CN217588359U

CN217588359U - Novel small-spacing full-color LED module used for electronic name board

Info

Publication number: CN217588359U
Application number: CN202221550615.8U
Authority: CN
Inventors: 黄大玮; 刘彬
Original assignee: Shenzhen Wenyao Semiconductor Technology Co ltd
Current assignee: Shenzhen Wenyao Semiconductor Technology Co ltd
Priority date: 2022-06-17
Filing date: 2022-06-17
Publication date: 2022-10-14
Anticipated expiration: 2032-06-17

Abstract

The utility model discloses a novel full-color LED module of booth apart from is used for electron name card, include: shell, lamp plate assembly, transparent cover plate, MCU module and battery, shell and lamp plate assembly form accommodation space, and MCU module and battery all set up at the lamp plate assembly back, and in accommodation space was located to lamp plate assembly, lamp plate assembly included: the LED lamp comprises a first substrate, a second substrate, a light-emitting LED chip set and a second substrate, wherein the second substrate is arranged on the first substrate in an overlapped mode, a front circuit is formed on the front surface of the first substrate, a back circuit is formed on the back surface of the first substrate, the light-emitting LED chip set is arranged on the front surface of the first substrate and electrically connected with the front circuit, an MCU module and a battery are arranged on the back surface of the first substrate and electrically connected with the back circuit, a plurality of through holes are formed in the second substrate, the light-emitting LED chip set is located in the through holes, and LED chip protection devices are arranged in the through holes. The utility model replaces the existing monochromatic light-emitting product with full-color light-emitting, thereby enriching the display effect; the light source ratio is multiplied under the same luminous area, and more information contents can be displayed.

Description

Novel small-spacing full-color LED module used for electronic name board

Technical Field

The utility model relates to an electron name card technical field especially relates to a novel full-color LED module of booth is used for electron name card.

Background

Most of the current nameplates are made of paper, and a small number of electronic products are manufactured, but the current nameplates are all formed by welding and assembling LEDs. The paper nameplate is easy to damage and cannot be reused; the electronic name board has the problems of large volume, heavy hanging, large distance between each luminous source, limited content capable of being displayed, single display effect caused by the fact that electronic LED light sources are monochromatic light sources and the like.

Accordingly, the prior art is deficient and needs improvement.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the not enough of prior art, providing a novel full-color LED module of booth interval is used for electron nameplate.

The technical scheme of the utility model as follows: the utility model provides a novel full-color LED module of booth is used for electron name card, include: shell, lamp plate assembly, transparent cover plate, MCU module and battery, the shell with lamp plate assembly forms accommodation space, MCU module and battery all set up lamp plate assembly's the back, lamp plate assembly locates in the accommodation space, lamp plate assembly includes: first base plate, second base plate, luminous LED chipset the second base plate coincide is located on the first base plate, the front of first base plate is formed with front circuit, and the back is formed with back circuit, luminous LED chipset sets up the front of first base plate and with front circuit electric connection, MCU module and battery setting are in the back of first base plate and with back circuit electric connection, be formed with a plurality of through-holes on the second base plate, luminous LED chipset is located in the through-hole, be equipped with LED chip protection device in the through-hole.

Further, the light emitting elements in the light emitting LED chip group comprise a red LED chip, a green LED chip and a blue LED chip.

Further, the hole wall of the through hole of the second substrate is plated with a copper layer.

Further, the first substrate is a glass fiber board, an aluminum substrate or a flexible printed circuit board (FPC), and the second substrate is a glass fiber board, an aluminum substrate or a flexible printed circuit board (FPC).

Furthermore, the LED chip protection device is made of silica gel or epoxy resin.

Furthermore, two electrodes of the light-emitting elements in the light-emitting LED chip sets are electrically connected to the corresponding front surface lines through conductive adhesives.

Or the two electrodes of the light-emitting element in the light-emitting LED chip set are electrically connected with the corresponding front surface circuit through the conductive gold wires respectively.

Or, one electrode of the light-emitting element in the light-emitting LED chip set is electrically connected to the corresponding front surface circuit through a conductive adhesive, and the other electrode of the light-emitting element in the light-emitting LED chip set is electrically connected to the corresponding front surface circuit through a conductive gold wire.

Further, the center-to-center distance of the LED chip sets is: 1 mm-2 mm.

Adopt above-mentioned scheme, the beneficial effects of the utility model reside in that: the electronic name plate is realized, so that the name plate can be repeatedly used; compared with the existing monochrome electronic name plate on the market, the whole volume is lighter and thinner, and the electronic name plate is convenient to hang and use; a full-color light emitting source is realized, so that the display effect is richer; the light panel assembly is arranged in a mode that the density of the light emitting elements is higher, and the displayable content is increased.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a second schematic structural diagram of the present invention.

Figure 3 is the utility model discloses a lamp plate assembly's structure explosion chart.

Fig. 4 is a schematic view of a configuration of the light emitting elements of the light emitting LED chip set according to the first embodiment of the present invention.

Fig. 5 is a schematic view of an arrangement form of light emitting elements of a light emitting LED chip set according to a second embodiment of the present invention.

Fig. 6 is a schematic view of an arrangement form of light emitting elements of a light emitting LED chip set according to a third embodiment of the present invention.

Fig. 7 is a schematic structural diagram of the LED chip protection device of the present invention.

