CN201936912U - Empty encapsulation patch white light digital tube - Google Patents
Empty encapsulation patch white light digital tube Download PDFInfo
- Publication number
- CN201936912U CN201936912U CN2010202372947U CN201020237294U CN201936912U CN 201936912 U CN201936912 U CN 201936912U CN 2010202372947 U CN2010202372947 U CN 2010202372947U CN 201020237294 U CN201020237294 U CN 201020237294U CN 201936912 U CN201936912 U CN 201936912U
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- external member
- white light
- light
- charactron
- plastic external
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Abstract
The utility model discloses an empty encapsulation patch white light digital tube, which comprises a PCB (printed circuit board), wherein the PCB comprises multiple electrodes and bonding pads, and a plastic external member is pressed above the PCB, each bonding pad is welded with a semiconductor chip which can emit blue light, light outlet passage ways in the plastic external members are positioned right above the blue light semiconductor chips, the blue light semiconductor chips and the bonding pads are connected with metal wires, the upper part of the plastic external member is also provided with a thin film, the thin film is attached with fluorescent powder, and the fluorescent powder is positioned above the light outlet passage ways of the plastic external member. Compared with the traditional product, the encapsulation with epoxy resin for the light outlet passage way of the plastic external member is omitted, the pollution of the epoxy resin is effectively avoided, the cost is saved, and the energy consumption is reduced.
Description
Technical field
The utility model relates to the white light charactron, belongs to the semiconductor LED product technical field.
Background technology
In the industry of SMD LED and SMD Display, the encapsulation enterprise in Taiwan occupies the very big market share, has critical role at present.For example Taiwan Yiguang Electronic Industry Co., Ltd. aspect the encapsulation of paster charactron, occupy the first place, Taiwan.But common process is adopted in its charactron encapsulation, the cost of manufacture height, and disposable yield is low, is difficult to apply in other area.
The China's Mainland begins research and development from the eighties and produces, to the nineties, the LED packaging industry has obtained fast development, but the most small scale of domestic LED encapsulation enterprise, packaging technology research insufficient investment, many technical bottlenecks do not break through, and technological level is totally not high, and this situation has seriously restricted the development of industry.Therefore, domestic charactron encapsulates enterprise and only updates technical merit, reduces cost, and could occupy the more market share in intense market competition.
Traditional paster white light charactron structure, as shown in Figure 1, welding white light-emitting diodes 1 and is added a cover plastics external member 3 in the pad 2 on pcb board 4, goes out optical channel 5 and hot setting with epoxy resin embedding plastics external member 3.This traditional packaging technology technology is that luminescence chip is encapsulated in the white light-emitting diodes, because white light-emitting diodes has the multiple tracks complicated technology to finish, therefore makes whole paster white light charactron technology more complicated, and cost is also higher.And white light-emitting diodes passes through this operation of high temperature sealing again, and the life-span is also influential.
Summary of the invention
The purpose of this utility model provides a kind of improved white light charactron, and it can avoid the pollution of epoxy resin, omits high temperature sealing operation, and is comparatively energy-conservation in the process that manufactures a product, and reduced production cost.
For achieving the above object, the utility model patent is achieved through the following technical solutions:
Empty sealed paster white light charactron comprises pcb board, includes a plurality of electrodes and pad on this pcb board, and the plastics external member is pressed in the top of pcb board.Wherein, be welded with the semiconductor chip that can send blue light in the pad; Bright dipping passage in the plastics external member be positioned at this blue-light semiconductor chip directly over, connect with metal wire between this blue-light semiconductor chip and the pad; Also have a film above the plastics external member, with fluorescent material, fluorescent material is positioned at the top of plastics external member bright dipping passage on the film.
According to the further setting to the appeal technical scheme, metal wire adopts aluminum steel.
The utility model patent is compared advantage with traditional product and is: 1, omitted in plastics external member bright dipping passage and used the epoxy resin embedding, effectively avoided the pollution of epoxy resin, omitted high temperature sealing operation.2, omit hot setting, saved cost, reduced energy consumption, can be energy-conservation in the process that manufactures a product about 50%, greatly reduce production costs.
Description of drawings
Fig. 1 is traditional white light charactron structural representation;
Fig. 2 is the empty sealed paster white light of a utility model charactron structural representation.
Embodiment
The empty sealed paster white light of the utility model charactron structure as shown in Figure 2, pcb board 4 includes a plurality of electrodes 6 and pad 2, blue chip 1 directly is welded in the pad 2, plastics external member 3 is pressed in pcb board 4 tops, go out optical channel 5 over against blue chip 1 in the plastics external member 3, the connection of aluminum steel 7 is arranged between blue chip 1 and the pad 2.Film 9 is bonded at plastics external member 3 tops, and the fluorescent material 10 in the film 9 goes out optical channel 5 over against plastics external member 3.
