CN217903118U

CN217903118U - Integrated packaging structure of IC and display screen

Info

Publication number: CN217903118U
Application number: CN202220680818.2U
Authority: CN
Inventors: 康孝恒; 蔡克林; 李清雄; 叶奇; 唐波; 杨飞; 许凯
Original assignee: Meiqi Circuit Jiangmen Co ltd
Current assignee: Meiqi Circuit Jiangmen Co ltd
Priority date: 2022-03-25
Filing date: 2022-03-25
Publication date: 2022-11-25
Anticipated expiration: 2032-03-25

Abstract

The utility model relates to a LED encapsulates technical field, indicates an integrated packaging structure of IC and display screen especially, contains: the light-emitting chip plastic package part, the support plate and the driving chip plastic package part are sequentially pressed together from top to bottom, the support plate is provided with a circuit line, and the circuit line is electrically connected with the light-emitting chip plastic package part and the driving chip plastic package part; the light-emitting chip plastic package part comprises a light-emitting chip, and the driving chip plastic package part comprises a driving chip. The utility model discloses can realize driver chip and luminescence chip's integration and interconnection, can promote the efficiency that the chip shifted simultaneously.

Description

Integrated packaging structure of IC and display screen

Technical Field

The utility model relates to a LED encapsulates technical field, indicates an integrated packaging structure of IC and display screen especially.

Background

In an LED display panel, a driver IC receives display data conforming to a protocol and outputs a current in accordance with a brightness/grayscale selection index to light an LED. Mainstream Chip type, TOP type SMD and IMD type LED all adopt luminescence Chip (RGB) and two-sided base plate to be connected the back encapsulation through the mode of just adorning or flip-Chip to expose the pin at the back, then weld on another piece of PCB board that links to have driver Chip. The COB type LED, generally having a 6-10 layer structure, can realize the functions of connecting the light emitting chip on the front side and connecting the driving chip on the back side, but the yield is low due to the long multi-time pressing process, and the mass production cannot be supported.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, an object of the present invention is to provide an integrated package structure of IC and a display screen, which can realize integration and interconnection of a driver chip and a light emitting chip, and can improve the efficiency of chip transfer.

In order to achieve the above object, the utility model adopts the following technical scheme:

an IC integrated package structure, comprising: the light-emitting chip plastic package part, the support plate and the driving chip plastic package part are sequentially pressed together from top to bottom, the support plate is provided with a circuit line, and the circuit line is electrically connected with the light-emitting chip plastic package part and the driving chip plastic package part; the light-emitting chip plastic package piece comprises a light-emitting chip, and the driving chip plastic package piece comprises a driving chip.

Further, the luminous chip plastic package spare with be equipped with first insulating piece between the support plate, the drive chip plastic package spare with be equipped with the second insulating piece between the support plate.

Further, first insulating piece and second insulating piece all are equipped with the through-hole, the through-hole packing has the conducting material, the circuit line passes through the conducting material with luminous chip plastic-sealed piece or driver chip plastic-sealed piece electric connection.

Further, the light emitting chip includes a red light chip, a green light chip, and a blue light chip.

Further, luminous chip plastic-sealed piece, first insulating piece, support plate, second insulating piece and drive chip plastic-sealed piece are from last down pressfitting in proper order and are in the same place.

The utility model also provides a display screen, the display screen include as above an integrated packaging structure of IC.

The beneficial effects of the utility model reside in that:

the utility model discloses contain: the light-emitting chip plastic package component comprises a light-emitting chip plastic package component, a carrier plate and a driving chip plastic package component, wherein the carrier plate is provided with a circuit line which is electrically connected with the light-emitting chip plastic package component and the driving chip plastic package component; the integration and interconnection of the driving chip and the light-emitting chip can be realized; meanwhile, the light-emitting chip and the driving chip are manufactured into a complete plastic package part, and the plastic package part is directly pressed with the carrier plate, so that the chip transfer efficiency can be improved.

Drawings

Fig. 1 is a schematic cross-sectional view of the present invention.

The reference numbers illustrate: 1. a light emitting chip plastic package; 2. a first insulating sheet; 3. a carrier plate; 4. a second insulating sheet; 5. driving the chip plastic package; 6. a light emitting chip; 7. and a driving chip.

Detailed Description

Referring to fig. 1, the present invention relates to an IC integrated package structure, including: the light-emitting chip plastic package comprises a light-emitting chip plastic package part 1, a carrier plate 3 and a driving chip plastic package part 5, wherein the light-emitting chip plastic package part 1, the carrier plate 3 and the driving chip plastic package part 5 are sequentially pressed together from top to bottom, the carrier plate 3 is provided with a circuit line, and the circuit line is electrically connected with the light-emitting chip plastic package part 1 and the driving chip plastic package part 5; the light-emitting chip plastic package member 1 comprises a light-emitting chip 6, the light-emitting chip 6 comprises a red light chip, a green light chip and a blue light chip, and the driving chip plastic package member 5 comprises a driving chip 7.

A first insulating sheet 2 is arranged between the light-emitting chip plastic package member 1 and the carrier plate 3, a second insulating sheet 4 is arranged between the driving chip plastic package member 5 and the carrier plate 3, the first insulating sheet 2 and the second insulating sheet 4 are both provided with through holes, the through holes are filled with conductive substances (the conductive substances can be solder paste), and the circuit line is electrically connected with the light-emitting chip plastic package member 1 or the driving chip plastic package member 5 through the conductive substances; the light-emitting chip plastic package member 1, the first insulation sheet 2, the carrier plate 3, the second insulation sheet 4 and the driving chip plastic package member 5 are pressed together from top to bottom according to the sequence. In this embodiment, the first insulating sheet 2 is used for isolating the light emitting chip package 1 from the carrier plate 3, and the second insulating sheet 4 is used for isolating the driver chip package 5 from the carrier plate 3.

It can be understood that IC integrated package structure includes from the last luminous chip plastic-sealed piece 1, first insulation piece 2, support plate 3, second insulating piece 4 and the driver chip plastic-sealed piece 5 down according to the preface pressfitting, support plate 3 is equipped with circuit line, first insulation piece 2 and second insulating piece 4 all are equipped with the through-hole, the through-hole packing has conductive substance, circuit line passes through conductive substance with luminous chip plastic-sealed

piece

1 or 5 electric connection of driver chip plastic-sealed piece. The light emitting chip plastic package member 1 comprises a light emitting chip 6, and the driving chip plastic package member 5 comprises a driving chip 7. The integrated packaging structure of the utility model can realize the integration and interconnection of the driving chip 7 and the light-emitting chip 6, and can replace the traditional W/B, FC or the way of connecting the chip and the carrier plate 3 by tapping and electroplating; and because the utility model discloses an earlier make into luminous chip 6, driver chip 7 complete plastic-sealed piece, will mould the direct and support plate 3 pressfitting of piece again, promoted the efficiency that the chip shifted greatly.

The above embodiments are only for describing the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and improvements made by the technical solution of the present invention by those skilled in the art are all within the scope of the present invention as defined by the claims.

Claims

1. An integrated circuit package structure, comprising: the light-emitting chip plastic package part, the carrier plate and the driving chip plastic package part are sequentially pressed together from top to bottom, the carrier plate is provided with a circuit line, and the circuit line is electrically connected with the light-emitting chip plastic package part and the driving chip plastic package part; the light-emitting chip plastic package piece comprises a light-emitting chip, and the driving chip plastic package piece comprises a driving chip.

2. The IC integrated package structure of claim 1, wherein: a first insulating sheet is arranged between the light-emitting chip plastic package part and the carrier plate, and a second insulating sheet is arranged between the driving chip plastic package part and the carrier plate.

3. The IC integrated package structure of claim 2, wherein: the first insulation sheet and the second insulation sheet are both provided with through holes, the through holes are filled with conductive substances, and the circuit line is electrically connected with the light-emitting chip plastic package piece or the driving chip plastic package piece through the conductive substances.

4. The IC integrated package structure of claim 1, wherein: the light emitting chip comprises a red light chip, a green light chip and a blue light chip.

5. The IC integrated package structure of claim 1, wherein: luminous chip plastic-sealed piece, first insulating piece, support plate, second insulating piece and drive chip plastic-sealed piece are from last down according to the preface pressfitting together.

6. A display screen, its characterized in that: the display screen comprises an IC integrated package structure as recited in any one of claims 1-5.