KR20060078820A - Luminous apparatus - Google Patents

Abstract

According to an embodiment of the present invention, a plurality of light emitting devices are connected in series, in parallel, or in parallel, each of the light emitting devices includes at least two light emitting cell arrays connected in parallel, and each of the light emitting cell arrays includes a plurality of light emitting cells in series. Provided is a light emitting device characterized in that the connection.

This makes it possible to assemble the LED chip on the PCB board when constructing the LED lamp, and to operate the AC power supply without the need of AC-DC converters, etc., so that the space utilization is excellent, and the effect of miniaturization and cost reduction can be achieved. You can get it.

Light Emitting Diode, Light Emitting Diode, LED, AC, Heat Sink

Description

Luminous apparatus

1 is a circuit diagram showing an equivalent circuit of a light emitting device having two bonding pads according to the present invention.

2 is a circuit diagram showing an equivalent circuit of a light emitting device having four bonding pads according to the present invention;

3 is a schematic view showing a light emitting device having two bonding pads according to the present invention;

4 is a schematic view showing a light emitting device having four bonding pads according to the present invention;

5A to 5B are circuit diagrams showing a test circuit for testing a light emitting device having four bonding pads in a DC power supply according to the present invention;

Fig. 6A is a layout showing a first embodiment of the present invention with two bonding pads.

6B is a layout showing a second embodiment of the present invention with two bonding pads.

Fig. 7A is a layout showing a third embodiment of the present invention with four bonding pads.

7B is a layout showing a fourth embodiment of the present invention with four bonding pads.                 

Fig. 8 is a circuit diagram showing an equivalent circuit of a light emitting device in which light emitting elements are configured in series and parallel according to the present invention.

Fig. 9 is a circuit diagram showing an equivalent circuit of a light emitting device in which light emitting elements are configured in series according to the present invention.

10A is a schematic diagram of a light emitting device constructed by wire bonding two light emitting elements in parallel according to the present invention;

10B is a schematic diagram of a light emitting device constructed by wire bonding two light emitting elements in series according to the present invention;

Fig. 11A is a schematic view of a light emitting device constructed by wire bonding four light emitting elements in series and parallel according to the present invention;

11B is a schematic view of a light emitting device constructed by wire bonding four light emitting elements in series according to the present invention;

12 is a cross-sectional view of a light emitting device of the present invention.

<Explanation of symbols for the main parts of the drawings>

100 light emitting cell 200 first light emitting cell array

300: second light emitting cell array 400: first bonding pad

500: second bonding pad 600: third bonding pad

700: fourth bonding pad 800: AC power

850: DC power supply 900: external resistance

1000: light emitting element 1100: substrate                 

1200: wire 1300: electrode

The present invention relates to a light emitting device, and more particularly, to a light emitting device using a light emitting element that can be driven by an AC power source.

A light emitting diode (hereinafter, referred to as 'LED') refers to a device that makes a small number of carriers (electrons or holes) injected by using a pn junction structure of a semiconductor and emits light by recombination thereof. Red light emitting diodes using GaAsP, etc., Green light emitting diodes using GaP, etc., Blue light emitting diodes using InGaN / AlGaN double hetero structure.

Such light emitting diodes are widely used in various fields such as numeric / character display elements, traffic light sensors, light sources for optical coupling elements, optical communication, displays, etc., and recently, active research is being conducted to apply them for general lighting purposes. This is because light emitting diodes consume less power and have a longer lifetime than conventional light bulbs or fluorescent lamps. That is, the power consumption of the light emitting diode is only several to tens of times and the lifetime is several to several tens of times compared to the conventional lighting device, which is excellent in terms of reducing power consumption and durability.

In a conventional LED chip driven by a DC power supply, when the DC power is applied, a current flows over a predetermined voltage, and the LED operates to turn on. As long as the current is applied, the lighting state is maintained and the light amount increases in proportion to the applied current when the current value is increased to a constant current level. However, if the current is increased above a certain threshold current, the amount of light begins to decrease and the amount of light continues to decrease as the current increases. In order to improve the output of such a light emitting diode, it is necessary to increase the threshold current value of the light emitting diode.

