CN216213535U - Filament structure and decorative lamp - Google Patents
Filament structure and decorative lamp Download PDFInfo
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- CN216213535U CN216213535U CN202122675324.3U CN202122675324U CN216213535U CN 216213535 U CN216213535 U CN 216213535U CN 202122675324 U CN202122675324 U CN 202122675324U CN 216213535 U CN216213535 U CN 216213535U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The application discloses filament structure and ornament lamp belongs to the illumination field. The first conducting layer of the filament structure is arranged on the first surface of the strip-shaped substrate and is patterned into a plurality of first anodes and a plurality of first cathodes, one end of each first anode is provided with an anode bonding pad, and the other end of each first anode is provided with an anode through hole; one end of the first negative pole is provided with a negative pole pad, and the other end of the first negative pole is provided with a negative pole through hole. The second conducting layer is arranged on the second surface of the strip-shaped substrate and is patterned into a plurality of second anodes and a plurality of second cathodes, the second anodes are electrically connected with the first anodes, and the second cathodes are electrically connected with the first cathodes. Because the first conducting layer is not electrically conductive with the second conducting layer for the insulation of base plate to make the projection of positive pole pad on the second face of bar base plate can overlap with second negative pole part, the projection of negative pole pad on the second face of bar base plate can overlap with second positive pole part, and then under the prerequisite of avoiding the short circuit, make the width of bar base plate can further shorten.
Description
Technical Field
The application relates to the field of lighting, especially, relate to a filament structure and ornament lamp.
Background
In the existing retro decorative lamp imitating the appearance of a tungsten filament, a flexible LED (light-emitting diode) filament needs to be arranged to imitate the tungsten filament to emit light, and in the LED filament, a plurality of light-emitting chips need to be arranged on a narrow filament substrate in parallel.
SUMMERY OF THE UTILITY MODEL
The application provides a filament structure and ornament lamp for solve the ancient ways ornament lamp among the prior art because the width of conducting wire and conducting wire interval can not be less than certain numerical value on the filament base plate, thereby lead to the width of base plate can't further shorten, and then lead to the poor problem of decorative effect of ancient ways ornament lamp.
In order to solve the above problems, the present application provides: a filament structure comprising:
a strip-shaped substrate;
the first conducting layer is arranged on the first surface of the strip-shaped substrate and is patterned into a plurality of first positive electrodes and a plurality of first negative electrodes, a positive electrode bonding pad is arranged at one end of each first positive electrode, a negative electrode bonding pad is arranged at one end of each first negative electrode, a positive electrode through hole is formed in the strip-shaped substrate at the other end of each first positive electrode, and a negative electrode through hole is formed in the strip-shaped substrate at the other end of each first negative electrode;
the second conducting layer is arranged on the second surface of the strip-shaped substrate and is patterned into a plurality of second anodes and a plurality of second cathodes, each second anode and each second cathode are arranged in a one-to-one correspondence manner, the second anodes and the second cathodes are located at opposite edge positions in the length direction of the strip-shaped substrate, the second anodes are electrically connected with the first anodes through the anode through holes, and the second cathodes are electrically connected with the first cathodes through the cathode through holes;
the projection of the positive electrode pad on the second surface of the strip-shaped substrate is overlapped with the second negative electrode part, and the projection of the negative electrode pad on the second surface of the strip-shaped substrate is overlapped with the second positive electrode part.
In a possible implementation manner, the filament structure further includes a plurality of chips, and both ends of each chip are respectively connected to one of the positive electrode bonding pads and one of the negative electrode bonding pads, so that one end of each chip is electrically connected to one of the second positive electrodes through one of the first positive electrodes, and the other end of each chip is electrically connected to one of the second negative electrodes through one of the first negative electrodes.
In a possible embodiment, the first positive electrode and the first negative electrode connected to the same chip are located on the same straight line, and the positive electrode pad and the negative electrode pad are oppositely disposed.
In a possible embodiment, two adjacent chips connected to the same second positive electrode and the same second negative electrode are arranged in parallel.
