CN209842290U - LED backlight device and backlight module - Google Patents
LED backlight device and backlight module Download PDFInfo
- Publication number
- CN209842290U CN209842290U CN201920766227.5U CN201920766227U CN209842290U CN 209842290 U CN209842290 U CN 209842290U CN 201920766227 U CN201920766227 U CN 201920766227U CN 209842290 U CN209842290 U CN 209842290U
- Authority
- CN
- China
- Prior art keywords
- chip
- led light
- pole
- led
- backlight device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a LED backlight device and a backlight module, wherein the backlight device comprises a circuit board, at least two red LED luminous chips, at least one green LED luminous chip and at least one blue LED luminous chip which are positioned on the front side of the circuit board; LED light-emitting chips of at least one color are connected in series; the A pole and the B pole of the LED light-emitting chip are positioned on the same side of the LED light-emitting chip; the connection lines from the A pole to the B pole of the LED light-emitting chips with the same light-emitting color point to the same direction. The embodiment of the utility model provides a LED backlight device, through the LED luminescence chip series connection of at least one colour, reduced LED backlight device's total current, reduced the calorific capacity in LED backlight device, and then improved LED luminescence chip's luminous efficacy; in addition, the connecting line from the A pole to the B pole of the LED light-emitting chips with the same color points to the same direction, so that the die bonding efficiency is improved.
Description
Technical Field
The utility model relates to a LED lighting technology especially relates to a LED backlight device and backlight unit.
Background
The LED white light source has the advantages of small volume, small heat radiation, low power consumption, high reaction speed and the like, and is widely applied to the fields of backlight, illumination and the like.
Specifically, white light can be emitted by integrating a plurality of red, green and blue three-primary-color LED light emitting chip combinations in one backlight device. In the existing backlight device, all the LED light-emitting chips are connected in parallel, and when the LED light-emitting chips are driven to emit light, a large-current low-voltage static scanning driving mode is adopted. Assuming that a backlight device is integrated with n light emitting chips, and the current for driving each light emitting chip is I, the total current inside the backlight device is I ═ n × I. The heat generated inside the backlight device is large, the luminous efficiency of the LED luminous chip is affected, and even the backlight device is burnt.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a LED backlight device and backlight unit can reduce the inside calorific capacity of LED backlight device, improves the luminous efficacy of LED luminescence chip, improves solid brilliant efficiency simultaneously.
In a first aspect, an embodiment of the present invention provides an LED backlight device, which includes a circuit board, and at least two red LED light emitting chips, at least one green LED light emitting chip, and at least one blue LED light emitting chip located on the front surface of the circuit board;
the LED light-emitting chips of at least one light-emitting color are connected in series;
at least one LED light-emitting chip is a double-electrode chip, and an A electrode and a B electrode of the double-electrode chip are positioned on the same side of the LED light-emitting chip;
and the connection lines from the A electrode to the B electrode of the double-electrode chip with the same luminous color point to the same direction.
Optionally, the connection lines from the a pole to the B pole of the LED light emitting chips with the same light emitting color are parallel to each other or on the same straight line.
Optionally, the circuit board includes an insulating substrate, a first metal line layer located on a front surface of the insulating substrate, and a second metal line layer located on a back surface of the insulating substrate, where the insulating substrate is provided with a metal via hole for connecting the first metal line layer and the second metal line layer;
the LED light-emitting chip is fixed on the first metal circuit layer, and the A pole and the B pole of the LED light-emitting chip are electrically connected with the first metal circuit layer.
Optionally, the light-emitting chips of the same color are connected in series to form three parallel branches, an input pad and an output pad are respectively arranged at the input end and the output end of each branch, and the first metal circuit layer comprises the input pad and the output pad.
Optionally, the LED light emitting chip of at least one color is a forward-mounted chip, and an a pole and a B pole of the forward-mounted chip are located on a light emitting side of the forward-mounted chip;
the first metal circuit layer comprises a plurality of first die bond pads, each forward chip is correspondingly provided with one first die bond pad, the forward chip is fixed on the corresponding first die bond pad through an insulating material, and the B pole of the forward chip is electrically connected with the corresponding first die bond pad through a first metal bonding wire;
in the same-color normally-installed chips, the first die bond pad corresponding to the previous normally-installed chip is electrically connected with the A pole of the next normally-installed chip through the second metal bonding wire.
