CN220648164U - LED lamp and LED product - Google Patents

Abstract

The utility model discloses an LED lamp and an LED product, comprising a light-emitting component, an insulating seat, packaging glue and a plurality of conductive pins, wherein the conductive pins are arranged on the insulating seat; the light-emitting assembly comprises a driving chip and a plurality of light-emitting wafer groups which are combined together in a parallel or serial mode, the light-emitting wafer groups are sequentially arranged along the length direction of the insulating seat, each light-emitting wafer group comprises a blue wafer, a green wafer and a red wafer, and the driving chip is electrically connected with each blue wafer, each green wafer and each red chip and is used for driving each blue wafer, each green wafer and each red chip to emit light.

Description

LED lamp and LED product

Technical Field

The utility model relates to the technical field of LEDs, in particular to an LED lamp and an LED product.

Background

The LED lamp is widely used in the lighting and display industries, and is one of the most attracting products in recent years, because of its advantages of energy saving, power saving, high efficiency, fast reaction time, long life cycle, no mercury, environmental protection, and the like.

However, similar to LED products such as LED display screens, LED light bars, etc. are all formed by combining a plurality of LED lamps having blue wafers, green wafers and red chips, along with the development of technology, the requirements for the dot pitch etc. of the LED products are increasingly higher, but the interior of the existing LED lamps usually has only one blue wafer, one green wafer and one red chip, and the volume is relatively large, so that it is difficult to realize small-pitch LED products, and small-pitch high-density installation cannot be achieved, and the color effect or the display effect is poor.

Disclosure of Invention

The utility model provides an LED lamp and an LED product, wherein a plurality of luminous wafer groups can be integrated in one LED lamp, so that a plurality of blue wafers, a plurality of green wafers and a plurality of red chips can emit light in one LED lamp, the LED product can be installed at a small interval and high density, and the color effect, the display effect and the resolution of the LED product are finer.

According to a first aspect of the present utility model, there is provided an LED lamp, including a light emitting component, an insulating base, a packaging adhesive, and a plurality of conductive pins, wherein the plurality of conductive pins are disposed on the insulating base, the light emitting component is disposed on the conductive pins and electrically connected with the conductive pins, and the packaging adhesive is packaged outside the light emitting component;

The light-emitting assembly comprises at least one driving chip and a plurality of light-emitting wafer groups which are combined together in a parallel or serial mode, the light-emitting wafer groups are sequentially arranged along the arrangement direction of the insulating seat, each light-emitting wafer group comprises a blue wafer, a green wafer and a red chip, and at least one driving chip is electrically connected with each blue wafer, each green wafer and each red chip and is used for driving each blue wafer, each green wafer and each red chip to emit light.

In an embodiment of the LED lamp of the present utility model, the insulating base has a first end surface, the conductive pin has a die bonding portion formed on the first end surface and a soldering portion formed on another end surface, the driving chip, the blue chip, the green chip and the red chip are disposed on the die bonding portion and electrically connected to the die bonding portion, and at least a part of the soldering portion has a via structure.

In an embodiment of the LED lamp of the present utility model, the conductive pins include a power pin and a ground pin, the driving chip is electrically connected with the power pin and the ground pin, the blue chip, the green chip and the red chip are electrically connected with the power pin and the driving chip, and the blue chip, the green chip and the red chip are equidistantly arranged on the insulating base.

In the LED lamp according to an embodiment of the present utility model, the driving chip is disposed on at least one of the ground pin and the power pin, and/or the light emitting die set is disposed on at least one of the power pin and the ground pin.

In the LED lamp according to an embodiment of the present utility model, the power supply pin includes a second soldering portion and a second die bonding portion, the ground pin includes a first soldering portion and a first die bonding portion, the second soldering portion and the first soldering portion are disposed on opposite sides of the insulating base, the driving chip is disposed on the first die bonding portion, the ground pin is disposed on the second die bonding portion, and the light emitting die is disposed on the second die bonding portion.

In an embodiment of the LED lamp of the present utility model, the conductive pin further includes a signal input pin and a signal output pin, and the signal input pin and the signal output pin are respectively electrically connected with the signal input end and the signal output end of the driving chip.

In the LED lamp according to an embodiment of the present utility model, the signal input pin and the ground pin are disposed on one side of the insulating base, and the signal output pin and the power pin are disposed on the other side of the insulating base.

In the LED lamp according to an embodiment of the present utility model, the number of the driving chips and the light emitting wafer groups is at least two, and at least two light emitting wafer groups are correspondingly connected to two driving chips and are combined together in parallel, so that each driving chip can correspondingly control each light emitting wafer group connected thereto to emit light.

In an embodiment of the LED lamp of the present utility model, the conductive pin further includes at least one transition pin, and the transition pin has a transition die bonding portion, and the transition die bonding portion is disposed between two driving chips and is used for electrically connecting a signal input end of one of the driving chips with a signal output end of the other driving chip.

In an embodiment of the LED lamp of the present utility model, the signal input pin includes a third die bonding portion, the signal output pin includes a fourth die bonding portion, the third die bonding portion and the fourth die bonding portion are disposed at two sides of the first die bonding portion and the second die bonding portion, and the transition die bonding portion is disposed between the third die bonding portion and the fourth die bonding portion.

In an embodiment of the LED lamp of the present utility model, the first die bonding portion has a first extension portion and at least one second extension portion perpendicular to the first extension portion, the first extension portion and the second die bonding portion extend along a length direction of the insulating base, the second extension portion extends toward the second die bonding portion and forms a receiving area, and the transition die bonding portion is disposed in the receiving area.