In a possible embodiment, a plurality of the second positive electrodes are located on one side of the second surface, a plurality of the second negative electrodes are located on the other side of the second surface, the corresponding second positive electrodes and the corresponding second negative electrodes form a parallel group, and two adjacent parallel groups are arranged in series.
In one possible embodiment, the second positive electrode of one of the parallel groups is connected to the second negative electrode of the other of the parallel groups in two adjacent parallel groups, so that two adjacent parallel groups are arranged in series.
In a possible implementation manner, a conductive adhesive layer is further arranged on the strip-shaped substrate, the conductive adhesive layer is respectively arranged on the positive electrode bonding pad and the negative electrode bonding pad, and the conductive adhesive layer is used for fixing the chip.
In a possible implementation manner, the filament structure further includes a protection glue layer, and the protection glue layer covers the first surface and the second surface.
In a possible embodiment, the chip is a light emitting chip, and phosphor is further mixed in the protective adhesive layer.
The present application further provides: a decorative lamp comprising the filament structure provided by any of the above embodiments.
The beneficial effect of this application is: the application provides a filament structure and ornament lamp, is equipped with a plurality of first positive poles and a plurality of first negative poles on the first face of the bar base plate of filament structure. And a second anode and a second cathode are arranged on the second surface of the strip-shaped substrate. The first positive pole is connected with the second positive pole through the positive pole through hole, and the first negative pole is connected with the second negative pole through the negative pole through hole. Because the insulation of base plate makes anodal pad not electrically conductive with the second negative pole, the negative pole pad is not electrically conductive with first negative pole, thereby make the projection of anodal pad on the second face of bar base plate can overlap with second negative pole part, the projection of negative pole pad on the second face of bar base plate can overlap with second anodal part, and then under the prerequisite of avoiding the short circuit, greatly utilized bar base plate two-sided space back to back of the body, make the width of bar base plate can further shorten, make the outward appearance and the tungsten filament of this filament structure more similar, thereby the decorative effect of this ornament lamp has been improved. In addition, the structure of the filament structure is reinforced by the arrangement of the double-sided conducting layers, so that the filament structure can bear larger tensile force and is not easy to break, the reliability is improved, and the service life is prolonged.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 shows a schematic cross-sectional structure of a partially segmented filament structure provided by an embodiment of the present invention;
fig. 2 shows a schematic structural view of a first side of a strip-shaped substrate of a partially segmented filament structure provided by an embodiment of the utility model;
fig. 3 shows a schematic structural view of a second face of the strip-shaped substrate of the partially segmented filament structure provided by the embodiment of the utility model;
fig. 4 shows a partially enlarged perspective structural diagram of a partially segmented filament structure provided by an embodiment of the present invention.
Description of the main element symbols:
100-a strip-shaped substrate; 110-a first side; 120-a second face; 200-a first conductive layer; 210-a first positive electrode; 211-positive electrode pad; 212-positive via; 220-a first negative electrode; 221-negative electrode bonding pad; 222-a negative through hole; 300-a second conductive layer; 310-a second positive electrode; 320-a second negative electrode; 400-chip; 500-protective glue layer.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Example one
Referring to fig. 1, 2 and 3, the present embodiment provides a filament structure applied in a decorative lamp, the filament structure includes a strip substrate 100, a first conductive layer 200 and a second conductive layer 300. The first conductive layer 200 is disposed on the first surface 110 of the strip-shaped substrate 100, the first conductive layer 200 is patterned into a plurality of first anodes 210 and a plurality of first cathodes 220, one end of each first anode 210 is provided with an anode pad 211, one end of each first cathode 220 is provided with a cathode pad 221, the other end of the strip-shaped substrate 100, which is located at the first anode 210, is provided with an anode through hole 212, and the other end of the strip-shaped substrate 100, which is located at the first cathode 220, is provided with a cathode through hole 222. The second conductive layer 300 is disposed on the second surface 120 of the strip substrate 100, and the second conductive layer 300 is patterned into a plurality of second anodes 310 and a plurality of second cathodes 320, each of the second anodes 310 and the second cathodes 320 are disposed in a one-to-one correspondence, the second anodes 310 and the second cathodes 320 are located at opposite edge positions in the length direction of the strip substrate 100, the second anodes 310 are electrically connected to the first anodes 210 through the anode vias 212, and the second cathodes 320 are electrically connected to the first cathodes 220 through the cathode vias 222. The projection of the positive electrode pad 211 on the second surface 120 of the bar substrate 100 partially overlaps the second negative electrode 320, and the projection of the negative electrode pad 221 on the second surface 120 of the bar substrate 100 partially overlaps the second positive electrode 310.
