CN201936912U - Empty encapsulation patch white light digital tube - Google Patents

Empty encapsulation patch white light digital tube Download PDF

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Publication number
CN201936912U
CN201936912U CN2010202372947U CN201020237294U CN201936912U CN 201936912 U CN201936912 U CN 201936912U CN 2010202372947 U CN2010202372947 U CN 2010202372947U CN 201020237294 U CN201020237294 U CN 201020237294U CN 201936912 U CN201936912 U CN 201936912U
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CN
China
Prior art keywords
external member
white light
light
charactron
plastic external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010202372947U
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Chinese (zh)
Inventor
劳铁均
孔宝根
盛立军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHAOXING GUANGCAI DISPLAY TECHNOLOGY Co Ltd
Original Assignee
SHAOXING GUANGCAI DISPLAY TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHAOXING GUANGCAI DISPLAY TECHNOLOGY Co Ltd filed Critical SHAOXING GUANGCAI DISPLAY TECHNOLOGY Co Ltd
Priority to CN2010202372947U priority Critical patent/CN201936912U/en
Application granted granted Critical
Publication of CN201936912U publication Critical patent/CN201936912U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses an empty encapsulation patch white light digital tube, which comprises a PCB (printed circuit board), wherein the PCB comprises multiple electrodes and bonding pads, and a plastic external member is pressed above the PCB, each bonding pad is welded with a semiconductor chip which can emit blue light, light outlet passage ways in the plastic external members are positioned right above the blue light semiconductor chips, the blue light semiconductor chips and the bonding pads are connected with metal wires, the upper part of the plastic external member is also provided with a thin film, the thin film is attached with fluorescent powder, and the fluorescent powder is positioned above the light outlet passage ways of the plastic external member. Compared with the traditional product, the encapsulation with epoxy resin for the light outlet passage way of the plastic external member is omitted, the pollution of the epoxy resin is effectively avoided, the cost is saved, and the energy consumption is reduced.

Description

Empty sealed paster white light charactron
Technical field
The utility model relates to the white light charactron, belongs to the semiconductor LED product technical field.
Background technology
In the industry of SMD LED and SMD Display, the encapsulation enterprise in Taiwan occupies the very big market share, has critical role at present.For example Taiwan Yiguang Electronic Industry Co., Ltd. aspect the encapsulation of paster charactron, occupy the first place, Taiwan.But common process is adopted in its charactron encapsulation, the cost of manufacture height, and disposable yield is low, is difficult to apply in other area.
The China's Mainland begins research and development from the eighties and produces, to the nineties, the LED packaging industry has obtained fast development, but the most small scale of domestic LED encapsulation enterprise, packaging technology research insufficient investment, many technical bottlenecks do not break through, and technological level is totally not high, and this situation has seriously restricted the development of industry.Therefore, domestic charactron encapsulates enterprise and only updates technical merit, reduces cost, and could occupy the more market share in intense market competition.
Traditional paster white light charactron structure, as shown in Figure 1, welding white light-emitting diodes 1 and is added a cover plastics external member 3 in the pad 2 on pcb board 4, goes out optical channel 5 and hot setting with epoxy resin embedding plastics external member 3.This traditional packaging technology technology is that luminescence chip is encapsulated in the white light-emitting diodes, because white light-emitting diodes has the multiple tracks complicated technology to finish, therefore makes whole paster white light charactron technology more complicated, and cost is also higher.And white light-emitting diodes passes through this operation of high temperature sealing again, and the life-span is also influential.
Summary of the invention
The purpose of this utility model provides a kind of improved white light charactron, and it can avoid the pollution of epoxy resin, omits high temperature sealing operation, and is comparatively energy-conservation in the process that manufactures a product, and reduced production cost.
For achieving the above object, the utility model patent is achieved through the following technical solutions:
Empty sealed paster white light charactron comprises pcb board, includes a plurality of electrodes and pad on this pcb board, and the plastics external member is pressed in the top of pcb board.Wherein, be welded with the semiconductor chip that can send blue light in the pad; Bright dipping passage in the plastics external member be positioned at this blue-light semiconductor chip directly over, connect with metal wire between this blue-light semiconductor chip and the pad; Also have a film above the plastics external member, with fluorescent material, fluorescent material is positioned at the top of plastics external member bright dipping passage on the film.
According to the further setting to the appeal technical scheme, metal wire adopts aluminum steel.
The utility model patent is compared advantage with traditional product and is: 1, omitted in plastics external member bright dipping passage and used the epoxy resin embedding, effectively avoided the pollution of epoxy resin, omitted high temperature sealing operation.2, omit hot setting, saved cost, reduced energy consumption, can be energy-conservation in the process that manufactures a product about 50%, greatly reduce production costs.
Description of drawings
Fig. 1 is traditional white light charactron structural representation;
Fig. 2 is the empty sealed paster white light of a utility model charactron structural representation.
Embodiment
The empty sealed paster white light of the utility model charactron structure as shown in Figure 2, pcb board 4 includes a plurality of electrodes 6 and pad 2, blue chip 1 directly is welded in the pad 2, plastics external member 3 is pressed in pcb board 4 tops, go out optical channel 5 over against blue chip 1 in the plastics external member 3, the connection of aluminum steel 7 is arranged between blue chip 1 and the pad 2.Film 9 is bonded at plastics external member 3 tops, and the fluorescent material 10 in the film 9 goes out optical channel 5 over against plastics external member 3.
The concrete implementation step of product is:
Step 1, modulation fluorescent material mixed proportion.By blue light fluorescent material excited the generation gold-tinted, and blue light mixes with the complementation of gold-tinted, can produce the nature white light, but require (the white light colour temperature is generally got 5200 ° of K--5500 ° of K) for different colour temperatures, the fluorescent material ratio that needs the configuration different wave length, just can meet the requirement of paster white light charactron, so the concrete first's work implemented of this patent is exactly the colour temperature modulation fluorescent material mixed proportion according to paster white light charactron.
Step 2, the design of paster charactron external member.Require the design of paster charactron to meet: bottom level also has conductive electrode, makes things convenient for the welding of tin glue; Positive level is convenient to SMT equipment and is drawn; Winding belt package is convenient in the pipe four directions.
Step 3, the empty encapsulation technique research of paster charactron.Anti-oxidation and the tempering of aluminium wire is handled, the luminous reflection uniformity of charactron.This partial content is the main contents of patented product innovation, and empty encapsulation technique is applied to the big characteristics that paster white light charactron product is this project, and this series products does not also appear on the market at present.
Step 4) adopts the silk-screen technology, and special fluorescent material pad pasting is made in screen printing and electronics ink jet printing.
Step 5), the assembling of paster white light charactron.Use the empty encapsulation technique that paster blue light charactron is adopted, stick on the charactron pad pasting of fluorescence byte, be assembled into the white light charactron, reach the product heatproof, byte shows performances such as even.
Operation principle: electric current flows to pad 2 through the electrode 6 of pcb board 4, through pad 2 and aluminum steel 7 interconnect functions, flow to blue chip 1, wherein blue chip 1 goes out optical channel 5 in the plastics external member 3, sends blue light by going out optical channel 5, simultaneously, the blue light that produces excites the generation gold-tinted to what be pressed in fluorescent material 10 in the film 9 on the plastics external member 3, because blue light mixes with the complementation of gold-tinted, produce the nature white light, make charactron white demonstrate Arabic numerals and the decimal point 8 of 0-9.
Wherein, above-mentioned aluminium wire need carry out anti-oxidation and tempering is handled, and makes its useful life above 100,000 hours.After aluminium wire was handled through tempering, pulling force was more than 0.1 N, and the probability that breaks after the sealing reduces greatly.The reflection cavity of paster charactron and go out optical channel carrying out optimal design, make charactron pen section luminance errors≤10%.The utility model adopts the silk-screen technology, and special fluorescent material pad pasting is made in screen printing and electronics ink jet printing.After being assembled into the white light charactron, reaching product heatproof, byte and show performances such as even.
The utility model patent packaging technology is simple, with combining of SMT automatic chip mounting technology, helps large-scale production, enhances productivity, and reduces energy consumption, reduces cost.