In the LED lamp according to an embodiment of the present utility model, the number of the driving chips and the light emitting wafer groups is three, and the driving chips are arranged on the second extension portions at equal intervals along the length direction of the insulating base, and the transition die bonding portions are arranged between two adjacent second extension portions.

In an embodiment of the LED lamp of the present utility model, the second die bonding portion has a third extension portion extending toward the first extension portion, the third extension portion is disposed adjacent to the second extension portion, and the first input end of the driving chip is connected to the third extension portion through a bonding wire.

In the LED lamp according to an embodiment of the present utility model, the number of the driving chips and the light emitting wafer groups is four, the driving chips are arranged on the second extension portion at equal intervals along the length direction of the insulating base, and the transition die bonding portion is arranged between the third extension portion and the second extension portion.

In the LED lamp according to an embodiment of the present utility model, the number of the driving chips and the light emitting chip sets is at least two, at least two light emitting chip sets are correspondingly connected to two driving chips and are combined together in a parallel manner, and the blue chip, the green chip and the red chip on each light emitting chip set are connected to the driving chips in a serial manner.

In the LED lamp according to an embodiment of the present utility model, the number of the driving chips is one, the number of the light emitting wafer groups is at least two, and the two light emitting wafer groups are connected to the driving chips in a serial manner, so that the driving chips can control the light emitting wafers connected in series to emit light.

In the LED lamp according to the embodiment of the utility model, the blue chips on the plurality of light emitting chips are connected in a serial manner, the green chips on the plurality of light emitting chips are connected in a serial manner, the red chips on the plurality of light emitting chips are connected in a serial manner, and the blue chips, the green chips and the red chips are arranged in parallel.

In the LED lamp according to the embodiment of the utility model, the number of the light emitting wafer groups is six, the six blue wafers are combined and connected in series, the six green wafers on the light emitting wafers are combined and connected in series, the six red wafers on the light emitting wafers are combined and connected in series, and the six blue wafers, the six green wafers and the six red wafers are arranged in parallel.

In an embodiment of the LED lamp of the present utility model, the conductive pin further includes at least one transition pin, and the transition pin has a transition die bonding portion, and the transition die bonding portion is disposed between at least two adjacent die bonding portions of the first die bonding portion, the second die bonding portion, the third die bonding portion, and the fourth die bonding portion.

In the LED lamp according to an embodiment of the present utility model, a protection device is connected between the transition pin and the power pin.

In the LED lamp according to an embodiment of the present utility model, at least a part of the light emitting die set is disposed on the transition die bonding portion and the signal input pin, and the remaining part of the light emitting die set is disposed on the power supply pin and electrically connected to the power supply pin.

In the LED lamp according to an embodiment of the present utility model, the second die bonding portion extends from the power pin and then extends vertically toward one side of the insulating base to form a fourth extension portion, the fourth extension portion extends toward the other side of the insulating base to form a fifth extension portion, the fifth extension portion is parallel to the fourth extension portion, the driving chip is disposed at a junction between the fourth extension portion and the fifth extension portion, and at least a portion of the light emitting die set is disposed on the fifth extension portion.

In an embodiment of the LED lamp of the present utility model, the conductive pins further include three transition pins, each transition pin has a transition die bonding portion, the three transition die bonding portions are disposed on the insulating base at intervals, and the driving chip is correspondingly connected with the blue chip, the green chip and the red chip through the three transition die bonding portions.

In the LED lamp according to an embodiment of the present utility model, one of the blue wafer and the green wafer is disposed on one of the transition die bonding portions, the other of the blue wafer and the green wafer is disposed on the other of the transition die bonding portions, and the red chip is disposed on the fifth extension portion and connected to the driving chip through the last of the transition die bonding portions.

In the LED lamp according to an embodiment of the present utility model, the number of the light emitting wafer groups is two, two blue wafers are disposed at two ends of one of the transition die bonding portions, two green wafers are disposed on the other transition die bonding portion, and two red chips are disposed at two ends of the fifth extension portion.

In the LED lamp according to an embodiment of the present utility model, the number of the light emitting wafer groups is at least three, at least three blue wafers are equidistantly disposed along a length direction of one of the transition die bonding portions, at least three green wafers are equidistantly disposed along a length direction of the other transition die bonding portion, and at least three red chips are equidistantly disposed along a length direction of the fifth extension portion.

According to a second aspect of the utility model, the utility model further provides an LED product, which comprises the LED lamps, wherein the plurality of LED lamps are arranged at equal intervals.

The technical scheme provided by the embodiment of the application can comprise the following beneficial effects: the application has designed an LED lamp and LED product, including light emitting component, the insulating seat, encapsulation is glued and a plurality of conductive feet, wherein, light emitting component has driving chip and a plurality of light emitting chip group that makes up through parallelly connected or series connection mode, driving chip and light emitting chip group set up on conductive foot and conductive foot electric connection, conductive foot integration is on the insulating seat, encapsulation is glued the encapsulation and is being in light emitting component's outside, make an LED lamp can integrate a plurality of light emitting chip groups, and every light emitting chip group all has a blue wafer, a green wafer and a red core, so that the LED lamp can be used for some high density closely spaced LED products, in order to improve the color effect and the display effect of LED product, make the resolution of LED product finer and smoother.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an LED lamp according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of the LED lamp of FIG. 1 at another angle;

FIG. 3 is an exploded schematic view of the LED lamp of FIG. 1;

FIG. 4 is a partially exploded view of the LED lamp of FIG. 1;

FIG. 5 is a schematic diagram of the structure of the light emitting wafer set of FIG. 1;

FIG. 6 is a schematic view of the insulating base of FIG. 1;

FIG. 7 is a schematic diagram of the conductive pin of FIG. 1;

FIG. 8 is a schematic view of the conductive leg of FIG. 1 at another angle;

FIG. 9 is a second schematic diagram of an LED lamp according to an embodiment of the present disclosure;

FIG. 10 is a schematic diagram of the conductive pin of FIG. 9;

FIG. 11 is a third schematic diagram of an LED lamp according to an embodiment of the present disclosure;

FIG. 12 is a schematic diagram of an LED lamp according to an embodiment of the present disclosure;

FIG. 13 is a fifth schematic diagram of an LED lamp according to an embodiment of the present disclosure;

FIG. 14 is a schematic diagram of an LED lamp according to an embodiment of the present disclosure;

FIG. 15 is an exploded schematic view of the LED lamp of FIG. 14;

FIG. 16 is a schematic diagram of an LED lamp according to an embodiment of the present disclosure;

FIG. 17 is an exploded schematic view of the LED lamp of FIG. 16;

FIG. 18 is a schematic diagram of an LED lamp according to an embodiment of the present disclosure;

fig. 19 is an exploded schematic view of the LED lamp in fig. 18.

Reference numerals illustrate:

10. a light emitting assembly; 11. a driving chip; 12. a light emitting wafer group; 121. a red chip; 122. a blue wafer; 123. a green wafer;

20. a conductive foot; 20a, via structures; 20b, a receiving area; 21. a grounding pin; 211. a first die bonding part; 2111. a second extension; 212. a first welded portion; 22. a power supply pin; 221. a second die bonding part; 2211. a third extension; 2212. a fourth extension; 2213. a fifth extension; 222. a second welded portion; 23. a signal input pin; 231. a third die bonding part; 232. a third welded portion; 24. a signal output pin; 241. a fourth die bonding part; 242. a fourth welded part; 25. a transition pin; 251. a transition die bonding part; 2511. a first transition die bonding part; 2512. a second transition die bonding part; 2513. a third transition die bonding part;

30. An insulating base; 31. a first end face;

40. and (5) packaging glue.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It is also to be understood that the terminology used in the description of the present utility model herein is for the purpose of describing the particular embodiments only, and it is to be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. are directional or positional relationships as indicated on the basis of the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Some embodiments of the present application are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.

As shown in fig. 1 to 19, according to a first aspect of the present application, the present application provides an LED lamp, including a light emitting component 10, an insulating base 30, a packaging adhesive 40 and a plurality of conductive pins 20, wherein the plurality of conductive pins 20 are disposed on the insulating base 30, the light emitting component 10 is disposed on the conductive pins 20 and electrically connected with the conductive pins 20, the packaging adhesive 40 is packaged outside the light emitting component 10, so that not only the light emitting component 10 can be protected, but also the light transmission effect of the light emitting component 10 can be improved.

The light emitting assembly 10 includes a driving chip 11 and a plurality of light emitting chip sets 12 combined together in parallel or in series, the plurality of light emitting chip sets 12 are sequentially arranged along the arrangement direction of the insulating base 30, and each light emitting chip set 12 includes a blue chip 122, a green chip 123 and a red chip 121, and the driving chip 11 is electrically connected with each blue chip 122, each green chip 123 and each red chip 121, and is used for driving each blue chip 122, each green chip 123 and each red chip 121 to emit light. The layout direction may be, but not limited to, a length direction and a width direction of the insulating base 30.

For example, if the number of the light emitting wafer groups 12 is three, the number of the blue wafers 122, the green wafers 123 and the red chips 121 is three, the three blue wafers 122 may be combined together in a serial manner, and the three blue wafers 122 may also be combined together in a parallel manner; similarly, the three green chips 123 may be combined together in series, and the three green chips 123 may be combined together in parallel; the three red chips 121 may be combined together in series, or the three red chips 121 may be combined together in parallel. In addition, the blue wafer 122, the green wafer 123, and the red chip 121 may be combined together in series, and the blue wafer 122, the green wafer 123, and the red chip 121 may be combined together in parallel. The number of the driving chips 11 may be one or more, which is not limited in this application.

After the technical scheme is adopted, the plurality of blue wafers 122, the plurality of green wafers 123 and the plurality of red chips 121 are integrated in the LED lamp at equal intervals, so that the plurality of blue wafers 122, the plurality of green wafers 123 and the plurality of red chips 121 in one LED lamp can emit corresponding light, the generated light color is various, and the color flickering effect is simulated; and can also weld the LED lamp on wire rod or support plate in order to form LED product (such as luminescent light area or display screen etc.), the LED lamp can be established ties or parallelly connected as required, also can set for different drive voltages to this high-density closely spaced design that realizes the LED product has improved the color effect and the display effect of LED product, makes the resolution of LED product finer and smoother.

In an alternative embodiment, as shown in fig. 1 to 8, the insulating base 30 has a first end surface 31, the conductive pin 20 has a die bonding portion formed on the first end surface 31 and a soldering portion formed on the other end surface, and at least part of the soldering portion is formed with a via structure 20a to enhance the soldering strength of the product, so that part of the soldering material can be accommodated on the via structure 20 a. The driving chip 11, the blue chip 122, the green chip 123 and the red chip 121 are disposed on the die bonding portion and electrically connected to the die bonding portion, and the encapsulation compound 40 is encapsulated outside the die bonding portion.

After the technical scheme is adopted, as the welding part is formed on other end surfaces except the first end surface 31 of the insulating base 30, the heat dissipation effect of the LED lamp can be effectively increased, and meanwhile, the welding area and the welding firmness of the welding part can be increased.