In the filament structure provided in the embodiment of the present application, a plurality of first positive electrodes 210 and a plurality of first negative electrodes 220 are disposed on the first surface 110 of the strip substrate 100. A second positive electrode 310 and a second negative electrode 320 are provided on the second surface 120 of the strip substrate 100. The first positive electrode 210 is connected to the second positive electrode 310 through the positive electrode through hole 212, and the first negative electrode 220 is connected to the second negative electrode 320 through the negative electrode through hole 222. The insulation of the substrate enables the positive electrode pad 211 not to be conductive with the second cathode 320, and the negative electrode pad 221 not to be conductive with the first cathode 220, so that the projection of the positive electrode pad 211 on the second surface 120 of the strip-shaped substrate 100 can be partially overlapped with the second cathode 320, and the projection of the negative electrode pad 221 on the second surface 120 of the strip-shaped substrate 100 can be partially overlapped with the second positive electrode 310, and further, on the premise of avoiding short circuit, the double-sided space of the strip-shaped substrate 100 opposite to each other is greatly utilized, the width of the strip-shaped substrate 100 can be further shortened, the appearance of the filament structure is more similar to that of a tungsten filament, and the decorative effect of the decorative lamp is improved. In addition, the structure of the filament structure is reinforced by the arrangement of the double-sided conducting layers, so that the filament structure can bear larger tensile force and is not easy to break, the reliability is improved, and the service life is prolonged.
The strip substrate 100 may be a Flexible Printed Circuit (FPC) film made of polyimide or polyester film as a base material, which has high reliability and is excellent.
The first conductive layer 200 and the second conductive layer 300 may be copper foils, and the copper foils may be patterned by etching, so as to form a copper foil line.
The line width of the second positive electrode 310 and the second negative electrode 320 may be 0.1mm, the line distance between the second positive electrode 310 and the second negative electrode 320 may be 0.05mm to 0.1mm, the sum of the line width of the second positive electrode 310, the line distance between the second positive electrode 310 and the second negative electrode 320, and the line width of the second negative electrode 320 is approximately equal to the width of the substrate, and the width of the substrate may be less than 0.4mm under the influence of complex factors such as errors.
Example two
As shown in fig. 1, fig. 2 and fig. 3, the present embodiment proposes an arrangement manner of a chip 400 based on the first embodiment. The filament structure further comprises a plurality of chips 400, wherein two ends of each chip 400 are respectively connected with a positive electrode bonding pad 211 and a negative electrode bonding pad 221, so that one end of each chip 400 is electrically connected with a second positive electrode 310 through a first positive electrode 210, and the other end of each chip 400 is electrically connected with a second negative electrode 320 through a first negative electrode 220.
Specifically, one chip 400 is disposed on each of the oppositely disposed positive electrode bonding pads 211 and the negative electrode bonding pads 221, so that one end of each chip 400 is conducted with one second positive electrode 310 through one first positive electrode 210, the other end of each chip 400 is conducted with one second negative electrode 320 through one first negative electrode 220, and the chips 400 are simultaneously controlled by controlling the voltage of the corresponding second positive electrode 310 and the voltage of the corresponding second negative electrode 320.
The chip 400 may be a light emitting chip, such as an LED flip chip.
As shown in fig. 2, in the above embodiment, optionally, the first positive electrode 210 and the first negative electrode 220 connected to the same chip 400 are located on the same straight line, and the positive electrode pad 211 is disposed opposite to the negative electrode pad 221.
Specifically, the first anode 210 and the first cathode 220 connected to the same chip 400 are located on the same straight line, and the anode pad 211 and the cathode pad 221 are oppositely arranged, so that a straight line is formed among the first anode 210, the chip 400 and the first cathode 220, the length of the first anode 210 and the length of the first cathode 220 can be further shortened, and the problem of resistance increase caused by overlong length of the first anode 210 and the second cathode 320 is avoided.