Fig. 8 is a schematic structural view of a copper layer according to the present invention.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1 to fig. 3, in this embodiment, the utility model provides a novel full-color LED module with small spacing for electronic nameplate, which includes: shell 200, lamp plate assembly 100, transparent cover 300, MCU module 400 and battery 500, shell 200 with lamp plate assembly 100 forms accommodation space, MCU module 400 and battery 500 all set up the back of lamp plate assembly 100, lamp plate assembly 100 locates in the accommodation space, lamp plate assembly 100 includes: first base plate 1, second base plate 2, luminous LED chipset 3 the coincide of second base plate 2 is located on the first base plate 1, the front of first base plate 1 is formed with front circuit 11, and the back is formed with back circuit, luminous LED chipset 3 sets up the front of first base plate 1 and with 11 electric connection of front circuit, MCU module 400 and battery 500 set up the back of first base plate 1 and with back circuit electric connection, be formed with a plurality of through-holes 21 on the second base plate 2, luminous LED chipset 3 is located in the through-hole 21, be equipped with LED chip protection device 4 in the through-hole 21.

Further, the light emitting elements in the light emitting LED chip group 3 include a red LED chip, a green LED chip, and a blue LED chip.

Further, the hole wall of the through hole 21 of the second substrate 2 is plated with the copper layer 22, so that the problem of light channeling of adjacent light emitting elements can be solved, and a light blocking component can be added into the second substrate 2 to achieve the effect of solving the light channeling.

Further, the first substrate 1 may be a glass fiber board, an aluminum substrate, a flexible printed circuit board (FPC), or the like, or may be another type of substrate, and the second substrate 2 may be a glass fiber board, an aluminum substrate, a flexible printed circuit board (FPC), or the like, or may be another type of substrate.

Further, the material of the LED chip protection device 4 is silica gel or epoxy resin, and the above materials are filled in the through hole 21 and cured to form the LED chip protection device 4.

Further, the center-to-center distance of the LED chip sets is: 1 mm-2 mm.

Referring to fig. 4, as an alternative embodiment, two electrodes of the light emitting elements in the light emitting LED chip sets 3 are electrically connected to the corresponding front surface circuit 11 through a conductive adhesive 5. The conductive adhesive 5 may be solder paste or the like, and performs a corresponding function through a reflow soldering process.

Referring to fig. 5, as an alternative embodiment, two electrodes of the light emitting elements in the light emitting LED chip set 3 are electrically connected to the corresponding front surface circuit 11 through conductive gold wires 6, respectively, and the light emitting elements are fixed on the front surface circuit 11 through an adhesive. The adhesive 7 and the conductive gold wire 6 can be arranged by heating, ultrasonic welding process and the like.

Referring to fig. 6, as an alternative embodiment, one electrode of the light emitting element in the light emitting LED chip set is electrically connected to the corresponding front surface circuit 11 through a conductive adhesive 5, and the other electrode of the light emitting element in the light emitting LED chip set is electrically connected to the corresponding front surface circuit 11 through a conductive gold wire 6. The conductive adhesive 5 and the conductive gold wire 6 can be arranged by heating, ultrasonic welding process and the like.

In this scheme, lamp plate assembly 100's structure can be so that light emitting component's realization is very high density, promotes the display effect. The battery 500 may be used to supply power to the electronic nameplate, and the MCU module may control the display content of the electronic nameplate.

To sum up, the utility model discloses beneficial effect lies in:

the electronic name plate is realized, so that the name plate can be repeatedly used; compared with the existing monochrome electronic name plate on the market, the whole volume is lighter and thinner, and the electronic name plate is convenient to hang and use; the full-color light-emitting source is realized, so that the display effect is richer; the light panel assembly is arranged in a mode that the density of the light emitting elements is higher, and the displayable content is increased.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a novel full-color LED module of small-pitch is used for electron nameplate, a serial communication port, include: shell, lamp plate subassembly, transparent cover plate, MCU module and battery, the shell with the lamp plate subassembly forms accommodation space, MCU module and battery all set up lamp plate subassembly's the back, lamp plate subassembly locates in the accommodation space, lamp plate subassembly includes: first base plate, second base plate, luminous LED chipset the second base plate coincide is located on the first base plate, the front of first base plate is formed with the front circuit, and the back is formed with the back circuit, luminous LED chipset sets up the front of first base plate and with front circuit electric connection, MCU module and battery setting are in the back of first base plate and with back circuit electric connection, be formed with a plurality of through-holes on the second base plate, luminous LED chipset is located in the through-hole, be equipped with LED chip protection device in the through-hole.

2. The new small-pitch full-color LED module for the electronic nameplate of claim 1, wherein the light emitting elements in the light emitting LED chip set comprise red LED chips, green LED chips and blue LED chips.

3. The new small-pitch full-color LED module for the electronic nameplate as claimed in claim 1, wherein the wall of the through hole of the second substrate is plated with a copper layer.

4. The new small-pitch full-color LED module of claim 1 is used for electronic nameplates, wherein the first substrate is a glass fiber board, an aluminum substrate or a flexible printed circuit board, and the second substrate is a glass fiber board, an aluminum substrate or a flexible printed circuit board.

5. The novel small-pitch full-color LED module is used for electronic nameplates, and is characterized in that the LED chip protection device is made of silica gel or epoxy resin.

6. The new small-pitch full-color LED module used for the electronic nameplate as claimed in any one of claims 1 to 5, wherein both electrodes of the light-emitting elements in the light-emitting LED chip set are electrically connected with the corresponding front surface circuit through a conductive adhesive.

7. The new small-pitch full-color LED module used for electronic nameplates according to any one of claims 1 to 5, wherein one electrode of the light-emitting element in the light-emitting LED chip set is electrically connected with the corresponding front surface circuit through a conductive adhesive, and the other electrode of the light-emitting element in the light-emitting LED chip set is electrically connected with the corresponding front surface circuit through a conductive gold wire.

8. The novel small-pitch full-color LED module used for the electronic nameplate according to any one of claims 1 to 5, wherein the center-to-center distance of the LED chip groups is as follows: 1 mm-2 mm.