Since the size of the die bonding portion depends on the number of the plurality of light emitting wafer groups 12 and the pitch between the plurality of light emitting wafers; therefore, in the present application, the plurality of light emitting wafer groups 12 are integrated on the die bonding portion, so that not only can the heat dissipation effect of the light emitting wafer be increased, but also the light emitting effect of the LED lamp can be ensured, and the LED lamp can be applied to various light-equalizing scenes.

In an alternative embodiment, the conductive pins 20 include a power pin 22 and a ground pin 21, wherein the driving chip 11 is electrically connected to the power pin 22 and the ground pin 21, the blue chip 122, the green chip 123 and the red chip 121 are electrically connected to the power pin 22 and the driving chip 11, and the blue chip 122, the green chip 123 and the red chip 121 are equidistantly arranged on the insulating base 30, so as to realize high-density and small-pitch design of the LED lamp.

In an alternative embodiment, the driving chip 11 is disposed on at least one of the power pin 22 and the ground pin 21, the light emitting die set 12 may be disposed on the power pin 22 or the ground pin 21, and the light emitting die set 12 may be disposed on other conductive pins 20 than the power pin 22 and the ground pin 21.

In an alternative embodiment, the light emitting die set 12 is disposed on at least one of the power pin 22 and the ground pin 21, the driving chip 11 may be disposed on the power pin 22 or the ground pin 21, and the driving chip 11 may be disposed on other conductive pins 20 than the power pin 22 and the ground pin 21.

In an alternative embodiment, the driver chip 11 is disposed on the ground pin 21 and the light emitting die set 12 is disposed on the power pin 22.

The second input end of the driving chip 11 is electrically connected to the ground pin 21, the driving chip 11 and the first input end of the light emitting wafer set 12 are electrically connected to the power pin 22, the second input end of the light emitting wafer set 12 is connected to the driving chip 11, that is, the light emitting wafers in the light emitting wafer set 12 are combined together in parallel, and meanwhile, the light emission can be controlled by the driving chip 11.

Alternatively, the first input end of the driving chip 11 is electrically connected with the power pin 22, the second input end of the driving chip 11 is electrically connected with the ground pin 21, and the first input end and the second input end of the light emitting wafer group 12 are connected with the driving chip 11, that is, the light emitting wafers of the light emitting wafer group 12 are combined together in a serial manner and obtain working voltage through the driving chip 11, and meanwhile, light emission can be controlled through the driving chip 11.

As shown in fig. 4 and 5, the number of the driving chips 11 and the light emitting chip groups 12 is three, that is, the number of the blue chips 122, the green chips 123 and the red chips 121 is three, and the three blue chips 122, the three green chips 123 and the three red chips 121 are correspondingly connected with the three driving chips 11 to form three groups of light emitting groups, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; meanwhile, the blue wafer 122, the green wafer 123, the red chip 121 and the driving chip 11 are combined together in a parallel manner, and three groups of light emitting groups are equidistantly and at intervals in a parallel manner.

As shown in fig. 5 and 10, the number of the driving chips 11 and the light emitting chip groups 12 is four, that is, the number of the blue chips 122, the green chips 123 and the red chips 121 is four, and the four blue chips 122, the four green chips 123 and the four red chips 121 are correspondingly connected with the four driving chips 11 to form four light emitting groups, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; meanwhile, the blue wafer 122, the green wafer 123, the red chip 121 and the driving chip 11 are combined together in a parallel manner, and four groups of light emitting groups are arranged at equal intervals in a parallel manner.

As shown in fig. 11, the number of the driving chips 11 and the number of the light emitting chip sets 12 are three, that is, the number of the blue chips 122, the green chips 123 and the red chips 121 is three, and the three blue chips 122, the three green chips 123 and the three red chips 121 are correspondingly connected with the three driving chips 11 to form three light emitting sets, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; meanwhile, the blue chip 122, the green chip 123 and the red chip 121 are combined together in series through the driving chip 11, and three groups of light emitting groups are arranged at equal intervals in parallel at the same time.

As shown in fig. 14 and 19, the number of the driving chips 11 is at least one, that is, the number of the light emitting wafer groups 12 is at least two, that is, the number of the blue wafers 122, the green wafers 123 and the red wafers 121 is at least two, at least two blue wafers 122 are combined together in a serial manner to form a first group light emitting group, at least two red wafers 121 are combined together in a serial manner to form a second group light emitting group, at least two green wafers 123 are combined together in a serial manner to form a third group light emitting group, and the first group light emitting group, the second group light emitting group and the third group light emitting group are combined together in a parallel manner and are electrically connected with the driving chips 11, so that the driving chips 11 can control the first group light emitting group, the second group light emitting group and the third group light emitting group to emit light.

As shown in fig. 14, the number of the driving chips 11 is one, the number of the light emitting chip sets 12 is two, that is, the number of the blue chips 122, the green chips 123 and the red chips 121 is two, wherein one blue chip 122, one green chip 123 and one red chip 121 are located at one side of the insulating base 30 in the length direction, the other blue chip 122, one green chip 123 and one red chip 121 are located at the other side of the insulating base 30 in the length direction, and the driving chips 11 are disposed at one side of the insulating base 30 in the length direction and electrically connected with the blue chips 122, the green chips 123 and the red chips 121 for controlling the two blue chips 122, the two green chips 123 and the two red chips 121 to emit light.

In an alternative embodiment, the LED lamp is fabricated by using a CH IP type packaging technology, that is, corresponding circuits are first laid on a package substrate, then the driving chips 11 and the light emitting chip set 12 are laid at equal intervals, and finally electrical connection is performed.

In an alternative embodiment, the ground lead 21 includes a first soldering portion 212 and a first die bonding portion 211, the power lead 22 includes a second soldering portion 222 and a second die bonding portion 221, wherein part of the structures of the second soldering portion 222 and the first soldering portion 212 are disposed on opposite sides of the insulating base 30, the driving chip 11 is disposed on the first die bonding portion 211, and the light emitting die set 12 is disposed on the second die bonding portion 221. In the present embodiment, the size of the first die bonding portions 211 corresponds to the number and density of the first die bonding portions 211, and the size of the second die bonding portions 221 corresponds to the number and density of the light emitting wafer groups 12, so that heat generated when the driving chip 11 and the light emitting wafer groups 12 operate can be transferred to the first soldering portions 212 and the second soldering portions 222 through the first die bonding portions 211 and the second die bonding portions 221, and then transferred to a circuit board connected thereto through the first soldering portions 212 and the second soldering portions 222 or diffused into the external environment.

In an alternative embodiment, the conductive pins 20 further include a signal input pin 23 and a signal output pin 24, where the signal input pin 23 and the signal output pin 24 are electrically connected to a signal input end and a signal output end of the driving chip 11, respectively, or a signal input end and a signal output end between two adjacent driving chips 11 are electrically connected, and the signal input pin 23 and the signal output pin 24 are electrically connected to a signal input end and a signal output end of the driving chip 11 on both sides of the insulating base 30, so that the signal input pin 23 and the signal output pin 24 can input or output a control signal of the light emitting wafer group 12 to the driving chip 11.

In an alternative embodiment, the signal input pin 23 and the ground pin 21 are disposed on one side of the insulating base 30, and the signal output pin 24 and the power pin 22 are disposed on the other side of the insulating base 30, that is, the signal input pin 23 and the ground pin 21 are disposed on the same side of the insulating base 30, and the signal output pin 24 and the power pin 22 are disposed on the opposite side of the insulating base 30 from the signal input pin 23 and the ground pin 21, so that the heat dissipation effect of the ground pin 21 and the power pin 22 during operation is improved.

In an alternative embodiment, the signal input pin 23 includes a third soldering portion 232 and a third die bonding portion 231, the signal output pin 24 includes a fourth soldering portion 242 and a fourth die bonding portion 241, a part of the structure of the third soldering portion 232 is disposed on an adjacent side of the first soldering portion 212 and is located on an opposite side of the second soldering portion 222, a part of the structure of the fourth soldering portion 242 is disposed on an adjacent side of the second soldering portion 222 and is located on an opposite side of the first soldering portion 212, the third die bonding portion 231 is connected with the third soldering portion 232 and is located on one side of the first die bonding portion 211, the fourth die bonding portion 241 is connected with the fourth soldering portion 242 and is located on one side of the second die bonding portion 221, and the signal input and signal output terminals between the driving chips 11 on both sides of the insulating base 30 are electrically connected with the third die bonding portion 231 and the fourth die bonding portion 241, respectively.

In an alternative embodiment, as shown in fig. 1 to 13, the number of the driving chips 11 and the light emitting wafer groups 12 is at least two, and at least two light emitting wafer groups 12 are correspondingly connected with the two driving chips 11 and combined together in parallel, so that each driving chip 11 can correspondingly control the light emission of each light emitting wafer group 12 connected with it.

In an alternative embodiment, the conductive pin 20 further includes at least one transition pin 25, the transition pin 25 has a transition die bonding portion 251, and the transition die bonding portion 251 is disposed between two adjacent driving chips 11 and is used for electrically connecting a signal input end of one driving chip 11 with a signal output end of another driving chip 11, so as to reduce a connection length of a bonding wire on the driving chip 11, reduce packaging difficulty of the LED lamp, and make a structure of the LED lamp simpler.

In an alternative embodiment, the second die bonding portion 221 and the fourth die bonding portion 241 are disposed on both sides of the second die bonding portion 221 and the first die bonding portion 211, and the transitional die bonding portion 251 is disposed between the second die bonding portion 221 and the first die bonding portion 211.

In an alternative embodiment, the first die bonding portion 211 has a first extension portion and at least one second extension portion 2111 perpendicular to the first extension portion, the first extension portion and the second die bonding portion 221 extend along the length direction of the insulating base 30, the second extension portion 2111 extends toward the second die bonding portion 221 and is formed with a receiving area 20b, and the transitional die bonding portion 251 is disposed in the receiving area 20b, so that the signal input ends and the signal output ends of the two adjacent driving chips 11 can be electrically connected through the transitional die bonding portion 251, so as to reduce the length of the bonding wire, and thus avoid the bonding wire from breaking during packaging. In addition, the signal input end and the signal output end between two adjacent driving chips 11 may be electrically connected by a direct bonding wire, which is not limited in this application.

In an alternative embodiment, as shown in fig. 1 to 8, the driving chips 11 and the light emitting wafer groups 12 are three in number and are equidistantly spaced along the length direction of the insulating base 30, the driving chips 11 are disposed on the second extension portions 2111, and the transitional die bonding portion 251 is disposed between two adjacent second extension portions 2111.

In an alternative embodiment, as shown in fig. 9 and 10, the second die bonding portion 221 has a third extension portion 2211 extending toward the first extension portion, the third extension portion 2211 is disposed adjacent to the second extension portion 2111, the first input end of the driving chip 11 is connected to the third extension portion 2211 through a bonding wire, and the transitional die bonding portion 251 is disposed in a receiving area 20b formed between the third extension portion 2211 and the second extension portion 2111.

In an alternative embodiment, the number of the driving chips 11 and the light emitting wafer groups 12 is four and the driving chips 11 are arranged on the second extension portion 2111 at equal intervals along the length direction of the insulating base 30, and the transitional die bonding portion 251 is arranged between the third extension portion 2211 and the second extension portion 2111.

In an alternative embodiment, as shown in fig. 11, the number of the driving chips 11 and the light emitting wafer groups 12 is at least two, at least two light emitting wafer groups 12 are correspondingly connected with two driving chips 11 and combined together in parallel, and the blue wafer 122, the green wafer 123 and the red wafer 121 on each light emitting wafer group 12 are connected with the driving chips 11 in series.

The number of the driving chips 11 and the light emitting chip groups 12 is three, that is, the number of the blue chips 122, the green chips 123 and the red chips 121 is three, and the three blue chips 122, the three green chips 123 and the three red chips 121 are correspondingly connected with the three driving chips 11 to form three groups of light emitting groups, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; meanwhile, the blue wafer 122, the green wafer 123 and the red chip 121 are combined together in series through the driving chip 11, that is, two ends of the blue wafer 122, the green wafer 123 and the red chip 121 are all electrically connected with the driving chip 11, and three groups of light emitting groups are simultaneously arranged at equal intervals in parallel.

In an alternative embodiment, as shown in fig. 12 and 13, the number of the driving chips 11 and the light emitting chip groups 12 is six, that is, the number of the blue chips 122, the green chips 123 and the red chips 121 is six, and the six blue chips 122, the six green chips 123 and the six red chips 121 are correspondingly connected with the six driving chips 11 to form six groups of light emitting groups, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; meanwhile, the blue chip 122, the green chip 123 and the red chip 121 are combined together in a parallel manner, and the signal input end and the signal output end between two adjacent driving chips 11 in the six driving chips 11 can also be electrically connected by a direct bonding wire.

In an alternative embodiment, as shown in fig. 14 to 19, the number of driving chips 11 is one, the number of light emitting wafer groups 12 is at least two, and two light emitting wafer groups 12 are connected to the driving chips 11 in series, so that the driving chips 11 can control the light emitting wafers connected in series to emit light.

In an alternative embodiment, the blue wafers 122 on the plurality of light emitting wafers are combined and connected in a serial manner, the green wafers 123 on the plurality of light emitting wafers are combined and connected in a serial manner, the red chips 121 on the plurality of light emitting wafers are combined and connected in a serial manner, and the three colors of light emitting wafers of the blue wafer 122, the green wafer 123 and the red chip 121 are arranged in parallel.

In an alternative embodiment, as shown in fig. 14 and 15, the number of the light emitting wafer group 12 is six, six blue wafers 122 are combined and connected in series, green wafers 123 on the six light emitting wafers are combined and connected in series, red chips 121 on the six light emitting wafers are combined and connected in series, and six blue wafers 122, six green wafers 123, and six red chips 121 are arranged in parallel.

In an alternative embodiment, the conductive pin 20 further includes at least one transition pin 25, the transition pin 25 has a transition die bond 251, and the transition die bond 251 is disposed between at least two adjacent die bonds of the first die bond 211, the second die bond 221, the third die bond 231, and the fourth die bond 241, such that at least one of the first die bond 211, the second die bond 221, the third die bond 231, and the fourth die bond 241 can be electrically connected to the driver chip 11 and/or the light emitting die set 12 through the transition die bond 251.

In an alternative embodiment, a protection device 26 is connected between the transition pin 25 and the power pin 22 for protecting the device. The protection device 26 may be a resistor and/or a diode, and may function as a voltage dividing and current limiting function to protect devices, including but not limited to the driving chip 11 and the light emitting wafer group 12.

In an alternative embodiment, at least a portion of the light emitting die set 12 is disposed on the transition carrier and signal input pins 23, and the remaining portion of the light emitting die set 12 is disposed on the power pins 22 and electrically connected to the power pins 22 such that the light emitting die set 12 can be disposed on the insulating base 30 at equidistant intervals.

In an alternative embodiment, the second die attach portion 221 extends from the power pin 22 toward one side of the insulating base 30 to form a fourth extension portion 2212, the fourth extension portion 2212 extends toward the other side of the insulating base 30 to form a fifth extension portion 2213, the fifth extension portion 2213 is parallel to the fourth extension portion 2212, the driving chip 11 is disposed at a junction between the fourth extension portion 2212 and the fifth extension portion 2213, and at least part of the light emitting die set 12 is disposed on the fifth extension portion 2213.

In an alternative embodiment, the conductive pins 20 further include three transition pins 25, each transition pin 25 has a transition die bonding portion 251, the three transition die bonding portions 251 are disposed on the insulating base 30 at intervals, and the driving chip 11 is correspondingly connected to the blue chip 122, the green chip 123 and the red chip 121 through the three transition die bonding portions 251.

Exemplary, the transition pins 25 include a first transition pin 25, a second transition pin 25, and a third transition pin 25, the first transition pin 25 has a first transition die bond 2511, the second transition pin 25 has a second transition die bond 2512, the third transition pin 25 has a third transition die bond 2513, the first transition die bond 2511 is disposed between the fifth extension 2213 and the fourth extension 2212, the second transition die bond 2512 is disposed between the fifth extension 2213 and the third transition die bond 2513, and the third transition die bond 2513 is disposed adjacent to the third die bond 231.

