set according to a specific use scenario, and is not particularly limited.
The area ratio of the insulating portion 41 may be different depending on the specific structure of the circuit board 100. For example, if the amount of heat generation of the first component 5 on the circuit board 100 is large, the area ratio of the insulating portion 41 may be relatively reduced, and if the amount of heat generation of the first component 5 on the circuit board 100 is small, the area ratio of the insulating portion 41 may be relatively increased to ensure good heat dissipation performance.
In a preferred embodiment, the area of the insulating portion 41 is less than or equal to one-half of the area of the base layer 4. This ensures that the metal portion 42 has sufficient area for providing good heat dissipation.
Referring to fig. 1 and fig. 2, in an embodiment, the circuit board 100 further includes an ink layer 1 disposed on the circuit layer 2. The ink layer 1 is formed on the circuit layer 2 by printing or the like, and is used for preventing the welding short circuit between the conductive circuits in the manufacturing process of the circuit board 100.
In one embodiment, the wiring layer 2 may be a copper foil layer and the material of the metal portion 42 may be aluminum. The material of the insulating portion 41 may be a resin, and the insulating portion 41 may be a resin layer, a composite layer formed of a plurality of resin layers, or a composite layer formed of a plurality of different resin layers. The material of the insulating layer 3 and the insulating portion 41 may be the same, which facilitates the fabrication of the circuit board 100.
Referring to fig. 3, in an embodiment, the insulating portion 41 includes a first insulating region 411, the first insulating region 411 may be located in a middle portion of the metal portion 42, that is, the first insulating region 411 may be spliced together in a manner of being surrounded by the metal portion 42, and a head portion (not labeled) of the first component 5 is located in the first insulating region 411, so that the first component 5 may be located in the middle portion of the circuit layer 2; alternatively, the first insulating region 411 may be located at the edge of the metal portion 42, and the first component 5 may be located at the edge of the metal portion 42, as shown in fig. 3.
Further, with reference to fig. 3, in an embodiment, the insulating portion 41 further includes a second insulating region 412, and the first insulating region 411 and the second insulating region 412 may be connected to each other or disposed at an interval. This is set according to the overall shape of the circuit board 100, the specific shapes of the first insulating region 411 and the second insulating region 412, and the positional arrangement requirement of the first component 5, and is not particularly limited.
In this embodiment, referring to fig. 3, the circuit board 100 further includes at least one pin 6, one end of the pin 6 is electrically connected to the circuit layer 2, and the other end of the pin 6 extends from the second insulating portion 412. Based on the arrangement of the pins 6, the circuit board 100 can be connected with other structures at its edge, such as other circuit boards, connectors, etc., to transmit current signals.
The number of the pins 6 is plural, the pins 6 are arranged side by side, one end of each of the pins 6 is electrically connected to the circuit layer 2, and the other end of each of the pins 6 protrudes from the second insulating region 412. This has the advantage that the first insulating region 411 can be used for plugging a first component 5 such as an electrolytic capacitor, and the second insulating region 412 can be separated from the second insulating region 412, so that the leads 6 and the first component 5 such as an electrolytic capacitor can be separated from each other, which is beneficial to the overall structure design of the circuit board 100.
In the present embodiment, the first insulating region 411 and the second insulating region 412 are both located at the edge of the metal portion 42, and are connected to each other, as shown in fig. 3.
Referring to fig. 3, in one embodiment, a positive connection hole 101 and a negative connection hole 102 are formed on the circuit board 100 to penetrate through the metal portion 42 and the circuit layer 2, and insulating inner walls (not shown) are attached to the positive connection hole 101 and the negative connection hole 102. In this way, the wires (not shown) can enter the positive electrode connection hole 101 and the negative electrode connection hole 102 from the metal portion 42 side, and are electrically connected to the wiring layer 2 while being insulated from the metal portion 42, whereby the electrical characteristics of the wiring layer 2 can be ensured. In a specific application, the material of the insulating inner wall in the positive connection hole 101 and the negative connection hole 102 may be the same as the material of the insulating portion 41 or the material of one layer, which facilitates the manufacture of the circuit board 100.
Further, as shown in fig. 3, in one embodiment, the metal portion 42 is provided with a mark 7 for distinguishing the positive connection hole 101 from the negative connection hole 102.