LEDs applied to general lighting have a threshold current of several hundred mA or more, for example, a large area light emitting diode chip has a threshold current of 350 mA or more. However, in this case, since the amount of heat generation is quite large, it is difficult to continuously maintain the performance of the light emitting diode unless a heat dissipation measure is provided to reduce it to an appropriate level or less.

The LED lamp for lighting uses the large-area high-current LED chip described above in a package and attaches it to a heat sink so that heat can be emitted, and an AC-DC converter (AC-DC converter) and a resistor on a PCB board or the like are used. Manufactured by attaching and connecting accessory parts.

When the large-area high-current LED chip described above is used for the construction of such a general lighting LED lamp, a considerable amount of heat is generated due to its high applied current level, which shortens the life of the LED chip. . In order to establish a heat dissipation countermeasure, it is necessary to select a material of the heat sink and to secure a considerable space. In addition, it is difficult to miniaturize the product because it requires a converter or a separate rectifier circuit to operate in an AC power source, there is a problem that excessive cost in manufacturing.

The present invention is to solve the above problems, it is possible to assemble the LED chip on the PCB substrate when the configuration of the LED lamp, and even in the AC power supply can be operated without accessories, such as A / D converter excellent space utilization In addition, an object of the present invention is to provide a light emitting device capable of improving the durability and extending the life of a light emitting diode chip.

In order to achieve the above object, the present invention is configured by connecting a plurality of light emitting devices in series, parallel or in parallel, each of the light emitting device is at least two light emitting cell array is connected in parallel, Each provides a light emitting device characterized in that a plurality of light emitting cells are connected in series.

Here, the light emitting cell array is connected in parallel so that a cathode of at least one light emitting cell array and an anode of a remaining light emitting cell array are connected to each other, and the number of light emitting cells of the at least one light emitting cell array and the number of light emitting cells of the remaining light emitting cell array are connected. Is preferably the same.

The present invention provides a light emitting device, characterized in that one end and the other end of each of the light emitting cell arrays are connected to bonding pads spaced apart from each other.

In another aspect, the present invention is characterized in that one end of each of the light emitting cell arrays is connected to two or more bonding pads adjacent to each other, and each other end of the light emitting cell array is connected to two or more other bonding pads adjacent to each other. Provided is a light emitting device. Two or more bonding pads connected to the one ends are electrically connected to each other, and two or more other bonding pads connected to the other ends are electrically connected to each other, and the two or more bonding pads connected to each other are connected to each other. And at least two times the width of the bonding pad and the two or more other bonding pads connected to each other.

The light emitting device of the present invention is characterized in that the at least two light emitting cell arrays are combined to form a matrix.

The light emitting device of the present invention further includes a substrate on which the light emitting device is mounted, an electrode formed on the substrate, and a wire for electrical connection between the electrode and the light emitting device.

Below. With reference to the accompanying drawings will be described an embodiment of the present invention in more detail. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention, and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. Like numbers refer to like elements in the figures.

 In the present invention, one light emitting device is formed by using a plurality of light emitting diodes on a single chip without manufacturing one light emitting device by using one light emitting diode. This is referred to as a light emitting cell to distinguish it from a conventional light emitting diode.

1 is a circuit diagram showing an equivalent circuit of a light emitting device having two bonding pads according to the present invention. Referring to this, the light emitting device 1000 according to the present invention includes a plurality of light emitting cells 100 connected to the first light emitting cell array 200 and the second light emitting cell array 300 and the light emitting cell arrays 200 and 300. Bonding pads 400 and 500 for supplying predetermined power. In the first or second light emitting cell arrays 200 and 300, the unit light emitting cells 100 are electrically connected in series from the respective bonding pads 400 and 500. The first light emitting cell array 200 and the second light emitting cell array 200 are connected to each other in series. The light emitting cell array 300 is connected in parallel so that the anode and the cathode are connected to each other between the bonding pads 400 and 500. That is, the cathode of the first light emitting cell array 200 is connected to the first bonding pad 400, the anode is connected to the second bonding pad 500, and the cathode of the second light emitting cell array 300 is the second bonding. It is connected to the pad 500 and the anode is connected to the first bonding pad 400. The light emitting cell arrays 200 and 300 electrically connected to the different bonding pads 400 and 500 emit light independently.

An AC power source 800 is connected to the outside to drive the light emitting cell arrays 200 and 300, and a predetermined circuit including an external resistor 900 is connected to adjust the applied current.