Optionally, the LED light emitting chip of at least one color is a flip chip, and an a pole and a B pole of the flip chip are located on a backlight side opposite to a light emitting side of the flip chip;
the first metal circuit layer comprises a plurality of A pole bonding pads and a plurality of B pole bonding pads, each flip chip is correspondingly provided with an A pole bonding pad and a B pole bonding pad, and the A pole and the B pole of each flip chip are fixed on the corresponding A pole bonding pad and the corresponding B pole bonding pad through conductive materials;
in the same-color flip chip, the B pole bonding pad corresponding to the previous flip chip and the A pole bonding pad corresponding to the next flip chip share one bonding pad or are connected through metal wiring.
Optionally, the second metal circuit layer includes three input pins and three output pins, the three input pins are electrically connected to the three input pads through metal vias penetrating through the insulating substrate, and the three output pins are electrically connected to the three output pads through metal vias penetrating through the insulating substrate.
Optionally, at least two branches share one input pad or one output pad.
Optionally, the second metal circuit layer includes three input pins and three output pins, the three input pins are electrically connected with the three input pads through metal vias penetrating through the insulating substrate, and the three output pins are electrically connected with the three output pads through metal vias penetrating through the insulating substrate;
at least two input pins or at least two input pins share one pin.
Optionally, the input pins and the output pins are distributed on two opposite sides of the insulating substrate.
Optionally, the back surface of the insulating substrate is provided with an identification mark for identifying the input pin and the output pin.
Optionally, the number of the red LED light emitting chips is greater than the number of the blue LED light emitting chips, and is greater than the number of the green LED light emitting chips.
Optionally, the number ratio of the red, green and blue LED light-emitting chips satisfies 3:2:2 or 5:3: 3.
In a second aspect, an embodiment of the present invention provides a backlight module, including as the second aspect of the present invention the LED backlight device.
The embodiment of the utility model provides a LED backlight device, through the LED luminescence chip series connection of at least one colour, reduced LED backlight device's total current, reduced the calorific capacity in LED backlight device, and then improved LED luminescence chip's luminous efficacy; in addition, the connecting line from the A pole to the B pole of the LED light-emitting chips with the same color points to the same direction, so that the die bonding efficiency is improved.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Fig. 1 is a connection diagram of an internal circuit of an LED backlight device according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of an LED backlight device according to an embodiment of the present invention;
fig. 3 is a top view of an LED backlight device according to an embodiment of the present invention;
fig. 4 is a top view of another LED backlight device provided in the embodiment of the present invention;
fig. 5 is a top view of another LED backlight device provided in the embodiment of the present invention;
FIG. 6 is a bottom view of the LED backlight device of FIG. 3, FIG. 4 or FIG. 5;
fig. 7 is a top view of another LED backlight device provided in the embodiment of the present invention;
fig. 8 is a bottom view of the LED backlight device of fig. 7.
Detailed Description
In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The embodiment of the utility model provides a LED device in a poor light can be as the light source in a poor light of LCD, and LED device in a poor light includes the circuit board to and be located the positive at least two red LED luminescence chips of circuit board, at least with a green LED luminescence chip, at least one blue LED luminescence chip;
LED light-emitting chips of at least one color are connected in series;
at least one LED light-emitting chip is a double-electrode chip, and an A electrode and a B electrode of the double-electrode chip are positioned on the same side of the LED light-emitting chip;
and the connection lines from the A electrode to the B electrode of the double-electrode chip with the same luminous color point to the same direction.
Fig. 1 is a connection diagram of an internal circuit of an LED backlight device provided by an embodiment of the present invention, which is exemplary, as shown in fig. 1, the LED backlight device includes three red LED light emitting chips (shown in fig. 1 as R1, R2, and R3), two green LED light emitting chips (shown in fig. 1 as G1 and G2), and two blue LED light emitting chips (shown in fig. 1 as B1 and B2), and the three red LED light emitting chips are connected in series, the two green LED light emitting chips are connected in series, and the two blue LED light emitting chips are connected in series as an example, which illustrates the present invention.