The concrete implementation step of product is:
Step 4) adopts the silk-screen technology, and special fluorescent material pad pasting is made in screen printing and electronics ink jet printing.
Step 5), the assembling of paster white light charactron.Use the empty encapsulation technique that paster blue light charactron is adopted, stick on the charactron pad pasting of fluorescence byte, be assembled into the white light charactron, reach the product heatproof, byte shows performances such as even.
Operation principle: electric current flows to pad 2 through the electrode 6 of pcb board 4, through pad 2 and aluminum steel 7 interconnect functions, flow to blue chip 1, wherein blue chip 1 goes out optical channel 5 in the plastics external member 3, sends blue light by going out optical channel 5, simultaneously, the blue light that produces excites the generation gold-tinted to what be pressed in fluorescent material 10 in the film 9 on the plastics external member 3, because blue light mixes with the complementation of gold-tinted, produce the nature white light, make charactron white demonstrate Arabic numerals and the decimal point 8 of 0-9.
Wherein, above-mentioned aluminium wire need carry out anti-oxidation and tempering is handled, and makes its useful life above 100,000 hours.After aluminium wire was handled through tempering, pulling force was more than 0.1 N, and the probability that breaks after the sealing reduces greatly.The reflection cavity of paster charactron and go out optical channel carrying out optimal design, make charactron pen section luminance errors≤10%.The utility model adopts the silk-screen technology, and special fluorescent material pad pasting is made in screen printing and electronics ink jet printing.After being assembled into the white light charactron, reaching product heatproof, byte and show performances such as even.
The utility model patent packaging technology is simple, with combining of SMT automatic chip mounting technology, helps large-scale production, enhances productivity, and reduces energy consumption, reduces cost.
Claims (2)
1. empty sealed paster white light charactron comprises pcb board, includes a plurality of electrodes and pad on this pcb board, and the plastics external member is pressed in the top of pcb board, it is characterized in that being welded with in the pad semiconductor chip that can send blue light; Bright dipping passage in the plastics external member be positioned at this blue-light semiconductor chip directly over, connect with metal wire between this blue-light semiconductor chip and the pad; Also have a film above the plastics external member, with fluorescent material, fluorescent material is positioned at the top of plastics external member bright dipping passage on the film.
2. empty sealed paster white light charactron as claimed in claim 1 is characterized in that described metal wire adopts aluminum steel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010202372947U CN201936912U (en) | 2010-06-25 | 2010-06-25 | Empty encapsulation patch white light digital tube |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010202372947U CN201936912U (en) | 2010-06-25 | 2010-06-25 | Empty encapsulation patch white light digital tube |
Publications (1)
Publication Number | Publication Date |
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CN201936912U true CN201936912U (en) | 2011-08-17 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2010202372947U Expired - Fee Related CN201936912U (en) | 2010-06-25 | 2010-06-25 | Empty encapsulation patch white light digital tube |
Country Status (1)
Country | Link |
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CN (1) | CN201936912U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103366645A (en) * | 2013-03-22 | 2013-10-23 | 美的集团武汉制冷设备有限公司 | Light emitting display device |
CN104017526A (en) * | 2014-05-29 | 2014-09-03 | 绍兴光彩显示技术有限公司 | Fluorescent-powder dispensing glue for white-light SMD nixie tube and application method thereof |
CN111240183A (en) * | 2020-03-17 | 2020-06-05 | 长沙天穹电子科技有限公司 | Testing device for satellite synchronous clock |
-
2010
- 2010-06-25 CN CN2010202372947U patent/CN201936912U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103366645A (en) * | 2013-03-22 | 2013-10-23 | 美的集团武汉制冷设备有限公司 | Light emitting display device |
CN104017526A (en) * | 2014-05-29 | 2014-09-03 | 绍兴光彩显示技术有限公司 | Fluorescent-powder dispensing glue for white-light SMD nixie tube and application method thereof |
CN104017526B (en) * | 2014-05-29 | 2016-04-27 | 绍兴光彩显示技术有限公司 | A kind of white light surface-mount digital tube fluorescent material point glue glue and using method thereof |
CN111240183A (en) * | 2020-03-17 | 2020-06-05 | 长沙天穹电子科技有限公司 | Testing device for satellite synchronous clock |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110817 Termination date: 20150625 |
|
EXPY | Termination of patent right or utility model |