In an alternative embodiment, one of the blue wafer 122 and the green wafer 123 is disposed on one of the transition die bonds 251, the other of the blue wafer 122 and the green wafer 123 is disposed on the other transition die bond 251, and the red chip 121 is disposed on the fifth extension 2213 and connected to the driving chip 11 through the last transition die bond 251.

Illustratively, the blue wafer 122 is disposed on the first transition die bond 2511 and electrically connected to the fifth extension 2213, the green wafer 123 is disposed on the third transition die bond 2513 and electrically connected to the fifth extension 2213, and the red chip 121 is disposed on the fifth extension 2213 and electrically connected to the fifth extension 2213. The blue wafer 122 is connected to the driving chip 11 through the first transition die bond 2511, the green wafer 123 is connected to the driving chip 11 through the third transition die bond 2513, and the red wafer 121 is connected to the driving chip 11 through the second transition die bond 2512.

In an alternative embodiment, as shown in fig. 16 to 17, the number of the light emitting wafer groups 12 is two, two blue wafers 122 are disposed at both ends of one transition die bonding portion 251, two green wafers 123 are disposed on the other transition die bonding portion 251, and two red chips 121 are disposed at both ends of the fifth extension portion 2213.

Illustratively, the blue wafer 122 is disposed at two ends of the first transition die bond 2511 and electrically connected to the fifth extension portion 2213, the green wafer 123 is disposed at two ends of the third transition die bond 2513 and electrically connected to the fifth extension portion 2213, the red chip 121 is disposed at two ends of the fifth extension portion 2213 and electrically connected to the fifth extension portion 2213, and the blue wafer 122 is connected to the driving chip 11 through the first transition die bond 2511, the green wafer 123 is connected to the driving chip 11 through the third transition die bond 2513, and the red chip 121 is connected to the driving chip 11 through the second transition die bond 2512.

In an alternative embodiment, as shown in fig. 18 to 19, the number of the light emitting wafer groups 12 is at least three, at least three blue wafers 122 are equidistantly disposed along the length direction of one of the transition die fixing portions 251, at least three green wafers 123 are equidistantly disposed along the length direction of the other transition die fixing portion 251, and at least three red chips 121 are equidistantly disposed along the length direction of the fourth extension portion 2212.

For example, the number of the light emitting wafer groups 12 is six, the six blue wafers 122 are equidistantly disposed along the length direction of the first transition die bonding portion 2511 and electrically connected to the fifth extending portion 2213, the six green wafers 123 are equidistantly disposed along the length direction of the third transition die bonding portion 2513 and electrically connected to the fifth extending portion 2213, and the six red chips 121 are equidistantly disposed along the length direction of the fifth extending portion 2213 and electrically connected to the fifth extending portion 2213. The blue wafer 122 is connected to the driving chip 11 through the first transition die bond 2511, the green wafer 123 is connected to the driving chip 11 through the third transition die bond 2513, and the red wafer 121 is connected to the driving chip 11 through the second transition die bond 2512.

As shown in fig. 1 to 19, according to the second aspect of the present application, the present application further provides an LED product, including the above-mentioned LED lamp, equidistant interval sets up between a plurality of LED lamps to realize the high-density closely spaced design of LED product, improved the color effect and the display effect of LED product, make the resolution of LED product finer and smoother. Among other things, LED products include, but are not limited to, display screens, LED light strips, and the like.

In the description of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected. Either mechanically or electrically. Can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the present application. The components and arrangements of specific examples are described above in order to simplify the disclosure of this application. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Claims (27)

1. The LED lamp is characterized by comprising a light-emitting component, an insulating seat, packaging glue and a plurality of conductive pins, wherein the conductive pins are arranged on the insulating seat, the light-emitting component is arranged on the conductive pins and is electrically connected with the conductive pins, and the packaging glue is packaged outside the light-emitting component;

the light-emitting assembly comprises at least one driving chip and a plurality of light-emitting wafer groups which are combined together in a parallel or serial mode, the light-emitting wafer groups are sequentially arranged along the arrangement direction of the insulating seat, each light-emitting wafer group comprises a blue wafer, a green wafer and a red chip, and at least one driving chip is electrically connected with each blue wafer, each green wafer and each red chip and is used for driving each blue wafer, each green wafer and each red chip to emit light.

2. The LED lamp of claim 1, wherein the insulating base has a first end surface, the conductive pins have a die bonding portion formed on the first end surface and a soldering portion formed on the other end surface, the driving chip, the blue chip, the green chip and the red chip are disposed on the die bonding portion and electrically connected to the die bonding portion, and at least a part of the soldering portion is formed with a via structure.

3. The LED lamp of claim 1, wherein the conductive pins comprise a power pin and a ground pin, the driver chip is electrically connected to the power pin and the ground pin, the blue die, the green die and the red die are electrically connected to the power pin and the driver chip, and the blue die, the green die and the red die are equidistantly spaced on the insulating base.

4. The LED lamp of claim 3, wherein the driver chip is disposed on at least one of the ground pin and a power pin, and/or the light emitting die set is disposed on at least one of the power pin and a ground pin.

5. The LED lamp of claim 3, wherein the ground pin comprises a first solder portion and a first die bond portion, the power pin comprises a second solder portion and a second die bond portion, portions of the second solder portion and the first solder portion are disposed on opposite sides of the insulator base, the driver chip is disposed on the first die bond portion, and the light emitting die set is disposed on the second die bond portion.

6. The LED lamp of claim 5, wherein the conductive pins further comprise signal input pins and signal output pins, the signal input pins and signal output pins being electrically connected to the signal input and signal output terminals of the driver chip, respectively; or the signal input end and the signal output end between two adjacent driving chips are electrically connected, and the signal input pins and the signal output pins are electrically connected with the signal input ends and the signal output ends of the driving chips on two sides of the insulating seat.

