KR100990423B1 - Led module of surface mount devices type - Google Patents

Abstract

The present invention proposes an improved configuration for electrically connecting a plurality of light emitting chips in the configuration of an LED device having a SMD form, so that the wire bonding process for energizing the light emitting chip can be performed more quickly and stably. At the same time, the present invention relates to an LED module having a surface-mounting device that can dissipate heat generated during driving by itself and to facilitate the expansion of the number of light emitting chips. In addition, the present invention is to optimize the series connection configuration between the light emitting chip in the circuit configuration to drive the LED by the AC power source.

To this end, the present invention is a surface-mount type LED device that is supplied with an external electric power to emit light from the inside of the body, comprising: a light emitting chip for emitting light by the external power; A lead terminal disposed on one side of the light emitting chip and wire-bonded with the light emitting chip to transfer external electric power to the light emitting chip; When the plurality of light emitting chips are disposed, the connection terminal is disposed between the adjacent light emitting chips and wire-bonded with each one polarity of the light emitting chips of both sides to have a power supply and heat dissipation function between the light emitting chips.

LED, SMD

Description

LED module of surface mount device type {LED MODULE OF SURFACE MOUNT DEVICES TYPE}

The present invention relates to an LED module in the form of a surface mount element.

In detail, the present invention provides an improved configuration for electrically connecting a plurality of light emitting chips in the configuration of an LED device having a SMD form, so that a wire bonding process for energizing the light emitting chips can be performed more quickly and stably. The present invention relates to an LED module in the form of a surface-mount device, which enables heat dissipation of heat generated during operation by itself and makes it easier to increase the number of light emitting chips. In addition, the present invention is to optimize the series connection configuration between the light emitting chip in the circuit configuration to drive the LED by the AC power source.

Among the LEDs that emit light of a certain color by the supply of electric power, an LED device, commonly referred to as a surface mount device (SMD), combines a light emitting chip with a lead frame and externally molded resin. Package configuration. In particular, the LED device is known that the lead terminal for connecting the electrical power to the lead frame to the outside of the body molded with the resin is drawn out, the lead terminal is emitted before the body is molded The chip and the wire bonding process have an electrically connected configuration.

1 is an exemplary internal configuration of the LED device of the SMD type as described above.

Referring to the drawings, the SMD type LED element is mainly composed of a plurality of light emitting chips 1 (3 in the figure) in order to improve the brightness characteristics of the light emitted from itself, and the light emitting chip ( Lead terminals 2 corresponding to the number of 1) are drawn out of the body 3. In addition, the LED device is configured by connecting a plurality of light emitting chips in parallel for connection with an external electrical power source.

In particular, in the above-described configuration, the light emitting chip 1 and the lead terminal 2 may have positive and negative electrodes (more specifically, anode and cathode) formed on the light emitting chip 1. It is generally arranged on both sides, and each pole of the light emitting chip 1 and the lead terminal 2 on both sides are mainly connected with a wire 4 made of a gold material by a wire bonding process. Electric conduction state is realized.

In addition, the lead terminal 2 constitutes an electrical connection state for each polarity of the light emitting chip 20 in order for each light emitting chip 1 to be connected in parallel. Such a parallel connection may be configured by connecting each polarity from the outside of the device in consideration of the luminance characteristics of the LED device, or may be formed by integrating the lead terminals 2 for each polarity of each light emitting chip 1 in the device itself. It can be connected and configured by wire bonding.

In the SMD type LED device configured as described above, the lead terminal must be disposed on both sides of a single light emitting chip due to the characteristics of the configuration. That is, in order to increase the number of the light emitting chips, the process of wire bonding the light emitting chips and the respective poles of the light emitting chips after the light emitting chips are arranged side by side left and right is very difficult, and when the light emitting chips are arranged side by side, the light emitting chips When arranging the cells in parallel, the LED device becomes large due to a design problem in which the arrangement of lead terminals is complicated.