The specific type of the mark 7 is not limited, and may be text information, non-text information, or a combination of both. Any indication information type capable of clearly distinguishing the positive electrode connection hole 101 and the negative electrode connection hole 102 can be applied to this. For example, referring to fig. 3, in the present embodiment, the mark 7 may include a line filling region 71 and a non-filling region 72, which are disposed in a form corresponding to the positive electrode connection hole 101 and the negative electrode connection hole 102. In other alternative embodiments, the logo 7 may comprise two areas filled with different line types.
Referring to fig. 4 in combination with fig. 1 to fig. 3, the embodiment of the present invention further provides a lamp 200, which includes the circuit board 100 and the light source assembly 9 disposed on the circuit board 100.
As shown in fig. 4, the lamp 200 further includes a driving assembly 8, and the circuit board 100 is electrically connected to the driving assembly 8 via a conducting wire to adjust the current, so as to finally provide a suitable current to the light source assembly 9 for the light source assembly 9 to work normally.
The light source assembly 9 may comprise one or more light emitting diodes.
The utility model provides a lamp 200, the stratum basale 4 of its circuit board 100 includes splicing connection's insulating part 41 and metal part 42, and metal part 42 can provide good heat dispersion, can guarantee that this circuit board 100 can have good heat dispersion, is arranged in with switching power supply's drive mode, can compromise heat dissipation and electrical connection performance; the insulating portion 41 can allow some first components 5 (such as electrolytic capacitors) with larger volume to partially pass through, so that the setting height of the first components 5 on the circuit board 100 can be reduced, and meanwhile, the first components 5 and the circuit layer 2 can be connected in a simpler and more convenient plug-in manner, so that the structural design and the manufacturing of the circuit board 100 are simplified, the lamp 200 is applicable to more driving scheme designs, and the applicability is stronger.
The specific type of the lamp 200 is not limited, for example, the lamp 200 may be a bulb lamp, a track lamp, a grille lamp, a down lamp, etc., and any lamp 200 that requires a circuit board to drive a light emitting diode to emit light may employ the circuit board 100 of the present embodiment.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A circuit board, comprising:
the substrate layer comprises an insulation part and a metal part which are connected in a splicing manner;
an insulating layer disposed on the base layer; and
the circuit layer is arranged on the insulating layer;
at least one first component interposed on the insulating portion; and
and the second component is attached to the circuit layer.
2. The circuit board of claim 1, wherein the area of the insulating portion is less than or equal to one-half of the area of the base layer.
3. The circuit board of claim 1, wherein the insulating portion includes a first insulating region disposed at a center or an edge of the metal portion, the first insulating region being disposed with the first component.
4. The circuit board of claim 3, wherein the insulating portion further comprises a second insulating region spaced from or connected to the first insulating portion, the second insulating region being disposed at an edge of the metal portion; the circuit board further comprises at least one pin, one end of the pin extends into the second insulation region and is electrically connected to the circuit layer, and the other end of the pin extends out of the second insulation region.
5. The circuit board according to claim 1, wherein the circuit board is provided with a positive electrode connection hole and a negative electrode connection hole penetrating the metal portion and the circuit layer, and insulating inner walls are attached to both the positive electrode connection hole and the negative electrode connection hole and are made of the same material as the insulating portion.
6. The circuit board of claim 5, wherein the metal portion is provided with a mark for distinguishing the positive connection hole from the negative connection hole.
7. The circuit board according to any one of claims 1 to 6, wherein the wiring layer is a copper foil layer, and the material of the metal portion is aluminum.
8. The circuit board according to any one of claims 1 to 6, wherein the insulating portion is of a single-layer structure or a composite-layer structure.
9. The circuit board of any of claims 1-6, wherein the first component comprises at least an electrolytic capacitor.
10. A luminaire comprising the circuit board of any one of claims 1 to 9 and a light source assembly disposed on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921746556.XU CN211260719U (en) | 2019-10-17 | 2019-10-17 | Circuit board and lamp with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921746556.XU CN211260719U (en) | 2019-10-17 | 2019-10-17 | Circuit board and lamp with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211260719U true CN211260719U (en) | 2020-08-14 |
Family
ID=71989758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921746556.XU Active CN211260719U (en) | 2019-10-17 | 2019-10-17 | Circuit board and lamp with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211260719U (en) |
-
2019
- 2019-10-17 CN CN201921746556.XU patent/CN211260719U/en active Active
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