In the prior art, the LED light emitting chips are connected in parallel, and assuming that the driving current of each LED light emitting chip is i, the total current of the prior art LED backlight device is 7 i. In this embodiment, the LED light emitting chips with the same light emitting color are connected in series, and the driving current of each series branch is i, so that the total current of the LED backlight device in this embodiment is 3i, which is 3/7 in the prior art, the total current of the LED backlight device is reduced, the heat productivity inside the LED backlight device is reduced, and the light emitting efficiency of the LED light emitting chips is further improved.
In addition, the LED light emitting chips are fixed to a preset position inside the backlight device by a die bonder, generally, the LED light emitting chips of the same color are die bonded by the same die bonder, if a connection line from an a pole to a B pole of the LED light emitting chips of the same color points to different directions, that is, the LED light emitting chips of the same color face different directions, then during die bonding, a head angle of the die bonder needs to be frequently adjusted, which reduces die bonding efficiency. The embodiment of the utility model provides a through the A utmost point with the luminous chip of homochromy LED to the directional same direction of line of the B utmost point, improved solid brilliant efficiency.
The embodiment of the utility model provides a LED backlight device, through establishing ties LED luminescence chip of at least one luminous colour, reduced LED backlight device's total current, reduced LED backlight device's inside calorific capacity, and then improved LED luminescence chip's luminous efficacy; in addition, the connecting line from the A pole to the B pole of the LED light-emitting chips with the same color points to the same direction, so that the die bonding efficiency is improved.
Fig. 2 is a cross-sectional view of an LED backlight device provided in an embodiment of the present invention, exemplarily, as shown in fig. 2, the circuit board includes an insulating substrate 100, a first metal line layer 200 located on the front surface of the insulating substrate 100, and a second metal line layer 300 located on the back surface of the insulating substrate 100, the insulating substrate 100 is provided with a metal via hole for connecting the first metal line layer 200 and the second metal line layer 300, and the metal via hole is a hole plated with a conductive metal layer on the inner wall of the hole.
The LED light emitting chip 400 is fixed on the first metal line layer 200, and an a pole and a B pole of the LED light emitting chip 400 are electrically connected to the first metal line layer, respectively. In an embodiment of the present invention, the a electrode of the LED light emitting chip is a cathode, and the B electrode is an anode.
Optionally, the LED light emitting chip of at least one color is a front-mounted chip, and an a pole and a B pole of the front-mounted chip are located on a light emitting side of the front-mounted chip;
the first metal circuit layer comprises a plurality of first die bond pads, each forward chip is correspondingly provided with a first die bond pad, the forward chips are fixed on the corresponding first die bond pads through insulating materials, and the B poles of the forward chips are electrically connected with the corresponding first die bond pads through first metal bonding wires;
in the same-color normally-installed chips, the first die bond pad corresponding to the previous normally-installed chip is electrically connected with the A pole of the next normally-installed chip through the second metal bonding wire.
Fig. 3 is a top view of an LED backlight device provided in an embodiment of the present invention, exemplarily, as shown in fig. 3, in an embodiment of the present invention, the LED backlight device includes three red LED light emitting chips 411, 412 and 413 connected in series in sequence, two green LED light emitting chips 421 and 422 connected in series in sequence, and two blue LED light emitting chips 431 and 432 connected in series in sequence. The LED light-emitting chips are all forward-mounted chips, and the cathodes and the anodes of the forward-mounted chips are both positioned on the light-emitting sides of the forward-mounted chips.
The first metal circuit layer 200 includes a plurality of first die attach pads 210, each of the normal chips is correspondingly provided with a first die attach pad 210, the first die attach pads 210 are used for fixing the LED light emitting chip, the normal chip is fixed on the corresponding first die attach pad 210 through an insulating material, and an anode of the normal chip is electrically connected to the corresponding first die attach pad 210 through a first metal bonding wire 501.
In the chips with the same color, the first die bond pad 210 corresponding to the previous chip with the same color is electrically connected with the cathode of the next chip with the same color through the second metal bonding wire 502, so that the serial connection of the light emitting chips with the same color is realized.