In addition, as described above, when the LED device emits light from the light emitting chip by an external power source, considerable heat is generated due to the characteristics of the LED device itself, and this heat causes a bad effect on the device. Therefore, although a heat dissipation structure is installed in a printed circuit board or the like in which the LED element is mounted to dissipate such heat to the outside, this is only a structure for dissipating the overall heat generated from the circuit configuration and dissipates heat generated from the element itself. Inadequate problems are exposed.

The present invention has been invented to solve the above problems.

Accordingly, the present invention, in a configuration in which a plurality of light emitting chips are built therein, so that the wire bonding process can be carried out more quickly and stably even in a state where the light emitting chips are arranged side by side left and right, and the limitation on the arrangement state of the light emitting chips As a result, the size of the device itself can be miniaturized, and the configuration to perform heat dissipation in the device itself is applied. Therefore, the LED device is provided as an easy LED fabrication process, excellent heat dissipation characteristics, and an increase in the number of light emitting chips. It is aimed at making it possible.

In addition, an object of the present invention is to provide an LED module for optimizing the series connection configuration between the light emitting chip in the circuit configuration to drive the LED by the AC power source.

In order to achieve the above object, the present invention has the following configuration.

According to an aspect of the present invention, there is provided a surface mounted LED device configured to emit light from a body by receiving external electric power, the light emitting chip emitting light by the external power source; A lead terminal disposed on one side of the light emitting chip and wire-bonded with the light emitting chip to transfer external electric power to the light emitting chip; When the plurality of light emitting chips are disposed, the connection terminal is disposed between the adjacent light emitting chips and wire-bonded with each one polarity of the light emitting chips of both sides to have a power supply and heat dissipation function between the light emitting chips.

In addition, the present invention provides a surface-mount type LED device to receive light from the inside of the body by receiving an external electric power, a plurality of light emitting chips disposed inside the body to emit light by the external electric power; In order to connect the light emitting chips on both sides of the plurality of light emitting chips arranged to be connected to an external electric power source, one pair on both sides is exposed to the outside of the body, and in order to connect the light emitting chips and the light emitting chips in series. A lead terminal electrically connecting the light emitting chips; And a connection terminal disposed between the light emitting chips adjacent to each other in the arrangement of the light emitting chips, the wires being bonded to each of the polarities of the light emitting chips on both sides, and having a conduction and heat dissipation function between the light emitting chips.

At this time, the light emitting chip is mounted on the lead terminal so that one polarity is directly connected, and the other polarity is configured to be wire bonded to the lead terminal or the connecting terminal of the other side. In particular, the light emitting chips are arranged in two or more rows with a number of at least three, and the connecting terminals are arranged between each of the light emitting chips adjacent to each other in the rows of the light emitting chips so as to have an expansion configuration of the light emitting chips.

In addition, the light emitting chip is connected to each other in series to be applied to the LED luminaire to perform the LED drive by the voltage drop generated by each element by the AC power source, the LED luminaire driven by the AC power source is a driving source A bridge diode rectifying circuit unit which receives AC power and converts the rectified power into a rectified power for driving a light emitting chip; In order to emit light by the power inputted through the bridge diode rectifier circuit unit, a certain number of light emitting chips are connected in series, and the driving unit receives the desired voltage through the voltage drop of the input power and emits light. At this time, a zener diode is coupled to the connection terminal connecting the light emitting chip and the light emitting chip.

As described above, the present invention provides a more convenient manufacturing process by arranging connection terminals between the light emitting chip and the light emitting chip so that wire bonding can be performed quickly and stably even in a state in which the light emitting chip is arranged side by side. The effect of improving the productivity can be obtained.

In addition, the present invention has the effect that the heat dissipation is performed in the device itself by the connection terminal to minimize the adverse effect on the device by heat can contribute to the production of a better product.

At the same time, the present invention increases the number of connection terminals in a state in which a plurality of light emitting chips are arranged side by side, so as to maximize the brightness of light emitted from a single device by increasing the number of light emitting chips to a desired number, It is effective to obtain a better product.