Referring to the operation of the light emitting device 1000 according to the circuit diagram of FIG. 1, a positive voltage is applied to the first bonding pad 400 and a negative voltage is applied to the second bonding pad 500. In this case, the second light emitting cell array 300 emits light. On the other hand, when a negative voltage is applied to the first bonding pad 400 and a positive voltage is applied to the second bonding pad 500, the first light emitting cell array 200 emits light. That is, since the light emitting cell arrays 200 and 300 alternately operate during the positive and negative duty of each voltage, the AC power source 800 can be sufficiently used.

2 is a circuit diagram showing an equivalent circuit of a light emitting device having four bonding pads according to the present invention. Referring to this, the light emitting device 1000 according to the present invention includes a plurality of light emitting cells 100 connected to the first light emitting cell array 200 and the second light emitting cell array 300 and the light emitting cell arrays 200 and 300. Bonding pads 400 to 700 for supplying predetermined power. In the first or second light emitting cell arrays 200 and 300, the unit light emitting cells 100 are electrically connected in series from each of the bonding pads 400 to 700. The first light emitting cell array 200 and the second light emitting cell array 200 are connected in series. The light emitting cell array 300 is connected in parallel so that the anode and the cathode are connected to each other between the bonding pads 400 to 700. That is, the cathode of the first light emitting cell array 200 is connected to the first bonding pad 400, the anode is connected to the third bonding pad 600, and the cathode of the second light emitting cell array 300 is the fourth bonding. It is connected to the pad 700 and the anode is connected to the second bonding pad 500. In addition, the first bonding pad 400 and the second bonding pad 500 are electrically connected to each other when driven in an AC power source, and the third bonding pad 600 and the fourth bonding pad 700 are electrically connected to each other. have. The light emitting cell arrays 200 and 300 electrically connected to the different bonding pads 400 to 700 emit light independently.

An AC power source 800 is connected to the outside to drive the light emitting cell arrays 200 and 300, and a predetermined circuit including an external resistor 900 is connected to adjust the applied current.

Referring to the operation of the light emitting device 1000 according to the circuit diagram of FIG. 2, a positive voltage is applied to the first bonding pad 400 and the second bonding pad 500, and the third bonding pad 600 and the third bonding pad 600 are applied. When a negative voltage is applied to the four bonding pads 700, the second light emitting cell array 300 emits light. On the other hand, a negative voltage is applied to the first bonding pad 400 and the second bonding pad 500 and a positive voltage is applied to the third bonding pad 600 and the fourth bonding pad 700. In this case, the first light emitting cell array 200 emits light. That is, since the light emitting cell arrays 200 and 300 alternately operate during the positive and negative duty of each voltage, the AC power supply 800 can be used sufficiently.

3 to 4 are schematic views showing a light emitting device 1000 according to the present invention. The embodiment of the present invention is characterized in that the light emitting cell array is arranged in two columns within the light emitting device 1000. Of course, various embodiments are possible without being limited thereto. In addition, the shape of the unit light emitting cell 100 and the bonding pads 400 to 700 of the light emitting device 1000 may have various shapes such as square, rectangle, triangle, and circle, and the sizes thereof may be variously changed.

The light emitting device 1000 of FIG. 3 includes two bonding pads 400 and 500, wherein each of the bonding pads 400 and 500 is connected to an external power source (positive and negative), and between the bonding pads 400 and 500. The plurality of light emitting cells 100 includes a plurality of light emitting cell arrays connected in series. At this time, the plurality of light emitting cell arrays are connected in parallel between the bonding pads 400 and 500 so as to alternately emit light. That is, when one cathode of one light emitting cell array is connected in the bonding pads 400 and 500, one end of the other light emitting cell array is connected to the anode.

In the light emitting device 1000 of FIG. 4, two light emitting cell arrays are formed, and four bonding pads 400 to 700 are formed. That is, bonding pads are connected to both ends of each light emitting cell array. The first bonding pad 400 connecting the cathodes of one light emitting cell array and the second bonding pad 500 connecting the anodes of the other light emitting cell array are adjacent to each other. It is composed by electrically connecting with each other. In addition, the third bonding pad 600 and the fourth bonding pad 700 which connect the other ends of the light emitting cell array to each other are located adjacent to each other. Likewise, the bonding pads are electrically connected to each other when driven by an AC power source. To configure. Here, the bonding pad groups electrically connected to each other may be disposed at a distance of two or more times the width of the bonding pads from the other bonding pad groups. The reason why the pair of bonding pad groups are symmetrically separated from each other is to have a breakdown voltage that can withstand a high AC voltage.