Optionally, the LED light emitting chip of at least one color is a flip chip, and an a pole and a B pole of the flip chip are located on a backlight side opposite to a light emitting side of the flip chip;
the first metal circuit layer comprises a plurality of A pole bonding pads and a plurality of B pole bonding pads, each flip chip is correspondingly provided with an A pole bonding pad and a B pole bonding pad, and the A pole and the B pole of each flip chip are fixed on the corresponding A pole bonding pad and the corresponding B pole bonding pad through conductive materials;
in the same-color flip chip, the A pole bonding pad corresponding to the previous flip chip and the B pole bonding pad corresponding to the next flip chip share one bonding pad or are connected through metal wiring.
Fig. 4 is a top view of another LED backlight device provided in an embodiment of the present invention, exemplarily, as shown in fig. 4, in an embodiment of the present invention, the LED backlight device includes three red LED light emitting chips 411, 412, and 413 connected in series in sequence, two green LED light emitting chips 421 and 422 connected in series in sequence, and two blue LED light emitting chips 431 and 432 connected in series in sequence. The LED light-emitting chips are all flip chips, and the cathodes and the anodes of the flip chips are both positioned on the backlight side opposite to the light-emitting side of the flip chips.
The first metal circuit layer 200 includes a plurality of cathode pads and a plurality of anode pads, each flip chip is correspondingly provided with a cathode pad and an anode pad, the cathode and the anode of the flip chip are fixed on the corresponding cathode pad and anode pad through conductive materials, wherein the conductive materials can be conductive silver paste or solder paste.
In the same-color flip chip, the anode bonding pad corresponding to the previous flip chip and the cathode bonding pad corresponding to the next flip chip share one bonding pad, so that the serial connection of the same-color LED light-emitting chips is realized. Specifically, the present invention is described by taking the serial branch of the red LED light emitting chip as an example, in this branch, the cathode of the red LED light emitting chip 411 is fixed on the cathode pad 221, the anode is fixed on the common pad 222, the cathode of the red LED light emitting chip 412 is fixed on the common pad 222, the anode is fixed on the common pad 223, the cathode of the red LED light emitting chip 413 is fixed on the common pad 223, and the anode is fixed on the anode pad 224. The connection relationship between the electrodes of other branches and the bonding pads is similar to that of the red LED light-emitting chip, and is not described herein again. In other embodiments of the present invention, the first metal circuit layer 200 further includes a plurality of metal wires, and the cathode pad corresponding to the previous flip chip and the anode pad corresponding to the next flip chip can be connected through the metal wires.
Optionally, the LED light emitting chip of at least one color is a vertical chip, and an a pole and a B pole of the vertical chip are respectively located on a light emitting side of the vertical chip and a backlight side opposite to the light emitting side;
the first metal circuit layer comprises a plurality of second die bond pads, each vertical chip is correspondingly provided with a second die bond pad, and the B pole of each vertical chip is fixed on the corresponding second die bond pad through a conductive material;
in the same-color vertical chip, the second die bond pad corresponding to the previous vertical chip is electrically connected with the A pole of the next vertical chip through a third metal bonding wire.
Fig. 5 is a top view of another LED backlight device provided in the embodiment of the present invention, exemplarily, as shown in fig. 5, in an embodiment of the present invention, the LED backlight device includes three red LED light emitting chips 411, 412, and 413 connected in series in sequence, two green LED light emitting chips 421 and 422 connected in series in sequence, and two blue LED light emitting chips 431 and 432 connected in series in sequence. The red LED light-emitting chips are vertical chips, cathodes and anodes of the vertical chips are respectively located on the light-emitting side of the vertical chips and the backlight side opposite to the light-emitting side, and the rest LED light-emitting chips are flip chips.
The first metal circuit layer 200 includes a plurality of second die attach pads 230, each vertical chip is correspondingly provided with a second die attach pad 230, and the anode of the vertical chip is fixed on the corresponding second die attach pad 230 through a conductive material; the first metal circuit layer 200 further comprises a plurality of cathode pads and a plurality of anode pads, each flip chip is correspondingly provided with a cathode pad and an anode pad, the cathode and the anode of the flip chip are fixed on the corresponding cathode pad and the anode pad through conductive materials respectively, and the conductive materials can be conductive silver paste or tin paste.