In particular, the present invention, when applied to the LED circuit driven by receiving an AC power source, the light emitting chip is connected in series can be optimized to obtain the effect of realizing high productivity and high quality products in the production of products such as LED lighting fixtures do.

Figure 2 is a perspective view of the LED module according to the present invention, Figures 3 to 6 are internal configuration diagrams of various forms of the LED module according to the present invention. At this time, the LED module is the same concept as the SMD-type LED element, and when adding a plurality of light-emitting chips to be described later, including the configuration of the expansion chip and the connection terminal of the light emitting chip, it will be described as "LED module". .

Referring to the drawings, the LED module according to the present invention is configured such that the light emitting chip 20, the lead terminal 30, and the connection terminal 40 are electrically connected to each other by the wire bonding in the body 10.

The light emitting chip 20 is configured to emit light of various colors by a specific color or voltage of a power source by an external electric power supply as a basic configuration for emitting light of the LED.

The lead terminal 30 is for transmitting an external electric power to the light emitting chip 20, and is configured to allow the end of the body 10 to be drawn out and mounted on a printed circuit board (PCB) after molding.

The lead terminal 30 is connected to the anode (+,-) by the light bonding chip 20 and wire bonding, or as shown in the drawing, the light emitting chip 20 is mounted on the lead terminal 30 so that one polarity is directly connected. The other polarity may be configured to be wire bonded to the lead terminal 30 or the connection terminal 40 on the other side.

When two or more light emitting chips 20 are disposed, the connection terminal 40 is disposed between adjacent light emitting chips 20 and coupled to the body 10 to connect each of the light emitting chips 20 to both sides. It is configured to be wire bonded with one side polarity.

At this time, the connection terminal 40 is formed in the form of a plate coupled to one side of the body 10, as shown in Figs. 3, 4 to set a wide point where the wire end is bonded during wire bonding for convenience in design and manufacturing It is configured to provide.

Alternatively, when the connection terminal 40 is enlarged as shown in FIGS. 5 and 6 in the form developed in the above configuration, it may be configured to radiate heat generated when the light emitting chip 20 is driven to the outside. have. In particular, the connection terminal 40 to have a heat dissipation as described above may be coupled to be exposed on the outer surface of the body 10 to improve the heat dissipation efficiency.

The LED module configured as described above has a configuration such as a transformer or an SMPS that receives an AC power and drops the input power separately, thereby driving a LED by driving a voltage drop in a circuit itself in which a plurality of LED elements are connected in series. Suitable to be applied to the configuration.

7 is a block diagram of a circuit for driving LEDs by the AC power source.

Referring to the drawings, the circuit configuration for driving the LED by the AC power source is a bridge diode rectifying circuit unit 60 for emitting the light emitting chip 20 and the drive unit 61 is connected in series with a plurality of light emitting chips 20 Has a circuit configuration consisting of The circuit configuration is constituted by adding a constant current supply circuit section 62 to the configuration.

The bridge diode rectifying circuit unit 60 is configured to receive an AC power source that is a driving source of the device and convert the DC power source into a driving power source of the light emitting chip 20. The bridge diode rectifying circuit unit 60 may be provided in the form of an integrated chip of one chip.

The driver 61 is configured by connecting a specific number of light emitting chips 20 in series in order to emit light by the power input through the bridge diode rectifier circuit 60. That is, the specific number of light emitting chips 20 is configured to receive the desired voltage through the voltage drop of the power inputted through the bridge diode rectifier circuit 60 so that the light emitting chips 20 can be driven.

Specifically, since the light emitting chip 20 constituting the LED has a forward voltage of about 3.2V, when the above-described light emitting chip 20 is connected in series to 60 to 72, the light emitting chip is about 192V to 230V. The voltage drops by (20). Therefore, in this embodiment, 192 ~ 230V is removed from the rectified voltage of 220 ~ 300V and the remaining voltage is used for setting the current through a resistor (not shown, but mounted in series with the light emitting chip), the light emitting chip 20 It will be able to emit light. Here, the meaning that the light emitting chip 20 is connected in series means that about 4 light emitting chips 20 are installed in a single LED module, about 12-16 LED modules are connected in series. It illustrates that the aforementioned 60 ~ 72 light emitting chips 20 are connected in series.