As shown in fig. 2, in the above embodiment, optionally, two adjacent chips 400 connected to the same second positive electrode 310 and the same second negative electrode 320 are arranged in parallel.
Specifically, since two adjacent chips 400 connected to the same second positive electrode 310 and the same second negative electrode 320 are arranged in parallel, voltages at both ends of each chip 400 can be set to be the same, thereby conveniently controlling each chip 400. Meanwhile, when one of the chips 400 is damaged, the other chips 400 can still be electrified to work, so that the working stability of the filament structure is improved, and the service life of the filament structure is prolonged.
As shown in fig. 2 and fig. 3, in the above embodiment, optionally, a plurality of second positive electrodes 310 are located on one side of the second surface 120, a plurality of second negative electrodes 320 are located on the other side of the second surface 120, and the corresponding second positive electrodes 310 and the corresponding second negative electrodes 320 form a parallel group, and two adjacent parallel groups are arranged in series.
Specifically, because the voltage that single chip 400 needs is lower, and the mutual parallel arrangement of chip 400 in every parallel group for the voltage of parallel group equals the voltage of single chip 400, and because connect through the mode of establishing ties between the adjacent parallel group, make this filament structure need not reduce total voltage and just can supply power, reduced the power supply degree of difficulty. The total voltage required by the filament structure is proportional to the number of parallel groups, i.e., the total voltage is equal to the voltage of the single chip 400 multiplied by the number of parallel groups.
As shown in fig. 2, 3 and 4, in the above embodiment, optionally, in two adjacent parallel groups, the second positive electrode 310 of one parallel group is connected to the second negative electrode 320 of the other parallel group, so that the two adjacent parallel groups are arranged in series.
Specifically, the second positive electrodes 310 of one parallel group are connected to the second negative electrodes 320 of another parallel group, so that the filament structure can realize the electrifying operation of all the chips 400 on the strip-shaped substrate 100 in a series connection manner, and the width of the strip-shaped substrate 100 can be shortened in the series connection manner as much as possible.
EXAMPLE III
In this embodiment, a technical solution is further defined on the basis of the first embodiment or the second embodiment. The strip-shaped substrate 100 is further provided with a conductive adhesive layer, the conductive adhesive layer is respectively arranged on the positive bonding pad 211 and the negative bonding pad 221, and the conductive adhesive layer is used for fixing the chip 400.
Specifically, the conductive adhesive layer may be a conductive solder paste, which may be attached to the chip 400 and cured at a high temperature by reflow soldering.
As shown in fig. 1, in the above embodiment, optionally, the filament structure further includes a protective adhesive layer 500, and the protective adhesive layer 500 covers the first surface 110 and the second surface 120.
Specifically, the protective adhesive layer 500 covering the first surface 110 and the second surface 120 can prevent moisture from entering and directly contacting the first conductive layer 200 and the second conductive layer 300, which affects the performance of the filament structure.
In the above embodiment, optionally, the chip 400 is a light emitting chip 400, and the protective adhesive layer 500 is further mixed with phosphor.
Specifically, when the chip 400 is a light-emitting LED chip 400, the LED chip 400 can emit blue light, and the phosphor can excite secondary light emission by receiving the blue light, thereby emitting light of other colors. Therefore, the filament structure can emit light with different colors by arranging different fluorescent powder, and the decorative effect of the decorative lamp is improved.
Example four
Another embodiment of the present application provides a decorative lamp including the filament structure of any of the above embodiments.