As can be seen in FIG. 4, the bonding pads are manufactured in duplicate, so that the bonding pads can be freely selected during the wire bonding process in the LED package, thereby facilitating wire bonding. 5A shows a circuit diagram of a method of testing light emitting device characteristics in a direct current power source. Referring to the drawings, by connecting the DC power supply 850 in the arrangement as shown in the drawings, it is possible to test the DC characteristics of the array cells between the second bonding pad 500 and the fourth bonding pad 700, the DC power supply If the direction of 850 is reversely connected, the direct current characteristic of the array cell between the first bonding pad 400 and the third bonding pad 600 may be tested. 5B shows a circuit diagram of a method for independently testing each array cell.

In the present invention, by forming the bonding pads in duplicate as described above, as shown in FIGS. 5A to 5B, the characteristics of the light emitting device can be easily measured not only in the AC power source but also in the DC power source. The two bonding pads included light emitting cell arrays operating under voltages flowing in opposite directions, and thus could not be driven simultaneously from a DC power source. Therefore, when trying to find out the characteristics of the light emitting device in the DC power supply, since only the result of each light emitting cell array is known, there is a need to construct a circuit several times. However, if the bonding pads are formed in duplicate, the test can be performed simply by constructing a circuit as shown in the figure. That is, FIG. 5A connects two rows of light emitting cell arrays in series to operate simultaneously, and FIG. 5B configures different external power supplies and external resistors independently to enable simultaneous operation.

In addition, by making the bonding pads in duplicate, the bonding pads can be freely selected during the wire bonding process in the LED package, thereby facilitating wire bonding.

6A to 7B are layout views showing respective embodiments of the light emitting device according to the present invention.

6A and 6B illustrate an embodiment of a light emitting device 1000 having two bonding pads 400 and 500, and in FIG. 6A, two bonding pads 400 and 500 are symmetrical in a diagonal direction of the light emitting device 1000. 6B, two bonding pads 400 and 500 are symmetrically formed on one side of the light emitting device 1000. Of course, the present invention is not limited thereto, and various arrangements of the bonding pads are possible for the convenience of electrical connection, and the shape of the unit light emitting cell 100 and the bonding pad may have various shapes such as square, rectangle, triangle, and circle. You can also change a variety.

In addition, the light emitting cells 100 are connected in series between the bonding pads 400 and 500 through predetermined wires. Each of the N-type or P-type electrodes of the light emitting cell 100 is connected to the P-type or N-type electrode of the adjacent light emitting cell 100. That is, the P-type electrode of the first light emitting cell 100 is connected to the first bonding pad 400, and the N-type electrode is connected to the P-type electrode of the second light emitting cell 100 via wiring. The N-type electrode of the second light emitting cell 100 is connected to the P-type electrode of the third light emitting cell 100. In this way, the N-type electrode of the light emitting cell 100 of the previous number is connected to the P-type electrode of the light emitting cell 100 of the rear number.

In the first embodiment illustrated in FIG. 6A, 28 light emitting cells 100 are arranged in a matrix of 5 × 6, and two light emitting cell arrays 200, between two bonding pads 400 and 500, are formed. 300 is connected in parallel. Referring to the drawings, the matrix (1,1) to the matrix (1,6) are the first bonding pads 400 and the light emitting cells (1, 8, 9, 10, 11), and the matrix (2,1) to the matrix ( 2,6 are light emitting cells 28, 2, 7, 19, 18, 12, and matrices 3,1 to 3,6 are light emitting cells 27, 3, 6, 20, 17, 13 ), Matrix (4,1) to matrix (4,6) are light emitting cells (26, 4, 5, 21, 16, 14), and matrix (5,1) to matrix (5, 6) are light emitting cells (25, 24, 23, 22, 15) and the second bonding pad 500. Of course, such a matrix arrangement can be modified in a myriad of forms and the number of light emitting cells 100 in the first and second light emitting cell arrays 200 and 300 is not limited. However, in order to minimize the change in brightness of the light emitting device 1000, the number of light emitting cells 100 in the first and second light emitting cell arrays 200 and 300 is preferably the same.