In the same-color vertical chips, the second die bond pad 230 of the previous vertical chip is electrically connected to the cathode of the next vertical chip through the third metal bonding wire 503, so that the serial connection of the same-color vertical chips is realized.
In the same-color flip chip, the anode bonding pad corresponding to the previous flip chip and the cathode bonding pad corresponding to the next flip chip share one bonding pad, so that the serial connection of the same-color flip chips is realized.
The LED luminous chips of the same color are connected in series to form three parallel branches, the first metal circuit layer 200 further comprises an input pad and an output pad, the input end and the output end of each branch are respectively provided with the input pad and the output pad, wherein, the input end can be the cathode or the anode of the series branch, and the output end can be the anode or the cathode of the series branch. Illustratively, as shown in fig. 3, in the serial branch of the red LED light emitting chip, the output pad 240 is a separately disposed pad electrically connected to the cathode of the red LED light emitting chip 411 through a metal bonding wire 502, and the input pad is a pad shared by the first die attach pad 210 corresponding to the red LED light emitting chip 413. The input bonding pad and the output bonding pad corresponding to other branches are similar to the series connection of the red LED light-emitting chip, and are not described herein again. Illustratively, as shown in fig. 4, in the serial connection of the red LED light emitting chips, the output pad is a pad common to the cathode pad 221 corresponding to the red LED light emitting chip 411, and the input pad is a pad common to the anode pad 224 corresponding to the red LED light emitting chip 413. The input bonding pad and the output bonding pad corresponding to other branches are similar to the series connection of the red LED light-emitting chip, and are not described herein again. Illustratively, as shown in fig. 5, in the serial connection of the red LED light emitting chips, the output pad 240 is a separately provided pad electrically connected to the cathode of the red LED light emitting chip 411 through a metal bonding wire 503, and the input pad is a pad shared by the second die attach pads 230 corresponding to the red LED light emitting chips 413. The input bonding pad and the output bonding pad corresponding to other branches are similar to the series connection of the red LED light-emitting chip, and are not described herein again.
Optionally, the second metal circuit layer includes three input pins and three output pins, the three input pins are electrically connected to the three input pads through metal vias penetrating through the substrate, and the three output pins are electrically connected to the three output pads through metal vias penetrating through the substrate.
Fig. 6 is a bottom view of the LED backlight device in fig. 3, 4 or 5, specifically, as shown in fig. 3 and 6, three output pins 311, 312 and 313 are electrically connected to the output pads 240 corresponding to the serial branches respectively through metal vias penetrating through the substrate 100, and three input pins 321, 322 and 323 are electrically connected to the first die attach pads 210 corresponding to the red LED light emitting chip 413, the green LED light emitting chip 422 and the blue LED light emitting chip 432 respectively through metal vias penetrating through the insulating substrate 100. In the embodiments shown in fig. 4 and 5, the connection relationship between the input pin and the input pad and the connection relationship between the output pin and the output pad are similar to those in fig. 3, and are not repeated herein.
Optionally, at least two branches share one input pad or one output pad.
Fig. 7 is a top view of another LED backlight device provided in an embodiment of the present invention, exemplarily, as shown in fig. 7, based on the embodiment shown in fig. 4, three serial branches share one output pad, that is, the cathode pad of the red LED light emitting chip 411, the cathode pad of the green LED light emitting chip 421, and the cathode pad of the blue LED light emitting chip 431 share one common pad 225.
The second metal circuit layer comprises three input pins and three output pins, the three input pins are respectively and electrically connected with the three input bonding pads through metal through holes penetrating through the substrate, and the three output pins are respectively and electrically connected with the three output bonding pads through metal through holes penetrating through the substrate;
at least two input pins or at least two input pins share one pin.
Fig. 8 is a bottom view of the LED backlight device in fig. 7, specifically, as shown in fig. 8, three output pins in the second metal circuit layer 300 are combined into one output pin 310, and the output pad 225 shared by three serial branches is electrically connected to the output pin 310 through a metal via penetrating through the insulating substrate 100.
Illustratively, as shown in fig. 6 and 8, the input pins and the output pins are distributed on opposite sides of the insulating substrate. Optionally, the identification mark 500 for identifying the input pin and the output pin is disposed on the back surface of the insulating substrate 100, specifically, the identification mark 500 may be an insulating coating layer with a color that is different from that of the insulating substrate 100, covers an area between the input pin and the output pin, is used for identifying the orientation of the input pin and the output pin, and plays a role in insulating and isolating each input pin and each output pin.