7. The LED lamp of claim 6, wherein the signal input pin and the ground pin are disposed on one side of the insulating base and the signal output pin and the power pin are disposed on the other side of the insulating base.

8. The LED lamp of claim 6, wherein the number of the driving chips and the light emitting wafer groups is at least two, and at least two of the light emitting wafer groups are correspondingly connected with two of the driving chips and combined together in parallel, so that each of the driving chips can correspondingly control each of the light emitting wafer groups connected with each of the driving chips to emit light.

9. The LED lamp of claim 8, wherein the conductive leg further comprises at least one transition pin having a transition die bond disposed between two of the driver chips for electrically connecting a signal input of one of the driver chips with a signal output of the other of the driver chips.

10. The LED lamp of claim 9, wherein the signal input pin comprises a third die bond portion, the signal output pin comprises a fourth die bond portion, the third and fourth die bond portions are disposed on both sides of the second and first die bond portions, and the transition die bond portion is disposed between the third and fourth die bond portions.

11. The LED lamp of claim 10, wherein the first die bonding portion has a first extension portion and at least one second extension portion connected to the first extension portion, the first extension portion and the second die bonding portion extend along a length direction of the insulating base, the second extension portion extends toward the second die bonding portion and forms a receiving area with the second die bonding portion, and the transition die bonding portion is disposed in the receiving area.

12. The LED lamp of claim 11, wherein the number of the driving chips and the light emitting wafer groups is three and the driving chips are arranged on the second extending portions at equal intervals along the length direction of the insulating base, and the transition die bonding portions are arranged between two adjacent second extending portions.

13. The LED lamp of claim 11, wherein the second die attach portion has a third extension portion extending toward the first extension portion, the third extension portion being disposed adjacent to the second extension portion, the first input of the driver chip being connected to the third extension portion by a bond wire.

14. The LED lamp of claim 13, wherein the number of driver chips and the light emitting die sets is four and the driver chips are arranged at equal intervals along the length direction of the insulating base, the driver chips are disposed on the second extension portion, and the transitional die bonding portion is disposed between the third extension portion and the second extension portion.

15. The LED lamp of claim 7, wherein the number of the driving chips and the light emitting chip sets is at least two, at least two of the light emitting chip sets are correspondingly connected to two of the driving chips and combined together in parallel, and the blue chip, the green chip and the red chip on each of the light emitting chip sets are connected to the driving chips in series.

16. The LED lamp of claim 7, wherein the number of the driving chips is one, the number of the light emitting wafer groups is at least two, and the two light emitting wafer groups are connected with the driving chips in series, so that the driving chips can control the light emitting wafers connected in series to emit light.

17. The LED lamp of claim 16, wherein the blue die on the plurality of light emitting dies are connected in series, the green die on the plurality of light emitting dies are connected in series, the red die on the plurality of light emitting dies are connected in series, and the blue die, the green die and the red die are arranged in parallel.

18. The LED lamp of claim 16, wherein the number of the light emitting die sets is six, six blue dies are combined and connected in series, six green dies on the light emitting dies are combined and connected in series, six red dies on the light emitting dies are combined and connected in series, and six blue dies, six green dies, and six red dies are arranged in parallel.

19. The LED lamp of claim 6, wherein the conductive leg further comprises at least one transition leg having a transition die bond disposed between at least two adjacent die bonds of the first, second, third, and fourth die bonds.

20. The LED lamp of claim 19, wherein a protection device is connected between the transition pin and the power pin.

21. The LED lamp of claim 20, wherein at least a portion of the light emitting die set is disposed on the transition die attach portion and the signal input pins and a remaining portion of the light emitting die set is disposed on and electrically connected to the power pins.

22. The LED lamp of claim 19, wherein the second die attach portion extends from the power pin and then extends vertically toward one side of the insulating base to form a fourth extension portion, the fourth extension portion extends toward the other side of the insulating base to form a fifth extension portion, the fifth extension portion is parallel to the fourth extension portion, the driving chip is disposed at a junction between the fourth extension portion and the fifth extension portion, and at least a portion of the light emitting die set is disposed on the fifth extension portion.

23. The LED lamp of claim 22, wherein the conductive pins further comprise three transition pins, each of the transition pins has a transition die bonding portion, the three transition die bonding portions are disposed on the insulating base at intervals, and the driving chip is correspondingly connected with the blue chip, the green chip and the red chip through the three transition die bonding portions.

24. The LED lamp of claim 23, wherein one of the blue and green dies is disposed on one of the transition die bonding portions, the other of the blue and green dies is disposed on the other of the transition die bonding portions, and the red die is disposed on the fifth extension portion and connected to the driving die through the last of the transition die bonding portions.

25. The LED lamp of claim 24, wherein the number of the light emitting die sets is two, two blue dies are disposed at both ends of one of the transition die bonding portions, two green dies are disposed on the other of the transition die bonding portions, and two red dies are disposed at both ends of the fifth extension portion.

26. The LED lamp of claim 24, wherein the number of the light emitting die sets is at least three, at least three of the blue dies are disposed equidistantly along the length direction of one of the transition die bonding portions, at least three of the green dies are disposed equidistantly along the length direction of the other of the transition die bonding portions, and at least three of the red dies are disposed equidistantly along the length direction of the fifth extension portion.

27. An LED product comprising a plurality of LED lamps according to any one of claims 1 to 26, a plurality of said LED lamps being equally spaced apart.