That is, the light emitting device 1000 of FIG. 6A may include a first light emitting cell array 200 in which first or second bonding pads 400 and 500 and first to second light emitting cells 100 are connected in series. 15 to 28 light emitting cells 100 include a second light emitting cell array 300 connected in series. At this time, the cathode of the first light emitting cell array 200 is connected to the first bonding pad 400, and the anode is connected to the second bonding pad 500. On the other hand, the cathode of the second light emitting cell array 300 is connected to the second bonding pad 500, and the anode is connected to the first bonding pad 400.

Referring to the driving of the light emitting device 1000, first, an AC voltage is applied through the bonding pads 400 and 500. When a positive voltage is applied to the first bonding pad 400 and a negative voltage is applied to the second bonding pad 500, the second light emitting cell arrays 300 to 15 may emit light. Done. On the other hand, when a negative voltage is applied to the first bonding pad 400 and a positive voltage is applied to the second bonding pad 500, the first light emitting cell arrays 200 of 1 to 14 are It will emit light.

As described above, since the light emitting cell arrays 200 and 300 alternately operate during the positive and negative duty of each voltage, even if the applied external power source is an AC power source, continuous light emission can be performed.

In the second embodiment shown in FIG. 6B, 46 light emitting cells 100 are arranged in a 6 × 8 matrix, and two light emitting cell arrays 200 and 300 are disposed between two bonding pads 400 and 500. It is connected in parallel. Referring to the drawing, the matrix (1,1) to the matrix (1,8) are the light emitting cells (5, 6, 7, 8, 17, 18, 19, 20), and the matrix (2,1) to the matrix (2, 8) are light emitting cells (4, 42, 41, 9, 16, 30, 29, 21), and matrices (3, 1) to (3, 8) are light emitting cells (3, 43, 40, 10, 15). , 31, 28, 22), matrix (4,1) to matrix (4,8) are light emitting cells (2, 44, 39, 11, 14, 32, 27, 23), matrix (5,1) Since matrix (5,8) is the light emitting cells (1, 45, 38, 12, 13, 33, 26, 24), matrix (6,1) to matrix (6,8) is the first bonding pad 400 Light emitting cells 46, 37, 36, 35, 34, 25, and second bonding pads 500. Of course, such a matrix arrangement can be modified in a myriad of forms and the number of light emitting cells 100 in the first and second light emitting cell arrays 200 and 300 is not limited.

That is, the light emitting device 1000 of FIG. 6B includes a first light emitting cell array 200 in which first or second bonding pads 400 and 500 and first to second light emitting cells 100 are connected in series. 25 to 46 light emitting cells 100 include a second light emitting cell array 300 connected in series. At this time, the cathode of the first light emitting cell array 200 is connected to the first bonding pad 400, and the anode is connected to the second bonding pad 500. On the other hand, the cathode of the second light emitting cell array 300 is connected to the second bonding pad 500, and the anode is connected to the first bonding pad 400.

Referring to the driving of the light emitting device 1000, first, an AC voltage is applied through the bonding pads 400 and 500. When the positive voltage is applied to the first bonding pad 400 and the negative voltage is applied to the second bonding pad 500, 25 to 46 second light emitting cell arrays 200 emit light. Done. On the other hand, when a negative voltage is applied to the first bonding pad 400 and a positive voltage is applied to the second bonding pad 500, the first light emitting cell array 200 of 1 to 24 times It will emit light.

As described above, since the light emitting cell arrays 200 and 300 alternately operate during the positive and negative duty of each voltage, even if the external power applied is AC power, continuous light emission may be performed.