In order to simplify a driving circuit, most of the current LED backlight devices use currents of the same magnitude to drive LED light emitting chips of different colors, however, the light emitting efficiency of the LED light emitting chips of different colors is different, wherein the light emitting efficiency of the red LED light emitting chip is the lowest, and under the condition that the number of the LED light emitting chips of different colors is the same, the white light emitted by the LED backlight device has a larger color difference from the expected white light, which finally results in inaccurate color display of the liquid crystal display.
In order to overcome the above problem, it is optional, in the embodiment of the present invention, the number of the red LED light emitting chips is greater than the number of the green LED light emitting chips, and is greater than the number of the blue LED light emitting chips, so as to compensate the problem of low light emitting efficiency of the red LED light emitting chips, reduce the color difference of the white light emitted by the LED backlight device, and improve the color accuracy of the liquid crystal display. In a specific embodiment, as shown in fig. 3-5, the number ratio of the red, green and blue LED light emitting chips satisfies 3:2:2, and in other embodiments, the number ratio of the red, green and blue LED light emitting chips satisfies 5:3: 3.
The embodiment of the utility model provides a still provide a backlight unit, include the utility model discloses above-mentioned embodiment is arbitrary LED backlight device.
In the description herein, it is to be understood that the terms "upper", "lower", "right", and the like are used in an orientation or positional relationship based on that shown in the drawings for convenience of description and simplicity of operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.
Claims (13)
1. The LED backlight device is characterized by comprising a circuit board, at least two red LED light-emitting chips, at least one green LED light-emitting chip and at least one blue LED light-emitting chip, wherein the at least two red LED light-emitting chips, the at least one green LED light-emitting chip and the at least one blue LED light-emitting chip are positioned on the front surface of the circuit board;
the LED light-emitting chips of at least one light-emitting color are connected in series;
at least one LED light-emitting chip is a double-electrode chip, and an A electrode and a B electrode of the double-electrode chip are positioned on the same side of the LED light-emitting chip;
and the connection lines from the A electrode to the B electrode of the double-electrode chip with the same luminous color point to the same direction.
2. The LED backlight device according to claim 1, wherein the circuit board comprises an insulating substrate, a first metal wiring layer on a front surface of the insulating substrate, and a second metal wiring layer on a back surface of the insulating substrate, the insulating substrate being provided with metal vias for connecting the first metal wiring layer and the second metal wiring layer;
the LED light-emitting chip is fixed on the first metal circuit layer, and the A pole and the B pole of the LED light-emitting chip are electrically connected with the first metal circuit layer.
3. The LED backlight device as claimed in claim 2, wherein the LED light-emitting chips of the same color are connected in series to form three branches connected in parallel, an input terminal and an output terminal of each branch are respectively provided with an input pad and an output pad, and the first metal wiring layer comprises the input pad and the output pad.
4. The LED backlight device of claim 3, wherein the LED light emitting chip of at least one color is a front-mounted chip, and the A pole and the B pole of the front-mounted chip are positioned on the light emitting side of the front-mounted chip;
the first metal circuit layer comprises a plurality of first die bond pads, each forward chip is correspondingly provided with one first die bond pad, the forward chip is fixed on the corresponding first die bond pad through an insulating material, and the B pole of the forward chip is electrically connected with the corresponding first die bond pad through a first metal bonding wire;
in the same-color normally-installed chips, the first die bond pad corresponding to the previous normally-installed chip is electrically connected with the A pole of the next normally-installed chip through the second metal bonding wire.
5. The LED backlight device of claim 3, wherein the LED light emitting chip of at least one color is a flip chip having an A pole and a B pole on a backlight side opposite to a light emitting side of the flip chip;
the first metal circuit layer comprises a plurality of A pole bonding pads and a plurality of B pole bonding pads, each flip chip is correspondingly provided with an A pole bonding pad and a B pole bonding pad, and the A pole and the B pole of each flip chip are fixed on the corresponding A pole bonding pad and the corresponding B pole bonding pad through conductive materials;
in the same-color flip chip, the B pole bonding pad corresponding to the previous flip chip and the A pole bonding pad corresponding to the next flip chip share one bonding pad or are connected through metal wiring.