Claims (2)

1. empty sealed paster white light charactron comprises pcb board, includes a plurality of electrodes and pad on this pcb board, and the plastics external member is pressed in the top of pcb board, it is characterized in that being welded with in the pad semiconductor chip that can send blue light; Bright dipping passage in the plastics external member be positioned at this blue-light semiconductor chip directly over, connect with metal wire between this blue-light semiconductor chip and the pad; Also have a film above the plastics external member, with fluorescent material, fluorescent material is positioned at the top of plastics external member bright dipping passage on the film.
2. empty sealed paster white light charactron as claimed in claim 1 is characterized in that described metal wire adopts aluminum steel.
CN2010202372947U 2010-06-25 2010-06-25 Empty encapsulation patch white light digital tube Expired - Fee Related CN201936912U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202372947U CN201936912U (en) 2010-06-25 2010-06-25 Empty encapsulation patch white light digital tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202372947U CN201936912U (en) 2010-06-25 2010-06-25 Empty encapsulation patch white light digital tube

Publications (1)

Publication Number Publication Date
CN201936912U true CN201936912U (en) 2011-08-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010202372947U Expired - Fee Related CN201936912U (en) 2010-06-25 2010-06-25 Empty encapsulation patch white light digital tube

Country Status (1)

Country Link
CN (1) CN201936912U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103366645A (en) * 2013-03-22 2013-10-23 美的集团武汉制冷设备有限公司 Light emitting display device
CN104017526A (en) * 2014-05-29 2014-09-03 绍兴光彩显示技术有限公司 Fluorescent-powder dispensing glue for white-light SMD nixie tube and application method thereof
CN111240183A (en) * 2020-03-17 2020-06-05 长沙天穹电子科技有限公司 Testing device for satellite synchronous clock

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103366645A (en) * 2013-03-22 2013-10-23 美的集团武汉制冷设备有限公司 Light emitting display device
CN104017526A (en) * 2014-05-29 2014-09-03 绍兴光彩显示技术有限公司 Fluorescent-powder dispensing glue for white-light SMD nixie tube and application method thereof
CN104017526B (en) * 2014-05-29 2016-04-27 绍兴光彩显示技术有限公司 A kind of white light surface-mount digital tube fluorescent material point glue glue and using method thereof
CN111240183A (en) * 2020-03-17 2020-06-05 长沙天穹电子科技有限公司 Testing device for satellite synchronous clock

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110817

Termination date: 20150625

EXPY Termination of patent right or utility model