7A and 7B illustrate embodiments of a light emitting device having four bonding pads 400 to 700, and each of the two bonding pads is electrically connected to each other when driven from an AC power source. In FIG. 7A, two pairs of bonding pad groups are symmetrically formed on the central side of the light emitting device 1000, and in FIG. 7B, two pairs of bonding pad groups are diagonally symmetrically formed of the light emitting device 1000. Of course, the present invention is not limited thereto, and various arrangements of the bonding pads 400 to 700 may be possible for convenience of electrical connection, and the shape of the unit light emitting cell 100 and the bonding pads 400 to 700 may be square, rectangular, triangular, circular, or the like. It can have various shapes and vary in size. In addition, the light emitting cells 100 are connected in series between the bonding pads 400 to 700 through predetermined wires. As described above, each of the N-type or P-type electrodes of the light emitting cell 100 is connected to the P-type or N-type electrode of the adjacent light emitting cell 100.

In the third embodiment illustrated in FIG. 7A, 32 light emitting cells 100 are arranged in a matrix of 6 × 6, and two light emitting cell arrays 200 and 300 are arranged between four bonding pads 400 to 700. It is connected in parallel. The first bonding pad 400 and the second bonding pad 500 are electrically connected to each other, and the third bonding pad 600 and the fourth bonding pad 700 formed symmetrically thereto are also electrically connected to each other. Referring to the drawings, matrices (1,1) through (1,6) are light emitting cells (2, 3, 8, 9, 14, 15), and matrices (2,1) through (2,6) emit light. Cells (1, 4, 7, 10, 13, 16), matrices (3, 1) through (3, 6) are the first bonding pads 400, light emitting cells (5, 6, 11, 12), Third bonding pad 600, matrixes 4, 1 to matrices 4, 6 are second bonding pad 500, light emitting cells 28, 27, 22, 21, and fourth bonding pad 700. Where matrix (5,1) to matrix (5,6) are light emitting cells 32, 29, 26, 23, 20, 17, and matrix (6,1) to matrix (6,6) are light emitting cells ( 31, 30, 25, 24, 19, 18). Of course, such a matrix arrangement can be modified in a myriad of forms and the number of light emitting cells 100 in the first and second light emitting cell arrays 200 and 300 is not limited. However, in order to minimize the change in brightness of the light emitting device 1000, the number of light emitting cells 100 in the first and second light emitting cell arrays 200 and 300 is preferably the same.

That is, the light emitting device 1000 of FIG. 7A includes a first light emitting cell array 200 in which first to fourth bonding pads 400 to 700 and first to fourth light emitting cells 100 are connected in series. 17 to 32 light emitting cells 100 include a second light emitting cell array 300 connected in series. In this case, the cathode of the first light emitting cell array 200 is connected to the first bonding pad 400, and the anode is connected to the third bonding pad 600. On the other hand, the cathode of the second light emitting cell array 300 is connected to the fourth bonding pad 700, and the anode is connected to the second bonding pad 500. Here, the first bonding pad 400 and the second bonding pad 500 are electrically connected to each other, and the third bonding pad 600 and the fourth bonding pad 700 are electrically connected to each other.

Referring to the driving of the light emitting device 1000, first, an AC voltage is applied through the bonding pads 400 to 700. 17 to 32 times when a positive voltage is applied to the first or second bonding pads 400 and 500 and a negative voltage is applied to the third or fourth bonding pads 600 and 700. The second light emitting cell array 300 emits light. 1 to 16 when negative voltage is applied to the first or second bonding pads 400 and 500 and positive voltage is applied to the third or fourth bonding pads 600 and 700. The first light emitting cell array 200 emits light.

As described above, since the light emitting cell arrays 200 and 300 operate alternately during the positive and negative duty of each voltage, they can be sufficiently used in AC power, and the bonding pads 400 to 700 may be used. In the double bonding process, since the bonding pads 400 to 700 can be freely selected during the wire bonding process, wire bonding can be facilitated.

In the fourth embodiment illustrated in FIG. 7B, 32 light emitting cells 100 are arranged in a matrix of 6 × 6, and two light emitting cell arrays 200 and 300 are arranged between four bonding pads 400 to 700. It is connected in parallel. The first bonding pad 400 and the second bonding pad 500 are electrically connected to each other, and the third bonding pad 600 and the fourth bonding pad 700 formed symmetrically thereto are also electrically connected to each other. Referring to the drawings, the matrix (1,1) to the matrix (1,6) are the first bonding pad 400, the light emitting cells (1, 10, 11, 12, 13), and the matrix (2,1) to the matrix (2,6) is the second bonding pad 500, the light emitting cells (2, 9, 22, 21, 14), and the matrix (3,1) to the matrix (3,6) are the light emitting cells (32, 3, 8, 23, 20, 15), from matrix (4,1) to matrix (4,6) are light emitting cells (31, 4, 7, 24, 19, 16), and from matrix (5,1) to matrix ( 5, 6 are light emitting cells 30, 5, 6, 25, 18, and third bonding pads 600, and matrices 6, 1 to 6, 6 are light emitting cells 29, 28, 27. , 26, 17) and a fourth bonding pad 700. Of course, such a matrix arrangement can be modified in a myriad of forms and the number of light emitting cells 100 in the first and second light emitting cell arrays 200 and 300 is not limited.

That is, the light emitting device 1000 of FIG. 7B includes a first light emitting cell array 200 in which first to fourth bonding pads 400 to 700 and first to fourth light emitting cells 100 are connected in series. 17 to 32 light emitting cells 100 include a second light emitting cell array 300 connected in series. In this case, the cathode of the first light emitting cell array 200 is connected to the first bonding pad 400, and the anode is connected to the third bonding pad 600. On the other hand, the cathode of the second light emitting cell array 300 is connected to the fourth bonding pad 700, and the anode is connected to the second bonding pad 500. Here, the first bonding pad 400 and the second bonding pad 500 are electrically connected to each other, and the third bonding pad 600 and the fourth bonding pad 700 are electrically connected to each other.

The driving of the light emitting device 1000 is the same as in the above-described third embodiment.

Therefore, since the light emitting cell arrays 200 and 300 operate alternately during the positive and negative duty of each voltage, the bonding pads 400 to 700 can be used sufficiently. It is possible to facilitate wire bonding since the bonding pads 400 to 700 can be freely selected during the double bonding process.

The light emitting device according to the present invention can obtain a high luminous efficiency by configuring the above-described light emitting device using at least one or more, and is configured by connecting a plurality of light emitting devices in a series, parallel or series parallel. 8 to 9 are circuit diagrams showing an equivalent circuit of the light emitting device using the light emitting device 1000. FIG. 8 illustrates an example in which four light emitting devices 1000 are connected in series and in parallel. FIG. 9 illustrates an example in which the same number of light emitting devices 1000 are connected in series. The AC power supply 800 is connected and an AC voltage is applied to the light emitting device 1000 through the bonding pad of the light emitting device 1000. The light emitting device 1000 of the present invention can be driven by the AC power supply 800 without the AC-DC converter. Of course, it may further include a separate circuit for stabilizing AC power. The illustrated configuration is only one embodiment, and the plurality of light emitting devices 1000 may be variously configured in series, parallel, or parallel and parallel connection, and the number of light emitting devices 1000 is not limited.

The light emitting device of the present invention can control the light output under a given voltage by configuring the plurality of light emitting devices 1000 in such a variety of connections. For example, FIGS. 8 to 9 may connect four identical light emitting devices 1000 in different configurations to obtain the same light output at 110V and 220V, respectively. In FIG. 8, when four light emitting devices 1000 are connected in parallel to a 110V power supply, when the applied current through an external resistor is 2 × I and the voltage applied to each light emitting device is V1, the power applied to each light emitting device is V1. The condition is 2V1 × 2I and the total power is 4V1 since it is four light emitting elements. On the other hand, when four light emitting devices are connected in series to the 220V power supply in FIG. 9, when the current applied through the external resistor is I and the voltage applied to each light emitting device is V1, the power condition applied to each light emitting device is 4V1 ×. Since I is four light emitting elements, the total power is 4V1. In the end, the same light emitting device can be connected in series and parallel to obtain the same light output at 110V and 220V, respectively.                     

As described above, the light emitting device of the present invention can obtain high luminous efficiency by using a plurality of light emitting elements, and can obtain necessary light output under an external voltage by various configurations of series, parallel or series.

10A to 11B are schematic views illustrating a light emitting device in which the light emitting devices 1000 are wire bonded in series, in parallel, or in parallel and in series according to the present invention. 10A and 10B illustrate a light emitting device including two light emitting devices 1000 and is configured using a light emitting device 1000 having bonding pads symmetrically formed on one side of the light emitting device 1000. 11A and 11B illustrate a light emitting device including four light emitting devices 1000 and is configured using a light emitting device 1000 in which bonding pads are symmetrically formed in a diagonal direction of the light emitting device 1000. The positions of the bonding pads of the light emitting device 1000 may be variously arranged according to the configuration and shape of the light emitting device, and the shapes of the bonding pads 1000 and the electrodes 1300 may have various shapes for the convenience of electrical connection. It can have a variety of sizes. When the external power is supplied to the light emitting device 1000 through the bonding pads connected from the electrode 1300, and four bonding pads are formed in the light emitting device 1000 as described above, the wire 1200 may be more easily processed during the wire 1200 process. (1200) can be bonded. The illustrated configuration is only one embodiment and can be variously connected and bonded to the wire 1200, and the number of light emitting devices 1000 is not limited.

The light emitting device 1000 according to the present invention may bond the wire 1200 to a mount to which a heat sink is attached. In addition, since only an external resistor circuit is driven without various accessories such as an AC-DC converter, the wire 1200 may be directly bonded to the PCB.                     

FIG. 10A illustrates a structure in which two light emitting devices 1000 are bonded by wires 1200 in parallel on a substrate 1100, and FIG. 10B illustrates two light emitting devices 1000 in series on a substrate 1100. ) It is composed by bonding. Each can be configured in various ways depending on the desired shape and the required light output.

FIG. 11A illustrates four light emitting devices 1000 bonded in series and parallel with a wire 1200 on a substrate 1100. FIG. 11B illustrates four light emitting devices 1000 connected in series on a substrate 1100. 1200) bonding.

12 is a cross-sectional view illustrating a light emitting device according to the present invention.

Referring to FIG. 12, the light emitting device according to the present invention includes a substrate 1100, a plurality of light emitting devices 1000 mounted on the substrate 1100, an electrode 1300 for connecting an external power source, and an electrode 1300. ) And a wire 1200 for electrical connection of the light emitting device 1000. The light emitting device 1000 includes a plurality of light emitting cell arrays in which a plurality of light emitting cells are connected in series, and each light emitting cell array is connected in parallel with each other across a cathode and an anode portion between bonding pads. Since the light emitting device 1000 is variously formed on the substrate 1100 in a series, parallel, or parallel type, it can be driven even in an AC power source. In this case, the substrate may be a mount having a heat sink and may be configured by bonding the wire 1200 directly to the PCB since only an external resistor can be operated without various accessories such as an AC-DC converter.

As described above, the light emitting device according to the present invention can be directly mounted on a mount or a PCB, and the lifespan can be extended by improving the durability and reliability can be improved.

In addition, it can be operated without accessories such as an AC-DC converter, thereby improving space utilization and reducing the number of parts, thereby reducing the volume of the LED package and reducing costs.

Claims (9)

A plurality of light emitting elements are configured in series, parallel or serially connected, At least two light emitting cell arrays are connected to each of the light emitting devices in parallel. Wherein each of the light emitting cell arrays has a plurality of light emitting cells connected in series. The method according to claim 1, And the light emitting cell array is connected in parallel such that a cathode of at least one light emitting cell array and an anode of the other light emitting cell array are connected to each other. The method according to claim 2, And the number of light emitting cells of the at least one light emitting cell array is the same as the number of light emitting cells of the remaining light emitting cell array. The method according to any one of claims 1 to 3, And one end and the other end of each of the light emitting cell arrays are connected to bonding pads spaced apart from each other. The method according to any one of claims 1 to 3, Wherein one end of each of the light emitting cell arrays is connected to two or more bonding pads that are adjacent to each other, and the other ends of the light emitting cell array are connected to two or more other bonding pads that are adjacent to each other. The method according to claim 5, At least two bonding pads connected to the one ends are electrically connected to each other, and at least two other bonding pads connected to the other ends are electrically connected to each other. The method according to claim 6, The two or more bonding pads connected to each other are arranged symmetrically with a distance of at least two times the width of the bonding pad and two or more other bonding pads connected to each other. The method according to any one of claims 1 to 3, And the at least two light emitting cell arrays are arranged in combination to form a matrix. The method according to any one of claims 1 to 3, A substrate on which the light emitting element is mounted; An electrode formed on the substrate; And And a wire for electrical connection between the electrode and the light emitting element.

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