The decorative lamp provided by the embodiment of the application has the filament structure provided by any one of the above embodiments, so that all the beneficial effects of the filament structure provided by any one of the above embodiments are achieved, and the description is omitted here.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (10)
1. A filament structure, comprising:
a strip-shaped substrate;
the first conducting layer is arranged on the first surface of the strip-shaped substrate and is patterned into a plurality of first positive electrodes and a plurality of first negative electrodes, a positive electrode bonding pad is arranged at one end of each first positive electrode, a negative electrode bonding pad is arranged at one end of each first negative electrode, a positive electrode through hole is formed in the strip-shaped substrate at the other end of each first positive electrode, and a negative electrode through hole is formed in the strip-shaped substrate at the other end of each first negative electrode;
the second conducting layer is arranged on the second surface of the strip-shaped substrate and is patterned into a plurality of second anodes and a plurality of second cathodes, each second anode and each second cathode are arranged in a one-to-one correspondence manner, the second anodes and the second cathodes are located at opposite edge positions in the length direction of the strip-shaped substrate, the second anodes are electrically connected with the first anodes through the anode through holes, and the second cathodes are electrically connected with the first cathodes through the cathode through holes;
the projection of the positive electrode pad on the second surface of the strip-shaped substrate is overlapped with the second negative electrode part, and the projection of the negative electrode pad on the second surface of the strip-shaped substrate is overlapped with the second positive electrode part.
2. The filament structure according to claim 1, further comprising a plurality of chips, wherein both ends of each of the chips are respectively connected to one of the positive electrode bonding pads and one of the negative electrode bonding pads, such that one end of each of the chips is electrically connected to one of the second positive electrodes through one of the first positive electrodes, and the other end of each of the chips is electrically connected to one of the second negative electrodes through one of the first negative electrodes.
3. The filament structure according to claim 2, wherein the first positive electrode and the first negative electrode connected to the same chip are located on the same straight line, and the positive electrode pad and the negative electrode pad are disposed opposite to each other.
4. The filament structure according to claim 2, wherein two adjacent chips connected to the same second positive electrode and the same second negative electrode are arranged in parallel.
5. The filament structure according to claim 2, wherein a plurality of the second positive electrodes are located on one side of the second surface, a plurality of the second negative electrodes are located on the other side of the second surface, and the corresponding second positive electrodes and the corresponding second negative electrodes form a parallel group, and two adjacent parallel groups are connected in series.
6. The filament structure according to claim 5, wherein the second positive electrode of one of the parallel groups is connected to the second negative electrode of the other of the parallel groups, so that the two adjacent parallel groups are connected in series.
7. The filament structure according to claim 2, wherein a conductive adhesive layer is further disposed on the strip-shaped substrate, the conductive adhesive layer is disposed on the positive bonding pad and the negative bonding pad, respectively, and the conductive adhesive layer is used for fixing the chip.
8. The filament structure according to claim 2, further comprising a protective glue layer covering the first surface and the second surface.
9. The filament structure according to claim 8, wherein the chip is a light emitting chip, and phosphor is mixed in the protective adhesive layer.
10. A decorative lamp comprising the filament structure of any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122675324.3U CN216213535U (en) | 2021-11-03 | 2021-11-03 | Filament structure and decorative lamp |
| PCT/CN2022/078848 WO2023077695A1 (en) | 2021-11-03 | 2022-03-02 | Filament structure and decorative lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122675324.3U CN216213535U (en) | 2021-11-03 | 2021-11-03 | Filament structure and decorative lamp |
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| Publication Number | Publication Date |
|---|---|
| CN216213535U true CN216213535U (en) | 2022-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122675324.3U Active CN216213535U (en) | 2021-11-03 | 2021-11-03 | Filament structure and decorative lamp |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN216213535U (en) |
| WO (1) | WO2023077695A1 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108317437B (en) * | 2018-02-12 | 2020-07-31 | 京东方科技集团股份有限公司 | Backlight source, backlight module and display device |
| CN211502399U (en) * | 2020-03-11 | 2020-09-15 | 江门市盈声电子科技有限公司 | Wire-free LED lamp strip |
| CN214481454U (en) * | 2021-03-01 | 2021-10-22 | 深圳市中深光电股份有限公司 | Flexible circuit board, lamp strip, backlight module and liquid crystal display device |
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2021
- 2021-11-03 CN CN202122675324.3U patent/CN216213535U/en active Active
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2022
- 2022-03-02 WO PCT/CN2022/078848 patent/WO2023077695A1/en unknown
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| WO2023077695A1 (en) | 2023-05-11 |
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