The constant current supply circuit unit 62 is configured to supply the power rectified by the bridge diode rectifier circuit unit 60 with a constant amount of current at all times. The constant current supply circuit unit 62 may be configured in various circuit forms such as a transistor amplification circuit, an OP amplifier or a regulator circuit, and preferably may be a one-chip constant current IC.

Due to the circuit configuration of FIG. 7 as described above, since the LED module according to the present invention should connect a plurality of light emitting chips 20 in series, each of the plurality of light emitting chips 20 is disposed left and right. It is optimized for the configuration which arrange | positions the connection terminal 40 between them.

In particular, the configuration of the LED module can reduce the total number of devices by setting the number of light emitting chips 20 embedded in a single device by the number of LED devices set by the present application.

In addition, when applied to the LED module of the present application of the present invention driven by an AC power source as described above, by providing a zener diode 50 in the connection terminal 40 of the LED module according to the present invention by providing a reverse characteristic to the power source, More various types of LED module circuits can be provided.

Additional Example 1

Figure 8 is a further structural embodiment 1 of the present invention.

Referring to the drawings, the LED module of the first embodiment suggests a configuration in which a large number of light emitting chips 20 are expanded. In this configuration, the light emitting chip 20 is arranged at the left and right sides in at least three or more numbers, and the arrangement is at least two rows.

In this case, a connection terminal 40 is disposed between each of the light emitting chips 20 adjacent to each other between the light emitting chips 20 so that the light emitting chip 20 is not connected between the light emitting chip 20 and the light emitting chip 20. 20) and the wire bonding is performed on the connection terminal 40 having a large area so that the work process can be performed quickly and stably.

In particular, when the connection terminal 40 is made of a metal material having a larger size and excellent thermal conductivity and then partially or entirely exposed to the outside of the body 10, heat is emitted between the respective light emitting chips 20 to emit light. The generation of heat due to the expansion of the chip 20 can be minimized.

Additional Example 2

9 and 10 illustrate a second embodiment of the present invention.

Referring to the drawings, the additional embodiment 2 proposes an optimized configuration when applied to the configuration of the LED luminaire and the like driven by the above-described AC power source. That is, the LED module of the second embodiment as described above has at least four light emitting chips 20 installed in a standard of an LED device having a size of 5 mm × 5 mm or more, which is mainly applied as a SMD type LED device standard. The configuration will be presented.

The LED module illustrated in FIG. 9 includes four light emitting chips 20 embedded therein, and each light emitting chip 20 is connected in series. At this time, each light emitting chip 20 is connected, and the above-described connection terminal 40 is configured to be mounted on the body 10 as a configuration for performing heat dissipation.

In particular, the LED module is configured so that each of the light emitting chip 20 is connected in series with each other, the lead terminal 30 exposed to the outside of the body 10 is drawn out one by one on each side. In addition, the lead terminals 30 other than the lead terminal 30 drawn out of the body 10 are electrically connected in consideration of the polarity of the light emitting chip 20.

In other words, in order to satisfy the above configuration, the entire arrangement of the lead terminals 30 may have an electrical connection configuration in the form of “z” or “z”.

In addition, the connection between the lead terminal 30 and the lead terminal 30 may form the shape of the lead terminal 30 itself in a bent form, or as shown in the drawing of the lead terminal 30 to which the light emitting chip 20 is coupled. The connection terminal 40 may be disposed therebetween and electrically connected by wire bonding, or the like, so that the heat dissipation function may be performed. Alternatively, the connection configuration may be configured in the form of a direct connection of the lead terminal 30 and the lead terminal 30 by wire bonding.

The LED module illustrated in FIG. 10 illustrates a configuration in which six light emitting chips 20 are embedded and each light emitting chip 20 is connected in series. Even in such a configuration, the lead terminals 30 exposed to the outside are configured to each one at both sides of the body 10, and the connection of the lead terminals 30 in each of the upper and lower rows is similar to the shape of "L" as described above. The electrical connection is made in the form of a "Z".

That is, the configuration in which the light emitting chip 20 is expanded as described above may be combined with the configuration of the above-described additional embodiment 1 so that the number of the light emitting chips 20 may be connected in series as desired. In addition, the connection configuration between the lead terminal 30 is formed by forming the shape of the lead terminal 30 itself in a bent form or by arranging the connection terminal 40 as described above, or the lead terminal 30 and the lead terminal ( 30) may be configured to be directly connected by wire bonding or the like.

1 is a diagram illustrating an internal configuration of a conventional SMD-type LED device.

Figure 2 is a perspective view of the LED module according to the present invention

3 to 6 is a diagram showing the internal configuration of various types of LED module according to the present invention.

7 is a block diagram of an AC power supply circuit configuration to which the LED module according to the present invention is applied.

8 is a further structural example 1 of the present invention.

9 and 10 illustrate a second embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: body 20: light emitting chip

30: lead terminal 40: connection terminal

50: zener diode 60: bridge diode rectifier circuit

Claims (6)

In the surface-mount type LED device that receives the external electric power to emit light from the inside of the body 10, A light emitting chip 20 emitting light by the external power source; A lead terminal 30 disposed on one side of the light emitting chip 20 and wire-bonded with the light emitting chip 20 to transfer external electric power to the light emitting chip 20; When a plurality of light emitting chips 20 are disposed, the light emitting chips 20 are disposed between adjacent light emitting chips 20 to be wire-bonded with polarities of one side of both light emitting chips 20 so as to conduct electricity and heat radiation between the light emitting chips 20. LED connector in the form of a surface-mounting device comprising a. In the surface-mount type LED device that is supplied with an external electric power to emit light from the inside of the body 10, A plurality of light emitting chips 20 disposed inside the body 10 to emit light by an external electric power source; Among the plurality of light emitting chips 20, one pair of both outer sides is exposed to the outside of the body 10 so as to be connected to the light emitting chips 20 on both sides and connected to an external electric power source, and the light emitting chips therein. A lead terminal 30 electrically connecting the light emitting chip 20 to connect the 20 and the light emitting chip 20 in series; In the arrangement of the light emitting chip 20 is disposed between the light emitting chip 20 adjacent to each other, the connection terminal having the conduction and heat dissipation function between the light emitting chip 20 is wire-bonded with each one of the polarity of each side of the light emitting chip 20 LED module in the form of a surface-mount device, characterized in that it comprises a. The method according to claim 1 or 2, The light emitting chip 20 is mounted on the lead terminal 30 so that one polarity is directly connected, and the other polarity is wire bonded to the lead terminal 30 or the connection terminal 40 on the other side. LED module. The method of claim 3, wherein The light emitting chip 20 is arranged in two or more columns with a number of at least three, and in each column of the light emitting chip 20, a connection terminal 40 is disposed between each light emitting chip 20 adjacent to each other. An LED module in the form of a surface mount element having an enlarged configuration of (20). The method according to claim 1 or 2, The light emitting chip 20 is connected to each other in series to be applied to the LED luminaire to perform the LED drive by the voltage drop generated in each device by the AC power source, The LED lighting fixture driven by the AC power source, A bridge diode rectifying circuit unit 60 which receives AC power as a driving source and converts the rectified power into a rectified power for driving the light emitting chip 20; In order to emit light by the power inputted through the bridge diode rectifier circuit 60, a specific number of light emitting chips 20 are connected in series to receive the desired voltage through the voltage drop of the input power to emit light. LED module in the form of a surface-mount device, characterized in that it comprises a. The method of claim 5, The LED module of the surface mount element type, characterized in that the zener diode 50 is coupled to the connection terminal 40 for connecting the light emitting chip 20 and the light emitting chip 20.

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