6. The LED backlight device according to any one of claims 3-5, wherein the second metal wiring layer comprises three input pins and three output pins, the three input pins are electrically connected with the three input pads respectively through metal vias penetrating through the insulating substrate, and the three output pins are electrically connected with the three output pads respectively through metal vias penetrating through the insulating substrate.
7. The LED backlight device according to claim 3, wherein at least two branches share one input pad or output pad.
8. The LED backlight device of claim 7, wherein the second metal circuit layer comprises three input pins and three output pins, the three input pins are electrically connected with the three input pads through metal vias penetrating through the insulating substrate, and the three output pins are electrically connected with the three output pads through metal vias penetrating through the insulating substrate;
at least two input pins or at least two input pins share one pin.
9. The LED backlight device of claim 6, wherein the input pins and the output pins are distributed on opposite sides of the insulating substrate.
10. The LED backlight device according to claim 9, wherein the insulating substrate is provided at a rear surface thereof with identification marks for identifying the input and output pins.
11. The LED backlight device according to claim 1, wherein the number of red LED light emitting chips is greater than the number of blue LED light emitting chips and greater than the number of green LED light emitting chips.
12. The LED backlight device of claim 11, wherein the number ratio of the red, green and blue LED light emitting chips satisfies 3:2:2 or 5:3: 3.
13. A backlight module comprising the LED backlight device according to any one of claims 1 to 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920766227.5U CN209842290U (en) | 2019-05-24 | 2019-05-24 | LED backlight device and backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920766227.5U CN209842290U (en) | 2019-05-24 | 2019-05-24 | LED backlight device and backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209842290U true CN209842290U (en) | 2019-12-24 |
Family
ID=68897920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920766227.5U Active CN209842290U (en) | 2019-05-24 | 2019-05-24 | LED backlight device and backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209842290U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110133912A (en) * | 2019-05-24 | 2019-08-16 | 佛山市国星光电股份有限公司 | A kind of LED backlight device and backlight module |
-
2019
- 2019-05-24 CN CN201920766227.5U patent/CN209842290U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110133912A (en) * | 2019-05-24 | 2019-08-16 | 佛山市国星光电股份有限公司 | A kind of LED backlight device and backlight module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11777068B2 (en) | Semiconductor light emitting device and method for manufacturing the same | |
| CN207852672U (en) | A kind of tetrad RGB-LED encapsulation modules and its display screen | |
| EP3582262B1 (en) | Four-in-one mini-led module, display screen and manufacturing method | |
| KR20190132907A (en) | Led display unit group and display panel | |
| TW200423440A (en) | LED lamp | |
| CN104867954B (en) | A kind of LED light emitting device and display screen | |
| KR20010064820A (en) | Led lamp of side surface light emitting type | |
| CN109755232A (en) | A kind of the four-in-one LED display module and its display screen of Optimization-type | |
| CN209842290U (en) | LED backlight device and backlight module | |
| CN213546315U (en) | Light-emitting unit | |
| KR20120038350A (en) | Light emitting device | |
| CN215182844U (en) | Display device and lamp panel thereof | |
| TW202127703A (en) | Double-sided display packaging structure | |
| CN110993769A (en) | Integrated structure support for realizing series connection of single electrode and single electrode or multiple electrodes | |
| US20060027827A1 (en) | Side structure of a bare LED and backlight module thereof | |
| CN112951971B (en) | All-in-one flip full-color SMD LED | |
| CN212033019U (en) | Light-emitting device of vertical integrated control chip | |
| CN211238246U (en) | RGBW integrated circuit encapsulation lamp pearl | |
| CN211455720U (en) | RGB packaging body | |
| CN215182843U (en) | Display device and lamp panel thereof | |
| CN110133912A (en) | A kind of LED backlight device and backlight module | |
| CN206282882U (en) | LED package assemblings | |
| CN111599911A (en) | LED light-emitting unit and display panel | |
| CN218827117U (en) | LED display module and LED display screen | |
| CN217903118U (en) | Integrated packaging structure of IC and display screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |